This research addresses the need for improved electronic devices formed from galium arsenide. The specific innovation comprises the formation of homoepitaxial galium arsenide on insulators by the lateral overgrowth process,and the fabrication of devices from such layers. The use of an insulator beneath an active layer will yield improved performance, as well as enhance resistance to radiation. The performance improvements derive from the decoupling of adjacent monolithic devices as well as a degree of decoupling from the substrate wafer. This research will determine the feasibility of the necessary lateral growth to evaluate the feasibility of applying organometalic chemical vapor deposition to device fabrication on the laterally overgrown films.