BACKGROUND OF THE INVENTION
(a) Field of the Invention
The invention relates to a land grid array connector, and more particularly, to a land grid array connector having high-density contact points serving as connecting structures between a circuit board and another circuit board, or between an integrated circuit and a circuit bard. The land grid array connector is deformed when a signal transmission portion thereof is suppressed without resulting in permanent deformation, however. Wiping movements of the contact points are performed between a circuit board and another circuit board, or between a circuit board and an integrated circuit, so as to remove oxidized thin-films at involved contact surfaces for facilitating signal transmission. Moreover, when terminals of the connector are assembled to corresponding terminal grooves at a connector plastic housing, a gap is reserved between the terminals and rear walls of the terminal grooves, and is for absorbing variation caused from suppression of a signal transmission portion, thereby accomplishing optimal connection effects.
(b) Description of the Prior Art
A common land grid array connector, and especially a high-density connector as disclosed by the U.S. Pat. Nos. 6,062,871, 6,146,152, and 6,203,331 (FIG. 8 shows the U.S. Pat. No. 6,062,871), comprises an insulative housing 10 having a plurality of slits 11, and a plurality of terminals 20 with a pair of contact points and being inserted in the slits 11. Each terminal 20 is a structure directly formed on a metal plate by stamping, wherein a first contact point 21 thereof is extended upward from a transmission section 23 thereof, and a second contact point 22 is disposed at a bottom end of the transmission section 23. Therefore, material anti-bending strength (flexibility) between the upper and lower contact points 21 and 22 is a square of a width of cross section multiplied by a height of the upper and lower contact points 21 and 22. The contact points are limited by the transmission section 23 of the terminal 20, and variation thereof is not drastically fluctuated due to limitations of space. Although a cantilever in a middle section receives a portion of stress, stress imposed on the terminal 20 is yet quite large due to the limited variation. In addition, stress is amplified by the plurality of terminals 20 in the entire connector. Consequently, when the connector is applied in land grid array connection with unsatisfactory planeness between individual contact points, a portion of the terminals may be resulted with poor contact. To allow the terminals with better contact, large forces pressing downward are needed. However, deformation of the circuit board then becomes probable and again leads to poor contact, or even damages of components therein.
It is observed that the terminals of the prior land grid array connectors have crucial influences over connection effects, and drawbacks as being likely to damage components and thus increase production costs. Therefore, it is a vital task of the invention as how to advance the prior invention, so as to provide good contact effects, and overcome the above drawbacks namely being likely to damage connected circuit boards or electronic components.
SUMMARY OF THE INVENTION
The primary object of the invention is to provide a land grid array connector, wherein terminals thereof have excellent flexibility, so that when the land grid array connector is practically applied, large forward (up and down) pressure is not required for forcing the terminals in the connector to electrically connect with contact points of a circuit board or an integrated circuit.
The secondary object of the invention is to provide a land grid array connector, wherein relative motions are generated between upper and lower contact points thereof when signal transmission sections of terminals thereof are suppressed, so as to produce friction between the contact points of the terminals and the contact points at a surface of a circuit board for wiping off dirt on involved contact surfaces.
To accomplish the above objects, the land grid array connector in accordance with the invention comprises the characteristics that, each terminal of the connector is formed by bending an integral metal plate, and has a fixing portion, a flexible portion and a signal transmission portion. The fixing portion a vertical plate having an interfering portion projecting toward two sides at an end thereof, respectively. Using the interfering portions, the terminals are fastened in terminal grooves in a plastic housing. The signal transmission portion is a vertical plate, and has arched contact points at upper and lower ends thereof. The flexible portion is joined between the fixing portion and the signal transmission portion, and is for generating relative motions between the upper and lower contact points when the signal transmission portion is suppressed. Each terminal groove at the connector plastic housing is provided with a side channel corresponding to the interfering portions of the terminal. Between the side channel and a rear wall of the terminal groove is a certain distance, and therefore when the terminal is assembled at the terminal groove, a gap is reserved between a rear end of the fixing portion of the terminal and the rear wall of the terminal groove in order to provided variation room for elastic deformation caused by suppression upon the signal transmission portion.
Using the above structure, when the invention is being connecting, each of the terminals is provided with better bending elasticity, and enough room is also reserved for receiving variation of the terminals in the terminal grooves when the terminals are suppressed, thereby reducing counteraction of the terminals and hence accomplishing the aforesaid objects.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 shows an exploded elevational view of the land grid array connector according to the invention.
FIG. 2 shows an elevational view of a terminal in an embodiment according to the invention.
FIG. 3 shows a sectional view illustrating two contact points of the terminal both exposed at surfaces of the plastic housing in an embodiment according to the invention.
FIG. 4 shows a motional schematic view illustrating the terminal in FIG. 3 being suppressed.
FIG. 5 shows a view illustrating one of the contact points of the terminal exposed at a surface of the plastic housing in an embodiment according to the invention.
FIG. 6 shows a motional schematic view illustrating the terminal in FIG. 5 being suppressed.
FIG. 7A to 7C show schematic views of three different embodiments of the terminals according to the invention.
FIG. 8 shows a conventional exploded elevational view of a prior structure.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Referring to FIGS. 1 and 2, a structure according to the invention comprises a flat-plate connector plastic housing 30 having a plurality of terminal grooves 31, and a plurality of terminals 40 having a pair of contact points and disposed in the various terminal grooves 31. An upper contact point 431 of each terminal 40 is exposed at an upper surface 32 of the plastic housing 30, whereas a lower contact point 432 is exposed at a lower surface 33 of the plastic housing 30 (or hidden in the plastic housing 30). The upper and lower contact points 431 and 432 serve as connecting structures between a circuit board and another circuit board, or between a circuit board and an integrated circuit.
Referring to FIG. 2, each terminal 40 is formed by bending an integral metal plate, and has a fixing portion 41, a flexible portion 42 and a signal transmission portion 43. The fixing portion 41 is a vertical plate having a relatively large thickness, and an interfering portion 411 projecting toward two sides at an end thereof, respectively. Using the interfering portions 411, the terminals 40 are fastened in the terminal grooves 31 in the plastic housing 30. The signal transmission portion 43 is a vertical plate, and has arched contact points 431 and 432 at upper and lower ends thereof. The flexible portion 42 is joined between the fixing portion 41 and the signal transmission portion 43, and is for generating relative motions between the upper and lower contact points 431 and 432 when the signal transmission portion 43 is suppressed, so as to produce friction between the contact points 431 and 432 of the terminal 40, and contact points at surfaces of circuit boards for wiping off dirt at contact surfaces involved.
For that the terminal 40 according to the invention is formed by bending an integral metal plate, the terminal 40 is allowed with good flexibility while stress thereof is apparently smaller than that of the prior art (as shown in FIG. 6). Hence, accumulated stress at individual terminals of the connector is unmatched by the prior art.
Furthermore, each terminal groove 31 at the connector plastic housing 30 is provided with a side channel 311 corresponding to the interfering portions 411 of the terminal 40. Between the side channel 311 and a rear wall 312 of the terminal groove 31 is a certain distance, and therefore when the terminal 40 is assembled at the terminal groove, a gap is reserved between a rear end of the fixing portion 41 of the terminal and the rear wall 312 of the terminal groove 31. The reserved gap is for absorbing or accommodating material variation caused by suppression upon the upper and lower contact points 431 and 432 at the signal transmission portion 43.
Referring to FIGS. 3 and 4, when using the assembled structure as above for connection according to the invention, deformation is incurred for that the upper and lower contact points 431 and 432 at each terminal 40 are simultaneously suppressed, and thus leading to displacement of the fixing portion 41, the flexible portion 42 and the signal transmission portion 43. At this point, oscillation of the flexible portion 42 take place owing to displacement of the two contact points 431 and 432. Wiping motions of the two contact points 431 and 432 of the terminal 40 are then performed at contact surfaces of two circuit boards, or a circuit board and an integrated circuit, so as to scrape off surface dirt or oxidized thin-films for accomplishing excellent contact effects. In addition, in the terminal 40, vertical heights of cross sections at various bent portions are relatively smaller; that is, the metal plate has a larger thickness. As a result, mechanical strength (stiffness) of the terminal 40 is smaller and bending flexibility is better. When the deformation occurs at the terminals 40 being simultaneously suppressed at top and bottom portions thereof, the terminal grooves 31 have enough room for receiving or accommodating variations of the terminals 40 for reducing resistance, thereby decreasing counteractions of the terminals 40 and preventing deformation and damages of circuit boards or electronic components.
According to the connector disclosed by the invention, each terminal 40 has at least one contact point 431 or 432 protruding out of the plastic housing, and thus when the protruding contact point 431 or 432 (431 in this particular diagram) generates downward motions when being suppressed, elastic oscillation are caused at the flexible portion 42. Meanwhile, the other contact point 432 is resultantly protruded out of another surface of the plastic housing 30, and so when the contact portion 432 also receives pressure, the signal transmission portion 43 is bent with elastic deformation. The flexible portion 42 for producing elastic oscillation, and reaction of generated by the elastically deformed signal transmission portion 43, are then capable of forcing the two contacts 431 and 432 to provide forward forces for maintaining electric connection with contact points at circuit boards.
Referring to FIGS. 5 and 6, when the terminal 40 is fastened and assembled at the terminal groove 31 of the plastic housing 30, one of the two contact points 431 and 432 is hidden within the plastic housing 30. When the structure is being connected, each terminal 40 is deformed because the contact point 431 protruding out of the upper surface 32 of the plastic housing 30 is suppressed, such that the other contact point 432 is displaced downward to electrically connect with a contact point of a corresponding circuit board. Similarly, this embodiment also achieves effects namely wiping off surface dirt or oxidized thin-films for accomplishing excellent connection, and preventing deformation and damages of circuit boards and electronic components.
Referring to FIG. 2, the flexible portion 42 of the terminal 40 is horizontal, and is joined at lower ends of the fixing portion 41 and the signal transmission portion 43, and thus giving the terminal 40 a U-shape appearance. Referring to FIGS. 7A and 7B, as described above, at the signal transmission portion 43 of the U-shaped terminal 40, the lower contact point 432 of the terminal 40 is extended from one side or two sides of the signal transmission portion 43 downward by means of stamping.
Referring to FIG. 7, when implementing the terminal 40 according to the invention, the flexible portion 42 is tilted and forms an N-shape with an upper end of the fixing portion 41 and a lower end of the transmission portion 43.
Conclusive from the above, the land grid array connector in accordance with the invention is capable of bearing larger deformation. At the same time, wiping motions by the contact points are performed between a circuit board and another circuit board, or an integrated circuit and a circuit board, thereby removing oxidized thin-films on contact surfaces and providing excellent connection effects between various contact points.
It is of course to be understood that the embodiments described herein are merely illustrative of the principles of the invention and that a wide variety of modifications thereto may be effected by persons skilled in the art without departing from the spirit and scope of the invention as set forth in the following claims.
Patent Application
20050037635
