Claims
- 1. A laser capture microdissection method, comprising:
providing a sample that is to undergo laser capture microdissection; positioning said sample on a translation stage of a laser capture microdissection instrument and within an optical axis of said laser capture microdissection instrument, said translation stage including a vacuum chuck having a beam path hole through which said optical axis extends; holding a sample holder in a position over said beam path hole, said sample being located upon said sample holder; providing a transfer film carrier having a substrate surface and a laser capture microdissection transfer film coupled to said substrate surface; placing said laser capture microdissection transfer film in juxtaposition with said sample with a pressure sufficient to allow laser capture microdissection transfer of a portion of said sample to said laser capture microdissection transfer film, without forcing nonspecific transfer of a remainder of said sample to said laser capture microdisection film; and then transferring a portion of said sample to said laser capture microdissection transfer film, without forcing nonspecific transfer of a remainder of said sample to said laser capture microdissection transfer film.
- 2. The method of claim 1, further comprising translating said sample holder with regard to said translation stage.
- 3. The method of claim 1, wherein holding a sample holder in said position over said beam path hole includes holding said sample holder with a force and modulating said force.
- 4. The method of claim 1, further comprising pulling a vacuum on said sample holder.
- 5. The method of claim 1, further comprising applying a force to an edge of said sample holder to move said sample holder with regard to said translation stage.
- 6. The method of claim 1, further comprising moving said sample holder in any direction parallel with a top surface of said translation stage without constraint.
- 7. A laser capture microdissection instrument, comprising:
a translation stage; and a vacuum chuck coupled to said translation stage.
- 8. The laser capture microdissection instrument of claim 7, wherein said vacuum chuck includes a beam path hole.
- 9. The laser capture microdissection instrument of claim 8, wherein a top surface of said vacuum chuck includes a first manifold hole and a second manifold hole.
- 10. The laser capture microdissection instrument of claim 9, wherein a sample holder is placed over said beam path hole, said first manifold hole, and said second manifold hole.
- 11. The laser capture microdissection instrument of claim 10, wherein there is leakage around a perimeter of said sample holder which modulates a force holding said sample holder in place.
- 12. The laser capture microdissection instrument of claim 7, wherein said vacuum chuck includes a conduit.
- 13. The laser capture microdissection instrument of claim 12, wherein said conduit is connected to a circular manifold that is coupled to a first manifold hole and a second manifold hole.
- 14. The laser capture microdissection instrument of claim 7, wherein there are no structures that project above a top surface of said vacuum chuck.
- 15. The laser capture microdissection instrument of claim 7, further comprising a transfer film carrier handling subsystem connected to said translation stage.
- 16. The laser capture microdissection instrument of claim 7, further comprising an illumination/laser optical subsystem coupled to said translation stage.
- 17. The laser capture microdissection instrument of claim 7, further comprising a manual joystick subsystem connected to said translation stage.
- 18. An inverted microscope, comprising:
a translation stage; and a vacuum chuck connected to said translation stage.
- 19. The laser capture microdissection instrument of claim 18, wherein said vacuum chuck includes a beam path hole.
- 20. The laser capture microdissection instrument of claim 19, wherein a top surface of said vacuum chuck includes a first manifold hole and a second manifold hole.
- 21. The laser capture microdissection instrument of claim 20, wherein a sample holder is placed over said beam path hole, said first manifold hole, and said second manifold hole.
- 22. The laser capture microdissection instrument of claim 21, wherein there is leakage around a perimeter of said sample holder which modulates a force holding said sample holder in place.
- 23. The laser capture microdissection instrument of claim 18, wherein said vacuum chuck includes a conduit.
- 24. The laser capture microdissection instrument of claim 23, wherein said conduit is connected to a circular manifold that is coupled to a first manifold hole and a second manifold hole.
- 25. The laser capture microdissection instrument of claim 18, wherein there are no structures that project above a top surface of said vacuum chuck.
- 26. The inverted microscope of claim 18, further comprising a transfer film carrier handling subsystem connected to said translation stage.
- 27. The inverted microscope of claim 18, further comprising an illumination/laser optical subsystem coupled to said translation stage.
- 28. The inverted microscope of claim 18, further comprising a manual joystick subsystem connected to said translation stage.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a divisional of U.S. Ser. No. 09/121,691, filed Jul. 23, 1998, which is a continuation of U.S. Ser. No. 09/018,452, filed Feb. 4, 1998, now U.S. Pat. No. 6,469,779, and claims benefit of both U.S. Ser. No. 60/060,731, filed Oct. 1, 1997 and U.S. Ser. No. 60/037,864, filed Feb. 7, 1997, the entire contents of all of which are hereby incorporated herein by reference as if fully set forth herein.
Provisional Applications (2)
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Number |
Date |
Country |
|
60060731 |
Oct 1997 |
US |
|
60037864 |
Feb 1997 |
US |
Divisions (1)
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Number |
Date |
Country |
Parent |
09121691 |
Jul 1998 |
US |
Child |
10722272 |
Nov 2003 |
US |
Continuations (1)
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Number |
Date |
Country |
Parent |
09018452 |
Feb 1998 |
US |
Child |
09121691 |
Jul 1998 |
US |