LASER PROCESSING METHOD

Abstract

A laser processing method for cutting, by laser beam, a cutting path (A0) of a workpiece having a corner (B) between a first cutting path (A1) and a second cutting path (A2) is provided. The workpiece is cut under the first cutting conditions (X) from the first cutting path to the corner, and under the second cutting conditions smaller in cutting ability than the first cutting conditions for a predetermined section (A21) on the second cutting path from the corner. The workpiece is cut under the first cutting conditions on the second cutting path after finished the predetermined section. The cutting conditions are continuously changed at the time of switching from the first cutting conditions to the second cutting conditions and/or from the second cutting conditions to the first cutting conditions. In this way, a processing defect is prevented while suppressing the delay of the cutting time at the time of cutting along the cutting path including the corner.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram showing a laser processing device including a laser machine according to this invention.

FIG. 2 is a flowchart showing the operation for carrying out the laser processing method of the laser machine according to this invention.

FIG. 3 is a flowchart showing the operation for carrying out the laser processing method of the laser machine according to this invention.

FIG. 4 is a diagram showing the relation between the cutting conditions and time according to an embodiment of the invention.

FIG. 5 is a diagram showing a map relating to the length of the section C2.

FIG. 6 is a diagram showing the relation between the cutting conditions and time according to another embodiment of the invention.

FIG. 7 a is a schematic diagram showing an example of the cutting path including an ordinary corner.

FIG. 7 b is a diagram showing another example of the cutting path including an ordinary corner.

FIG. 8 a is a diagram showing the relation between the cutting conditions and the time according to the prior art.

FIG. 8 b is a diagram showing the state of the workpiece section at the time of laser cutting according to the prior art.

Claims

1. A laser processing method for cutting, by laser beam, a cutting path of a workpiece having a corner between a first cutting path and a second cutting path, comprising the steps of: cutting the workpiece under the first cutting conditions from the first cutting path to the corner;cutting the workpiece under the second cutting conditions, smaller in cutting ability than the first cutting conditions, for a predetermined section on the second cutting path from the corner; andcutting the workpiece under the first cutting conditions on the second cutting path after completing the predetermined section;wherein, at the time of a selected one of switching from the first cutting conditions to the second cutting conditions and switching from the second cutting conditions to the first cutting conditions, the cutting conditions are continuously changed.

2. A laser processing method for cutting, by laser a cutting path of a workpiece having a corner section containing a corner, between a first cutting path and a second cutting path, comprising the steps of: cutting the workpiece under the first cutting conditions from the first cutting path to immediately before the corner section;cutting the workpiece, in the corner section, under the second cutting conditions smaller in cutting ability than the first cutting conditions; andcutting the workpiece under the first cutting conditions on the second cutting path after finishing the corner section;wherein, at the time of at least a selected one of switching from the first cutting conditions to the second cutting conditions and switching from the second cutting conditions to the first cutting conditions, the cutting conditions are continuously changed.

3. The laser processing method according to claim 1, wherein the cutting conditions are continuously changed over a predetermined time length.

4. The laser processing method according to claim 1, wherein the cutting conditions are changed continuously for a predetermined distance.

5. The laser processing method according to claim 4, wherein the predetermined section is determined based on at least one of the material, thickness of the workpiece and the angle of the corner.

6. The laser processing method according to claim 3, wherein the predetermined time length is configured of a plurality of minor time lengths, and the cutting conditions are changed to each of predetermined cutting conditions in each of the minor time lengths.

7. The laser processing method according to claim 1, wherein the cutting conditions include at least selected one of the laser output, the duty factor of the pulse, the pulse frequency, the assist gas pressure and the cutting speed.

8. The laser processing method according to claim 1, wherein the cutting conditions are determined based on at least one of the material, the thickness of the workpiece and the angle of the corner.