The present disclosure relates to the field of display technologies, and in particular, to a laser projection apparatus.
Laser projection apparatuses include a laser source assembly, a light modulation assembly, and a projection lens. Illumination beams provided by the laser source assembly are modulated by the light modulation assembly to become projection beams, and the projection beams are projected onto a screen or a wall by the projection lens, so as to display a projection image. A laser device in the laser source assembly includes a plurality of light-emitting chips arranged in an array, and the plurality of light-emitting chips are configured to emit laser beams, so as to form the illumination beams.
A laser projection apparatus is provided. The laser projection apparatus includes a laser source assembly, a light modulation assembly, and a projection lens. The laser source assembly is configured to provide illumination beams, and the illumination beams include laser beams of three primary colors. The light modulation assembly is configured to modulate the illumination beams with an image signal, so as to obtain projection beams. The projection lens is configured to project the projection beams into an image. The laser source assembly includes a laser device, and the laser device includes a base plate, at least one frame, and a plurality of light-emitting chips. The at least one frame is located on the base plate, and at least one accommodating space is defined between the at least one frame and the base plate. The plurality of light-emitting chips are disposed on the base plate and located in the at least one accommodating space. The plurality of light-emitting chips are configured to emit laser beams. The laser beams exit from the accommodating space in a direction away from the base plate, so as to constitute the illumination beams. The region of the base plate located in the at least one accommodating space includes a first region and a second region. The second region is located on at least one side of the first region, and two or more light-emitting chips in the corresponding region are arranged in a row. An operating parameter of each light-emitting chip in the first region is less than an operating parameter of each light-emitting chip in the second region, and the operating parameter includes at least one of a photothermal conversion efficiency or a wavelength of the emitted laser beam.
Some embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings. However, the described embodiments are merely some but not all embodiments of the present disclosure. All other embodiments obtained by a person of ordinary skill in the art based on embodiments of the present disclosure shall be included in the protection scope of the present disclosure.
Unless the context requires otherwise, throughout the specification and the claims, the term “comprise” and other forms thereof such as the third-person singular form “comprises” and the present participle form “comprising” are construed as an open and inclusive meaning, i.e., “including, but not limited to.” In the description of the specification, the terms such as “one embodiment,” “some embodiments,” “exemplary embodiments,” “example,” “specific example,” or “some examples” are intended to indicate that specific features, structures, materials, or characteristics related to the embodiment(s) or example(s) are included in at least one embodiment or example of the present disclosure. Schematic representations of the above terms do not necessarily refer to the same embodiment(s) or example(s). In addition, the specific features, structures, materials, or characteristics may be included in any one or more embodiments or examples in any suitable manner.
Hereinafter, the terms such as “first” and “second” are used for descriptive purposes only and are not to be construed as indicating or implying the relative importance or implicitly indicating the number of indicated technical features. Thus, features defined by “first” or “second” may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, the term “a plurality of” or “the plurality of” means two or more unless otherwise specified.
In the description of some embodiments, the expressions “coupled,” “connected,” and derivatives thereof may be used. The term “connected” should be understood in a broad sense. For example, the term “connected” may represent a fixed connection, a detachable connection, or a one-piece connection, or may represent a direct connection, or may represent an indirect connection through an intermediate medium. The embodiments disclosed herein are not necessarily limited to the content herein.
The phrase “at least one of A, B, and C” has the same meaning as the phrase “at least one of A, B, or C,” both including the following combinations of A, B, and C: only A, only B, only C, a combination of A and B, a combination of A and C, a combination of B and C, and a combination of A, B, and C.
The use of the phrase “applicable to” or “configured to” herein means an open and inclusive expression, which does not exclude devices that are applicable to or configured to perform additional tasks or steps.
The term such as “about,” “substantially,” and “approximately” as used herein includes a stated value and an average value within an acceptable range of deviation of a particular value. The acceptable range of deviation is determined by a person of ordinary skill in the art, considering measurement in question and errors associated with measurement of a particular quantity (i.e., limitations of a measurement system).
The term such as “parallel,” “perpendicular,” or “equal” as used herein includes a stated condition and a condition similar to the stated condition. A range of the similar condition is within an acceptable deviation range, and the acceptable deviation range is determined by a person of ordinary skill in the art, considering measurement in question and errors associated with measurement of a particular quantity (i.e., the limitations of a measurement system).
In some embodiments of the present disclosure, a laser projection apparatus is provided. As shown in
The laser source assembly 1, the light modulation assembly 2, and the projection lens 3 are sequentially connected in a propagation direction of beams. In some examples, an end of the light modulation assembly 2 is connected to the laser source assembly 1, and the laser source assembly 1 and the light modulation assembly 2 are arranged in an exit direction (referring to the M direction shown in
In some examples, as shown in
In some embodiments, the laser source assembly 1 may sequentially provide beams of three primary colors (i.e., beams of red color, green color and blue color). In some other embodiments, the laser source assembly 1 may simultaneously output the beams of three primary colors, so as to continuously emit white beams. Of course, the illumination beams provided by the laser source assembly 1 may also include beams other than beams of the three primary colors, such as beams of yellow. The laser source assembly 1 includes a laser device. The laser device may emit laser beams of at least one color, such as blue laser beams.
In some examples, as shown in
The illumination beams emitted by the laser source assembly 1 enter the light modulation assembly 2. Referring to
The digital micromirror device 25 is located on a laser-exit side of the laser source assembly 1 and is configured to use an image signal to modulate the illumination beams provided by the laser source assembly 1 to obtain the projection beams and reflect the projection beams to the projection lens 3. Since the digital micromirror device 25 may control the projection beams to display different luminance or gray scales according to different pixels in the image to be displayed, so as to finally produce a projection image. The digital micromirror device 25 is also referred to as a light modulation device (or light valve). In addition, the light modulation assembly 2 may be classified as a single-chip system, a double-chip system, or a three-chip system according to the number of the digital micromirror devices 25 used in the light modulation assembly 2.
It will be noted that, in some embodiments of the present disclosure, the light modulation assembly 2 shown in
As shown in
As shown in
In a display cycle of a frame of an image, some or all of the micromirrors 251 may be switched at least once between the ON state and the OFF state, so that gray scales of pixels in the frame image are achieved according to durations that the micromirrors 251 are in the ON state and the OFF state. For example, in a case where the pixels have 256 gray scales from 0 to 255, the micromirrors 251 corresponding to a gray scale 0 are each in the OFF state in an entire display cycle of a frame of an image, the micromirrors 251 corresponding to a gray scale 255 are each in the ON state in the entire display cycle of the frame of the image, and the micromirrors 251 corresponding to a gray scale 127 are each in the ON state for a half of time and in the OFF state for another half of time in the display cycle of the frame of the image. Therefore, by controlling a state that each micromirror 251 in the DMD 25 is in and a duration of each state in the display cycle of a frame of an image through the image signals, luminance (the gray scale) of the pixel corresponding to the micromirror 251 may be controlled, thereby modulating the illumination beams projected onto the DMD 25.
In some embodiments, with continued reference to
The diffusion sheet 21 is located on the laser-exit side of the laser source assembly 1 and configured to diffuse the illumination beams from the laser source assembly 1. The first lens group 22 is located on a laser-exit side of the diffusion sheet 21 and configured to converge the illumination beams diffused by the diffusion sheet 21. The fly-eye lens group 23 is located on a laser-exit side of the first lens group 22 and configured to homogenize the illumination beams converged by the first lens group 22. The second lens group 24 is located on a laser-exit side of the fly-eye lens group 23 and configured to transmit the illumination beams homogenized by the fly-eye lens group 23 to the prism group 26. The prism assembly 26 is configured to reflect the illumination beams to the digital micromirror device 25.
In some embodiments, as shown in
As shown in
Referring to
In some embodiments, the combining lens group 11 may be a dichroic mirror. In a case where the laser source assembly 1 outputs the beams of three primary colors (that is, the laser device 10 outputs the beams of three primary colors) simultaneously or sequentially, the combining lens group 11 may adjust the red laser beams, green laser beams, and blue laser beams emitted by the laser device 10 to a substantially same beam path and reflect them to the converging lens group 12.
In some embodiments, the converging lens group 12 may include at least one planoconvex lens, and a convex surface of the at least one planoconvex lens faces a laser-exit direction of the combining lens group 11. Of course, the converging lens group 12 may also include a plurality of convex lenses, and the present disclosure is not limited thereto.
In some embodiments, as shown in
In some embodiments, the light homogenizing component 14 may include a fish-eye lens or a light pipe. In some examples, the light homogenizing component 14 includes a fly-eye lens. For the structure of the light homogenizing component 14, reference may be made to the structure of the above fly-eye lens group 23, and details will not be repeated herein. In some other examples, the light homogenizing component 14 includes a light pipe. The light pipe may be a tubular device (i.e., a hollow light pipe) spliced by four planar reflecting sheets. The illumination beams are reflected multiple times inside the light pipe, so as to achieve the effect of homogenizing light. Of course, the light homogenizing component 14 may also include a solid light pipe. For example, a light inlet and light outlet of the light pipe are in a shape of a rectangle with a same shape and area. The illumination beams enter the light pipe from the light inlet of the light pipe and then exit from the light outlet of the light pipe, so that the illumination beams and the beam spot of the illumination beams may be homogenized during the illumination beams passing through the light pipe.
It will be noted that, in a case where the light homogenizing component 14 includes the light pipe, the light modulation assembly 2 may not be provided with a light pipe. In a case where the light homogenizing component 14 is other components other than the light pipe, the light modulation assembly 2 may be provided with the above light pipe, so as to receive and homogenize the illumination beams from the laser source assembly 1.
In the related art, as shown in
In view of the above problems, it is found through research that: in the related art, the plurality of light-emitting chips 202 of the laser device 200 are arranged in an array of multiple rows and columns, and the arrangement is relatively regular and compact. In this way, in the plurality of light-emitting chips 202, the overlapping degree of heat dissipation regions of the light-emitting chips 202 in a middle region is high, and the heat generated by the light-emitting chips 202 in the middle region is difficult to dissipate. For example, a region between two adjacent light-emitting chips 202 in the middle region may receive heat from at least two light-emitting chips 202, and the heat generated by the light-emitting chips 202 may be significantly concentrated in the middle region, as a result, the heat of the light-emitting chips 202 in the middle region is difficult to dissipate rapidly. However, the overlapping degree of the heat dissipation regions of the light-emitting chips 202 in an edge region is low, and the heat generated by the light-emitting chips 202 in the edge region is easy to dissipate. For example, the heat of a light-emitting chip 202 in the edge region may transmit to the outside of the light-emitting chip 202. Since there are no components that may generate heat outside the light-emitting chip 202, the heat of the light-emitting chip 202 in the edge region is easy to dissipate rapidly. Therefore, compared with the light-emitting chips 202 in the edge region, the light-emitting chips 202 in the middle region is more prone to high junction temperature and thermal damage such as COD.
On this basis, as shown in
In some embodiments, as shown in
The frame 1012 is located on the base plate 1011, and an accommodating space 1013 is defined between the frame 1012 and the base plate 1011.
The plurality of light-emitting chips 102 are disposed on the base plate 1011 and located in the accommodating space 1013 and configured to emit the laser beams. The laser beams exit from the accommodating space 1013 in a direction away from the base plate 1011, so as to form the illumination beams.
The structure composed of the base plate 1011 and the frame 1012 may be referred to as a tube shell 101, and the accommodating space 1013 defined between the base plate 1011 and the frame 1012 is the accommodating space 1013 of the tube shell 101. A region of the base plate 1011 located in the accommodating space 1013 is a region where the plurality of light-emitting chips 102 are disposed.
The region of the base plate 1011 located in the accommodating space 1013 includes a first region 10A and a second region 10B, and the plurality of light-emitting chips 102 satisfy at least one of the following: the number of light-emitting chips 102 in the first region 10A is less than the number of light-emitting chips 102 in the second region 10B; or, the arrangement density of the light-emitting chips 102 in the first region 10A is less than the arrangement density of the light-emitting chips 102 in the second region 10B.
In some embodiments, the second region 10B is located on at least one side of the first region 10A. In some examples, the second region 10B may surround the first region 10A. For example, the second region 10B surrounds the first region 10A, or half surrounds the first region 10A, or is located on two opposite sides of the first region 10A. Alternatively, the second region 10B may also be located on a side of the first region 10A. The present disclosure does not limit the relative positional relationship between the first region 10A and the second region 10B. The following is introduced by considering an example in which the second region 10B is located on two opposite sides of the first region 10A in a second direction Y.
For example, as shown in
Moreover, since the second region 10B is located on two sides of the first region 10A, the first region 10A is closer to the center of the base plate 1011 than the second region 10B, and the first region 10A may also be referred to as the middle region. The second region 10B is closer to the edge of the base plate 1011 than the first region 10A, and the second region 10B may also be referred to as the edge region. In addition, the first region 10A may be in a shape of a quadrilateral (e.g., a rectangle, a square), a circle, or other regular shapes, or may be an irregular shape, and the present disclosure does not limit thereto. For ease of description, the first region 10A and the second region 10B are shown in dashed boxes in
It will be noted that, the number of light-emitting chips 102 in the first region 10A may refer to the total number of light-emitting chips 102 in the first region 10A, and the number of light-emitting chips 102 in the second region 10B may refer to the total number of light-emitting chips 102 in the second region 10B. Alternatively, in a case where the light-emitting chips 102 in the first region 10A and the light-emitting chips 102 in the second region 10B each are arranged in an array of a plurality of rows and columns, the number of light-emitting chips 102 in the first region 10A may refer to the number of a row of light-emitting chips 102 in the first region 10A, and the number of light-emitting chips 102 in the second region 10B may refer to the number of a row of light-emitting chips 102 in the second region 10B.
Moreover, the arrangement density of the light-emitting chips 102 is a dense degree of the arrangement of the light-emitting chips 102, and the arrangement density may be characterized by a distance between two adjacent light-emitting chips 102. For example, the greater the distance between two adjacent light-emitting chips 102, the less the arrangement density of the light-emitting chips 102. It will be noted that,
In the laser projection apparatus 1000 provided by some embodiments of the present disclosure, in a case where the arrangement manner of the plurality of light-emitting chips 102 satisfies that the number of light-emitting chips 102 in the first region 10A is less than the number of light-emitting chips 102 in the second region 10B, the total heat generated by the light-emitting chips 102 in the first region 10A is reduced, so that the heat per unit area of the first region 10A is reduced, which facilitates the rapid dissipation of the heat generated by the light-emitting chips 102 in the first region 10A. In a case where the arrangement manner of the plurality of light-emitting chips 102 satisfies that the arrangement density of the light-emitting chips 102 in the first region 10A is less than the arrangement density of the light-emitting chips 102 in the second region 10B, an area of the heat dissipation region of a single light-emitting chip 102 in the first region 10A increases, which is conducive to the rapid dissipation of the heat generated by the light-emitting chips 102 in the first region 10A. In this way, it is possible to improve the heat dissipation effect of the light-emitting chips 102 in the first region 10A and reduce the probability of thermal damage to the light-emitting chips 102 in the first region 10A due to heat accumulation, thereby improving the reliability of the laser device 10 and further improving the reliability of the laser projection apparatus 1000. Moreover, since the reliability of the laser device 10 is improved, a large number of light-emitting chips 102 may be arranged in the laser device 10 in the premise that the plurality of light-emitting chips 102 in the laser device 10 may normally operate, so as to improve the luminance of the illumination beams provided by the laser device 10, thereby improving the display effect of the projection image projected by the laser projection apparatus 1000.
The relationship between the numbers of light-emitting chips 102 in the first region 10A and the second region 10B is described below by considering an example in which the plurality of light-emitting chips 102 are arranged in four rows and the light-emitting chips 102 in the second region 10B include the first row and fourth row of light-emitting chips 102 with reference to accompanying drawings. Of course, the light-emitting chips 102 in the first region 10A and the second region 10B each may also be arranged in one row, three rows, or more rows, and the present disclosure is not limited thereto.
In some embodiments, the number of light-emitting chips 102 in the first region 10A is less than the number of light-emitting chips 102 in the second region 10B. Moreover, the arrangement density of the light-emitting chips 102 in the first region 10A is less than or equal to the arrangement density of the light-emitting chips 102 in the second region 108.
In this case, the number of at least one row of light-emitting chips 102 in the first region 10A is less than the number of at least one row of light-emitting chips 102 in the second region 10B.
In some examples, referring to
In some other examples, the numbers of rows of light-emitting chips 102 in the first region 10A may also be unequal to each other, and the numbers of rows of light-emitting chips 102 in the second region 10B may also be unequal to each other. For example, the number of light-emitting chips 102 in the first row is seven, the number of light-emitting chips 102 in the fourth row is six, the number of light-emitting chips 102 in the second row is four, and the number of light-emitting chips 102 in the third row is five.
In yet some other examples, referring to
In some other embodiments, the number of light-emitting chips 102 in the first region 10A is equal to the number of light-emitting chips 102 in the second region 10B. Moreover, the arrangement density of the light-emitting chips 102 in the first region 10A is less than the arrangement density of the light-emitting chips 102 in the second region 10B.
In some examples, referring to
It will be noted that in a case where the distances between any two adjacent rows of light-emitting chips 102 in the plurality of light-emitting chips 102 are equal to each other, and the arrangement density of the light-emitting chips 102 may be adjusted by adjusting the arrangement length of the light-emitting chips 102 in the row direction. In some embodiments of the present disclosure, it is also possible to adjust the arrangement density of the light-emitting chips 102 by adjusting the distance between two adjacent rows of the light-emitting chips 102. For example, in a case where the distances between any two adjacent rows of light-emitting chips 102 in the plurality of light-emitting chips 102 are equal to each other, the arrangement density of light-emitting chips 102 in the first region 10A may be reduced by increasing the distances between any two adjacent rows of light-emitting chips 102 in the first region 10A. Of course, the arrangement density of the light-emitting chips 102 in the first region 10A may be reduced by increasing the distances between any two adjacent rows of light-emitting chips 102 and the distances between any two adjacent columns of light-emitting chips 102 in the first region 10A simultaneously, and the present disclosure is not limited thereto.
The relationship between the arrangement densities of the light-emitting chips 102 in the first region 10A and the second region 10B is described below by considering an example in which the plurality of light-emitting chips 102 are arranged in four rows, the light-emitting chips 102 in the second region 10B include the first row and the fourth row of light-emitting chips 102, and the distances between any two adjacent rows of light-emitting chips 102 in the plurality of light-emitting chips 102 are equal to each other with reference to accompanying drawings.
In some embodiments, the arrangement density of light-emitting chips 102 in the first region 10A is less than the arrangement density of light-emitting chips 102 in the second region 10B.
In some examples, the number of light-emitting chips 102 in the first region 10A is equal to the number of light-emitting chips 102 in the second region 10B. In this case, for the arrangement manner of the plurality of light-emitting chips 102, reference may be made to
In some other examples, the number of light-emitting chips 102 in the first region 10A is less than the number of light-emitting chips 102 in the second region 10B. In this case, referring to
It will be noted that, in some embodiments of the present disclosure, the light-emitting chips 102 in a same row may be arranged at equal intervals or may be arranged at unequal intervals. The above embodiments are described by considering an example in which the light-emitting chips 102 in a same row are arranged at equal intervals. In addition, the above embodiments are described by considering an example in which the arrangement densities of rows of light-emitting chips 102 in the first region are equal to each other, and the arrangement densities of rows of light-emitting chips 102 in the second region 10B are equal to each other. Of course, in some embodiments of the present disclosure, the arrangement densities of different rows of light-emitting chips 102 in a same region (e.g., the first region 10A or the second region may also be unequal to each other.
Moreover, in some embodiments of the present disclosure, the plurality of light-emitting chips 102 may be arranged in a shape of a rectangle. Here, the rectangular arrangement means that, in the plurality of rows of light-emitting chips 102, the light-emitting chips 102 located at two ends in the row direction are aligned with each other in the column direction. That is to say, an outer edge of the arrangement shape of the plurality of rows of light-emitting chips 102 is in a shape of a rectangle. For example, referring to
In some other embodiments, the arrangement density of the light-emitting chips 102 in the first region 10A is equal to the arrangement density of the light-emitting chips 102 in the second region 10B. In this case, the number of light-emitting chips 102 in the first region 10A is less than the number of light-emitting chips 102 in the second region 10B.
In some examples, referring to
The plurality of rows of light-emitting chips 102 may have various relative positions. The relative positions between the plurality of rows of light-emitting chips 102 are described below with reference to the accompanying drawings.
In some embodiments, at least a portion of the light-emitting chips 102 in a row of light-emitting chips 102 in the first region 10A may be aligned in the column direction with at least a portion of the light-emitting chips 102 in a row of light-emitting chips 102 in the second region 10B. In such arrangement manner, in the first aspect, the plurality of light-emitting chips 102 are arranged regularly, which facilitates the encapsulation of the plurality of light-emitting chips 102 during the manufacturing process. In the second aspect, in a case where the plurality of light-emitting chips 102 are operating, the beam spots of the laser beams emitted by the plurality of light-emitting chips 102 are also arranged regularly, which is conducive to improving the uniformity of the illumination beams provided by the laser device 10. For example, referring to
Moreover, in such arrangement manner, the distances between two adjacent light-emitting chips 102 in the rows of light-emitting chips 102 in the row direction may be an integer multiple relationship. For example, as shown in
In some other embodiments, at least one row of light-emitting chips 102 in the first region 10A and at least one row of light-emitting chips 102 in the second region 10B are arranged in a staggered manner. In this way, in a case where the distance between two adjacent rows of light-emitting chips 102 is unchanged, the distance between the light-emitting chip 102 in the first region 10A and the light-emitting chip 102 in the adjacent row may be increased, so that heat dissipation area of the light-emitting chips 102 in the first region 10A may be increased, so as to avoid heat accumulation in the first region 10A.
It will be noted that the staggered arrangement of two rows of light-emitting chips 102 means that the light-emitting chips 102 in the two rows are misaligned with each other in the column direction. That is to say, at least one light-emitting chip 102 in a row of light-emitting chips 102 is misaligned in the column direction with the light-emitting chips 102 in another row of light-emitting chips 102. For example, referring to
In some examples, the rows of light-emitting chips 102 in the first region 10A are aligned in the column direction with each other, the rows of light-emitting chips 102 in the second region 10B are aligned in the column direction with each other, and the light-emitting chips 102 in the first region 10A are misaligned in the column direction with the light-emitting chips 102 in the second region 10B. The following is described by considering an example in which a row of light-emitting chips 102 in the second region 10B include seven light-emitting chips 102, and a row of light-emitting chips 102 in the first region 10A include six light-emitting chips 102. Referring to
In some other examples, the light-emitting chips 102 in two adjacent rows in the plurality of light-emitting chips 102 are misaligned in the column direction with each other. It will be noted that, in such example, the light-emitting chips 102 in two non-adjacent rows in the plurality of light-emitting chips 102 may be aligned in the column direction with each other. The following is described by considering an example in which a row of light-emitting chips 102 in the second region 10B includes seven light-emitting chips 102, and a row of light-emitting chips 102 in the first region 10A includes six light-emitting chips 102. Referring to
It will be noted that the numbers and arrangement densities of the light-emitting chips 102 in the first region 10A and the second region 10B and relative positions of the rows of the light-emitting chips 102 in the first region 10A and the second region 10B may be combined in various ways. For example, the following is described by considering an example in which the plurality of light-emitting chips 102 are arranged in two rows, the second region 10B is located on a side of the first region 10A, and the light-emitting chips 102 in the second region 10B include the second row of light-emitting chips 102. As shown in
The following continues to be described by considering an example in which the plurality of light-emitting chips 102 are arranged in two rows, the second region 10B is located on a side of the first region 10A, and the light-emitting chips 102 in the second region 10B include the second row of light-emitting chips 102. As shown in
In some embodiments, the laser device 10 may include the plurality of light-emitting chips 102 of a same type, and the plurality of light-emitting chips 102 have a same operating parameter. For example, the laser device 10 is a monochromatic laser device (e.g., a laser device emitting blue laser beams), and the laser beams emitted by the plurality of light-emitting chips 102 have a same color. The operating parameter of the light-emitting chip 102 will be described later.
In some other embodiments, the laser device 10 may include a plurality of types of light-emitting chips 102, and the operating parameters of different types of light-emitting chips 102 may be different. Different types of light-emitting chips 102 generate different amounts of heat when emitting laser beams. For example, in a case where the laser device 10 includes a two-color laser device or a multi-color laser device, the plurality of light-emitting chips 102 emit laser beams of two or three colors. Here, the light-emitting chips 102 may be distinguished according to the colors of the laser beams emitted by the light-emitting chips 102. For example, the light-emitting chip 102 emitting the red laser beam is referred to as a red light-emitting chip, the light-emitting chip 102 emitting the green laser beam is referred to as a green light-emitting chip, and the light-emitting chip 102 emitting the blue laser beam is referred to as a blue light-emitting chip.
In a case where the laser device 10 includes the plurality of types of light-emitting chips 102, a relationship between the heat generated when the plurality of light-emitting chips 102 emit laser beams may be determined based on the operating parameters of the light-emitting chips 102 in the laser device 10, and the plurality of light-emitting chips 102 are arranged according to the relationship between the heat.
In some examples, the operating parameters of the light-emitting chips 102 in the first region 10A are less than the operating parameters of the light-emitting chips 102 in the second region 10B. The operating parameter of the light-emitting chip 102 refers to a parameter that affect the operating temperature of the light-emitting chip 102 when the light-emitting chip 102 emits the laser beam. For example, the operating parameter includes at least one of a photothermal conversion efficiency, a power, or a wavelength of the emitted laser beam. In this way, the light-emitting chips 102 that generate high heat may be arranged in the second region 10B, and light-emitting chips 102 that generate low heat may be arranged in the first region 10A, thereby avoiding the heat accumulation in the first region 10A.
Here, the photothermal conversion efficiency refers to an efficiency of converting optical energy into heat energy by the light-emitting chip 102 when the light-emitting chip 102 emits the laser beam. The higher the photothermal conversion efficiency, the higher the heat generated when the light-emitting chip 102 emits the laser beam. The higher the power of the light-emitting chip 102, the higher the luminance of the emitted laser beam, and the higher the heat generated when the light-emitting chip 102 emits the laser beam. The greater the wavelength of the emitted laser beam, the higher the heat generated when the light-emitting chip 102 emits the laser beam. For example, the heat generated when the red light-emitting chip emits a laser beam, the heat generated when the green light-emitting chip emits a laser beam, and the heat generated when the blue light-emitting chip emits a laser beam decrease in sequence.
In some embodiments, the operating parameter includes the photothermal conversion efficiency. In this case, a photothermal conversion efficiency of each of the plurality of light-emitting chips 102 in the first region 10A is less than a photothermal conversion efficiency of each of the plurality of light-emitting chips 102 in the second region 10B.
In some other embodiments, the operating parameter includes the wavelength of the emitted laser beam. In this case, a wavelength of the laser beam emitted by each of the plurality of light-emitting chips 102 in the first region 10A is less than a wavelength of the laser beam emitted by each of the plurality of light-emitting chips 102 in the second region 10B. For example, the light-emitting chips 102 in the first region 10A emit at least one green or blue laser beam, and the light-emitting chips 102 in the second region 10B emit the red laser beam.
Of course, the wavelength of the laser beams emitted by some light-emitting chips 102 in the first region 10A may also be equal to the wavelength of the laser beams emitted by some light-emitting chips 102 in the second region 10B, as long as the total heat generated by all light-emitting chips 102 in the first region 10A is less than the total heat generated by all light-emitting chips 102 in the second region 10B. For example, in an example where the operating parameter includes the wavelength of the emitted laser beam, in a case where the laser device 10 includes three types of light-emitting chips 102, the three types of light-emitting chips 102 are referred to as a first light-emitting chip, a second light-emitting chip, and a third light-emitting chip according to the wavelength of the emitted laser beam, respectively. The wavelength of the laser beam emitted by the first light-emitting chip is greater than the wavelength of the laser beam emitted by the second light-emitting chip, and the wavelength of the laser beam emitted by the second light-emitting chip is greater than the wavelength of the laser beam emitted by the third light-emitting chip. The first light-emitting chips are arranged in the second region 10B. After finishing arranging the first light-emitting chips, if there is still an empty region in the second region 10B, the second light-emitting chips are arranged in the empty region. If all the second light-emitting chips cannot be arranged in the second region 10B, the remaining of the second light-emitting chips are arranged in the first region 10A, and the third light-emitting chips are arranged in the first region 10A.
In some embodiments, a row of light-emitting chips 102 may include different types of light-emitting chips 102, and in the row of light-emitting chips 102, light-emitting chips 102 that generate low heat may be arranged at the positions proximate to the middle of the row of light-emitting chips 102, and the light-emitting chips 102 that generate high heat may be arranged at the positions proximate to both ends (e.g., the head end or the tail end) of the row of light-emitting chips 102. Alternatively, different types of light-emitting chips 102 may also be arranged in a row of light-emitting chips 102 in a staggered manner.
For example, referring to
It will be noted that the present disclosure does not limit the number of types of light-emitting chips 102 included by a row of light-emitting chips 102 and the proportions of different types of light-emitting chips 102 in the plurality of light-emitting chips 102. For example, referring to
In some embodiments, in a case where the laser device 10 includes a two-color or multi-color laser device, different types of light-emitting chips 102 in the laser device 10 are configured to emit light in a time-division manner, so as to sequentially provide the illumination beams of different colors. In this case, the plurality of light-emitting chips 102 may be arranged according to the difference between light-emitting durations of different types of light-emitting chips 102 during a display period of a frame of an image. For example, the light-emitting chips 102 with a less light-emitting duration during a display period of a frame of an image may be arranged in the first region 10A, so as to reduce the heat generated by the light-emitting chips 102 in the first region 10A.
As shown in
The arrangement manner of the plurality of collimating lenses 1070 may correspond to the arrangement manner of the plurality of light-emitting chips 102. The collimating lenses 1070 corresponding to the light-emitting chips 102 in the first region 10A are located in a third region 107A (as shown in
For example, the arrangement manner of the collimating lenses 1070 is similar to that of the plurality of light-emitting chips 102. In this way, the laser beams emitted by the plurality of light-emitting chips 102 may be collimated by the plurality of collimating lens 1070, so that the laser device 10 may operate normally.
It will be noted that, the center distance between the two collimating lenses 1070 may refer to a distance between center points of orthogonal projections of the two collimating lenses 1070 on the base plate 1011. In a case where a vertex of a convex arc surface of the collimating lens 1070 coincides with the center point of the corresponding orthogonal projection, the center distance between the two collimating lenses 1070 refers to a distance between the vertices of the convex arc surfaces of the two collimating lenses 1070.
In some embodiments, the number of collimating lenses 1070 in the third region 107A is less than the number of collimating lenses 1070 in the fourth region 1073, and the center distance between two adjacent collimating lenses 1070 in a same row in the third region 107A is equal to the center distance between two adjacent collimating lenses 1070 in a same row in the fourth region 107B. Correspondingly, the arrangement manner of the plurality of light-emitting chips 102 corresponding to the plurality of collimating lenses 1070 is that the number of light-emitting chips 102 in the first region 10A is less than the number of light-emitting chips 102 in the second region 10B, and the arrangement density of the light-emitting chips 102 in the first region 10A is less than the arrangement density of the light-emitting chips 102 in the second region 10B.
For example, in a case where the arrangement manner of the plurality of light-emitting chips 102 is shown in
In some other embodiments, the number of collimating lenses 1070 in the third region 107A is less than the number of collimating lenses 1070 in the fourth region 107B, and the center distance between two adjacent collimating lenses 1070 in the same row in the third region 107A is greater than the center distance between two adjacent collimating lenses 1070 in a same row in the fourth region 107B. In this case, as shown in
In some embodiments, in the row direction, a width of the collimating lens 1070 in the third region 107A is greater than a width of the collimating lens 1070 in the fourth region 107B. For example, as shown in
In this way, it is conducive to reducing the difficulty of arranging the collimating lens group 107. Moreover, it is possible to increase an area of the orthogonal projection of the collimating lens 1070 in the third region 107A, so that the collimating lenses 1070 in the third region 107A may receive more laser beams from the light-emitting chips 102 in the first region 10A, thereby improving the collimating effect of the collimating lens group 107 on the laser beams emitted by the light-emitting chips 102 in the first region 10A.
In some other embodiments, the plurality of collimating lenses 1070 have orthogonal projections with a same shape and size. For example, as shown in
For other arrangement manners of the plurality of collimating lenses 1070 in the collimating lens group 107, reference may be made to the above arrangement manner of the plurality of light-emitting chips 102, and details will not be repeated herein.
In some embodiments, in a case where the wavelength of the laser beam emitted by the light-emitting chip 102 in the first region 10A is greater than the wavelength of the laser beam emitted by the light-emitting chip 102 in the second region 10B, a radius of curvature of the collimating lens 1070 in the third region 107A is less than a radius of curvature of the collimating lens 1070 in the fourth region 107B.
Here, the radius of curvature of the collimating lens 1070 is a reciprocal of a curvature. The less the radius of curvature of the collimating lens 1070 (i.e., the greater the curvature), the more curved the convex arc surface of the collimating lens 1070, and the greater the reduction in the divergence angle of the laser beam passing through the collimating lens 1070, the better the collimating effect.
In a case where the wavelength of the laser beam emitted by at least one light-emitting chip 102 in the first region 10A is greater than the wavelength of the laser beam emitted by the light-emitting chip 102 in the second region 10B, the divergence angle of the laser beam emitted by the at least one light-emitting chip 102 in the first region 10A is greater than the divergence angle of the laser beam emitted by the light-emitting chip 102 in the second region 10B. Therefore, a collimating lens 1070 with a small radius of curvature may be provided for the light-emitting chips 102 emitting the laser beam with a large divergence angle in the first region 10A, so that the collimating lens group 107 may adaptively collimate the laser beams emitted by the plurality of light-emitting chips 102, thereby improving the light-emitting effect of the laser device 10.
In some embodiments, as shown in
The heat generated when the light-emitting chip 102 in the groove 1014 emits a laser beam may be dissipated to the outside through the base plate 1011 proximate to the groove 1014, and a conduction path of the heat generated by the light-emitting chip 102 is a thickness of a portion of the base plate 1011 corresponding to the groove 1014. Since the thickness of the portion of the base plate 1011 at the light-emitting chip 102 is reduced by providing the groove 1014, the conduction path of the heat generated by the light-emitting chip 102 is short, and the heat may be rapidly transmitted to the outside. In this way, by providing the groove 1014 on the base plate 1011, it is possible to improve the heat dissipation efficiency of the light-emitting chip 102, reduce the probability of thermal damage of the light-emitting chips 102 due to heat accumulation, and thus improve the reliability of the laser device 10.
In some examples, the laser device 10 includes a groove 1014. For example, as shown in
In some other examples, the laser device 10 includes a plurality of grooves 1014 corresponding to the plurality of light-emitting chips 102, respectively. For example, as shown in
It will be noted that the number of light-emitting chips 102 accommodated in the plurality of grooves 1014 may be equal or unequal to each other, and the present disclosure is not limited thereto.
In some embodiments, referring to
The reflecting prism 104 is configured to guide the laser beam emitted by the light-emitting chip 102 to a direction (i.e., the Z direction in
It will be noted that the laser device 10 may also include one reflecting prism 104, and the reflecting prism 104 has a plurality of reflecting surfaces 1040, so as to correspondingly reflect the laser beams emitted by the plurality of light-emitting chips 102.
In some embodiments, as shown in
The laser-exit region of the light-emitting chip 102 refers to a region where the light-emitting chip 102 emits a laser beam, and the laser-exit region may be in a shape of a square, a rectangle, a circle, an ellipse, or the like, and the present disclosure does not limit the shape of the laser-exit region. The distance between the laser-exit region and the surface of the base plate 1011 away from the frame 1012 refers to a distance between a point or side of the laser-exit region proximate to the base plate 1011 and the surface of the base plate 1011 away from the frame 1012. For example, in a case where the laser-exit region is in a shape of a rectangle, the distance between the laser-exit region and the base plate 1011 refers to a distance between a side of the laser-exit region proximate to the base plate 1011 and the surface of the base plate 1011 away from the frame 1012.
In some embodiments of the present disclosure, the distance between the laser-exit region of the light-emitting chip 102 and the surface of the base plate 1011 away from the frame 1012 is greater than or equal to the distance between the bottom surface of the reflecting prism 104 corresponding to the light-emitting chip 102 and the surface of the base plate 1011 away from the frame 1012. In this way, the laser beam emitted by the light-emitting chip 102 may be prevented from being blocked by an inner wall of the groove 1014 where the light-emitting chip 102 is located, so that the laser beam emitted by the light-emitting chip 102 may be incident on the reflecting surface 1040 of the reflecting prism 104 corresponding to the light-emitting chip 102, and the laser beam emitted by the light-emitting chip 102 may be reflected and exit from the laser device 10, thereby improving the utilization rate of the laser beam.
In some embodiments, as shown in
In some embodiments, in addition to guiding the laser beam emitted by the light-emitting chip 102 to the direction away from the base plate 1011, the reflecting prism 104 is further configured to collimate the laser beam emitted by the light-emitting chip 102. In this way, the laser device 10 may not be provided with the collimating lens group 107, so as to reduce the components in the laser device 10, which is conducive to the miniaturization design of the laser device 10.
For example, as shown in
In some embodiments, the plurality of light-emitting chips 102 include one or more first type light-emitting chips and one or more second type light-emitting chips. The first type light-emitting chip is configured to emit a first type laser beam, the second type light-emitting chip is configured to emit a second type laser beam, and a polarization direction of the first type laser beam is perpendicular to a polarization direction of the second type laser beam. The first type laser beam and the second type laser beam exit from the accommodating space 1013 in the direction away from the base plate 1011, so as to form the illumination beams. For example, the first type laser beam includes at least one of the green laser beam or the blue laser beam, the second type laser beam includes the red laser beam. The polarization direction of the green laser beam or the blue laser beam emitted by the light-emitting chip 102 is substantially perpendicular to the polarization direction of red laser beam emitted by the light-emitting chip 102.
In this case, as shown in
Since the laser beams with different polarization directions have different transmittance when passing through optical components (e.g., the projection lens 3) in the laser projection apparatus 1000, if the illumination beams provided by the laser device 10 include the laser beams with a plurality of polarization directions, the projection image displayed may have a color cast problem and the display effect may be affected after the illumination beams are modulated by the light modulation assembly 2 and projected by the projection lens 3. However, in some embodiments of the present disclosure, the polarization direction of the first type laser beam is the same as that of the second type laser beam through the polarization conversion component 109, and the polarization directions of the laser beams in the illumination beams are same, so that the transmittance of the illumination beams passing through the optical components is same, which avoids the color cast problem in the projection image displayed by the laser projection apparatus 1000, thereby improving the display effect of the projection image.
In some embodiments, the polarization conversion component 109 includes a wave plate located on the side of the frame 1012 away from the base plate 1011, and the accommodating space 1013 is defined between the wave plate, the frame 1012, and the base plate 1011. In this way, water and oxygen outside the laser device 10 may be prevented from corroding the plurality of light-emitting chips 102, thereby prolonging the service life of the plurality of light-emitting chips 102 and improving the light-emitting effect of the plurality of light-emitting chips 102. Moreover, by using the polarization conversion component 109 to close the accommodating space 1013 directly, it is possible to reduce the number of components in the laser device 10, which facilitates the miniaturization of the laser device 10.
In some embodiments, as shown in
In some examples, as shown in
In some other examples, the polarization conversion component 109 defines the accommodating space 1013 by other components.
For example, as shown in
For another example, as shown in
For another example, as shown in
It will be noted that the boss 110 may be a boss in a shape of a ring or include a plurality of sub-bosses. For example, in a case where the boss 110 is a boss in a shape of a ring, the boss 110 is continuously disposed on the frame 1012. Alternatively, in a case where the boss 110 includes a plurality of sub-bosses, the plurality of sub-bosses are arranged at intervals on the frame 1012, and the present disclosure is not limited thereto.
The polarization conversion component 109 may adjust the polarization directions of the incident first type laser beam and the second type laser beam to be same in various ways. The following are two possible ways for the polarization conversion component 109 to adjust the polarization directions of the laser beams.
In the first way, the polarization conversion component 109 may adjust the polarization direction of a portion of the incident laser beams. For example, the polarization conversion component 109 deflects the polarization direction of the first type laser beam by 90 degrees without adjusting the polarization direction of the second type laser beam. Alternatively, the polarization conversion component 109 deflects the polarization direction of the second type laser beam by 90 degrees without adjusting the polarization direction of the first type laser beam. Since the polarization direction of the first type laser beam is perpendicular to the polarization direction of the second type laser beam, the polarization conversion component 109 may adjust the polarization directions of the incident first type laser beam and the incident second type laser beam to be same. In such way, the polarization conversion component 109 may be a half-wave plate.
In the second way, the polarization conversion component 109 may adjust the polarization directions of all incident laser beams. For example, the polarization conversion component 109 deflects the polarization direction of the first type laser beam and the polarization direction of the second type laser beam by 45 degrees. In such way, the polarization conversion component 109 may be a quarter-wave plate.
It will be noted that the angle of the polarization direction of the laser beam adjusted by the polarization conversion component 109 is related to a thickness D of the polarization conversion component 109 and a wavelength λ of the laser beam. For example, in a case where the wavelength λ of the laser beam is constant, the greater the thickness of the polarization conversion component 109, the greater the angle of the polarization direction of the laser beam adjusted by the polarization conversion component 109. For example, in a case where the wavelength λ of the laser beam is constant, a thickness of the half-wave plate is greater than that of the quarter-wave plate.
In some embodiments, referring to
In some embodiments, referring to
To sum up, the laser projection apparatus 1000 provided by some embodiments of the present disclosure changes at least one of the number or arrangement density of the light-emitting chips 102 in the first region 10A, so that the light-emitting chips 102 in the first region 10A have at least one of the two characteristics of reducing the total heat generated or increasing the heat dissipation area of a single light-emitting chip 102, so as to improve the heat dissipation effect of the light-emitting chips 102 in the first region of the laser device 10 and reduce the probability of thermal damage of the light-emitting chips 102 in the first region 10A due to heat accumulation, thereby improving the reliability of the laser projection apparatus 1000. Moreover, by providing the groove 1014 on the base plate 1011, it is possible to shorten the conduction path of the heat generated by the light-emitting chip 102 located in the groove 1014 and improve the heat dissipation efficiency of the light-emitting chip 102. In addition, by arranging the polarization conversion component 109, it is possible to make the polarization directions of the laser beams in the illumination beams same, so that the transmittance of the illumination beams passing through the optical components is same, thereby improving the display effect of the projection image.
A person skilled in the art will understand that the scope of disclosure in the present disclosure is not limited to specific embodiments discussed above and may modify and substitute some elements of the embodiments without departing from the spirits of this application. The scope of this application is limited by the appended claims.
Number | Date | Country | Kind |
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202111037630.2 | Sep 2021 | CN | national |
202111056654.2 | Sep 2021 | CN | national |
202122280816.2 | Sep 2021 | CN | national |
This application is a continuation application of International Patent Application No. PCT/CN2022/113950, filed on Aug. 22, 2022, which claims priority to Chinese Patent Application No. 202111037630.2, filed on Sep. 6, 2021; Chinese Patent Application No. 202111056654.2, filed on Sep. 9, 2021; and Chinese Patent Application No. 202122280816.2, filed on Sep. 18, 2021, which are incorporated herein by reference in their entireties.
Number | Date | Country | |
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Parent | PCT/CN2022/113950 | Aug 2022 | US |
Child | 18477016 | US |