Claims
- 1. A layer system for a semi-conductor resistance measuring sensor, comprising a ceramic substrate; electrodes applied on said ceramic substrate; a sensor layer arranged over said electrodes; and means for improving adherence of said sensor layer to said substrate, said means including at least one adherence improving layer portion located under and extending upwardly into said sensor layer, said at least one layer portion extending along at least one of said electrodes and also sintered with said substrate, said at least one layer portion being composed of a material which has at least one layer portion being composed of a same material as said substrate and thereby good adhesive strength is provided between said at least one layer portion and said substrate after sintering of said at least one layer portion and said substrate.
- 2. A layer system as defined in claim 1, wherein said layer portion is arranged as a strip along at least one of said electrodes.
- 3. A layer system as defined in claim 1, wherein said layer portion extends partially along at least one of said electrodes.
- 4. A layer system as defined in claim 1, wherein said layer portion is located between said electrodes.
- 5. A layer system as defined in claim 1, wherein said layer portion is formed as a column-shaped anchor clamped by said sensor layer.
- 6. A layer system as defined in claim 5, wherein said sensor layer has a layer thickness, said anchor extending at least over a half of said layer thickness.
- 7. A layer system as defined in claim 5, wherein said anchor is formed as an anchoring strip.
- 8. A layer system as defined in claim 1, wherein at least one of said adherence improving layer portion and said sensor layer have a surface which is rough.
- 9. A layer system as defined in claim 1, wherein said adherence improving layer portion and said sensor layer have surfaces which are rough.
- 10. A layer system as defined in claim 1, wherein at least one of said adherence improving layer portion and said sensor layer have a porous surface.
- 11. A layer system as defined in claim 1, wherein said adherence improving layer portion and said sensor layer have porous surfaces.
- 12. A layer system as defined in claim 1, wherein at least one of said adherence improving layer portion and said sensor layer is composed of a material which has substantially similar properties with a material of said substrate.
- 13. A layer system as defined in claim 1, wherein at least one of said adherence improving layer portion and said sensor layer is composed of a material of which said substrate is composed.
- 14. A layer system as defined in claim 1, wherein said adherence improving layer portion and said sensor layer are composed of a material which is at least substantially similar to a material of said substrate.
- 15. layer system as defined in claim 1, wherein at least one of said adherence improving layer portion and said sensor layer is composed of a material which contains more than 90% A.sub.2 O.sub.3.
- 16. A layer system as defined in claim 15, wherein said material is an Al.sub.2 O.sub.3 -containing printing paste with a pore-forming substance which at least during sintering forms a porous surface.
- 17. A layer system as defined in claim 1, wherein at least one of said adherence improving layer portion and said sensor layer is composed of Al.sub.2 O.sub.3.
- 18. A semi-conductor resistance measuring sensor, comprising a ceramic substrate; electrodes applied on said ceramic substrate; a sensor layer arranged over said electrodes; and means for improving adherence of said sensor layer to said substrate, said means including at least one adherence improving layer portion located under and extending upwardly into said sensor layer, said at least one layer portion extending arranged along at least one of said electrodes and also sintered with said substrate, said at least one layer portion being composed of a material which has at least one layer portion being composed of a same material as said substrate and thereby good adhesive strength is provided between said at least one layer portion and said substrate after sintering of said at least one layer portion and said substrate.
Parent Case Info
This is a continuation of application Ser. No. 08/120,580 filed Sep. 10, 1993 now abandoned.
US Referenced Citations (6)
Continuations (1)
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Number |
Date |
Country |
Parent |
120580 |
Sep 1993 |
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