Claims
- 1. A method of curing epoxy resin compositions, which comprises:
- heating an epoxy resin composition comprising (a) an epoxy resin having an average of more than one epoxy group per molecule and (b) a curing agent comprising a compound having the formula: ##STR22## wherein R.sub.1 and R.sub.2 are each a hydrocarbon atom, C.sub.1 -C.sub.8 alkyl radical or --CH.sub.2 CH.sub.2 SCH.sub.3 radical and R is a hydrogen atom or methyl radical.
- 2. The method of claim 1, wherein R.sub.1 is a hydrogen atom, R.sub.2 is methyl, n-propyl, isopropyl, sec.-butyl or --CH.sub.2 CH.sub.2 SCH.sub.3, and R is a hydrogen atom or methyl radical.
- 3. A curable epoxy resin composition comprising (a) an epoxy resin having an average of more than one epoxy group per molecule and (b) a curing agent comprising a compound having the formula: ##STR23## wherein R.sub.1 and R.sub.2 are each a hydrogen atom, C.sub.1 -C.sub.8 alkyl radical or --CH.sub.2 CH.sub.2 SCH.sub.3 radical, and are the same or different from each other; and R is a hydrogen atom or methyl radical.
- 4. The curable epoxy resin composition claimed in claim 3, wherein the amount of said compound is sufficient to provide 0.5-1.5 times active hydrogen equivalent weight based on epoxy equivalent weight.
- 5. The curable epoxy resin composition claimed in claim 3, wherein R.sub.1 is a hydrogen atom, R.sub.2 is methyl, propyl, isopropyl, sec.-butyl or --CH.sub.2 CH.sub.2 SCH.sub.3, and R is a hydrogen atom or methyl radical.
- 6. The curable epoxy resin composition claimed in claim 3, wherein said epoxy resin is a polyglycidyl ether of a polyhydric phenol.
- 7. A cured resin obtained by contacting an epoxy resin having an average of more than 1 epoxy group per molecule with a curing agent comprising a compound having the formula: ##STR24## wherein R.sub.1 and R.sub.2 are each a hydrogen atom, C.sub.1 -C.sub.8 alkyl radical or --CH.sub.2 CH.sub.2 SCH.sub.3 radical, and are the same or different from each other; and R is a hydrogen atom or methyl radical, the amount of said compound being sufficient to provide 0.5-1.5 times active hydrogen equivalent weight based on epoxy equivalent weight.
- 8. The curable epoxy resin composition claimed in claim 5, wherein the amount of said compound is sufficient to provide 0.5-1.5 times active hydrogen equivalent weight per epoxy equivalent weight.
- 9. The curable epoxy resin composition claimed in claim 8, wherein the amount of said compound is sufficient to provide 0.7-1.2 times active hydrogen equivalent weight per epoxy equivalent weight.
- 10. The curable epoxy resin composition claimed in claim 3, wherein said epoxy resin is a glycidyl ether of a polyhydric phenol wherein the polyhydric phenol is selected from the group consisting of 2,2-bis(4-hydroxyphenyl)-propane, resorcinol, hydroquinone, pyrocatechol, salignenin, Bisphenol F and phenolformaldehyde resin.
- 11. The cured resin claimed in claim 7, wherein the amount of said compound is sufficient to provide 0.7-1.2 times active hydrogen equivalent weight per epoxy equivalent weight.
- 12. The method of claim 1, wherein said heating is in the range of from 100.degree. to 130.degree. C.
Priority Claims (2)
Number |
Date |
Country |
Kind |
56-193065 |
Dec 1981 |
JPX |
|
57-12892 |
Jan 1982 |
JPX |
|
Parent Case Info
This application is a continuation of application Ser. No. 445,154, filed Nov. 29, 1982, now abandoned.
US Referenced Citations (4)
Number |
Name |
Date |
Kind |
3597441 |
Wollner et al. |
Aug 1971 |
|
3635844 |
Porret et al. |
Jan 1971 |
|
3635845 |
Porret et al. |
Jan 1972 |
|
3725342 |
Porret et al. |
Apr 1973 |
|
Non-Patent Literature Citations (1)
Entry |
"Nippon Kagaku Zasshi" 83, No. 5, 620-624 (1962) with English Translation. |
Continuations (1)
|
Number |
Date |
Country |
Parent |
445154 |
Nov 1982 |
|