1. Field of the Invention
The present invention generally relates to the art of electrical connectors and, more particularly, to a land grid array (LGA) socket to provide electrical connection between an LGA package and an electrical substrate, such as a printed circuit board (PCB). The instant application relates to the copending applications Ser. Nos. 11/055,412 and 11/055,130.
2. Background of the Invention
Integrated circuit packages are generally classified as pin grid array (PGA) packages, ball grid array (BGA) packages and land grid array (LGA) packages depending on the shape of contacting section of the terminals. An integrated circuit package with conductive pads arranged on a bottom surface thereof in a land grid array is known as an LGA package.
Connectors for removably connecting an LGA package with a PCB are known as LGA sockets. Basically, an LGA socket includes a socket body and a plurality of terminals embedded in the socket body. Each terminal has a contacting section and an opposite connecting section. Under compression, the contacting section of the terminal is resiliently deflected from its natural state and electrically registered with a conductive pad on the LGA package. Thus, a flow of electrical signals is established between the LGA package and the PCB.
The mating of the conductive pads of the LGA package with the contacting sections of the terminals typically causes a large contact pressure on the socket, which is likely to conduce deformation or warpage of the socket body. In case where a large contact pressure is exerted on the socket, various methods are known to provide the socket with sufficient strength.
For example, typically, an LGA socket as shown in U.S. application publication No. 2004/0095693, includes a socket body having a plurality of terminals, a metallic stiffener attached to the socket body, and a load plate and a load lever pivotally assembled to opposite ends of the stiffener, respectively. As the socket body is supported by the metallic stiffener, deformation or warpage of the socket body is reduced when a force is exerted on the socket during assembly of the LGA package.
However, to properly fix the socket body to the stiffener, a plurality of columnar projections is formed on sidewalls of the socket body. A plurality of grooves is correspondingly defined in a bottom wall of the stiffener. In assembly, the columnar projections are fixed in the grooves via heating and riveting process. Thus, the assembly procedure of the socket may be prone to be relatively complicated.
Additionally, during the heating and riveting process, the socket body may be prone to warpage, which may lead to the terminals embedded in the socket body cannot be properly connected with corresponding circuit pads on the PCB.
Therefore, there is a heretofore unaddressed need in the industry to address the aforementioned deficiencies and inadequacies.
In a preferred embodiment of the present invention, an LGA socket includes a socket body having a number of terminals, a stiffener attached to the socket body, and a load plate and a load lever pivotally mounted to two ends of the stiffener, respectively. The stiffener is engaged with the socket body prior to setting the socket to a PCB. The stiffener is disengaged from the socket body and fastened to the PCB via a number of bolts in course of setting the socket to the PCB.
In assembly of the LGA socket, no riveting or heating process is needed. Therefore, the assembly procedure of the socket is simplified and the socket body is free from warping. Additionally, in use, the bolts fastening the stiffener to the PCB not only strengthens the PCB, but also prevents the socket from departing from the PCB under extreme shock or vibration.
Other features and advantages of the present invention will become more apparent to those skilled in the art upon examination of the following drawings and detailed description of preferred embodiment, in which:
Reference will now be made to describe the preferred embodiment of the present invention in detail.
As shown in
Individual elements of the socket 10 will now be described in greater detail. As shown in
Each terminal 40 includes a contacting section (not numbered) to be resiliently and electrically mated with a conductive pad on the LGA package and an opposite soldering section (not numbered) to be connected to a circuit pad arranged on the PCB 20.
The stiffener 50 is formed by stamping and bending a single sheet of metal into a rectangular plate. The stiffener 50 includes a planar bottom wall 502. Side edges of the bottom wall 502 are bent upward to form a rear wall 504, a front wall 508 and a pair of lateral walls 506 between the rear wall 504 and the front wall 508.
The bottom wall 502 has a large rectangular opening 503a defined by straight edges 503b. The rectangular opening 503a has a dimension that permits the socket body 30 to press-fit therein. Two pairs of through-holes 505 corresponding to mounting holes 202 defined in the PCB 20 are defined at each corner of the bottom wall 502. The through-holes 505 are symmetrically disposed along a front-rear direction. A pair of slots 507 for partially receiving the load plate 60 is provided at the joints of the bottom wall 502 and the two lateral walls 506. Each of the slots 507 extends along the bottom wall 502 in a front-rear direction.
The front wall 508 includes a pair of generally L-shaped retaining elements 510 that project upward and are bent inward. The retaining elements 510 are spaced apart from one another.
A locking element 514 is formed integrally with one of the lateral walls 506 at a position corresponding to an actuating section 704 of the load lever 70. The downward-facing surface of the locking element 514 is concave to make the load lever 70 hard to remove therefrom when the load lever 70 is engaged with the locking element 514. A pair of shaft-supporting ribs 512 for supporting the load lever 70 is provided at front sides of the lateral walls 506.
A pair of vertical poles 511 is provided at opposite lateral sides of the rear wall 504. A beam 513 parallel to the bottom wall 502 is disposed to connect the vertical poles 511. The beam 513, the vertical poles 511 and the bottom wall 502 jointly define two cavities 509 for receiving bearing tongues 603 of the load plate 60, respectively.
The load plate 60 is formed by stamping and bending a single sheet of metal into a rectangular shape. The load plate 60 includes a joint side 602, a pressing side 606 and a pair of lateral sides 604 disposed between the joint side 602 and the pressing side 606.
A pair of bearing tongues 603 is formed on the joint side 602. The bearing tongues 603 are curved downward and spaced apart from one another. A holding element 604 is provided midway between the bearing tongues 603.
An interlocking element 610 for engaging with the load lever 70 is formed at a middle section of the pressing side 606. The interlocking element 610 projects downward and extends in an outward direction.
Upper surface of the load plate 60 is slightly curved downward so that a force applied on the load plate 60 is transferred uniformly to the LGA package when the load plate 60 presses the LGA package against the socket 10. Edges of the lateral sides 604 are bent downward to form blocking walls 608.
The load lever 70 is formed by bending a single metallic wire and includes a pair of rotary shafts 702 which are spaced apart from one another. A locking section 706 is disposed between the rotary shafts 702 and is displaced relative to the rotary shafts 702. An actuating section 704 for rotating the rotary shafts 702 is bent at a right angle with respect to the rotary shafts 702. A distal end of the actuating section 704 is formed into a U-like shape in order to form a handle 708 for ease of actuation.
Assembly of the socket 10 will now be described in greater detail. As shown in
Referring to
In assembly, the socket body 30 is engaged with the stiffener 50 and no riveting or heating process is needed. Therefore, the assembly procedure of the socket 10 is simplified and the socket body 30 is free from warping. Additionally, the socket body 30 is easy to be disassembled from the stiffener 60 in case the terminals 40 or the socket body 30 is damaged during assembly.
As best shown in
The bolts 80 not only strengthens the PCB 20, but also prevents the socket 10 from departing from the PCB 20 under extreme shock or vibration at a sudden. Moreover, the soldering balls 402 disposed on the terminals 40 are free from disconnecting from the circuit pads on the PCB 20.
It should be understood that the socket body 30 may be attached to the stiffener 50 in other manners. For example, in an alternative form, the socket body 30 is designed to have an inverted pyramid shape. Prior to setting the socket 10 to the PCB 20, the stiffener 50 is engaged with upper section of the socket body 30. In course of setting the socket 10 to the PCB 20, the stiffener 50 is disengaged from the socket body 30 and slides down to lower section of the socket body 30.
In still another alternative form, the socket body 30 is configured to a T-shaped estrade including an upper horizontal section and a lower vertical section. Prior to setting the socket 10 to the PCB 20, bottom surface of the upper horizontal section is seated on the bottom wall 502 of the stiffener 50. In course of setting the socket 10 to the PCB 20, the stiffener 50 is departed from the upper horizontal section and moves down to the lower vertical section.
Referring to
It should be noted that the stiffener 50 of the present invention still can be fastened to the PCB 20 via other fastening means, such as screws and board locks, on condition that the joint between the fastening means and the PCB 20 is strong enough.
While the present invention has been described with reference to a specific embodiment, the description of the invention is illustrative and is not to be construed as limiting the invention. Various of modifications to the present invention can be made to the preferred embodiment by those skilled in the art without departing from the true spirit and scope of the invention as defined by the appended claims.
This is a continuation application of U.S. Ser. No. 11/165,674 filed Jun. 24, 2005, now U.S. Pat. No. 7,241,161
Number | Name | Date | Kind |
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7241161 | Mar | Jul 2007 | B2 |
Number | Date | Country | |
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20070259553 A1 | Nov 2007 | US |
Number | Date | Country | |
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Parent | 11165674 | Jun 2005 | US |
Child | 11825881 | US |