1. Field of the Invention
The present invention relates to the art of electrical connectors, and more particularly to a land grid array (LGA) connector contact.
2. General Background
Various types of connectors have been developed for electrical connections to an IC package and a printed circuit board, such as Pin Grid Array (PGA) connectors, Ball Grid Array (BGA) connectors, Land Grid Array (LGA) connectors, etc., the names of which are assigned thereto based on conductive elements of the IC package that connectors electrically connect. Contacts resided within the respective connectors are accordingly classified as PGA contacts, BGA contacts, LGA contacts and so on.
As shown in
An LGA connector contact according to an embodiment of the present invention includes a base for being retained in a passageway of the LGA connector, and a pair of spring arms extending from an upper portion and a lower portion of the base respectively. One of the spring arms includes an extending section extending from the upper portion of the base, a connecting section extending from an upper portion of the extending section, and a contacting section formed at a distal end of the connecting section for engaging an IC package's contact pad. The contacting section has an exterior side and an interior side, and includes a recess on the exterior side of the contacting section around a middle portion of the contacting section so as to define at least a pair of contact regions adjacent the recess. Compared with the prior art, the LGA contacting portion is configured to have its contact regions electrically engage with an un-oxidized portion of the IC package' contact pad, thereby achieving an effective electrical connection between the LGA connector contact and the IC package's contact pad.
Other features and advantages of the present invention will become more apparent to those skilled in the art upon examination of the following drawings and detailed description of preferred embodiments, in which:
Referring to
The base 31 is of a plate-like shape, and includes a plurality of barbs 312 formed on an outer edge of the base 31 for being vertically retained in the passageway of the LGA connector with interference fit.
Each of the spring arms 32 includes an extending section 320 extending from the upper portion of the base 31, a connecting section 321 extending from an upper portion of the extending section 320. A first contact section 322 is formed at a distal end of the upper spring arm's connection section 321 for engaging an IC package's contact pad. A second contact section 325 is formed at a distal end of the lower spring arm's connection section 321 for engaging a printed circuit board's contact pad. The first contact section 322 and the second contact section 325 are structurally different, to be later described. Each of the contacting section 322, 325 in width is larger than that of at least one of the extending section 320 and the connecting section 321. In this embodiment, the width of the contacting section 322 or 325 is larger than any one of the extending section 320 and the connecting section 321. Thus, the contacting section 322 or 325 can provide a much more mating surface sufficient to electrically contact the whole conductive pad of the IC package than the tiny contacting portion of the conventional LGA contact. Further, the present LGA contact spring arm is configured to have a better elasticity thereof than the conventional LGA contact arm, since the present spring arm is composed of two spring sections including the extending section 320 and the connecting section 321.
The first contact section 322 defines a base having an exterior side and an interior side thereof. The first contact section 322 includes a recess 323 on the exterior side of the contacting section 322 around a middle portion of the contacting section 322 so as to define at least a pair of contact regions 324 adjacent the recess 323. The contacting regions 324 are located on opposite sides of the recess 323. In this embodiment, the recess 323 is formed by stamping a part of the contacting section 322 around the middle portion of said contacting section. The recess 323 is preferably arranged corresponding to an oxidized portion of the IC package's contact pad such that the LGA connector contact 30 electrically mates with the IC package's contact pad by its contact regions 324 of the LGA contact 30 engaging the remaining un-oxidized portion of the IC package's contact pad, rather than that oxidized portion of the IC package's contact pad. Thereby, electrical connection failure between the IC package's contact pad and the LGA contacting portion 322 is prevented due to having the LGA contact 30 engage the un-oxidized portion of the IC package's contact pad. It should be noted that the second contact section 325 has no recess defined therein due to some consideration about mechanical property, since the lower spring arm 320, where the second contact section 325 is formed, is required much more to supportably the whole LGA contact when the upper spring arm is compressed by loading the IC package on the LGA connector.
While the LGA contact 30 defining one recess 323 to form a pair of contact regions 324 is preferred according to this embodiment of the present invention, the LGA contact 30 having a suitable number of recesses 323 to form a plurality of contact regions 324 can be also employed in other alternative embodiments.
While the present invention has been described with reference to preferred embodiments, the description of the invention is illustrative and is not to be construed as limiting the invention. Various of modifications to the present invention can be made to preferred embodiments by those skilled in the art without departing from the true spirit and scope of the invention as defined by the appended claims.
Number | Date | Country | Kind |
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94222917 | Dec 2005 | TW | national |