The present invention relates to a laser processing monitoring device, a laser processing monitoring method, and a laser processing device.
Conventionally, in a laser processing device, a technology for determining the quality of laser processing has been used. Specifically, a laser processing device has a photodetector or an optical sensor incorporated into a processing head that irradiates workpiece with a laser beam. A beam to be measured which is generated or reflected near a processing point of the workpiece is received by the optical sensor through an optical system in the processing head. The laser processing device performs a predetermined signal process for an electric signal (sensor output signal) obtained by photoelectric conversion of the optical sensor, so that the quality of the laser processing is determined.
In this kind of laser processing monitoring technology, not only hardware and software are simpler compared to a technique of image analysis of a processing situation near the processing point using an imaging device, but also qualitative improvement of monitoring is achieved depending on ingenuity of a signal process technology. For example, in laser welding, it is also possible to precisely monitor or analyze subtle behavior and change of a weld part.
However, while the present inventors promote the research and development of the laser processing monitoring technology as described above, an error in a photoelectric conversion characteristic of the optical sensor becomes a major hindrance in improvement of monitoring performance. That is, the photoelectric conversion characteristic of a photodiode used in the optical sensor inevitably changes over time and, furthermore, is also influenced by an environmental condition such as an ambient temperature. When the photoelectric conversion characteristic of the photodiode changes, even when a beam to be measured having the same light intensity is received from the workpiece side, a value of a sensor output signal obtained after photoelectric conversion of the beam. Therefore, even when the performance of a digital signal process technology is made higher, it is not possible to monitor and analyze laser processing precisely, and it is not possible to determine the quality accurately.
In order to cope with this problem, the present inventors use the following calibration method. First, at the time of shipment or setting of the laser processing device, as part of initialization, a reference workpiece sample is irradiated with a laser beam with reference power. Then, a waveform of a sensor output signal obtained from the optical sensor in the processing head is acquired as a reference waveform SW such as a waveform illustrated in
As illustrated in
When the optical sensor is calibrated, a waveform RW of a sensor output signal obtained by irradiating the same workpiece sample with a laser beam with the same reference power is displayed on a monitor screen (maintenance screen) together with the upper and lower limit value envelopes JW+δ and JW−δ. Then, the waveform RW of the sensor output signal protrudes outside the upper and lower limit value envelopes JW+δ and JW−δ, for example, as illustrated in
However, it is found that the above optical sensor calibration method is not a valid solution. That is, a laser oscillation unit and the workpiece sample involve a radiation source of a test beam received by the optical sensor during calibration, and a laser optical system is interposed in an optical path of the test beam. Therefore, an error between the reference waveform SW in initial acquisition and the waveform RW of the sensor output signal in current acquisition includes not only the variation of the photoelectric conversion characteristic of the optical sensor, but also the variation of the optical characteristic or the physical characteristic of an involving element or an interposing element thereof. Therefore, it is not possible to perform calibration focused on the photoelectric conversion characteristic of the optical sensor. Furthermore, there is no guarantee that the light intensity of the test beam for calibration is always constant. Therefore, it is not possible to correct the error of the photoelectric conversion characteristic of the optical sensor correctly. In addition, in order to involve the laser oscillation unit and the workpiece sample in the calibration of the optical sensor, calibration work is troublesome and large-scale.
Furthermore, the optical sensor calibration method described above is a method for performing calibration based on relative comparison between the reference waveform SW unique to a device and the waveform RW of the sensor output signal in current acquisition, and a calibration reference value of the optical sensor varies per device. Therefore, a difference in monitoring performance and accuracy between an actually indicated value and a value to be originally indicated causes variation as the individual difference of the laser processing device of the same model using the optical sensor of the same product. That is, the instrument error between laser processing devices of the same model varies among the same model, and therefore it is not possible to perform the same quality evaluation under the setting of the same processing condition.
A laser processing monitoring device of an aspect of the present invention is a laser processing monitoring device for photoelectrically converting a predetermined beam to be measured by an optical sensor disposed in a processing head or in proximity to the processing head to acquire a sensor output signal representing light intensity of the beam to be measured, and monitoring the laser processing based on the sensor output signal, during irradiation to a workpiece with a laser beam for laser processing by the processing head, the predetermined beam to be measured being generated or reflected in a vicinity of a processing point of the workpiece, the laser processing monitoring device including: a reference beam source provided in the processing head, and configured to generate a reference beam for calibrating the optical sensor; a reference beam source power supply unit configured to supply, to the reference beam source, adjustable power for generating the reference beam; and an optical measuring instrument having a beam receiver for receiving the reference beam from the reference beam source in order to calibrate the reference beam source, and configured to measure light intensity of the received reference beam or a predetermined physical quantity equivalent to the light intensity.
In the laser processing monitoring device of the aspect of the present invention, the optical sensor for monitoring laser processing is calibrated using the reference beam source built in the processing head, and this reference beam source is calibrated through the optical measuring instrument built in the device, and therefore even when the electrical-to-optical conversion characteristic of the reference beam source changes over time or fluctuates due to an environmental condition, it is possible to correct this timely and appropriately. Additionally, even when the photoelectric conversion characteristic of the optical sensor changes over time or fluctuates due to an environmental condition, it is possible to correct this timely and appropriately.
A laser processing monitoring method of an aspect of the present invention is a laser processing monitoring method for photoelectrically converting a beam to be measured by an optical sensor disposed in a processing head or in proximity to the processing head to acquire a sensor output signal representing light intensity of the beam to be measured, and monitoring the laser processing based on the sensor output signal, during irradiation to a workpiece with a laser beam for laser processing by the processing head, the beam to be measured being generated or reflected in a vicinity of a processing point of the workpiece, the laser processing monitoring method including: providing the optical sensor in a sensor unit built into the processing head, or disposed in proximity to the processing head; mounting, on the sensor unit, a reference beam source that generates a reference beam for calibrating the optical sensor; setting a first optical path optically connecting the processing point of the workpiece and the optical sensor inside the sensor unit when the laser processing is performed; setting a second optical path optically connecting the reference beam source and the optical sensor inside the sensor unit when the optical sensor is calibrated; and causing the reference beam emitted from the reference beam source to be incident on a beam receiver of an optical measuring instrument in order to calibrate the reference beam source, and adjusting output of the reference beam source such that a measured value of the optical measuring instrument coincides with a reference value.
In the laser processing monitoring method of the aspect of the present invention, when laser processing is monitored, the first optical path is set in the sensor unit and the beam to be measured is made incident on the optical sensor from the workpiece side. Additionally, when the optical sensor is calibrated, the second optical path is set in the sensor unit, and the reference beam from the reference beam source is made incident on the optical sensor. Then, when the reference beam source is calibrated, the reference beam from the reference beam source is made incident on the beam receiver of the optical measuring instrument. Consequently, even when the electrical-to-optical conversion characteristic of the reference beam source changes over time or fluctuates due to an environmental condition, it is possible to correct this timely and appropriately. Additionally, even when the photoelectric conversion characteristic of the optical sensor changes over time or fluctuates due to an environmental condition, it is possible to correct this timely and appropriately.
A laser processing device of an aspect of the present invention includes: a laser oscillation unit configured to oscillate and output a laser beam for laser processing; a processing head optically connected to the laser oscillation unit via an optical fiber cable, and configured to focally irradiate a processing point of a workpiece with the laser beam from the laser oscillation unit; and a laser processing monitor unit configured to monitor laser processing, wherein the laser processing monitor unit has: an optical sensor disposed in the processing head or in proximity to the processing head, and configured to output a sensor output signal representing light intensity of a predetermined beam to be measured, the predetermined beam to be measured being generated or reflected in a vicinity of the processing point of the workpiece; a sensor signal processing unit configured to generate digital waveform data for the sensor output signal from the optical sensor, and display and output a waveform of the sensor output signal based on the waveform data; a reference beam source configured to generate a reference beam for calibrating the optical sensor; a reference beam source power supply unit configured to supply, to the reference beam source, adjustable power for generating the reference beam; and an optical measuring instrument having a beam receiver for receiving the reference beam from the reference beam source in order to calibrate the reference beam source, and configured to measure light intensity of the received reference beam or a predetermined physical quantity equivalent to the light intensity.
In the laser processing device of the aspect of the present invention, the optical sensor of the laser processing monitor unit is calibrated using the reference beam source built in the device, and this reference beam source is calibrated through the optical measuring instrument built in the device, and therefore even when the electrical-to-optical conversion characteristic of the reference beam source changes over time or fluctuates due to an environmental condition, it is possible to correct this timely and appropriately. Additionally, even when the photoelectric conversion characteristic of the optical sensor changes over time or fluctuates due to an environmental condition, it is possible to correct this timely and appropriately. The monitoring performance of the laser processing monitor unit is thus improved, so that it is possible to perform qualified quality determination for laser processing.
According to the laser processing monitoring device or the laser processing monitoring method of the aspect of the present invention, with the above configuration and operation, it is possible to improve the accuracy, reproducibility and workability of calibration for the optical sensor used for monitoring laser processing, and improve monitoring performance.
According to the laser processing device of the aspect of the present invention, with the above configuration and operation, it is possible to perform qualified quality determination for laser processing.
Hereinafter, a preferred embodiment of the present invention will be described with reference to the attached drawings.
In this laser processing device, the laser oscillator 10, the laser power supply 12, the control unit 14, and the operation panel 22 are usually disposed in one place or close together to form a main body of the device. On the other hand, the processing head 20 is configured as a separate and independent unit from the main body of the device, and is disposed at any processing place within an area according to the length of the optical fiber cable 16.
The laser processing monitor unit 24 includes the control unit 14, the operation panel 22, a sensor signal processing unit 26 and a sensor unit 30 as a basic configuration for a main function, that is, a monitoring function, and includes a reference beam source 100, a reference beam source power supply 102, an optical measuring instrument 104 and an optical path switching unit 105 as a calibration unit 32 for calibrating an optical sensor 50 incorporated in the sensor unit 30.
The laser oscillator 10 is composed of, for example, a YAG laser, a fiber laser, or a semiconductor laser. For example, when laser spot welding is applied to the workpiece W, the laser oscillator 10 receives supply of excitation power from the laser power supply 12 under the control of the control unit 14 to excite an internal medium, and oscillates and outputs laser beams LB of pulses with wavelengths unique to the medium. The laser beams LB oscillated and output by the laser oscillator 10 are transmitted to the processing head 20 through the optical fiber cable 16.
The processing head 20 has an emission unit 28 which is a head body, and a sensor unit 30 integrally or detachably connected to the emission unit 28 through a unit connection opening 45. The emission unit 28 has a cylindrical housing. An upper end of the housing of the emission unit 28 is connected to the optical fiber cable 16 from the laser oscillator 10, and a laser emission port of a lower end of the housing of the emission unit 28 is directed to the workpiece W directly under the laser emission port. In the housing of the emission unit 28, a collimating lens 38, a dichroic mirror 40, a focusing lens 42 and a protective glass 44 are arranged in a vertical line from a top to a bottom, as the laser optical system. Herein, the protective glass 44 is mounted on the laser emission port. The dichroic mirror 40 is disposed so as to be inclined obliquely at 45° towards the unit connection opening 45. The dichroic mirror 40 is coated with a dielectric multilayer film that transmits the laser beams LB from the optical fiber cable 16 and reflects a beam to be measured and a visible ray from the vicinity of the processing point Q of the workpiece W.
During laser processing, the laser beams LB propagating through the optical fiber cable 16 are emitted vertically downward at a constant flare angle from an end surface of the optical fiber cable 16 within the emission unit 28. The laser beams LB pass through the collimating lens 38 to become parallel beams, pass through the dichroic mirror 40 to be focused through the focusing lens 42 and the protective glass 44, and are incident on the processing point Q of the workpiece W. Then, laser energy of the laser beams LB melts and solidifies the vicinity of the processing point Q to form a weld nugget and further a weld joint. The weld joint is arbitrary, for example, a butt joint, a T-shaped joint, an L-shaped joint, a lap joint, or the like, and is selected by a user.
The sensor unit 30 also has an integral or assembled cylindrical housing. In the housing of the sensor unit 30, the optical sensor 50 is provided in an upper end of the housing, a folding mirror 46, a dichroic mirror 58 and a condenser lens 48 are arranged in a vertical line from a bottom to a top, as a monitor optical system directly below the optical sensor 50. Herein, the folding mirror 46 is disposed so as to be inclined obliquely at 45° at the same height as the unit connection opening 45. The optical path switching unit 105 of the calibration unit 32 is provided between the dichroic mirror 58 and the condenser lens 48.
The dichroic mirror 58 is provided in order to monitor and photograph the vicinity of the processing point Q of the workpiece W. The dichroic mirror 58 is disposed so as to be inclined obliquely at 45° at the same height as a folding mirror 60 provided on the lateral side of the dichroic mirror 58. This dichroic mirror 58 is coated with a dielectric multilayer film that transmits a beam to be measured and reflects a visible ray. The folding mirror 60 is also disposed so as to be inclined obliquely at 45°, and is mounted with a CCD camera 62 directly above the folding mirror 60. An image signal output by the CCD camera 62 is transmitted to a display device 66 through an electric cable 64. The display device 66 is generally disposed on the device main body side. Although not illustrated, an optical system that irradiates the vicinity of the processing point Q of the workpiece W with a guide beam of the visible ray can be incorporated in the sensor unit 30.
The optical sensor 50 of this embodiment includes, for example, a photodiode 56 as a photoelectric transducer. The optical sensor 50 includes, in front of (below) the photodiode 56, a wavelength filter or a band pass filter 54 which transmits only beams LM each having a wavelength in a specific band and blocks other beams. Behind the optical sensor 50, a substrate of an amplification and output circuit 70 is provided.
At the time of the laser processing, electromagnetic waves (beams) having a broadband wavelength is emitted from the vicinity of the processing point Q of the workpiece W which is irradiated with the laser beams LB by the emission unit 28. In vertically upward electromagnetic waves among the electromagnetic waves emitted from the workpiece W, beams that pass through the focusing lens 42 in the emission unit 28 and are reflected horizontally by the dichroic mirror 40 passing through the unit connection opening 45 to be guided into the sensor unit 30. Among the beams guided into the sensor unit 30, a beam reflected vertically upward by the folding mirror 46 and then transmitted through the dichroic mirror 58 is incident on the band pass filter 54 through the optical path switching unit 105 and the condenser lens 48. Then, the beams LM having a wavelength component in a predetermined band selected by the band pass filter 54 are focused and incident on a light receiving surface of the photodiode 56. In this case, the optical path switching unit 105 is switched such that the processing point Q of the workpiece W and the optical sensor 50 are optically connected by a first optical path K1 indicated by a dashed line in
Among beams that pass from the emission unit 28 through the unit connection opening 45 to enter the sensor unit 30, a visible ray is folded vertically upwards by the folding mirror 46. The folded visible ray is horizontally reflected by the dichroic mirror 58 as illustrated by a broken line in
In the optical sensor 50, a wavelength band in which a beam is transmitted through the band pass filter 54 is preferably set to the most suitable band for grasping the influence of a predetermined factor on a welding characteristic of the vicinity of the processing point for a plurality of types of materials and a variety of processing forms to be selected for the workpiece W as the intensity or change of the radiant energy, in comprehensive consideration of sensitivity, versatility, cost, and the like, in monitoring method using a single photodiode 56.
In this regard, well-known black body radiation spectrum distribution illustrated in
On the other hand,
From this fact, it is possible to determine a practical optimal wavelength band in laser processing monitoring method using the single photodiode 56, by using, as an index, a melting point of each of a plurality of types of metals that can be assumed as the material of the workpiece W, with reference to the graph in
Referring again to
The arithmetic processing unit 84 is composed of a hardware or middleware arithmetic processing device, preferably an FPGA (Feed Programmable Gate Array), capable of performing specific arithmetic processing at high speed. The arithmetic processing unit 84 converts an instantaneous voltage value of the sensor output signal CS into a count value (relative value) representing the intensity of a radiated beam by using a data memory 88, and generates the converted value as digital waveform data DCS. The generated waveform data DCS is stored in the data memory 88. The arithmetic processing unit 84 displays a waveform of the sensor output signal CS on a display of a display unit 22a of the operation panel 22 via the control unit 14 based on the waveform data DCS. Alternatively, the arithmetic processing unit 84 also executes quality determination processing described later, and displays a determination result together with the waveform of the sensor output signal CS. The control unit 14 converts the waveform data DCS and the determination result data given from the arithmetic processing unit 84 into a video signal, and displays an image of the waveform of the sensor output signal CS and the determination result information and the like on the display of the display unit 22a of the operation panel 22.
Thus, according to the laser processing monitor unit 24 of this embodiment, the radiated beam (infrared rays) when the processing point of the workpiece reaches a molten state is an object to be monitored. Then, instead of conversion of the radiated beam into temperature, change in the amount of the radiated beam during processing is converted into an instantaneous integrated value or a count value in a specific band and is displayed, so that the processing status of the workpiece is visualized as a waveform.
The operation panel 22 has, for example, the display unit 22a composed of a liquid crystal display, and a keyboard or touch panel type input unit 22b, and displays a setting screen, a monitor screen, a maintenance screen, or the like under display control of the control unit 14. For example, as one of the setting screens, a laser output waveform corresponding to a setting condition of the laser beam LB is displayed on the display of the display unit 22a. In addition, as one of the monitor screens, for example, as illustrated in
In order to verify the monitoring function of the laser processing monitor unit 24 in this embodiment, the present inventors conducted Experiments 1, 2, and 3 as illustrated in
In Experiment 1 (
The waveform of the case (a) where there is no gap in a butted part and the waveform of the case (b) where there is a gap in a butted part are compared. The former (a) has a characteristic that a detection starting point is high immediately after the start of the rise of the waveform and the fall of the waveform is relatively gentle. On the other hand, the latter (b) has a characteristic that the detection starting point immediately after the beginning of the rise of the waveform is low and the fall of the waveform is relatively sharp. This phenomenon indicates the followings. That is, in the case (b) where there is a gap in the butted part, a laser beam is also incident on a part (gap) where there is no metal. Therefore, due to the presence of the gap with respect to the spot diameter at the irradiation point, a phenomenon that an amount of molten metal, which forms a molten pool, decreases occurs. A difference in the molten metal amount also appears as a difference in the radiated beam amount in the radiated beam detected in the vicinity of the molten pool, and the detection starting point immediately after the rise of the waveform becomes low. In addition, the molten metal amount decreases due to the phenomenon that vaporized metal flies together with a transmitted beam that passes through the gap. Therefore, in a case where there is a gap, the fall of the waveform is detected quickly.
In Experiment 2 (
The case (b) where there is a gap of 0.06 mm in this lap welding and the case (a) where there is no gap in this lap welding are compared. It was difficult to distinguish the intensity change of a radiated beam in the rising part of the waveform. However, in the falling portion of the waveform, that is, after the pulse laser irradiation was stopped, the fall of the waveform in the case (b) of the waveform with a gap was more gentle than that in the case (a) of the waveform with no gap. This phenomenon indicates the followings. That is, in the lap welding, in the case (a) where there is no gap in the workpiece material, it is considered that the irradiation laser beam melts and penetrates the first metal W1, and thereafter melts the second metal W2 as it is. On the other hand, in the case (b) where there is a small gap in the workpiece materials, the heat transfer in the workpiece material is delayed due to the influence of an air layer existing in the gap, compared to the case (a) where there is no gap between the metal layers, so that it is detected that the fall of the waveform is gentle.
In Experiment 3 (
From
As described above, according to the laser processing monitor unit 24 of this embodiment, monitoring and analysis of the action of the laser beam LB in the laser processing, monitoring and analysis of the degree of influence of a predetermined factor related to the processing state or the processing quality of the laser processing, quality determination of the laser welding processing can be simply and precisely performed from the waveform characteristic of the sensor output signal CS displayed on the monitor screen of the operation panel 22 during the laser processing.
In the laser processing monitor unit 24 of this embodiment, a photodetector or an optical sensor 50 is incorporated into the sensor unit 30 built into the processing head 20. However, the photoelectric conversion characteristic of the photodiode 56 that constitutes this optical sensor 50 not only inevitably changes over time, but also depends on an environmental condition such as an ambient temperature. When the photoelectric conversion characteristic of the photodiode 56 changes, even when a beam LM to be measured having the same light intensity is received from the workpiece W side, a value of an analog sensor output signal CS obtained by photoelectric conversion changes. Therefore, even when the sensor signal processing unit 26 has higher performance, the accuracy and the reliability of the waveform information of the sensor output signal CS provided on the monitor screen are low, and the detailed monitoring and analysis of the laser processing and the appropriate quality determination is not possible.
In order to cope with this problem, the laser processing monitor unit 24 of this embodiment includes the calibration unit 32 that enables highly accurate and reliable calibration for change over time in the photoelectric conversion characteristic of the sensor 50 and variation according to an environmental condition. Hereinafter, the configuration and the operation of the calibration unit 32 will be described in detail.
As illustrated in
The reference beam source 100 is a beam source that generates infrared rays containing the wavelength of beam LM to be measured, and preferably has radiation characteristics close to the radiation spectrum distribution of the ideal black body in
In a reference beam source 100 in
Referring again to
The optical path switching unit 105 switches in order to select the first optical path K1 that optically connects the processing point Q of the workpiece W and the optical sensor 50, a second optical path K2 that optically connects the reference beam source 100 and the optical sensor 50, or a third optical path K3 that optically connects the reference beam source 100 and the beam receiver 104a of the optical measuring instrument 104.
In order to realize this switching function, the optical path switching unit 105 has one (or more) folding mirror(s) 106 capable of moving among a first position P1 (
In this embodiment, the optical path switching unit 105 is provided between the dichroic mirror 58 and the condenser lens 48 in the housing of the sensor unit 30. The reference beam source 100 and the beam receiver 104a of the optical measuring instrument 104 are mounted on a side wall of the housing of the sensor unit 30 adjacent to the optical path switching unit 105. An optical filter 103 having the same or similar wavelength selection characteristic as the band pass filter 54 of the optical sensor 50 may be disposed in front of the beam receiver 104a of the optical measuring instrument 104. The reference beam source power supply 102 and the main body 104b of the optical measuring instrument 104 are provided outside the sensor unit 30.
Now, operation of the calibration unit 32 will be described. The calibration unit 32 has three modes that are selected according to an operation status of the laser processing device and the determination of an on-site person. That is, there are a first mode in which interference with the light reception and photoelectric conversion of the optical sensor 50 during monitoring of laser processing does not occur, a second mode in which the optical sensor 50 is calibrated by use of the reference beam source 100, and a third mode in which the reference beam source 100 is calibrated by use of the optical measuring instrument 104.
In the first mode, as described above, the folding mirror 106 of the optical path switching unit 105 is switched to the first position P1 illustrated in
The second mode is selected (performed) from time to time or periodically during laser processing monitoring. In this mode, when the folding mirror 106 of the optical path switching unit 105 is switched to the second position P2 illustrated in
In the second mode, each unit except for the laser oscillator 10 and the laser power supply 12 is operated even on the device main body side. However, the sensor signal processing unit 26, the control unit 14 and the operation panel 22 are switched to have not the function of waveform display processing in the first mode for the sensor output signal CS sent from the sensor unit 30, but the calibration function for displaying the measured value (measurement count value) of the power or the luminous flux numerically and performing gain adjustment.
In the second mode, the reference beam emitted from the reference beam source 100 passes through the second optical path K2 to be guided to the optical sensor 50. More specifically, the reference beam emitted horizontally from the reference beam source 100 is folded vertically upward by the folding mirror 106 of the optical path switching unit 105. Then, the reference beam folded vertically upward is incident on the band pass filter 54 of the optical sensor 50 via the condenser lens 48, and the beam in a specific wavelength band that passes through this filter 54 is incident on the photodiode 56. The photodiode 56 photoelectrically converts the wavelength selected from the received reference beam and outputs an analog sensor output signal CS. This sensor output signal CS is amplified in the latter amplification and output circuit 70 in the same manner as above, and then sent to the sensor signal processing unit 26 on the device main body side via the electric cable 18.
In the sensor signal processing unit 26, the sensor signal processing unit 26 calculates the light intensity of the reference beam photoelectrically converted by the optical sensor 50 or a measured value, namely, a measurement count value of a luminous flux of the reference beam based on the sensor output signal CS converted into a digital signal by the A/D converter 82, and stores the calculated value in the data memory 88. The control unit 14 reads the measurement count value from the data memory 88 and displays the measurement count value on the display of display unit 22a of operation panel 22.
An on-site person who performs the second mode reads the measurement count value displayed on the monitor screen (maintenance screen) of display unit 22a. The on-site person performs gain adjustment or offset adjustment to the output of the optical sensor 50 by input operation on the operation panel 22 such that the measurement count value coincides with a predetermined reference count value.
The third mode is selected (performed) from time to time or periodically during laser processing monitoring, and selected (performed) immediately before the second mode. In this mode, the folding mirror 106 of the optical path switching unit 105 is switched to the third position P3 illustrated in
An on-site person who performs the third mode reads the measured value of the reference beam displayed on the display 104c of the optical measuring instrument 104, and checks whether or not the measured value coincides with an absolute reference value preset as the output of the optical sensor 50. If not, the on-site person adjusts (updates) the volume position of the reference beam source power supply 102 such that the measured value and the absolute reference value coincide with each other. Thus, the light intensity of the reference beam emitted from the reference beam source 100 is calibrated to the absolute reference value via the optical measuring instrument 104. In addition, the measurement accuracy of the normal optical measuring instrument 104 is guaranteed by separate calibration management.
The reference beam source 100 is composed of a semiconductor element such as a light-emitting diode as described above, and the electrical-to-optical conversion characteristics inevitably change over time or fluctuate according to an environmental condition. Therefore, when the constant excitation power is regularly supplied to the reference beam source 100 from the reference beam source power supply 102, the light intensity of the reference beam emitted from the reference beam source 100 changes undesirably and irregularly. According to the calibration unit 32 of this embodiment, it is possible to correct change and fluctuation in the electrical-to-optical conversion characteristic of the reference beam source 100 at any time or frequently by the third mode. Therefore, in the second mode (calibration of the optical sensor 50), a reference beam having higher accuracy than the reference beam source 100 can always be given to the optical sensor 50.
As described above, the laser processing monitor unit 24 of this embodiment uses the reference beam source 100 equipped in the device for calibration of the optical sensor 50 incorporated into the sensor unit 30, and further calibrates the reference beam source 100 with the optical measuring instrument 104 equipped in the device. In this laser processing monitor unit 24, even when the electrical-to-optical conversion characteristic of the reference beam source 100 changes over time or fluctuates due to an environmental condition, it is possible to correct this timely and appropriately. Additionally, even when the photoelectric conversion characteristic of the optical sensor 50 changes over time or fluctuates due to an environmental condition, it is possible to correct this timely and appropriately. Consequently, accuracy, reproducibility and workability of calibration for the optical sensor 50 can be largely improved, and the monitoring performance can be dramatically improved. In addition, the calibration reference value of the optical sensor 50 is the absolute reference value of the optical measuring instrument 104, and therefore it is possible to obtain monitoring performance without any machine difference.
Furthermore, in this embodiment, the optical path switching unit 105 is provided near the optical sensor 50 inside the sensor unit 30, and the reference beam source 100 and the beam receiver 104a of the optical measuring instrument 104 are mounted on the side wall of the housing of the sensor unit 30 adjacent to the optical path switching unit 105. Consequently, without disassembling of the sensor unit 30 or removal of the optical sensor 50, calibration focusing on the photoelectric conversion characteristic of the optical sensor 50 can be performed easily and safely. In addition, at the laser processing site, without exposing the optical sensor 50 and the monitor optical system in the sensor unit 30 to the surrounding dusty environment, the calibration of the optical sensor 50 and the calibration of the reference beam source 100 can be performed frequently in a daily inspection and or a periodic inspection.
As described above, in the laser processing monitor unit 24 of this embodiment, the optical path switching unit 105 is provided together with (preferably near) the optical sensor 50 inside the sensor unit 30. Hereinafter, a preferred configuration example of the optical path switching unit 105 will be described with reference to
The folding mirror 46 and the dichroic mirror 58 (
Thus, the reference beam source 100 and the beam receiver 104a of the optical measuring instrument 104 are not housed inside the sensor unit 30 but mounted on the side wall from the outside, and the rotary knob 138 of the optical path switching unit 105 is also provided outside the side wall of the sensor unit 30. The providing of the calibration unit 32 does not substantially increase the size (particularly the transvers width) of the internal cavity (optical path) of the sensor unit 30.
As illustrated in
Three side openings 146, 148 and 150 are formed in a side surface of the mirror support 140 at intervals in the circumferential direction. The first and second side openings 146 and 148 face each other, and the third side opening 150 is located in the middle between both the openings.
Inside the mirror support 140, a first folding mirror 106A is provided inside the end surface 140b facing the end surface opening 142, and a second folding mirror 106B is provided inside a side surface facing the third side opening 150. Herein, the first folding mirror 106A is disposed at a predetermined inclination angle so as to receive a reference beam introduced from the reference beam source 100 through the end surface opening 142 at an oblique incident angle and reflect the received reference beam in the predetermined direction, that is, toward the second folding mirror 106B. On the other hand, the second folding mirror 106B is disposed at a predetermined inclination angle so as to receive the reference beam from the first folding mirror 106A at an oblique incident angle and reflect the reference beam outward through the third side opening 150.
As illustrated in
The rotational position of the mirror support 140 is selected in three ways (or two ways) according to the three modes of the calibration unit 32. In the first mode, in order to select the first optical path K1, the rotational position of the mirror support 140 is selected or adjusted such that the first and second side openings 146 and 148 vertically face each other and are located on the first optical path K1.
The beam to be measured propagating inside the lower cylindrical part 130 through the dichroic mirror 58 (
In the second mode, in order to select the second optical path K2, the rotational position of the mirror support 140 is selected or adjusted such that the third side opening 150 faces the optical sensor 50.
When the reference beam emitted from the reference beam source 100 enters the mirror support 140 from the end surface opening 142, the reference beam advances straight and is incident on the first folding mirror 106A in the innermost part at an oblique incident angle, reflects obliquely downward on the first folding mirror 106A to be incident on the second folding mirror 106B at an oblique incident angle. Then, the reference beam incident on the second folding mirror 106B reflects vertically upward on the second folding mirror 106B, and exits from the third side opening 150. The reference beam that exits from the third side opening 150 described above propagates inside the upper cylindrical part 134, and is incident on the optical sensor 50 through the condenser lens 48.
In the third mode, in order to select the third optical path K3, the rotational position of the mirror support 140 is selected or adjusted such that the third side opening 150 faces horizontally (Y-direction) the beam receiver 104a of the optical measuring instrument 104 located just beside the optical path switching unit 105.
When the reference beam from the reference beam source 100 enters the mirror support 140 through the end surface opening 142, the reference beam advances straight and is incident on the first folding mirror 106A in the front innermost part at an oblique incident angle, reflects obliquely sideways on the first folding mirror 106A to be incident on the second folding mirror 106B at an oblique incident angle. Then, the reference beam incident on the second folding mirror 106B further reflects obliquely sideways (Y-direction) on the second folding mirror 106B, and exits from the third side opening 150. The reference beam thus exits in the horizontal direction (Y-direction) perpendicular to the rotation axis HX and is incident on the beam receiver 104a of the optical measuring instrument 104.
The rotational positions in the first mode and the third mode of the mirror support 140 are different by 180° in the above description, but can be made to be the same (common). That is, when the mirror support 140 is rotated by 180° from the rotational position illustrated in
In this case, as illustrated in
The optical path switching unit 105 of this configuration example is mounted with the folding mirrors 106 (106A and 106B) inside the rotatable cylindrical mirror support 140 having a plurality of the openings on the end surface and the side surface as described above. The rotational position of the mirror support 140 is selected or adjusted, so that the folding mirrors 106 (106A and 106B) are selectively moved to the first, second and third positions P1, P2 and P3. Consequently, it is possible to select either the first, second and third optical paths K1, K2 and K3 alternatively, or either the first and third optical paths (K1, K3) or the second optical path K2. According to such a configuration, it is possible to efficiently and smoothly perform required optical path selection or switching within a limited cavity of the sensor unit 30.
The preferred embodiment of the present invention is described above, but the embodiment described above does not limit the present invention. It is possible for those skilled in the art to make various modifications and changes to the specific embodiments without departing from the technical idea and the technical scope of the present invention.
For example, it is possible to modify or change the arrangement configuration of the optical path switching unit 105, the reference beam source 100 and the beam receiver 104a of the optical measuring instrument 104. That is, either or all of the reference beam source 100, the beam receiver 104a of the optical measuring instrument 104, and the optical path switching unit 105 can be provided in the sensor unit 30 or in the processing head 20 away from the optical sensor 50, or at least one of the reference beam source 100 and the beam receiver 104a of the optical measuring instrument 104 can be detachably mounted on the sensor unit 30.
Furthermore, as illustrated in
Alternatively, in a case where the optical path switching unit 105 of the above preferred configuration example (
In the sensor unit 30, the reference beam source 100 and the beam receiver 104a of the optical measuring instrument 104 can face with the optical path switching unit 105 therebetween, and a single folding mirror 106 of the optical path switching unit 105 can also be enough. In this case, the single folding mirror 106 can be moved between the first position P1 for retreating from the first optical path K1 in order to select the first optical path K1, and the second position P2 for blocking the first optical path K1 at an inclination angle 45° and reflecting the reference beam from the reference beam source 100 toward the optical sensor 50 in order to select the second optical path K2. Furthermore, in this case, the first position P1 of the folding mirror 106 can be set to such a position as to retreat from the third optical path K3, so that the first position P1 and the third position P3 can be common.
In the laser processing device of the above embodiment, the sensor unit 30 is integrated with the emission unit 28 and built into the processing head 20. However, the sensor unit 30 can be separated from the emission unit 28 to be used as an independent unit, and can be disposed near the processing head 20 or the emission unit 28 so as to be directed toward the workpiece W.
When the sensor unit 30 is thus used as the independent unit, an entrance window is provided in the front stage (unit end surface) of the monitor optical system of the sensor unit 30 so as to directly take a beam to be measured generated or reflected near the processing point Q of the workpiece W. Then, in this case, not only the beam receiver 104a of the optical measuring instrument 104 but also the reference beam source 100 can be used outside the sensor unit 30. That is, in the second mode, the emission surface of the reference beam source 100 is applied (directed) to the entrance window of the sensor unit 30 from the outside, the reference beam emitted from the reference beam source 100 is taken from the entrance window into the sensor unit 30, and the taken reference beam can be received in the optical sensor 50 at the innermost part through the monitor optical system on the inner side. Consequently, it is possible to omit the optical path switching unit (105) from the sensor unit 30.
In the laser beam monitor unit 24 in the above embodiment, the beam to be measured is an infrared ray emitted from the vicinity of the processing point Q of the workpiece W. However, the beam to be measured can be a plasma beam emitted from the vicinity of the processing point Q of the workpiece W, a reflected beam from the vicinity of the processing point Q (reflected laser beam for processing) or a visible ray. Therefore, the reference beam source 100 is not limited to a black body radiated beam source, and various light-emitting diodes or semiconductor lasers with radiation characteristics according to the wavelength band of a beam to be measured can be used. In this case, a band pass filter with a wavelength selection characteristic according to the radiation characteristic of the reference beam source to be used or the wavelength of a beam to be measured, or an optical filter can be provided on the second optical path K2 that optically connects the reference beam source 100 and the optical sensor 50.
The laser processing monitoring method or device of the present invention is not limited to application to a laser processing device that performs laser welding, and a laser processing device that performs other laser processing, for example, laser cutting, laser brazing, laser hardening, laser surface modification, or the like can be applied.
The disclosure of this application relates to the subject matter described in Japanese Patent Application No. 2020-068853 filed on Apr. 7, 2020, the entire disclosure of which is incorporated herein by reference.
Number | Date | Country | Kind |
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2020-068853 | Apr 2020 | JP | national |
Filing Document | Filing Date | Country | Kind |
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PCT/JP2021/008475 | 3/4/2021 | WO |