The present disclosure relates to a laser apparatus and an electronic device manufacturing method.
Recently, in a semiconductor exposure apparatus, resolving power improvement has been requested along with miniaturization and high integration of a semiconductor integrated circuit. Thus, the wavelength of light discharged from an exposure light source has been shortened. Examples of a gas laser apparatus for exposure include a KrF excimer laser apparatus configured to emit a laser beam having a wavelength of 248 nm approximately and an ArF excimer laser apparatus configured to emit a laser beam having a wavelength of 193 nm approximately.
The KrF excimer laser apparatus and the ArF excimer laser apparatus have a wide spectrum line width of 350 to 400 pm for spontaneous oscillation light. Thus, chromatic aberration occurs in some cases when a projection lens is made of a material that transmits ultraviolet light such as a KrF laser beam and an ArF laser beam. As a result, resolving power potentially decreases. Thus, the spectrum line width of a laser beam emitted from such a gas laser apparatus needs to be narrowed until chromatic aberration becomes negligible. To narrow the spectrum line width, a line narrowing module (LNM) including a line narrowing element (for example, etalon or grating) is provided in a laser resonator of the gas laser apparatus in some cases. In the following description, a gas laser apparatus that achieves narrowing of the spectrum line width is referred to as a line narrowed gas laser apparatus.
A laser apparatus according to an aspect of the present disclosure includes a master oscillator configured to emit a laser beam, an amplifier including an optical resonator and configured to amplify the laser beam emitted by the master oscillator in the optical resonator, and a phase shift structure disposed on an optical path between the master oscillator and the amplifier at a position closer to the amplifier than a middle point of the optical path. The phase shift structure includes a plurality of cells having different phase shift amounts for the laser beam. The cells have a disposition interval of 80 μm to 275 μm inclusive.
A laser apparatus according to another aspect of the present disclosure includes a master oscillator configured to emit a laser beam, an amplifier including an optical resonator and configured to amplify the laser beam emitted by the master oscillator in the optical resonator, and a phase shift structure disposed on an optical path between the master oscillator and the amplifier at a position closer to the amplifier than a middle point of the optical path. The phase shift structure includes a plurality of cells having different phase shift amounts for the laser beam. The cells have a disposition interval of λ/(1.5·θmax) to λ/θmin inclusive when λ represents a wavelength of the laser beam, θmax represents an upper limit of a beam expansion angle of a laser beam emitted from the amplifier, and θmin represents a lower limit of the beam expansion angle.
An electronic device manufacturing method according to another aspect of the present disclosure includes generating a laser beam amplified by an amplifier by using a laser apparatus, emitting the amplified laser beam to an exposure apparatus, and exposing a photosensitive substrate to the laser beam in the exposure apparatus to manufacture an electronic device. The laser apparatus includes a master oscillator configured to emit a laser beam, the amplifier including an optical resonator and configured to amplify the laser beam emitted by the master oscillator in the optical resonator, and a phase shift structure disposed on an optical path between the master oscillator and the amplifier at a position closer to the amplifier than a middle point of the optical path. The phase shift structure includes a plurality of cells having different phase shift amounts for the laser beam. The cells have a disposition interval of 80 μm to 275 μm inclusive.
Embodiments of the present disclosure will be described below merely as examples with reference to the accompanying drawings.
Embodiments of the present disclosure will be described below in detail with reference to the accompanying drawings. The embodiments described below are examples of the present disclosure, and do not limit the contents of the present disclosure. Not all configurations and operations described in each embodiment are necessarily essential as configurations and operations of the present disclosure. Components identical to each other are denoted by an identical reference sign, and duplicate description thereof will be omitted.
1.1 Random Phase Plate
Equiphase cells as cells having the same shape are formed in a polygonal shape. The shape of a speckle pattern changes with the shape of cells. The dimension or disposition interval of cells is referred to as a “pitch”. The “dimension” may be interpreted as a “length” or “size”.
1.2 Dimension and Aspect Ratio of Cell
Each cell of the random phase plate 10 is a minimum unit region having a predetermined shape and serving as a convex part region or a concave part region in a concave-convex pattern that provides a phase difference to light. A plurality of cells having a predetermined shape are periodically arrayed on an element surface of the random phase plate 10. The term “periodically” means regular arrangement in a particular spatially repetitive pattern. In other words, the element surface of the random phase plate 10 is divided in a plurality of cells, and each cell is formed as a concave or convex part region. A concave or convex part region is disposed spatially at random for each cell on the element surface of the random phase plate 10. A phase shift structure in which a plurality of cells having different phase shift amounts are disposed spatially at random is referred to as a “random phase structure”. The random phase plate 10 is an example of an optical element having a random phase structure.
The “aspect ratio” of the shape of each cell is defined as follows. Specifically, the aspect ratio is defined to be d2/d1 when a first direction and a second direction orthogonal to the first direction are defined as in-surface directions parallel to the element surface of the random phase plate 10, d1 represents the length of the cell in the first direction, and d2 represents the length of the cell in the second direction.
In a case of a laser apparatus including an oscillation stage laser (master oscillator) and an excimer amplifier (power oscillator), the excimer amplifier including an optical resonator, the first direction is specified in relation to a discharge direction (the V direction) of the excimer amplifier. The first direction is a direction corresponding to the V direction, and the second direction is a direction corresponding to the H direction. “Corresponding directions” are relatively same directions in beam sections at different positions on an optical path. In a case in which a mirror or the like that changes the traveling direction of a laser beam exists on the optical path between the random phase plate 10 and the excimer amplifier, the first direction of the random phase plate 10 and the discharge direction of the excimer amplifier are different from each other in some cases. However, it is understood that the first direction in a beam section of a laser beam having passed through the random phase plate 10 and the V direction in a beam section of a laser beam entering the excimer amplifier are relatively same directions.
The first direction may be parallel to the V direction in a case in which neither a mirror nor the like that changes the traveling direction of a laser beam exists on the optical path between the random phase plate 10 and the excimer amplifier and the first direction in a beam section of a laser beam having passed through the random phase plate 10 is maintained when the laser beam enters the excimer amplifier.
The term “parallel” in the present specification may include the concept of being substantially parallel, which can be regarded as being parallel in effect in technological meanings. The term “perpendicular” or “orthogonal” in the present specification may include the concept of being substantially perpendicular or substantially orthogonal, which can be regarded as being perpendicular in effect or orthogonal in effect in technological meanings.
2.1 Configuration
The laser apparatus 20 includes a master oscillator 22, high reflectance mirrors 24 and 26, and a power oscillator 28. The master oscillator 22 is a discharge-pumped excimer laser apparatus including a line narrowing module (LNM) 30, a chamber 32, and an output coupling mirror 34.
The LNM 30 includes a prism 36 for narrowing a spectrum width and a grating 38. The grating 38 is disposed in Littrow arrangement such that an incident angle is equal to a diffracting angle. The output coupling mirror 34 is a partially reflective mirror having a reflectance of 20% to 30%. The output coupling mirror 34 is disposed to constitute an optical resonator together with the LNM 30.
The chamber 32 is disposed on the optical path of the optical resonator. The chamber 32 includes a pair of discharge electrodes 40a and 40b and two windows 42 and 44 through which a laser beam passes. Laser gas is introduced into the chamber 32. The laser gas is excimer laser gas containing rare gas, halogen gas, and buffer gas. The rare gas may be, for example, argon (Ar) or krypton (Kr) gas. The halogen gas may be, for example, fluorine (F2) gas. The buffer gas may be, for example, neon (Ne) gas. Voltage is applied between the discharge electrodes 40a and 40b by a non-illustrated power source. The power source may be a pulse power module (PPM) including a switch and a charging capacitor.
The high reflectance mirrors 24 and 26 are disposed on the optical path between the master oscillator 22 and the power oscillator 28 such that a laser beam emitted from the master oscillator 22 enters the power oscillator 28.
The power oscillator 28 is an excimer amplifier including a rear mirror 50, a chamber 52, and an output coupling mirror 54. The rear mirror 50 and the output coupling mirror 54 constitute an optical resonator, and the chamber 52 is disposed on the optical path of the optical resonator. The configuration of the chamber 52 may be the same as that of the chamber 32 of the master oscillator 22. The chamber 52 includes a pair of discharge electrodes 60a and 60b and two windows 62 and 64. The laser gas is introduced into the chamber 52. The rear mirror 50 is a partially reflective mirror having a reflectance of 80% to 90%. The output coupling mirror 54 is a partially reflective mirror having a reflectance of 20% to 30%.
In
2.2 Operation
When discharge occurs with voltage applied between the discharge electrodes 40a and 40b in the chamber 32 of the master oscillator 22, the laser gas is excited and a pulse laser beam having a spectral width that is narrowed via the optical resonator constituted by the output coupling mirror 34 and the LNM 30 is output from the output coupling mirror 34.
The pulse laser beam is transmitted via the high reflectance mirrors 24 and 26 and incident as a seed beam on the rear mirror 50 of the power oscillator 28. The seed beam having passed through the rear mirror 50 enters the chamber 52. When the seed beam enters the chamber 52, discharge is caused between the discharge electrodes 60a and 60b. As a result, the laser gas in the chamber 52 is excited, the seed beam is amplified by the optical resonator constituted by the output coupling mirror 54 and the rear mirror 50, and the amplified laser beam is output as an output laser beam LP from the output coupling mirror 54.
2.3 Problem
Since the rear mirror 50 of the power oscillator 28 is a partially reflective mirror having a reflectance of 80% to 90%, part of a laser beam emitted by the master oscillator 22 is reflected by the rear mirror 50 and returned to the master oscillator 22 side. The laser beam returned to the master oscillator 22 side is referred to as “return light”. This return light RL adversely affects stability of emission energy and wavelength in some cases.
Specifically, the return light RL is returned to the master oscillator 22, taken into the optical resonator again, and increases a thermal load on the master oscillator 22 as a result, which destabilizes performance of the master oscillator 22.
The laser apparatus 100 includes the random phase plate 10 on the optical path between the rear mirror 50 and the high reflectance mirror 26. The random phase plate 10 may be disposed in a housing of the power oscillator 28. The distance between the random phase plate 10 and the rear mirror 50 is preferably as short as possible. When the distance between the random phase plate 10 and the rear mirror 50 is shortened, decrease of the efficiency of seed beam injection into the optical resonator of the power oscillator 28 can be suppressed and the distance between the random phase plate 10 and the output coupling mirror 34 of the master oscillator 22 relatively increases. Accordingly, due to beam expansion of the return light RL by the random phase plate 10 as well, the amount of light reentering the master oscillator 22 can be reduced. The random phase plate 10 is an example of a “phase shift structure” in the present disclosure. The power oscillator 28 is an example of an “amplifier” in the present disclosure. The high reflectance mirrors 24 and 26 are an example of “a plurality of mirrors” in the present disclosure. The high reflectance mirror 26 is an example of a “mirror closest to the optical resonator among the mirrors” in the present disclosure.
In the laser apparatus 100, a non-illustrated aperture may be disposed near the output coupling mirror 34 of the master oscillator 22 to shield the return light RL expanded through the random phase plate 10. The aperture may have a size substantially equal to that of the beam shape of a laser beam emitted from the master oscillator 22.
When the random phase plate 10 is disposed at a close distance of 20 cm or shorter from the rear mirror 50, the distance between the random phase plate 10 and the output coupling mirror 34 of the master oscillator 22 is relatively long and thus the effect of suppressing return light to the master oscillator 22 can be sufficiently obtained.
As for the pitch of the random phase plate 10, a preferable pitch condition is specified based on the beam expansion angles of a laser beam emitted from the power oscillator 28 from a viewpoint as follows. The beam expansion angles of the output laser beam LP coming out of the power oscillator 28 with no random phase plate 10 provided on the optical path between the master oscillator 22 and the power oscillator 28 are defined as θAH and θAV. The angle θAH is the beam expansion angle in the H direction, and the angle θAV is the beam expansion angle in the V direction. The beam expansion angles in the H and V directions after transmission through the random phase plate 10 are defined as θRPP_H and θRPP_V. The angles θRPP_H and θRPP_V are approximated by expressions below.
In the expressions, λ represents the wavelength, dH represents the H direction length of each cell, and dV represents the V direction length of each cell.
The pitch of the random phase plate 10 is selected such that the beam expansion angles are substantially equal to θAH and θAV, respectively, in other words, Expressions (3) and (4) below are satisfied.
The description “substantially equal” implies approximation with a difference in a predetermined allowable range. Specifically, the H direction length dH of each cell is selected such that θRPP_H is approximate to θAH with a difference from θAH in a predetermined allowable range, and the V direction length dV of each cell is selected such that θRPP_V is approximate to θAV with a difference from θAV in a predetermined allowable range.
The predetermined allowable ranges may be set as appropriate within a range in which a technological effect is obtained. The allowable ranges may have the same allowable amount in the V and H directions or may be different between the directions. For example, such an allowable range may be set that the difference between θRPP_H and θAH is equal to or smaller than 10% of θAH, the difference between θRPP_H and θAH is equal to or smaller than 0.1 milliradian [mrad], or θRPP_H is not more than 1.5 times larger than θAH. Description that a pitch is “selected” means that the random phase plate 10 of such a pitch is used for the laser apparatus 100, and includes the concept of being “determined”, “specified”, and “designed” as the pitch of the random phase plate 10 applied to the laser apparatus 100.
When conditions of Expressions (3) and (4) are satisfied, the beam expansion angles after transmission through the random phase plate 10 are substantially equal to the expansion angles of a laser beam emitted from the master oscillator 22, and accordingly, decrease of the efficiency of light injection into the power oscillator 28 can be suppressed.
Assume that the laser apparatus 100 is an ArF excimer laser apparatus having a wavelength λ of 193 nm, a Gaussian distribution beam profile in the H direction, and a top-hat beam profile in the V direction.
Typical values of the beam expansion angles θAH and θAV of a laser beam emitted from the ArF excimer laser apparatus in the H and V directions substantially satisfy ranges below.
H direction: 0.8 mrad≤θAH≤2.4 mrad (5)
V direction: 0.7 mrad≤θAV≤1.6 mrad (6)
The beam expansion angle θRPP of a laser beam having passed through the random phase plate 10 and a cell pitch d have a relation represented by an expression below.
θRPP=λ/d (7)
A condition on the pitch dH that satisfies Expressions (3) and (5) is calculated, by using the relation of Expression (7), to be a range represented by Expression (8) below.
80 μm≤dH≤241 μm (8)
Similarly, a condition on the pitch dV that satisfies Expressions (4) and (6) is calculated, by using the relation of Expression (7), to be a range represented by Expression (9) below.
120 μm≤dV≤275 μm (9)
When the H and V directions are comprehensively handled based on Expressions (8) and (9), the pitch d of the random phase plate 10 has a preferable range represented by Expression (10) below.
80 μm≤d≤275 μm (10)
The angles θAH in Expression (5) and θAV in Expression (6) are each an example of “θA”, in other words, a “beam expansion angle of a laser beam emitted from the amplifier” in the present disclosure. The angles “2.4 mrad” in Expression (5) and “1.6 mrad” in Expression (6) are each an example of “θmax”, in other words, the “upper limit of the beam expansion angle of the laser beam emitted from the amplifier” in the present disclosure. The angles “0.8 mrad” in Expression (5) and “0.7 mrad” in Expression (6) are each an example of “θmin”, in other words, the “lower limit of the beam expansion angle of the laser beam emitted from the amplifier” in the present disclosure. The angle “2.4 mrad” in Expression (5) is an example of “θAH1”, in other words, the “upper limit of the beam expansion angle of the laser beam emitted from the amplifier in the H direction” in the present disclosure. The angle “1.6 mrad” in Expression (6) is an example of “θAV1”, in other words, the “upper limit of the beam expansion angle of the laser beam emitted from the amplifier in the V direction” in the present disclosure. The angle “0.8 mrad” in Expression (5) is an example of “θAH2”, in other words, the “lower limit of the beam expansion angle of the laser beam emitted from the amplifier in the H direction” in the present disclosure. The angle “0.7 mrad” in Expression (6) is an example of “θAV2”, in other words, the “lower limit of the beam expansion angle of the laser beam emitted from the amplifier in the V direction” in the present disclosure.
When it is assumed that the numerical ranges of the beam expansion angle conditions represented by Expressions (5) and (6) are expanded to have upper limit values of 1.5 times larger, conditions represented by Expressions (11) and (12) below are obtained.
H direction: 0.8 mrad≤θAH≤3.6 mrad (11)
V direction: 0.7 mrad≤θAV≤2.4 mrad (12)
When the conditions of Expressions (11) and (12) are applied in place of those of Expressions (5) and (6), a condition on the pitch dH that satisfies Expressions (3) and (11) is calculated, by using the relation of Expression (7), to be a range represented by Expression (13) below.
53 μm≤dH≤241 μm (13)
Similarly, a condition on the pitch dV that satisfies Expressions (4) and (12) is calculated, by using the relation of Expression (7), to be a range represented by Expression (14) below.
80 μm≤dV≤275 μm (14)
When the H and V directions are comprehensively handled based on Expressions (13) and (14), the pitch d has a preferable range represented by Expression (15) below.
53 μm≤d≤275 μm (15)
As understood from the above discussion of specific numerical example 1, when θAmax and θAmin represent the upper and lower limit values of the beam expansion angle θA of a Laser Beam Emitted from the Power Oscillator 28 of the laser apparatus 100, the pitch d has a preferable range expressed by, for example, Expression (16) below.
λ/θAmax≤d≤λ/θAmin (16)
In addition, as understood from the above discussion of specific numerical example 2, when the beam expansion angle θRPP of a laser beam having passed through the random phase plate 10 is allowed to be 1.5 times larger than θAmax, the pitch d has a preferable range expressed by, for example, Expression (17) below.
λ/(1.5·θAmax)≤d≤λ/θAmin (17)
As clearly understood from Expressions (16) and (17), the minimum value of the selectable range of the pitch d is specified based on the upper limit value θAmax of the beam expansion angle θA of a laser beam emitted from the power oscillator 28. The minimum value (lower limit value) of the selectable range of the pitch d changes depending on a degree to which the difference between θRPP and θAmax is allowed. When θRPP is allowed to be k times larger than θAmax, the pitch d has a preferable range expressed by Expression (18) below.
λ/(k·θAmax)≤d≤λ/θAmin (18)
In the expression, k is a value equal to or larger than one and may be, for example, a value that satisfies 1≤k≤1.5.
The random phase plate 10 having the pitch d that is suitable for a condition is used for the laser apparatus 100 based on the concept described by using Expressions (16) to (18).
The seed beam emitted from the master oscillator 22 passes through the random phase plate 10 and enters the optical resonator of the power oscillator 28. The seed beam reflected by the rear mirror 50 and part of the laser beam amplified by the optical resonator of the power oscillator 28 are output as the return light RL from the rear mirror 50. The random phase plate 10 functions to expand the beam expansion angles of the return light RL output from the rear mirror 50 toward the master oscillator 22. The power oscillator 28 is an example of the “amplifier” in the present disclosure.
In the laser apparatus 100 according to Embodiment 1, the pitch of the random phase plate 10 is selected such that the beam expansion angle θRPP of a laser beam having passed through the random phase plate 10 is as close as possible to θA, and thus decrease of the efficiency of light injection into the optical resonator of the power oscillator 28 is suppressed. Moreover, the amount of light returned to the master oscillator 22 decreases since the return light RL diffuses while passing through the random phase plate 10. Accordingly, stability degradation of energy and wavelength due to the return light RL can be suppressed. Furthermore, decrease of the efficiency of light injection into the optical resonator of the power oscillator 28 can be efficiently suppressed since each cell has a cell shape with an aspect ratio in which the V direction length dV and the H direction length dH are different from each other as described with reference to
4.1 Configuration
The partial reflection film 72 and the output coupling mirror 54 constitute an optical resonator. The random phase structure film 80 has a structure same as the cell structure of the random phase plate 10.
4.2 Operation
The seed beam emitted from the master oscillator 22 passes through the optical element 70 and enters the optical resonator of the power oscillator 28. Part of the laser beam amplified by the optical resonator of the power oscillator 28 is output as the return light RL from the optical element 70. The random phase structure film 80 functions to expand the beam expansion angles of the return light RL output from the optical element 70 toward the master oscillator 22.
4.3 Effect
In the laser apparatus 102 according to Embodiment 2, similarly to the laser apparatus 100 according to Embodiment 1, decrease of the efficiency of light injection into the optical resonator of the power oscillator 28 is suppressed. Moreover, the amount of light returned to the master oscillator 22 decreases since the return light RL diffuses while passing through the random phase structure film 80. Accordingly, stability degradation of energy and wavelength due to the return light RL can be suppressed.
According to Embodiment 2, decrease of the light injection efficiency is further suppressed as compared to Embodiment 1 since the partial reflection film 72 and the random phase structure film 80 are provided on the same optical element 70. In addition, according to Embodiment 2, stability degradation of energy and wavelength due to the return light RL can be further suppressed as compared to Embodiment 1.
5.1 Configuration
Specifically, the laser apparatus 103 illustrated in
The random phase plate 10 is disposed on the optical path between the master oscillator 22 and the output coupling mirror 154. The random phase plate 10 is preferably disposed as close as possible to the output coupling mirror 154. As described with reference to
5.2 Operation
The seed beam emitted from the master oscillator 22 is incident on the output coupling mirror 154 of the amplifier 128 through the random phase plate 10. A surface of the output coupling mirror 154 on a side on which the seed beam is incident is a beam imaging position of the non-illustrated output coupling mirror (refer to reference sign 34 in
The seed beam is amplified when control to cause discharge between the electrodes is performed while the seed beam exists in the discharge space. The amplified laser beam is output from the chamber 152 through the window 164. The laser beam output from the window 164 is highly reflected by the high reflectance mirrors 122 and 123, proceeds to the discharge space in the chamber 152 through the window 164 again, and is amplified.
The laser beam thus amplified is output from the chamber 152 through the window 162. The amplified laser beam output from the window 162 is incident on the output coupling mirror 154. Part of the amplified laser beam incident on the output coupling mirror 154 passes through the output coupling mirror 154 and is emitted as the output laser beam LP from the amplifier 128 toward a non-illustrated exposure apparatus.
The other part of the amplified laser beam incident on the output coupling mirror 154 is reflected by the output coupling mirror 154 and returned as feedback light into the ring resonator again. Part of the laser beam amplified by the ring resonator is output as the return light RL from the output coupling mirror 154 toward the master oscillator 22.
Similarly to Embodiment 1, the random phase plate 10 functions to expand the beam expansion angles of the return light RL.
5.3 Effect
Effects same as those of the laser apparatus 100 according to Embodiment 1 are obtained with the laser apparatus 103 according to Embodiment 3.
6.1 Configuration
Although a detailed configuration of the ultraviolet solid-state laser apparatus 112 is not illustrated, the ultraviolet solid-state laser apparatus 112 may be, for example, a laser apparatus in which a titanium sapphire laser having a narrowed spectral width and a non-linear crystal are combined. Alternatively, the ultraviolet solid-state laser apparatus 112 may be, for example, a laser apparatus in which a semiconductor laser and a non-linear crystal are combined. The non-linear crystal is used at a wavelength conversion unit.
Contents described with reference to
6.2 Operation
The seed beam emitted from the ultraviolet solid-state laser apparatus 112 passes through the random phase plate 10 and enters the optical resonator of the power oscillator 28. Part of the laser beam amplified by the optical resonator of the power oscillator 28 is output as the return light RL from the rear mirror 50. The random phase plate 10 functions to expand the beam expansion angles of the return light RL output from the rear mirror 50 toward the ultraviolet solid-state laser apparatus 112.
When the return light RL is returned to the non-linear crystal of the wavelength conversion unit, the light would cause a thermal load or the like and potentially destabilize oscillation performance. However, since the return light RL is diffused by the random phase plate 10, the amount of light returned to the non-linear crystal of the wavelength conversion unit is suppressed.
6.3 Effect
In the laser apparatus 104 according to Embodiment 4, decrease of the efficiency of light injection into the optical resonator of the power oscillator 28 is suppressed, and the amount of light returned to the ultraviolet solid-state laser apparatus 112 decreases since the return light RL passes and diffuses through the random phase plate 10. Accordingly, stability degradation of energy and wavelength due to the return light RL can be suppressed. Moreover, according to Embodiment 4, degradation of an optical element such as a non-linear crystal can be suppressed.
6.4 Modification
The optical element 70 as a rear mirror with a random phase structure, which is described in Embodiment 2, may be employed in place of the random phase plate 10 and the rear mirror 50 in the laser apparatus 104 illustrated in
The exposure apparatus 300 translates the reticle stage RT and the workpiece table WT in synchronization such that the workpiece is exposed to the laser beam on which the reticle pattern is reflected. A semiconductor device can be manufactured through a plurality of processes after the reticle pattern is transferred onto the semiconductor wafer through the exposure process as described above. The semiconductor device is an example of an “electronic device” in the present disclosure. The laser apparatuses 102, 103, and 104 described above in Embodiments 2 to 4 may be each used in place of the laser apparatus 100.
The description above is intended to be illustrative and the present disclosure is not limited thereto. Therefore, it would be obvious to those skilled in the art that various modifications to the embodiments of the present disclosure would be possible without departing from the spirit and the scope of the appended claims. Further, it would be also obvious for those skilled in the art that embodiments of the present disclosure would be appropriately combined.
The terms used throughout the present specification and the appended claims should be interpreted as non-limiting terms. For example, terms such as “comprise”, “include”, “have”, and “contain” should not be interpreted to be exclusive of other structural elements. Further, indefinite articles “a/an” described in the present specification and the appended claims should be interpreted to mean “at least one” or “one or more”. Further, “at least one of A, B, and C” should be interpreted to mean any of A, B, C, A+B, A+C, B+C, and A+B+C as well as to include combinations of the any thereof and any other than A, B, and C.
The present application is a continuation application of International Application No. PCT/JP2020/013579, filed on Mar. 26, 2020, the entire contents of which are hereby incorporated by reference.
Number | Date | Country | |
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Parent | PCT/JP2020/013579 | Mar 2020 | US |
Child | 17818178 | US |