1. Technical Field
The disclosure generally relates to projection devices and more particularly to a laser projection device.
2. Description of Related Art
Laser projection devices are more and more popular for its projected images having a lager color gamut, a higher brightness, an increased contrast and a better saturation.
Referring to
However, the distribution of the LEDs 21, 23, 25 and the beam splitters 31, 33, 35 in
What is needed, therefore, is an improved laser projection device which can overcome the above described shortcomings
Embodiment of laser projection device will now be described in detail below and with reference to the drawings.
Referring to
The substrate 10a is flat. The light source 20a and the spectroscope 40 are arranged on a top surface of the substrate 10a. A circuit (not shown) is arranged on the top surface of the substrate 10a. In this embodiment, the substrate 10 is made of electrically insulating materials, such as silicone, epoxy.
The light source 20a includes a first laser chip 21a, a second laser chip 23a and a third laser chip 25a. Each laser chip 21a (23a, 25a) is a laser diode. A brightness of each laser chip 21a (23a, 25a) can be controlled by a current flow through the circuit. The light source 20a is used to emit laser beams with colors needed.
The laser chips 21a, 23a, 25a are arranged on the substrate 10a along an arc-shaped curve. A sector-shaped region is defined by the laser chips 21a, 23a, 25a and two adjacent sides of the substrate 10a.
In this embodiment, the first laser chip 21a is arranged approaching, and is facing toward a corner of the top surface of the substrate 10a, and light emitting direction of the first laser chip 21a is along a transverse direction of the substrate 10a (shown in
The light emitting directions of the laser chips 21a, 23a and 25a are intersected. A sharp angle is defined between the light emitting direction of the second laser chip 23a and the transverse direction of the substrate 10a. Alternatively, the located positions of the laser chips 21a, 23a and 25a can be exchanged.
The spectroscope 40 is in the sector-shaped region, and light emitted from the laser chips 21a, 23a and 25a is adjusted to be oriented to a same direction to mix together.
The spectroscope 40 includes a first beam splitter 41, and a second beam splitter 43 spaced from the first beam splitter 41. The first beam splitter 41 and the second beam splitter 43 are arranged slantwise on the top surface of the substrate 10a. A sharp angle is defined between the first beam splitter 41 and the second beam splitter 43. In detail, the first beam splitter 41 and the second beam splitter 43 are located in a region surrounded by a dashed line I extending from an outer side of the first laser chip 21a, another dashed line II extending from an outer side of the third laser chip 25a, and the arranged curve of the laser chips 21a, 23a and 25a.
The first beam splitter 41 is located on light paths of the first laser chip 21a, the second beam splitter 43 is located on light paths of the second laser chip 23a. Both of the first beam splitter 41 and the second beam splitter 43 are located on light paths of the third laser chip 25a. The beam splitters 41, 43 are used to adjust light emitted from the laser chips 21a, 23a and 25a to mix together. The beam splitters 41, 43 are located at the sector-shaped region of the substrate 10a.
In this embodiment, the first laser chip 21a is a blue laser diode, the second laser chip 23a is a red laser diode, the third laser chip 25a is a green laser diode, and the first beam splitter 41 is a blue beam splitter, the second beam splitter 43 is a red beam splitter.
The first beam splitter 41 may reflect the blue laser beams and laser beams whose wavelength is near the wavelength of blue laser beams, but allows laser beams with other wavelength to pass through; the second beam splitter 43 may reflect the red laser beams and laser beams whose wavelength is near the wavelength of red laser beams, but allows laser beams with other wavelength to pass through.
Referring to
According to the laser projection device 100a of the present disclosure, because the laser chips 21a, 23a and 25a are arranged in a arc-shaped curve, and the first beam splitter 41 and the second beam splitter 43 are in the region surrounded by a dashed line I extending from an outer side of the first laser chip 21a, another dashed line II extending from an outer side of the third laser chip 25a, and the arranged curve of the laser chips 21a, 23a, 25a, the occupied areas of the substrate 10a are reduced, whereby the bulk of the substrate 10a can be smaller. As such, the bulk of the laser projection device 100a can be reduced.
Otherwise, in this disclosure, only two beam splitters 41, 43 are needed to adjust light emitted from the laser chips 21a, 23a and 25a to mix together, whereby the bulk and the cost of manufacturing the laser projection device 100a are reduced.
It is to be further understood that even though numerous characteristics and advantages of the present embodiment have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
---|---|---|---|
102113381 | Apr 2013 | TW | national |