(a) Field of the Invention
The invention relates to a land grid array connector, and more particularly, to a land grid array connector having high-density contact points serving as connecting structures between a circuit board and another circuit board, or between an integrated circuit and a circuit board. The land grid array connector is deformed when a signal transmission portion thereof is suppressed without resulting in permanent deformation, however. Wiping movements of the contact points are performed between a circuit board and another circuit board, or between a circuit board and an integrated circuit, so as to remove oxidized thin-films at involved contact surfaces for facilitating signal transmission. Moreover, when terminals of the connector are assembled to corresponding terminal grooves at a connector plastic housing, a gap is reserved between the terminals and rear walls of the terminal grooves, and is for absorbing variation caused from suppression of a signal transmission portion, thereby accomplishing optimal connection effects.
(a) Description of the Prior Art
A common land grid array connector, and especially a high-density connector as disclosed by the U.S. Pat. No. 6,062,871, 6,146,152, and 6,203,331 (
It is observed that the terminals of the prior land grid array connectors have crucial influences over connection effects, and drawbacks as being likely to damage components and thus increase production costs. Therefore, it is a vital task of the invention as how to advance the prior invention, so as to provide good contact effects, and overcome the above drawbacks namely being likely to damage connected circuit boards or electronic components.
The primary object of the invention is to provide a land grid array connector, wherein terminals thereof have excellent flexibility, so that when the land grid array connector is practically applied, large forward (up and down) pressure is not required for forcing the terminals in the connector to electrically connect with contact points of a circuit board or an integrated circuit.
The secondary object of the invention is to provide a land grid array connector, wherein relative motions are generated between upper and lower contact points thereof when signal transmission sections of terminals thereof are suppressed, so as to produce friction between the contact points of the terminals and the contact points at a surface of a circuit board for wiping off dirt on involved contact surfaces.
To accomplish the above objects, the land grid array connector in accordance with the invention comprises the characteristics that, each terminal of the connector is formed by bending an integral metal plate, and has a fixing portion, a flexible portion and a signal transmission portion. The fixing portion a vertical plate having an interfering portion projecting toward two sides at an end thereof, respectively. Using the interfering portions, the terminals are fastened in terminal grooves in a plastic housing. The signal transmission portion is a vertical plate, and has arched contact points at upper and lower ends thereof. The flexible portion is joined between the fixing portion and the signal transmission portion, and is for generating relative motions between the upper and lower contact points when the signal transmission portion is suppressed. Each terminal groove at the connector plastic housing is provided with a side channel corresponding to the interfering portions of the terminal. Between the side channel and a rear wall of the terminal groove is a certain distance, and therefore when the terminal is assembled at the terminal groove, a gap is reserved between a rear end of the fixing portion of the terminal and the rear wall of the terminal groove in order to provided variation room for elastic deformation caused by suppression upon the signal transmission portion.
Using the above structure, when the invention is being connecting, each of the terminals is provided with better bending elasticity, and enough room is also reserved for receiving variation of the terminals in the terminal grooves when the terminals are suppressed, thereby reducing counteraction of the terminals and hence accomplishing the aforesaid objects.
Referring to
Referring to
Furthermore, each terminal groove 31 at the connector plastic housing 30 is provided with a side channel 311 corresponding to the interfering portions 411 of the terminal 40. The side channel 311 is separated from a rear wall 312 of the terminal groove 31 by a certain distance, and therefore when the terminal 40 is assembled at the terminal groove, a gap is reserved between a rear end of the fixing portion 41 of the terminal and the rear wall 312 of the terminal groove 31. The reserved gap is for absorbing or accommodating material variation caused by depression of upon the upper and lower contact points 431 and 432 at the signal transmission portion 43.
Referring to
According to the connector disclosed by the invention, each terminal 40 has at least one contact point 431 or 432 protruding out of the plastic housing, and thus when the protruding contact point 431 or 432 (431 in this particular diagram) generates downward motions when being depressed, elastic oscillation are caused at the flexible portion 42. Meanwhile, the other contact point 432 is resultantly protruded out of another surface of the plastic housing 30, when the contact portion 432 is depressed, so that the signal transmission portion 43 is bent with elastic deformation. The flexible portion 42 for producing elastic oscillation, and reaction of generated by the elastically deformed signal transmission portion 43, are then capable of forcing the two contacts 431 and 432 to provide forward forces for maintaining electric connection with contacts points at circuit boards.
Referring to
Referring to
Referring to
Conclusive from the above, the land grid array connector in accordance with the invention is capable of bearing larger deformation. At the same time, wiping motions by the contact points are performed between a circuit board and another circuit board, or an integrated circuit and a circuit board, thereby removing oxidized thin-films on contact surfaces and providing excellent connection effects between various contact points.
It is of course to be understood that the embodiments described herein are merely illustrative of the principles of the invention and that a wide variety of modifications thereto may be effected by persons skilled in the art without departing from the spirit and scope of the invention as set forth in the following claims.
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5984693 | McHugh et al. | Nov 1999 | A |
6062871 | Arai et al. | May 2000 | A |
6146152 | Mchugh et al. | Nov 2000 | A |
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6299458 | Yamagami et al. | Oct 2001 | B1 |
Number | Date | Country | |
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20050037635 A1 | Feb 2005 | US |