The present invention relates to medical devices and methods of manufacturing such devices. More specifically, the present invention pertains to laser shock peening of medical devices.
Medical devices such as stents, guidewires, catheters, intravascular filters, needles, and needle stylets are used in performing a wide variety of medical procedures within the body. To permit such devices to be inserted into relatively small regions such as the cardiovascular and/or peripheral anatomies, the various components forming the device must be made relatively small while still maintaining a particular performance characteristic within the body such as high flexibility and fatigue strength. In the design of stents, for example, it is desirable to make the struts highly flexible to permit the stent to be easily collapsed and inserted into a deployment device such as a sheath or catheter. The stent must also be resistant to the formation of cracks or other irregularities that can reduce the performance of the device. Crack propagation may occur, for example, in regions of the stent subjected to high tensile stresses such as at joints and bending regions. Repeated expansion and contraction of the device within the body may accelerate the growth of these cracks, reducing the performance of the device over time.
A number of processes have been used to impart flexibility and fatigue strength to the surface of medical devices. Such processes typically include treating the medical device by annealing, work hardening, or other suitable techniques to alter the physical characteristics of the material. In a shot peening process, for example, the surface of a workpiece is physically bombarded with particles or shot to form a superficial compressive residual stress region below the surface. The formation of these compressive residual stresses within the workpiece tend to negate the tensile stresses that can cause the initiation and growth of fatigue cracks, and allows the workpiece to undergo a greater amount of bending before plastically deforming.
While conventional processes such as shot peening have been used in treating medical devices, the efficacy of such processes are typically limited by the depth, and in some cases the accuracy, at which the compressive residual stress regions can be formed within the workpiece. In general, the greater the depth at which compressive residual stresses are formed within the workpiece, the greater the resistance to cracking that will result. Since many conventional processes such as shot peening are limited by the depth at which the compressive residual stress region can be formed, such processes are not always effective at preventing cracks in highly flexible regions deep within the surface of the workpiece.
The present invention pertains to laser shock peening of medical devices. An illustrative laser shock peening process in accordance with an embodiment of the present invention includes the steps of providing a workpiece having a target surface to be irradiated, applying an absorption overlay onto the target surface, and directing a laser beam onto the absorption overlay to induce a pressure shock wave within the workpiece that can be used to produce one or more compressive residual stress regions therein. A high-energy laser apparatus capable of producing one or more intense laser beams may be provided to vaporize the absorption overlay material and form an interface layer of plasma above the target surface. The rapid expansion of volume and pressure at the interface layer induces a pressure shock wave within the workpiece that is greater than the dynamic yield stress of the workpiece material, creating a compressive residual stress region within the workpiece. In certain embodiments, a confining medium such as water can be provided to increase the magnitude of the induced pressure shock wave, further increasing the depth of the compressive residual stress region within the workpiece.
To form multiple compressive residual stress regions within the workpiece, a diffraction grating, prism or other similar device may be used to direct the light beam to selective locations on the workpiece target surface. In one illustrative embodiment, a holographic optical element may be employed to produce a desired laser beam pattern on the target surface of the workpiece. The holographic optical element may include a hologram that, when subjected to a laser beam, produces a desired pattern or array of compressive residual stress regions within the workpiece. In certain embodiments, for example, two adjacently pulsed laser beams can be directed simultaneously onto two locations of the target surface, inducing multiple pressure shock waves within the workpiece. The distance between the two locations on the target surface can be selected to produce a vertical compressive residual stress region deep within the workpiece formed by the overlapping of pressure shock waves. Other factors such as the laser beam intensity, duration, number of pulses, etc. may also be controlled to produce a desired compressive residual stress distribution within the workpiece.
In another illustrative laser shock peening process, multiple compressive residual stress regions may be formed within the workpiece by applying a patterned absorption overlay to the workpiece target surface. The patterned absorption overlay may comprise a patterned layer of absorptive paint, adhesive tape, or other suitable means for selectively absorbing the laser beam at certain locations above the target surface. When subjected to an intense laser beam, the patterned absorption overlay can be configured to induce multiple pressure shock waves that form a desired compressive residual stress distribution within the workpiece.
Using one or more of the aforesaid processes, a medical device such as a stent, guidewire, intravascular filter, guide catheter, needle, needle stylet, etc. may be formed having one or more compressive residual stress regions therein. In one illustrative embodiment, for example, a stent having a number of struts may include one or more compressive residual stress regions formed therein. In use, the compressive residual stress regions increase the flexibility and fatigue strength of the material at these locations, allowing the use of thinner struts with less disruption to the bloodstream. In another illustrative embodiment, a guidewire may include a core wire with one or more compressive residual stress regions formed in a pattern along the length of the guidewire, or within the entire guidewire. In certain embodiments, the one or more compressive residual stress regions may be formed about a joint used to fuse various components of the guidewire together. In use, the compressive residual stress regions can be used to impart one or more desired characteristics to the guidewire such as increased fatigue life and resistance to plastic deformation. In another illustrative embodiment, a medical device such as a guidewire, catheter, or the like, may include an elongated structure, such as a tube or wire, including a plurality of slots formed therein, wherein the elongated structure includes at least one compressive residual stress region.
The following description should be read with reference to the drawings, in which like elements in different drawings are numbered in like fashion. The drawings, which are not necessarily to scale, depict selected embodiments and are not intended to limit the scope of the invention. Although examples of construction, dimensions, and materials are illustrated for the various elements, those skilled in the art will recognize that many of the examples provided have suitable alternatives that may be utilized.
The inventive techniques described herein can be used to form any number of devices having a metal, metal-polymer, or metal-metal composition, or materials including a carbon ceramic material and/or ceramic coatings. Examples of suitable metals include, but are not limited to, copper, aluminum, titanium, nickel, platinum, tantalum, nickel-titanium alloy, and steel-based alloys such as stainless steel. Composites of one or more of these materials may also be used, if desired.
A sacrificial absorption overlay 20 disposed over the target surface 16 of the workpiece 18 may be employed to absorb the laser beam 14 irradiated from the high-energy laser apparatus 12. The absorption overlay 20 may comprise one or more materials that are substantially opaque to laser radiation. The absorption overlay 20 may include, for example, a layer or sheet of paint (e.g. iron oxide or carbon), pentacrythritol tetranitrate (PETN), bismuth, aluminum, iron, lead, cadmium, tin, zinc, graphite, or other suitable material. In certain embodiments, a biocompatible absorption overlay 20 including carbon or high-density polytetrafluoroethylene (HDPTFE) loaded with tungsten filler may be employed. Adhesive or gel materials that are opaque to laser radiation may also be used in certain embodiments.
In addition to absorbing radiation from the laser beam 14, in some embodiments the absorption overlay 20 acts as a thermal barrier to protect the workpiece 18 from thermal effects generated during the laser peening process in some cases. The ability to prevent the transfer of heat into the workpiece 18 is important to maintain the desired performance characteristics of the material in some embodiments. With respect to some shape-memory nickel-titanium alloys, for example, the absorption overlay 20 prevents undesired thermal effects within the material that can alter the memory and/or flexibility characteristics of the material.
To induce a pressure shock wave within the workpiece 18, the high-energy laser apparatus 12 should be configured to provide an intense laser beam in some cases. In one illustrative embodiment, a high-energy laser apparatus may include a 600-Watt neodymium-doped glass laser capable of producing a 20-nanosecond laser beam pulse having an energy density of about 200 J/cm2. The resultant shock wave produced by the high-energy laser apparatus 12 may have a pressure of greater than 1 GPa, which is above the yield stress of most metals.
When irradiated with the intense laser beam 14, the target surface 16 of the metallic workpiece 18 instantly vaporizes, forming an expanding gas release of plasma 22 at interface 24, which is then further heated by the incident laser beam 14. As the high-temperature plasma is formed at the interface 24, its pressure is increased to a range of about 1 to 10 GPa. This increase in temperature and pressure causes the plasma 22 to expand in a direction indicated generally by the upwardly pointed arrows 26, inducing a pressure shock wave within the workpiece 18. As indicated by the downwardly directed arrows 28, the induced pressure shock wave then propagates in part into the interior of the workpiece 18 along a semi-circular wavefront.
In certain embodiments, a confining medium 30 transparent to the irradiated laser beam 14 can be used to increase the magnitude of the induced pressure shock wave, in some cases by a factor of 5 or more in comparison to an open-air condition. The confining medium 30 may comprise any number of suitable materials known in the art, including, for example, water, glass, quartz, sodium silicate, fused silica, potassium chloride, sodium chloride, polyethylene, fluoropolymers, and nitrocellulose. The confining medium 30 may be formed integral with the absorption overlay 20, or may comprise a separate layer located adjacent to the absorption overlay 20.
As the induced pressure shock wave is transmitted into the workpiece 18, the region beneath the shocked area undergoes both plastic and elastic deformations, forming compressive residual stresses deep within the workpiece 18. The formation of compressive residual stresses within the workpiece 18 can be used to impart one or more desired characteristics to the medical device such as increased elasticity (i.e., resistance to plastic deformation) and resistance to cracking. Other characteristics such as corrosion resistance and wear resistance can also be achieved using a laser shock peening process.
The magnitude and depth of the compressive residual stress region 32 can be controlled by the amount of energy delivered to the irradiated area, and the dwell time of the laser beam 14. In some cases, the amount of energy delivered to the irradiated area is governed by the power at which the beam is generated, by any attenuation of the laser beam, by the degree of beam focusing, and by the spatial characteristics of the laser beam. By increasing the intensity of the laser beam 14, for example, the magnitude of the induced pressure shock wave can be increased to provide greater compressive residual stresses within the workpiece 18. Other characteristics such as the acoustic impedance of the workpiece 18 material(s) may also have an effect on the magnitude and depth at which compressive residual stresses are formed in the workpiece 18.
The laser apparatus 12 can be configured to emit either a continuous or pulsed laser beam 14 onto the target surface 16 of the workpiece 18. In a pulsed laser beam configuration, the dwell time can be controlled by varying the pulse duration and frequency of the emitted beam. A similar result can be obtained with a continuous laser beam configuration through the use of a mechanical or optical shutter. All other factors being the same, an increase in dwell time results in the formation of compressive residual stress regions of greater magnitude and depth. Thus, by altering the pulse duration and/or frequency of the laser beam, a desired compressive residual stress distribution can be achieved within the workpiece 18.
The high-energy laser apparatus 40 can be configured to simultaneously pulse the two laser beams 42,44 through the confining medium 52 and onto the absorption overlay 50. The intensity of each laser beam 42,44 can be made sufficient to induce two separate pressure shock waves within the workpiece 48, each emanating from a location immediately below the respective laser beam 42,44. As the pressure shock wave travels through the workpiece 48, first and second indents 54,56 are formed on the target surface 46 of the workpiece 48.
As is further indicated by dashed lines in
The laser beams 42,44 may be produced using multiple laser sources, or through the use of a single laser source in conjunction with a diffraction grating, prism, or other similar device. In certain embodiments, for example, the high-energy laser apparatus may include a type of diffraction grating called holographic optical element (HOE), which can be used to spatially modulate a single laser beam to produce a desired pattern onto the surface of the workpiece.
In certain embodiments, the distance D1 between each line of indents 90,92 can be selected to produce multiple vertical compressive residual stress regions within the workpiece 80. In the embodiment depicted in
The formation of multiple pressure shock waves within the workpiece can also be accomplished through the use of a patterned absorption overlay that is adapted to selectively absorb the laser pulse at only certain locations above the workpiece target surface. In certain embodiments, for example, a patterned absorption overlay of black paint can be applied to the workpiece. Using laser micro-texturing techniques known in the art, a pattern of absorptive dots, lines or other desired geometric pattern can be created on the absorption overlay. An inkjet patterning technique can also be employed in certain embodiments, if desired. When subjected to a large area laser beam, the patterned absorption overlay can be configured to produce multiple pressure shock waves within the workpiece at the absorptive regions of the overlay. As with other embodiments herein, the intensity, duration, and arrangement of the absorptive pattern can be selected to produce a desired compressive residual stress distribution within the workpiece.
In one such embodiment depicted in
As further shown in
To impart greater elasticity and fatigue strength, a number of compressive residual stress regions may be formed at selective locations of the stent 106 normally subjected to relatively high tensile stresses. As shown in greater detail in
As can be further seen in
When a biocompatible absorption overlay is utilized (e.g. carbon or HDPTFE), the process of laser shock peening the stent 106 can be accomplished after the stent 106 has been crimped on the delivery system (e.g. a balloon catheter). The remaining portion of the absorption overlay not used during the laser shock peening process can then be implanted within the body while still being attached to the stent 106. By selectively peening one or more regions of the stent 106 in this manner, the inherent stresses caused by the compression of the stent 106 on the delivery device can be either reset, or altered in some other desired manner. In certain embodiments, higher securement forces can also be imparted to the crimped stent 106 by laser shock peening the stent 106 after it has been placed on the delivery device.
During expansion of the stent 132 within the body, the amount of stress within the first and second circumferential bands 138,140 may increase significantly. In those embodiments in which the stent 132 is configured to expand using a balloon catheter, for example, the interior portion 148 of each peak 142 and trough 144 may undergo a significant increase in tensile stress in comparison to the outer portion 150 resulting from the decrease in the radius of curvature at this region. As a result, small cracks or other irregularities can form, reducing the performance characteristics desired in the device. Repeated expansion and contraction of the device caused by the pumping action of the heart can accelerate the growth of the cracks, reducing the performance of the stent 132 over time.
To impart greater elasticity and fatigue strength at these regions, the interior portion 148 of the peaks 142 and/or troughs 144 can be laser shock peened to form one or more compressive residual stress regions therein. As can be seen in
While the embodiments of
As shown in greater detail in
In use, the indents 164 create a compressed plane of residual stresses at an angle to the guidewire 158 that can be used to impart greater elasticity and torqueability to the guidewire 158. While two adjacently disposed lines of indents 164 are specifically illustrated in
When manufacturing guidewires like guidewire 158, core wire 160 may be formed from a generally metallic shaft (e.g., stainless steel, such as 304V, 304L, and 316
LV stainless steel; nickel-titanium alloy including linear elastic and/or super elastic nitinol; etc.) that is ground, for example, using a known centerless or other suitable grinding technique to define one or more tapers and/or a tapered section 161 as depicted in
Accordingly, it may be desirable to utilize laser shock peening along portions or all of core wire 160 in a manner similar to what is described herein when manufacturing guidewires like guidewire 158. For example, laser shock peening may be utilized along portions or all of distal section 163. This may create one or more compressive residual stress regions in distal section 163 that are similar to, for example, compressive residual stress region 162. The compressive residual stress regions in distal section 163 may improve the ability of distal section 163 to remain straight after grinding and to be resistant to plastic deformations during the use of guidewire 158. It should be noted that laser shock peening of core wire 160 is not intended to be limited to being in any particular pattern such as the spiral pattern depicted in
As can be further seen in
Attachment of the spring coil 188 to the distal section 186 of the guidewire 180 can be accomplished using a weld joint 192 or other suitable bonding means. To further strengthen the joint 192 and permit greater flexion of the guidewire 180, a compressive residual stress region 194 may be formed at or near the weld joint 192. As indicated by dashed lines 196 in
Turning now to
A sacrificial absorption overlay 208 may be applied to the target surface 204 of the mandrel 206. The absorption overlay 208 may include one or more materials that are substantially opaque to laser radiation, causing the absorption overlay 208 to absorb the laser beam 202 and form a number of indents 210 on the target surface 204. A confining medium may also be used to increase the magnitude of the induced pressure shock wave. In the illustrative embodiment of
With the laser apparatus 200 directed towards the mandrel 206, one or more laser beam 202 pulses can be directed onto the absorptive overlay 208 while rotating and periodically moving the mandrel 206 across the path of the laser beam 202. In an alternative configuration, the mandrel 206 can remain stationary while the high-energy laser apparatus 200 is rotated and periodically advanced across the surface of the mandrel 206. Using either embodiment, the indents 210 can be arranged in any pattern or array on the mandrel 206, as desired. In the illustrative embodiment depicted in
Once the desired pattern of indents 210 has been formed on the target surface 204, a tubular member is then created by extruding a polymeric material through a die using the indented mandrel 206. As can be seen in cross-section in
The member 2530 may comprise or be made of a metallic material, for example, the metallic materials discussed above with regard to the other embodiments. For example, the member 2530, or other portions of the device 2500, may be comprise stainless steel, such as 304V, 304L, and 316LV stainless steel; nickel-titanium alloy including linear elastic and/or super elastic nitinol; or any other suitable metallic material. The medical device 2500 may include a distal tip 2537 disposed at the distal end of member 2530. As can be appreciated, the medical device 2500 may include additional structures, such as additional shaft sections, core wires and/or members, shaping structures, such as a shaping ribbon or wire, one or more coils, marker members, or the like, or other structures that may be used in constructing the device 2500, some of which will be shown and discussed in additional embodiments below. All or portions of the shaft 2501 and/or member 2530 may include regions of compressive residual stresses, for example, formed by laser shock peening as discussed above.
With reference now to
In some embodiments, at least some, if not all of the slots 2535 are disposed at the same or a similar angle with respect to the longitudinal axis of the member 2530. As shown, the slots 2535 can be disposed at an angle that is perpendicular, or substantially perpendicular, or on a plane that is substantially normal to the longitudinal axis of the member 2530. However, in other embodiments, one or more slots 2535 or groups of slots may be disposed at different angles relative to one or more other slots 2535 or groups of slots and/or relative to the longitudinal axis.
The slots 2535 may be formed such that the remaining structure of the member 2530 includes a plurality of turns and/or ring structures 2537 interconnected by one or more segments or beams 2536. In other words, such rings 2537 and beams 2536 may include portions of the member 2530 that remain after the slots 2535 are formed in the body of the member 2530. As shown in
The slots 2535 and/or the associated rings 2537 and beams 2536 may be disposed in a pattern that provides the desired properties. For example, the slots 2535, or groups thereof, can be arranged along the length of, or about the circumference of, the member 2530 to achieve desired properties. For example, the slots 2535 can be arranged in a symmetrical pattern, such as being disposed essentially equally on opposite sides about the circumference of the member 2530, or equally spaced along the length of the member 2530, or can be arranged in an increasing or decreasing density pattern, or can be arranged in a non-symmetric or irregular pattern. As can be appreciated, the slots 2535 can be arranged in groups of two or more slots that are disposed at substantially the same point along the length of the member 2530. In some embodiments, some adjacent slots 2535 or groups of slots can be formed such that they include portions that overlap with each other about the circumference of the member 2530. In other embodiments, some adjacent slots 2535 or groups or slots can be disposed such that they do not necessarily overlap with each other. Other characteristics, such as slot size, slot shape and/or slot angle with respect to the longitudinal axis of the member 2530, can also be varied along the length of the member 2530, for example, to vary the flexibility or other properties. In other embodiments, moreover, it is contemplated that portions of the member 2530, or the entire member 2530, is substantially free of and/or does not include any such slots 2535.
Any of the above mentioned slots 2535 can be formed in essentially any known way. For example, slots 2535 can be formed by methods such as micro-machining, saw-cutting, laser cutting, grinding, milling, casting, molding, chemically etching or treating, or other known methods, and the like. In some such embodiments, the structure of the member 2530 is formed by cutting and/or removing portions of the member to form slots 2535. Some example embodiments of appropriate micromachining methods and other methods for forming slots, and structures for tubular members and medical devices including tubular members are disclosed in U.S. patent appliation Ser. No. 10/213,123 (now US Pub. No. 2003/0069522); and Ser. No. 10/604,504 (now US Pub. No. 2004/0181174-A2); and in U.S. Pat. Nos. 6,766,720; and 6,579,246, the entire disclosures of all of which are herein incorporated by reference. Some example embodiments of etching processes are described in U.S. Pat. No. 5,106,455, the entire disclosure of which is herein incorporated by reference.
As indicated above, all or portions of the shaft 2501 and/or member 2530, such as the remaining rings 2537 and beams 2536, or other portions of the member 2530 may include regions of compressive residual stresses, for example, formed by laser shock peening. As can be appreciated, in some embodiments, the beams 2536 may be somewhat small regions that are configured to transfer applied forces along the length of the tubular member 2530. Therefore, it may be beneficial to augment segments 2535 with increased elasticity and fatigue strength. As such, in some embodiments, one or more, or all of the beams 2536 may preferentially include compressive residual stress regions 2540. Compressive residual stress regions 2540 may be selectively formed at beams 2536, or compressive residual stress regions 2540 may be formed along other portions, or along substantially the entire length the portion including slots, such as distal portion 2531. Alternatively or additionally, compressive residual stress regions may be formed along any portion or substantially the entire length of the member 2530, the shaft 2501 and/or the medical device 2500. Compressive residual stress regions 2540 may be formed by a laser shock peening process such as those disclosed above.
Alternatively, and/or additionally, the member 2530 or other portions of the device 2500 can include two or more different regions of compressive residual stress that are at a different magnitude from one another. For example, as shown in
As indicated above, compressive residual stress regions 2547, 2548 may be located at any portion of the member 2530. Compressive residual stress regions 2547, 2548 may be formed in a portion of the tubular member 2530 before the slots 2535 are formed, or after the slots 2535 have been formed along the tubular member 2530. In some embodiments, the compressive residual stress regions 2547, 2548 may be formed after the slots 2535 have been formed in the tubular member 2530 such that the process of forming slots 2535, such as micromachining, may not adversely affect the compressive residual stresses 2547, 2548 formed in the tubular member 2530. In some such cases, any stresses remaining as a result of the slot forming process may be reduced and/or removed during the subsequent laser shock peening process, wherein compressing residual stress regions 2547, 2548 are formed in the tubular member 2530.
As can be appreciated, such a member 2530 may be incorporated and/or used in any of a wide variety of medical devices. For example, refer now to
A distal tip member 2537 may be disposed at the distal end 2626 of the tubular member 2530 and/or the distal end 2616 of the guidewire 2600. The distal tip member 2537 may be any of a broad variety of suitable structures, for example, a solder tip, a weld tip, a pre-made or pre-formed metallic or polymer structure, or the like, that is attached or joined to the distal end of the tubular member 2535 using a suitable attachment technique.
The guidewire 2600 may also include a core member 2630 that may be attached to the tubular member 2535, and extend from a location within the tubular member 2535 and/or from the proximal end 2628 of the tubular member 2535, for example, to the proximal end 2618 of the guidewire 2600. As can be appreciated, a portion of the core member 2630 may extend into at least a portion of the lumen 2570. In the embodiment shown, the core member 2630 includes a distal portion 2640 that extends within the lumen 2570, and a proximal portion 2642 that extends proximally from the tubular member 2530. In the embodiments shown, the core member 2630 ends proximally from the distal tip member 2537 and/or proximally of the distal end 2626 of the tubular member 2530. In other embodiments, however, core member 2630 may extend to, and be attached to the distal tip member 2537. The core member 2630 can be attached to the tubular member 2530 in any suitable manner and at any suitable location. For example, the core member 2630 may be attached to the tubular member 2530 through one or more attachment areas 2644, which in this embodiment are disposed adjacent the proximal end 2628 of the tubular member 2530. It can also be appreciated that the core member 2630 may be attached to the tubular member 2530 through the distal tip member 2537. It should be understood that additional attachment areas, and/or alternative positioning of attachment areas may be used in other embodiments.
Additionally, in other embodiments, the core member 2630 may be absent, and/or the tubular member 2530 may extend to the proximal end 2618 of the guidewire 2600. For example, in some other embodiments, the tubular member 2530 may extend along substantially the entire length of the guidewire 2600, for example, from the proximal end 2618 to the distal end 2616, and the core member 2630 may be present and disposed within at least a portion of the tubular member 2530, or may be absent, as desired.
The guidewire 2600 may also include other structures, such as such as a shaping wire or ribbon, one or more coils, marker members, coating, sleeve, or the like, or others, but such structures are not necessary in some other embodiments. In the embodiment shown, the guidewire 2600 includes a distal coil member 2636 and a shaping ribbon member 2638 that may be, for example, attached to and extend distally from the distal end of the core wire 2630, and may be attached, for example, to the tip member 2537. The materials used for such structures can be any that are suitable for their intended purpose, such as metals, polymers, or composites, and may include the example materials discussed above, or others. Additionally, the attachment of the various components can be achieved using any suitable attachment techniques, some examples of which may include adhesive bonding, welding, soldering, brazing, mechanical bonding and/or fitting, or the like, or any other suitable technique. As can be appreciated, this is but one example of a guidewire construction, and many others including various additional components and/or arrangements are contemplated.
Refer now to
The shaft 2712 can also include an inner tubular member 2724 defining an inner lumen 2715. For example, the slotted tubular member 2535 may be used a reinforcing member for the shaft 2712, and the inner tubular member 2724 may extend within the slotted tubular member 2535. The catheter may also include a distal tip structure 2728 disposed about a distal portion of the inner tubular member 2724 and/or the slotted tubular member 2535. A manifold 2714 can be connected to the proximal end of the elongate shaft 2712, and include a lumen and/or other structure to facilitate connection to other medical devices (e.g., syringe, Y-adapter, etc.) and to provide access to the lumen within the shaft 2712. The manifold may include a hub portion 2717 and a strain relief portion 2719. In some embodiments, the shaft 2712 may include additional devices or structures such as inflation or anchoring members, sensors, optical elements, ablation devices or the like, depending upon the desired function and characteristics of the catheter 2700. The catheter 2700 may also include other structures, such as one or more coil or braid, marker member, coating, sleeve, or the like, or others, but such structures are not necessary in some other embodiments. As can be appreciated, this is but one example of a catheter construction, and many others including various additional components and/or arrangements are contemplated. Some example embodiments of catheter constructions incorporating a slotted tubular member are disclosed in U.S. patent application Ser. No. 10/400,750 (Publication No. US-2004-0193140-A1), which is incorporated herein by reference.
The various laser shock peening processes also may be used to alter the elasticity and/or the elastic behavior of any of the devices and/or device components described herein. For example, a laser shock peening process may be used to impart cold work to portions of all of a tubular member (including a slotted tubular member), a core wire, a stent, any of the various components of a guidewire, any of the various components of a catheter, any of the various components of other medical devices, combinations thereof, and the like, including any of those structures described herein; thereby altering the elastic behavior. The relative amount of cold work imparted by laser shock peening processes that results in changes in elastic behavior may be the same as those sufficient to define compressive residual stress regions or it may be different. For example, a greater degree of laser shock peening may be necessary to alter the elastic behavior of structure than that required to define compressive residual stress regions. In some embodiments, cold working in the range of 5 to 70%, or in the range of 10 to 60% may be imparted using laser shock peening. However, other amounts of cold work outside of these ranges is contemplated, depending upon the desired characteristics. By altering the elastic behavior, the laser shock peening process may alter the profile of the stress-strain curve of these structures (e.g., when they are made from super-elastic materials such as super-elastic nickel-titanium alloy) so that the profile approaches linear-elastic behavior. This may improve the pushability, torquability, fatigue life, and the like of these structures or of the devices bearing these structures. The linear-elastic characteristics may be limited to a selected portion of the structure (i.e., laser shock peening to a selected portion of a structure may impart linear-elastic properties to that selected portion) or to essentially the entire structure. In some embodiments, further variations may be achieved by modulating the intensity of the shock wave (e.g., by modulation of laser intensity and/or through the selection of the sacrificial overlay materials, properties, and/or thickness) that the structures are subjected to, thereby modulating the depth of penetration of the cold work into the structure, for example. The amount of modulation can be manipulated to increase or decrease the degree to which elastic properties are affected.
Laser shock peening may also be used to increase the recoverable (elastic) strain in structures made from materials other than nickel-titanium alloys by cold working these components. For example, laser shock peening may increase the recoverable strain in structures made from or otherwise including materials such as stainless steel, platinum, other metals and/or metal alloys, and the like including any of those materials disclosed herein. This may improve the durability (e.g., resistance to kinking) of these structures.
Laser shock peening may also be useful in achieving desirable elastic strain behavior in delicate metal structures that cannot be machined or otherwise fabricated with the desired properties already imparted in the material. This could occur in cases where processing steps cause full or partial annealing of the material, where the material is more difficult or impossible to process when it possesses its desired final properties, or where the material is not commercially available with the desired final properties. For example, when a metal structure is laser cut, the laser cutting process may cause full or partial annealing of the structure. In this example, laser shock peening may be used to restore improved elastic properties to the structure after the laser cutting is complete.
As will be appreciated by those of skill in the art and others, the particular structure and assembly of the medical devices disclosed herein are provided by way of example only, and that many of a broad variety of others may be used. Having thus described several example embodiments of the present invention, those of skill in the art will readily appreciate that other embodiments may be made and used which fall within the scope of the claims attached hereto. Numerous advantages of the invention covered by this document have been set forth in the foregoing description. It will be understood that this disclosure is, in many respects, only illustrative. Changes may be made in details, particularly in matters of shape, size and arrangement of parts without exceeding the scope of the invention.