Patent Grant
9077145
This application claims all benefits accruing under 35 U.S.C. §119 from China Patent Application No. 201210572832.1, filed on Dec. 26, 2012 in the China Intellectual Property Office. This application is also related to application entitled, “LASER”, filed Dec. 20, 2013 Ser. No. 14/137,248, “LASER”, filed Dec. 20, 2013 Ser. No. 14/137,219, “LASER”, filed Dec. 20, 2013 Ser. No. 14/137,236, and “LASER”, filed Dec. 20, 2013 Ser. No. 14/137,185. Disclosures of the above-identified applications are incorporated herein by reference.
1. Technical Field
The present disclosure relates to lasers.
2. Description of Related Art
Because of the high power levels available, a variety of lasers are frequently used in industrial applications such as cutting and welding, and in military applications such as laser weapons.
Most of the high power lasers are multi-mode lasers, and the laser beams have large divergence angle, shallow depth of focus, low stability, and high power density loss during long distance transmission.
What is needed, therefore, is to provide a laser in which the laser beam has small divergence angle, long depth of focus, small spot size, and low power density loss during long distance transmission.
Many aspects of the present disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments.
The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “another,” “an,” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
Similar to some prior art, the laser 10 further includes two electrodes, a water-cooled jacket, a water inlet, a water outlet, a gas reservoir, a gas tube, and other components (not shown in
The body 1020 is made of a nonmetal which is not easy to deform under heating, such as silicon, silicon oxide, and silicon carbide. In one embodiment, the body 1020 is made of silicon. The body 1020 has a diameter ranging from about 5 millimeters to about 50 millimeters. In one embodiment, the body 1020 has a diameter of 20 millimeters. The body 1020 has a thickness ranging from about 2 millimeters to about 20 millimeters. In one embodiment, the body 1020 has a thickness of 5 millimeters.
The metal film 1022 is made of a metal which has high melting point, it is difficult to be oxidized, and can produce surface plasma. In one embodiment, gold is used to make the metal film 1022. The metal film 1022 has a thickness which is greater than its skin depth. In one embodiment, the thickness of the metal film 1022 is greater than 50 nanometers. The metal film 1022 can be coated onto the first reflective surface 1021 of the body 1020 by electroplating, depositing, sputtering, spraying, or any other coating methods.
The microstructure 112 is concaved from the first reflective surface 1021 of the body 1020. The metal film 1022 coats both on the first reflective surface 1021 and the microstructure 112. The microstructure 112 is located close to a center of the first reflective surface 1021. In one embodiment, the center of the first reflective surface 1021 is set as the center of the microstructure 112. The microstructure 112 can be formed by etching the body 1020 with the aid of a mask.
The microstructure 112 is a concave ring-shaped structure. The microstructure 112 has a depth relating to a working wavelength of the laser 10. The depth is in a range from about 0.5λ to about 2λ, wherein λ is the working wavelength of the laser 10. In one embodiment, the depth of the microstructure 112 is 0.5λ. The working wavelength of the laser 10 is determined by the active laser medium 108. In one embodiment, the active laser medium 108 is carbon dioxide (CO2), and the working wavelength λ is 10.6 micrometers. The depth of the microstructure 112 is in a range from about 5.3 micrometers to about 21.2 micrometers. In one embodiment, the depth of the microstructure 112 is 5.3 micrometers.
The microstructure 112 has a width (the outside radius of the concave ring-shaped structure minus the inside radius of the concave ring-shaped structure) relating to the working wavelength λ of the laser 10. The width is in a range from about 0.5λ to about 2λ. In one embodiment, the width of the microstructure 112 is 0.5λ. The working wavelength λ of the laser 10 is determined by the active laser medium 108. In one embodiment, the active laser medium 108 is carbon dioxide (CO2), and the working wavelength λ is 10.6 micrometers. The width of the microstructure 112 is in a range from about 5.3 micrometers to about 21.2 micrometers. In one embodiment, the width of the microstructure 112 is 5.3 micrometers.
While the depth and the width of the microstructure 112 are both in a range from about 0.5λ to about 2λ, then the laser beam obtained by the laser 10 will have a relatively small divergence angle and spot size.
The output mirror 104 is a flat mirror. A diameter can be same as the body 1020 of the total reflective mirror 102. In one embodiment, the diameter of the output mirror 104 is 20 millimeters. The output mirror 104 is a partial reflective mirror. A reflectivity of the output mirror 104 ranges from about 25% to about 55%. The output mirror 104 is made of germanium, zinc selenide, or gallium arsenide. In one embodiment, the output mirror 104 is made of zinc selenide.
The discharge lamp 106 is a quartz glass tube. The discharge lamp 106 has a diameter smaller than that of the output mirror 104. In one embodiment, the diameter of the discharge lamp 106 is in a range from about 2 millimeters to about 10 millimeters. In another embodiment, the diameter of the discharge lamp 106 is in a range from about 5 millimeters to about 6 millimeters.
The active laser medium 108 can be gas, such as CO2, helium (He), neon (Ne), nitrogen (N2), and carbon oxide (CO). The active laser medium 108 can also be solid, liquid, or semi-conductor. In one embodiment, the active laser medium 108 is CO2.
The resonant cavity 110 has a length of about 400 millimeters to about 800 millimeters. In one embodiment, the length of the resonant cavity 110 ranges from about 500 millimeters to about 600 millimeters. In another embodiment, the length of the resonant cavity 110 is 600 millimeters.
The plurality of microstructures 212 is concaved from the first reflective surface 2021 of the body 2020. The metal film 2022 coats both on the first reflective surface 2021 and the plurality of microstructures 212. The plurality of microstructures 212 is located close to a center of the first reflective surface 2021. In one embodiment, the center of the first reflective surface 2021 is set as the center of the plurality of microstructures 212. The plurality of microstructures 212 can be formed by etching the body 2020 with the aid of a mask.
Similar to the laser 10, each of the plurality of microstructures 212 is a concave ring-shaped structure. Each of the plurality of microstructures 212 in the laser 20 has a depth ranging from about 0.5λ to about 2λ, wherein λ is the working wavelength of the laser 20. In one embodiment, the plurality of microstructures 212 has a same depth. In another embodiment, the same depth is 0.5λ. In another embodiment, the plurality of microstructure 212 has different depths. When the active laser medium 208 is CO2, each of the plurality of microstructure 212 has a depth ranging from about 5.3 micrometers to about 21.2 micrometers.
Similar to the laser 10, each of the plurality of microstructures 212 in the laser 20 has a width ranging from about 0.5λ to about 2λ. In one embodiment, the plurality of microstructures 212 has a same width. In another embodiment, the same width is 0.5λ. In another embodiment, the plurality of microstructures 212 has different widths. When the active laser medium 208 is CO2, each of the plurality of microstructures 212 has a width ranging from about 5.3 micrometers to about 21.2 micrometers.
There is an interval between each two adjacent microstructures 212. Each interval has a size ranging from about 0.5λ to about 2λ. In one embodiment, each interval has a same size. In another embodiment, the same size of all the intervals is λ. When the active laser medium 208 is CO2, each interval has a size ranging from about 5.3 micrometers to about 21.2 micrometers.
The other components of the laser 20 are all the same as that of the laser 10.
Compared with the laser 10 having one microstructure 112, the laser 20 has a plurality of microstructures 212; additionally, each interval between each two adjacent microstructures 212 has a size ranging from about 0.5λ to about 2λ, therefore, the surface plasma resonance produced in the resonant cavity 210 is more remarkable. A laser beam which has a long depth of focus, and low power density loss during long distance transmission can then be obtained.
Both the first microstructure 3120 and the second microstructure 3122 are concaved from the first reflective surface 3021 of the body 3020. The metal film 3022 coats both on the first reflective surface 3021, the first microstructure 3120, and the second microstructure 3122. The first microstructure 3120 and the second microstructure 3122 are located close to a center of the first reflective surface 3021. In one embodiment, the center of the first reflective surface 3021 is set as the center of both the first microstructure 3120 and the second microstructure 3122. Both the first microstructure 3120 and the second microstructure 3122 can be formed by etching the body 3020 with the aid of a mask.
The shape, structure, and size of the first microstructure 3120 are all the same as that of the microstructure 112.
The second microstructure 3122 is a hole with a geometric shape. The shape of the hole can be round, oval, square, rectangular, hexagonal, or octagonal, for example. In one embodiment, the second microstructure 3122 is a round hole.
The second microstructure 3122 has a depth relating to a working wavelength of the laser 30. The depth is in a range from about 0.5λ to about 2λ, wherein λ is the working wavelength of the laser 30. In one embodiment, the depth of the second microstructure 3122 is 0.5λ. The working wavelength of the laser 30 is determined by the active laser medium 108. In one embodiment, the active laser medium 308 is carbon dioxide (CO2), and the working wavelength λ is 10.6 micrometers. The depth of the second microstructure 3122 is in a range from about 5.3 micrometers to about 21.2 micrometers. In one embodiment, the depth of the second microstructure 3122 is 5.3 micrometers.
The second microstructure 3122 has a lateral size relating to a working wavelength λ of the laser 30. The lateral size is in a range from about 0.5λ to about 2λ. In one embodiment, the lateral size of the second microstructure 3122 is 0.5λ. The working wavelength λ of the laser 30 is determined by the active laser medium 308. In one embodiment, the active laser medium 308 is carbon dioxide (CO2), and the working wavelength λ is 10.6 micrometers. The lateral size of the second microstructure 3122 is in a range from about 5.3 micrometers to about 21.2 micrometers. In one embodiment, the lateral size of the second microstructure 3122 is 5.3 micrometers.
The first microstructure 3120 and the second microstructure 3122 can have a same depth. In one embodiment, the same depth is 0.5λ. The first microstructure 3120 and the second microstructure 3122 can also have different depths.
There is an interval between the first microstructure 3120 and the second microstructure 3122. A size of the interval is in a range from 0.5λ to about 2λ. In one embodiment, the size of the interval between the first microstructure 3120 and the second microstructure 3122 is λ.
While the depth and the width of the first microstructure 3120 are both in a range from about 0.5λ to about 2λ, and the depth and the lateral size of the second microstructure 3122 are both in a range from about 0.5λ to about 2λ, then the laser beam obtained by the laser 30 will have a relatively small divergence angle and spot size.
The other components of the laser 30 are all the same as that of the laser 10.
The shape, structure, and range of size of the plurality of first microstructures 4120 are the same of that of the first microstructure 3120.
The shape, structure, and size of the second microstructure 4122 are all the same of that of the second microstructure 3122.
The plurality of first microstructures 4120 and the second microstructure 4122 can have a same depth. In one embodiment, the same depth is 0.5λ. The first plurality of microstructures 4120 and the second microstructure 4122 can also have different depths.
There is an interval between each two adjacent first microstructures 4120 or between the adjacent first microstructure 4120 and second microstructure 4122. Each interval has a size ranging from 0.5λ to about 2λ. In one embodiment, each interval has a same size. In one embodiment, the same size of the interval is λ.
The other components of the laser 40 are all the same as that of the laser 30.
Compared with the laser 30 having one first microstructure 3120, the laser 40 has a plurality of first microstructures 4120; additionally, each interval between each two adjacent microstructures 4120 and 4122 has a size ranging from about 0.5λ to about 2λ, therefore, the surface plasma resonance produced in the resonant cavity 410 is more remarkable. A laser beam which has a long depth of focus, and low power density loss during long distance transmission can then be obtained.
The laser beam obtained by the laser 10, 20, 30 or 40 in present disclosure has a high quality beam, a long depth of focus, and a high power density in the beam center. Therefore, the laser beam can be easily applied in cutting or welding, especially in long distance transmission or commutation.
It is to be understood that the above-described embodiment is intended to illustrate rather than limit the disclosure. Variations may be made to the embodiment without departing from the spirit of the disclosure as claimed. The above-described embodiments are intended to illustrate the scope of the disclosure and not restricted to the scope of the disclosure.
It is also to be understood that the above description and the claims drawn to a method may include some indication in reference to certain steps. However, the indication used is only to be viewed for identification purposes and not as a suggestion as to an order for the steps.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2012 1 05728321 | Dec 2012 | CN | national |
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|---|---|---|---|
| 4713824 | Heller | Dec 1987 | A |
| 5506858 | Takenaka et al. | Apr 1996 | A |
| Number | Date | Country |
|---|---|---|
| 01189972 | Jul 1989 | JP |
| Number | Date | Country | |
|---|---|---|---|
| 20140294034 A1 | Oct 2014 | US |
