Layer system with at least one mixed crystal layer of a multi-oxide

Abstract
A PVD layer system for the coating of workpieces encompasses at least one mixed-crystal layer of a multi-oxide having the following composition: (Me11-xMe2x)2O3, where Me1 and Me2 each represent at least one of the elements Al, Cr, Fe, Li, Mg, Mn, Nb, Ti, Sb or V. The elements of Me1 and Me2 differ from one another. The crystal lattice of the mixed-crystal layer in the PVD layer system has a corundum structure which in an x-ray diffractometrically analyzed spectrum of the mixed-crystal layer is characterized by at least three of the lines associated with the corundum structure. Also disclosed is a vacuum coating method for producing a mixed-crystal layer of a multi-oxide, as well as correspondingly coated tools and components.
Description

EXAMPLES AND FIGURES

The following will explain this invention with the aid of examples and with reference to the exemplary figures which illustrate the following:



FIG. 1 X-ray spectra of (Al1-xCrx)2O3 layers;



FIG. 2 Lattice parameters of (Al1-xCrx)2O3 layers;



FIG. 3 Temperature pattern of the lattice parameters;



FIG. 4 Oxidation pattern of a TiAlN layer;



FIG. 5 Oxidation pattern of a TiCN layer;



FIG. 6 Oxidation pattern of a TiCN/(Al1-xCrx)2O3 layer;



FIG. 7 Detail of a (Al1-xCrx)2O3 layer.





The example per test #1), described below in more detail, covers a complete coating cycle according to the invention, employing a weak, essentially vertical magnetic field in the area of the target surface.


The workpieces were placed in appropriately provided double- or triple-rotatable holders, the holders were positioned in the vacuum processing chamber, whereupon the vacuum chamber was pumped down to a pressure of about 10−4 mbar.


For generating the process temperature, supported by radiation heaters, a low voltage arc (LVA) plasma was ignited between a baffle-separated cathode chamber housing a hot cathode and the anodic workpieces in an argon-hydrogen atmosphere.


The following heating parameters were selected:


















Discharge current (LVA)
250 A



Argon flow
50 sccm



Hydrogen flow
300 sccm



Process pressure
1.4 × 10−2 mbar



Substrate temperature
approx. 550° C.



Process duration
45 min










Those skilled in the art will be familiar with possible alternatives. As a matter of preference the substrate was connected as the anode for the low voltage arc and also preferably pulsed in unipolar or bipolar fashion.


As the next procedural step the etching was initiated by activating the low voltage arc between the filament and the auxiliary anode. Here as well, a DC-, pulsed DC- or AC-operated MF or RF power supply can be connected between the workpieces and frame ground. By preference, however, a negative bias voltage was applied to the workpieces.


The following etching parameters were selected:


















Argon flow
60 sccm



Process pressure
2.4 × 10−3 mbar



Discharge current, LVA
150 A



Substrate temperature
approx. 500° C.



Process duration
45 min



Bias
200-250 V










The next procedural step consisted in the coating of the substrate with an AlCrO layer and a TiAlN interface layer. If higher ionization is needed, all coating processes can be assisted by means of the low voltage arc plasma.


For the deposition of the TiAlN interface layer the following parameters were selected:


















Argon flow
0 sccm (no argon added)



Nitrogen flow
Pressure-regulated to 3 Pa



Process pressure
3 × 10−2 mbar



DC source current TiAl
200 A



Coil current of the source
1 A



magnetic field (MAG 6)



DC substrate bias
U = −40 V



Substrate temperature
approx. 550° C.



Process duration
120 min










For the transition of about 15 min to the actual functional layer the AlCr arc sources were switched on with a DC source current of 200 A, with the positive pole of the DC source connected to the annular anode of the source and to frame ground. During that phase a DC substrate bias of −40 V was applied to the substrate. 5 minutes after activation of the AlCr (50/50) targets the oxygen inflow was started and was then ramped up within 10 min from 50 to 1000 sccm. At the same time the TiAl (50/50) targets were turned off and the N2 was reduced back to approx. 100 sccm. Just before the introduction of oxygen the substrate bias was switched from DC to bipolar pulses and increased to U=−60 V. That completed the interface layer and the transition to the functional layer. The targets were powder-metallurgically produced targets. Alternatively, melt-metallurgical targets may be used as well. To reduce the spattering rate, monophase targets as described in DE 19522331 may be used.


The coating of the substrate with the actual functional layer took place in pure oxygen. Since aluminum oxide constitutes an insulating layer, either a pulsed or an AC bias supply was used.


The key functional-layer parameters were selected as follows:















Oxygen flow
1000 sccm


Process pressure
2.6 × 10−2 mbar


DC source current, AlCr
200 A


Coil current of the source
0.5 A, which generated on the target surface a


magnetic field (MAG 6)
weak, essentially vertical field of



approx. 2 mT (20 Gs).


Substrate bias
U = 60 V (bipolar, 36 μs negative,



4 μs positive)


Substrate temperature
approx. 550° C.


Process duration
60 to 120 min









The process described yielded well-bonded, hard layers. Comparison tests of the coating on lathe-work and milling tools revealed a product life significantly improved over traditional TiAlN coatings, although the surface roughness was clearly higher than the roughness values of optimized pure TiAlN coatings.


The test examples #2 to #22 shown in Table 1 refer to simple layer systems according to the invention, each consisting of a double oxide layer of the (Al1-xCrx)2O3 type produced at a coating temperature of between 450 and 600° C. The remaining parameters were identical to the parameters described above for producing the functional layer. The stoichiometric component of the layer composition was measured by Rutherford backscattering spectrometry (RBS). The largest deviation from the target alloy composition shown in column 2 was encountered in tests #10 to #12, with a deviation of 3.5 percentage points at a 70/30 Al/Cr ratio. The metal components of the layer are scaled to the total metal content of the oxide. In terms of the stoichiometry of the oxygen, however, there were somewhat greater deviations of up to over 8%. All layers nevertheless exhibited a clearly corundum-like lattice structure. Preferably, therefore, layers produced according to the invention should have an oxygen-related stoichiometry shortage of 0 to 10% since even with an oxygen deficit of as much as 15% the desired lattice structure will be obtained.



FIG. 1 A to C show typical corundum structures of (Al1-xCrx)2O3 layers produced at 550° C. in accordance with the invention, with targets of varying alloys as indicated in tests #18 (Al/Cr=25/75), #14 (50/50) and #3 (70/30). The measurements and analyses were obtained by x-ray diffractometry with the parameter selections described in more detail under Measuring Methodology, above. In the illustration any correction for background noise was dispensed with. Lattice parameters can be determined by other means as well, such as electron diffraction spectrometry. Due to the decreasing layer thickness from FIG. 1A to 1C, from 3.1 to 1.5 μm, there is a strong increase of the unmarked substrate lines relative to the dash-marked layer lines of the corundum structure. But even in spectrum C, the linear presentation of the Y-axis notwithstanding, 7 lines can still be clearly associated with the corundum lattice. The remaining lines belong to the basic tungsten carbide metal (WC/Co alloy). Of course, for an unambiguous association of the crystal lattice and the determination of the lattice constants, at least 3 and preferably 4 to 5 lines should be uniquely identifiable.


The crystal structure of the layers is compact-grained, in large measure with an average crystallite size of less than 0.2 μm. Only in cases of large chromium concentrations and at coating temperatures of 650° C. were crystallite sizes found to be between 0.1 and 0.2 μm.


For the tests #2 to #22, FIG. 2 shows the lattice constants a (solid line) and c (dashed line) of the (Al1-xCrx)2O3 crystal lattice plotted above the stoichiometric chromium content and comparing them with the dotted straight lines determined by three values DB1 to DB3 from the ICDD (International Center for Diffraction Data), applying Vegard's Law. Over the entire concentration range the maximum deviation from the ideal Vegard's straight line is 0.7 to 0.8%. Measurements taken on other multi-oxide layers showed similar results, with deviations for the parameters indicated amounting to a maximum of 1%. This suggests very low intrinsic stress in the mixed-crystal layer, which is why, in contrast to many other PVD layers, it is possible to deposit these coatings with a greater layer thickness for instance between 10 and 30 μm, in some cases even up to 40 μm, with good bonding qualities. Larger stress patterns in the layer were obtained only by applying greater substrate voltages (>150) and/or by using an Ar/O2 mixture of the process gas with a high Ar component. Since for many applications it is especially the multilayer systems, described in more detail below, that are well suited, it is possible within a wide range to adjust, where necessary, the layer stress values by selecting perhaps a multistratum interface layer and/or cover layer between the workpiece and the mixed-crystal layer. For example, this allows for the selection of higher residual compressive stress values to increase the hardness of the coating for hard-metal machining processes. For industrial applications involving a high level of abrasive wear, thick layer systems with layers more than 10 or 20 am thick can be produced economically, with the mixed-crystal layer preferably having a thickness of more than 5 and especially more than 8 μm.


Parallel tests were performed on mixed-crystal layers 2 μm thick, employing the methods described above (Stoney's bending strip method and bending disk method). The layer stress values measured ranged from stress-free to minor compressive and tensile stress values less than or equal to 0.5 GPa. However, thicker PVD coatings can still be deposited with layers exhibiting a somewhat higher layer stress of about 0.8 GPa. Another possibility consists in a sequence of thin layers (≦1 μm) deposited with alternating tensile and compressive stress, constituting a multilayer system.


As shown in Table 2, test #2, the temperature and oxidation resistance of the corundum structure of the deposited (Al1-xCrx)2O3 layers was tested by heating coated carbide metal test objects with an elevated Co content to a temperature of 1000° and, respectively, 1100° C. over a period of 50 minutes, then holding them there for 30 minutes and finally cooling them to 300° C. over a time span of 50 minutes. Once cooled to room temperature, the lattice constants were reevaluated. According to the phase diagram [W. Sitte, Mater. Sci. Monogr., 28A, React. Solids 451-456, 1985] referred to in Phase Equilibria Diagrams Volume XII Oxides published by the American Ceramic Society, there is a miscibility gap in the range between about 5 and 70% aluminum, i.e. (Al0.05-0.7Crx0.95-0.30)2O3 for temperatures up to about 1150° C., which would predict a segregation of the (Al1-xCrx)2O3 mixed crystal into Al2O3 and Cr2O3 and an (Al1-xCrx)2O3 mixed crystal of some other composition. From that diagram it is also evident that with the process according to this invention it is possible to shift the thermodynamic formation temperature for (Al1-xCrx)2O3 mixed-crystal layers from 1200° C. to between 450° and 600° C. Surprisingly it was also found that the mixed-crystal layers produced by this inventive method experience only minimal changes in their lattice constants as a result of the glow process and that there is no segregation into their binary components. The maximum deviation, shown in FIG. 3, of the value of the lattice parameters a and of the red hot sample, measured after the coating process at room temperature, is about 0.064% while the maximum deviation of value c is 0.34%. For various other multi-oxides as well, the measurements revealed an extraordinary thermal stability of the layer with a minor deviation of the lattice constants by 1 to 2% at the most.



FIGS. 4 and 5 show the results of oxidation tests on conventional layer systems based on an REM fracture pattern of a TiAlN and a TiCN layer, heated to 900° C. as described above and then glowed at that temperature for 30 minutes in an oxygen atmosphere. In a range of over 200 nm the TiAlN layer reveals a distinct alteration of its surface structure. A thin outer layer, consisting essentially of aluminum oxide and having a thickness of between 130 and 140 nm, is followed by a porous aluminum-depleted layer with a thickness of between 154 and 182 nm. Much poorer yet is the oxidation pattern of the TiCN layer in FIG. 5 which, subjected to the same treatment, has oxidized right down to the base material and reveals an incipient layer separation on the right side in the illustration. The layer is coarse-grained and no longer features the columnar structure of the original TiCN layer.



FIG. 6 and FIG. 7 show the results of identical oxidation tests on a TiCN layer protected by an (Al0.7Cr0.3)2O3 layer, about 1 μm thick, according to this invention. FIG. 6 is a 50,000× magnification of the interlaminar bonding. The known columnar structure of the TiCN layer and the slightly finer crystalline (Al0.7Cr0.3)2O3 layer are clearly recognizable. The crystallite size of the aluminum/chrome oxide layer can be further refined by using targets with a higher Al content. FIG. 7 is a 150,000× magnification of the interlaminar bond, with the TiCN layer still visible only at the bottom edge of the image. Compared to the layers in FIG. 4 and FIG. 5 the reaction zone of the (Al0.5Cr0.5)2O3 layer with a height H2 of maximally 32 nm is substantially narrower, having a dense structure without detectable pores. A series of comparison tests with different mixed-crystal layers according to the invention revealed that, unlike other, prior-art, oxide layers, they protect the intermediate layers underneath, thus giving the entire layer system excellent heat and oxidation resistance. It is generally possible to use for this purpose all inventive mixed-crystal layers which in the oxidation test described do not form reaction zones larger than 100 nm. The preferred mixed-crystal layers are those with reaction zones between 0 and 50 nm.


The hardness values of the (Al0.5Cr0.5)2O3 layers were determined to be about 2000 HV50. Measurements performed on other multi-oxides such as (Al0.5Ti0.3Cr0.2)2O3, or (Al0.6Ti0.4)2O3, (V0.5Cr0.5)2O3, (Al0.2Cr0.8)2O3, on their part yielded values between 1200 and 2500 HV.


Tables 3 to 6 list additional multilayer implementations of the layer system according to the invention. Process parameters for producing AlCrO and AlCrON mixed-crystal layers on a 4-source coating system (RCS) are shown in Table 7 while corresponding process parameters for producing individual strata for various support layers are shown in Table 8.


The tests #23 to #60 in Tables 3 and 4 refer to layer systems in which the oxidic mixed-crystal layer is of a corundum structure throughout and is mostly formed as a monolayer. Only in tests #25, #29 and #31 the mixed-crystal layer is formed from two consecutive individual strata of different chemical compositions. In test #29 the only difference between the mixed-crystal layers is their respective Al/Cr ratio.


The tests #61 to #107 in Tables 5 and 7 refer to layer systems in which the mixed-crystal layer is composed of 5 to as many as 100 very thin strata measuring between 50 nm and 1 μm. In these cases, there may be alternating oxidic mixed-crystal layers of a corundum structure with different chemical compositions and corresponding mixed-crystal layers with different layer systems.


In comparison tests on various turning and milling tools, the layers used in tests #23, #24 and #61 to #82 proved clearly superior in turning and milling applications over conventional layer systems such as TiAlN, TiN/TiAlN and AlCrN. Even when compared to CVD coatings, tool product-life improvements were achieved in the milling arena and in some lathe applications.


Although, as stated above, analyses and tests have already been conducted on a substantial number of layer systems, those skilled in the art will use conventional measures, where necessary, to adapt certain characteristics of the inventive layer system to specific requirements. For example, one may consider adding further constituent elements to individual or all layers of the system but in particular to the mixed-crystal layer. Elements known to improve for instance the heat resistance at least of nitridic layers include Zr, Y, La or Ce.
















TABLE 1









Depos'n
Glow
Stoichiometric

















V-
Target
Temp.
Temp.
Component
Cr/
Lattice Constants
d


















No.
[Al/Cr]
[° C.]
[° C.]
Cr
Al
O
(Cr + Al)
a
c
c/a
[μm]




















DB1 - Al2O3


0.00
2.00
3.00
0.00
4.75870
12.99290
2.7303



DB2 - 90/10


0.20
1.80
3.00
0.10
4.78550
13.05900
2.7289


















 2
70/30
550°

0.59
1.41
3
0.30
4.85234
13.26296
2.7333



 3
70/30
550°

0.60
1.40
2.80
0.30
4.85610
13.24587
2.7277
1.5


 4
70/30
600°

0.61
1.39
3.00
0.31
4.84603
13.23092
2.7303
3.3


 5
70/30
550°

0.62
1.38
2.75
0.31
4.85610
13.24587
2.7277
3.0


 6
70/30
550°

0.64
1.36
3.1
0.32
4.85610
13.24587
2.7277
3.1


 7
70/30
550°

0.63
1.37
2.90
0.32
4.85612
13.23089
2.7246
2.9


 8
70/30
550°

0.67
1.33
2.8
0.34
4.88443
13.15461
2.6932
2.7


 9
70/30
550°

0.68
1.32
2.95
0.34
4.86815
13.15461
2.7022


10
70/30
550°

0.67
1.33
3
0.34
4.85610
13.24587
2.7277
1.9


11
70/30
550°

0.67
1.33
2.95
0.34
4.84804
13.23103
2.7292
2.5


12
70/30
550°

0.67
1.33
2.85
0.34
4.83993
13.24192
2.7360
2.5


13
50/50
500°

1.01
0.99
2.80
0.51
4.89218
13.32858
2.7245
4.1


14
50/50
550°

1.04
0.96
2.95
0.52
4.88403
13.31746
2.7267
1.9


15
50/50
600°

1.06
0.94
2.95
0.53
4.87996
13.33965
2.7336
3.5


16
25/75
600°

1.52
0.48
2.85
0.76
4.92028
13.44988
2.7336


17
25/75
500°

1.54
0.46
2.8
0.77
4.92464
13.43581
2.7283
4.5


18
25/75
550°

1.53
0.47
2.8
0.77
4.92053
13.44655
2.7327
3.1


19
 0/100
550°

2.00
0.00
2.80
1.00
4.95876
13.58287
2.7392


21
 0/100
450°

2.00
0.00
2.85
1.00
4.97116
13.58280
2.7323
2.0


22
 0/100
500°

2.00
0.00
2.75
1.00
4.97116
13.59412
2.7346
1.7

















DB3 - Cr2O3


2.00
0.00
3.00
1.00
4.95876
13.59420
2.7415

























TABLE 2










Depos'n
Glow








Target
Temp
Temp.




Lattice Constants

















V-No.
[Al/Cr]
[° C.]
[° C.]




a
c
c/a





2
70/30
550°
RT




4.85030
13.24484
2.7307


2
70/30
550°
1000°




4.85339
13.22837
2.7256


2
70/30
550°
1100°




4.84727
13.20028
2.7232









Test Objects: Hard Metal











TABLE 3









Mixed-Crystal Layer



Monolayer










Intermediate Layer
Corundum











Bonding Layer
Hard Metal Layer
Structure













V-No.
[(Me1Me2)X]
d [μm]
[(Me1Me2)X]
d [μm]
[(Me1Me2)X]
d [μm]






TiN

TiAlN

(Al.5Cr.5)2O3




wo

TiAlN

(Al.5Cr.5)2O3




TiN

TiAlN

(Al.5Cr.5)2O3




TiN

TiCN

(Al.65Cr.35)2O3



TiN



(Al.65Cr.35)2O3





TiCN

(Al.7Cr.3)2O3



TiN

TiAlN

(Al.7Cr.3)2O3




TiN

TiC

(Al.7Cr.3)2O3



TiN

TiAlN

(Al.7Fe.3)2O3




TiN



(Al.6Fe.4)2O3




TiN

TiCN

(Al.6Fe.4)2O3





TiCN

(Al.1Fe.9)2O3



wo

TiAlN

(Al.1Fe.9)2O3



wo

wo

(Al.5Fe.5)2O3



wo

wo

(Al.5Fe.5)2O3




TiN

wo

(Al.5V.5)2O3




VN

VCN

(Al.5V.5)2O3




VN



(Al.5V.5)2O3




CrN

CrC

Cr2O3




CrN

CrCN

Cr2O3




CrN

wo

Cr2O3




CrN

wo

Cr2O3



AlCrN

wo

(Al.2Cr.8)2O3














Mixed-Crystal Layer





Monolayer
Cover Layer


V-
Other Oxide Layer
DS1
DS2













No.
[(Me1Me2)X]
d [μm]
[(Me1Me2)X]
d [μm]
[(Me1Me2)X]
d [μm]






wo

wo

Wo



wo

wo

Wo



(Al.7Cr.3)2O3



(Al,CR,Zr)2O3+x

ZrO2

ZrN



(Al,Cr)2O3

AlCrN





AlCrN





AlCrN







TiN





AlVN





AlVN





CrN





CrN





CrN





AlCrN



















TABLE 4









Mixed-Crystal Layer Monolayer














Intermediate Layer
Corundum
Other Oxide
Cover Layer















Bonding Layer
Hard Metal Layer
Structure
Layer
DS1
DS2



















V-

d

d

d

d

d

d


No.
[(Me1Me2)X]
[μm]
[(Me1Me2)X]
[μm]
[(Me1Me2)X]
[μm]
[(Me1Me2)X]
[μm]
[(Me1Me2)X]
[μm]
[(Me1Me2)X]
[μm]





46
CrN
0.3
AlCrON
5.0
(Al.02Cr.08)2O3
3.0








47
CrN
0.5
AlCrN
3.0
(Al.05Cr.85)2O3
3.0


(Al.7Cr.3)2O3
1.0
CrN
2.0


48
AlCrN
0.5
AlCrON
5.0
(Al.05Cr.85)2O3
3.0


49
TiN
0.8
TiAlN
4.0
(Al.5Ti.5)2O3
4.0


TiN
1.0


50
wo

TiAlN
6.0
(Al.5Ti.5)2O3
2.0


51
TiN
0.3
TiCN
8.0
(Al.7Ti.3)2O3
4.0


52
wo

TiAlN
3.0
(Al,Mg,Ti)2O3
3.0


53
TiN
0.5
AlMgTiN
6.0
(Al,Mg,Ti)2O3
4.0


54
TiN
6.0


(Al,Mg,Ti)2O3
3.0


TiN
2.0


55
TiN
0.3
(Al,Mg,Ti)ON
5.0
(Al,Mg,Ti)2O3
2.0


56
AlCrN
0.2
(Al,Mg,Ti)ON
1.0
(Al,Mg,Ti)2O3
6.0


57
TiN
1.0


(Al,Fe,Ti)2O3
5.0


TiN
0.5


58
TiN
1.0
TiCN
6.0
(Al,Fe,Ti)2O3
2.0


TiN
1.0


59
TiN
1.0
TiAlN
4.0
(Al,Fe,Ti)2O3
4.0


60


TiCN
4.0
(Al,Fe,Ti)2O3
2.0


















TABLE 5









Mixed-Crystal Layer as Multilayer











Intermediate Layer
Corundum












Hard Metal Layer
Structure
Other ML Layer














V-
Bonding Layer

d

d

d















No.
[(Me1Me2)X]
d [μm]
[(Me1Me2)X]
[μm]
[(Me1Me2)X]
[μm]
[(Me1Me2)X]
[μm]





61
TiN
0.2
TiAlN
3.0
(Al.65Cr.35)2O3
0.100
AlCrN
0.100


62
wo

TiAlN
2.0
(Al.65Cr.35)2O3
0.500
AlCrN
0.500


63
TiN
0.3
TiAlN
3.0
(Al.65Cr.55)2O3
0.100
AlCrN
0.050


64
TiN
0.3
TiAlN
4.0
(Al.65Cr.55)2O3
0.050
AlCrN
0.050


65
TiN
0.3
TiAlN
3.0
(Al.65Cr.35)2O3
0.100
ZrO2
0.300


66
TiN
0.3
TiAlN
6.0
(Al.65Cr.35)2O3
0.200
Ta2O5
0.100


67
TiN
0.3
TiAlN
3.0
(Al.65Cr.35)2O3
0.200
Nb2O5
0.500


68
TiN
0.3
TiAlN
4.0
(Al.65Cr.35)2O3
0.200
V2O3
0.100


69
TiN
0.3
TiAlN
3.0
(Al.65Cr.35)2O3
0.200
Al.8Cr.2)2O3
0.050


70
TiN
0.3
TiAlN
2.0
(Al.65Cr.35)2O3
0.200
(Al,V)2O3
0.050


71
TiN
0.3
TiAlN
2.0
(Al.5Cr.5)2O3
0.100
TiAlN
0.100


72
TiN
0.2
TiCN
6.0
(Al.5Cr.5)2O3
0.100
0.100
0.100


73
wo

TiCN
3.0
(Al.5Cr.6)2O3
0.500
AlCrN
0.500


74
TiN
0.3
TiCN
12.0
(Al.5Cr.5)2O3
0.100
AlCrN
0.050


75
TiN
0.3
TiCN
8.0
(Al.5Cr.5)2O3
0.050
AlCrN
0.050


76
TiN
0.3
TiCN
4.0
(Al.5Cr.5)2O3
0.100
ZrO2
0.300


77
TiN
0.3
TiCN
3.0
(Al.5Cr.5)2O3
0.200
Ta2O5
0.100


78
TiN
0.3
TiCN
6.0
(Al.4Cr.0)2O3
0.200
Nb2O5
0.500


79
TiN
0.3
TiCN
3.0
(Al.4Cr.6)2O3
0.200
V2O3
0.100


80
TiN
0.3
TiCN
2.0
(Al.4Cr.6)2O3
0.200
(Al,Cr)2O3
0.050


81
TiN
0.3
TiCN
3.0
(Al.4Cr.6)2O3
0.200
(Al,Zr)2O3
0.050


82
TiN
0.3
TiC
4.0
(Al.4Cr.6)2O3
0.100
AlCrN
0.050


83
TiN
0.5
TiAlN
3.0
(Al.4Cr.6)2O3
0.300
(Al,Cr,Zr)2O3+>
0.300


84
TiN
0.4
TiAlN
2.0
(Al.7Cr.3)2O3
0.200
(Al,Cr)2O3
0.200


85
TiN
0.3
wo

(Al.6V.4)2O3
0.200
AlVN
0.100


86
VN
0.4
VCN
4.0
(Al.6V.4)2O3
0.200
(Al,Cr)2O3
0.100













Cover Layer











DS1














V-
No.

d
DS2














No.
MLs
[(Me1Me2)X]
[μm]
[(Me1Me2)X]
d [μm]







61
50.0
AlCrN
0.5



62
10.0



63
100.0
AlCrN
0.2



64
100.0



65
10.0
ZrN
1.0



66
30.0
TaN
0.6



67
10.0
NbN
1.0



68
50.0



69
30.0
AlCrN
0.2



70
30.0
AlVN
0.2



71
50.0



72
50.0
AlCrN
0.5



73
10.0



74
100.0
AlCrN
0.2



75
100.0



76
10.0
ZrN
1.0



77
30.0
TaN
0.5



78
10.0
NbN
1.0



79
50.0



80
30.0
AlCrN
0.2



81
30.0
AlZrN
0.2



82
100.0
TiN
0.2



83

ZrN
1.0
ZrN
0.5



84
10.0
AlCrN
0.5



85



TiN
0.3



86



















TABLE 6









Mixed-Crystal Layer as Multilayer











Intermediate Layer
Corundum













Bonding Layer
Hard Metal Layer
Structure
Other ML Layer















V-

d

d

d

d


No.
[(Me1Me2)X]
[μm]
[(Me1Me2)X]
[μm]
[(Me1Me2)X]
[μm]
[(Me1Me2)X]
[μm]





 87
CrN
0.5
CrC
4.0
Cr2O3
0.200
CrN
0.300


 88
CrN
0.5
CrCN
6.0
Cr2O3
0.200
(Al.65Cr.35)2O3
0.100


 89
CrN
0.5
wo

Cr2O3
1.000
(Al.65Cr.35)2O3
0.500


 90
CrN
0.5
wo

Cr2O3
0.050
(Al.65Cr.35)2O3
0.050


 91
CrN
0.5
wo

Cr2O3
0.050
CrN
0.050


 92
AlCrN
0.3
wo

(Al.65Cr.35)2O3
0.100
CrN
0.400


 93
CrN
0.3
AlCrON
5.0
(Al.5Cr.5)2O3
0.200
(Al.7Cr.3)2O3
0.100


 94
CrN
0.5
AlCrN
3.0
(Al.5Cr.5)2O3
1.000
(Al.7Cr.3)2O3
0.500


 95
AlCrN
0.5
AlCrON
5.0
(Al.5Cr.5)2O3
0.050
(Al.7Cr.3)2O3
0.050


 96
TiN
0.8
TiAlN
4.0
(Al.5Ti.5)2O3
0.100
TiAlN
0.200


 97
wo

TiAlN
6.0
(Al.1Ti.0)2O3
0.050
TiAlN
0.300


 98
TiN
0.3
TiCN
8.0
(Al.1Ti.0)2O3
0.200
(Al.7Cr.3)2O3
0.100


 99
wo

TiAlN
3.0
(Al,Mg,Ti)2O3
0.100
0.100
0.100


100
TiN
0.5
AlMgTiN
6.0
(Al,Mg,Ti)2O3
0.500
AlCrN
0.500


101
TiN
5.0


(Al,Mg,Ti)2O3
0.100
AlCrN
0.050


102
TiN
0.3
(Al,Mg,Ti)ON
5.0
(Al,Mg,Ti)2O3
0.050
AlCrN
0.050


103
AlCrN
0.2
(Al,Mg,Ti)ON
1.0
(Al,Mg,Ti)2O3
0.100
(Al.65Cr.35)2O3
0.300


104
TiN
1.0


(Al,Fe,Ti)2O3
0.200
Nb2O3
0.500


105
TiN
1.0
TiCN
6.0
(Al,Fe,Ti)2O3
0.200
V2O3
0.100


106
TiN
1.0
TiAlN
4.0
(Al,Fe,Ti)2O3
0.200
(Al.65Cr.35)2O3
0.100


107


TiCN
4.0
(Al,Fe,Ti)2O3
0.200
(Al,Me)2O3
0.050













Cover Layer











DS1
DS2














V-


d

d



No.
No. MLs
[(Me1Me2)X]
[μm]
[(Me1Me2)X]
[μm]







 87
5.0
CrN
2.0



 88
10.0
CrN
1.0



 89
5.0



 90
200.0



 91
100.0



 92
8.0
AlCrN
1.0



 93
10.0



 94
5.0
CrN
0.5
CrN
2.0



 95
200.0



 96
30.0
TiN
1.0



 97
10.0



 98
20.0



 99
40.0



100
12.0



101
50.0



102
30.0



103
15.0



104
20.0
TiN
0.5



105
20.0
TiN
0.5



106
10.0



107
15.0


























TABLE 7






I-Source 1
I-S.2
I-S.3
I-S.4
U-base-bp
O2
N2
p
T


Material
[A]
[A]
[A]
[A]
[V]
[sccm]
[sccm]
[Pa]
[° C.]







AlCrO

200

200
−60
1000

2.6
550° C.


AlCrO—

200

200
−60
1000
1000
2.6
550° C.


AlCrN


Multilayer









Coil current of the source magnetic system 0.5 to 1 A



















TABLE 8






I-Source 1
I-S.2
I-S.3
I-S.4
U-Bias DC
Ar
C2H2
N2
p
T


Material
[A]
[A]
[A]
[A]
[V]
[sccm]
[sccm]
[sccm]
[Pa]
[° C.]

























TiAlN
200

200

−40


Pressure
3  
550° C.










regulated


TiN
180

180

−100


Pressure
0.8
550° C.










regulated


TiCN
190

190

−100
420
15-125
500-150
2.5-2.0
550° C.


AlCrN
200

200

−100


1000
2.6
550° C.


AlMeN
140

140

−80


 600
0.8
500° C.


AlMeCN
220

220

−120
300
10-150
Pressure
2.5
600° C.










regulated










Coil current of the source magnetic system 0.1 to 2 A

Claims
  • 1. PVD layer system for the coating of workpieces, encompassing at least one mixed-crystal layer of a multi-oxide of the following composition: (Me11-xMe2x)2O3
  • 2. Layer system as in claim 1, characterized in that the corundum structure of the mixed-crystal layer is so thermally stable that even after 30 minutes of heating in air at a temperature of at least 1000° C. or at least 1100° C. the lattice parameter(s) a and/or c of the mixed-crystal layer will not shift by more than a maximum of 2% or preferably a maximum of 1%.
  • 3. Layer system as in one of the preceding claims, characterized in that the mixed-crystal layer has a stoichiometric or substoichiometric oxygen content.
  • 4. Layer system as in claim 3, characterized in that the oxygen content remains 0 to 15 percentage points and preferably 0 to 10 percentage points below the stoichiometric composition of the compound.
  • 5. Layer system as in one of the preceding claims, characterized in that the mixed-crystal layer is finely crystalline with an average crystallite size of less than 0.2 μm, preferably less than 0.1 μm.
  • 6. Layer system as in one of the preceding claims, characterized in that Me1 is comprised of Al and Me2 of at least one of the elements Cr, Fe, Li, Mg, Mn, Nb, Ti, Sb or V and is 0.2≦x≦0.98, preferably 0.3≦x≦0.95.
  • 7. Layer system as in one of the preceding claims, characterized in that the content of inert gas and halogens in the mixed-crystal layer is less than 2 at % each.
  • 8. Layer system as in claim 7, characterized in that the inert gas content in the mixed-crystal layer does not exceed a maximum of 0.1 at % or preferably a maximum of 0.05 at % and/or the halogen content does not exceed a maximum of 0.5 at % or preferably a maximum of 0.1 at % or that, preferably, the mixed-crystal layer contains essentially no inert gas and/or halogen.
  • 9. Layer system as in claim 1, characterized in that the layer stress of the mixed-crystal layer is so minor that the deviation of the lattice parameters of the multi-oxides from the value determined by Vegard's Law is less than or equal to 1%, preferably less than or equal to 0.8%.
  • 10. Layer system as in one of the preceding claims, characterized in that the layer stress measured on a mixed-crystal layer 2 μm thick represents a compressive or tensile stress with a value of less than ±0.8 GPa, preferably less than ±0.5 GPa.
  • 11. Layer system as in one of the preceding claims, characterized in that the mixed-crystal layer encompasses a multi-stratum layer consisting of at least two different, alternatingly deposited multi-oxides.
  • 12. Layer system as in one of the preceding claims, characterized in that the mixed-crystal layer encompasses a multistratum layer consisting of at least one multi-oxide and an additional oxide in an alternating sequence.
  • 13. Layer system as in one of the preceding claims, characterized in that the multi-oxide is a double oxide, in particular (AlCr)2O3 or (AlV)2O3.
  • 14. Layer system as in claim 13, characterized in that the additional oxide is HfO2, Ta2O5, TiO2, ZrO2, γ-Al2O3, but in particular an oxide having a corundum structure, such as Cr2O3, V2O3, Fe2O3, FeTiO3, MgTiO2 or α-Al2O3.
  • 15. Layer system as in one of the preceding claims, characterized in that in addition to the mixed-crystal layer at least one intermediate layer, in particular a bonding layer and/or a hard-metal layer, is positioned between the workpiece and the mixed-crystal layer and/or a cover layer is deposited on the mixed-crystal layer, and that these preferably contain one of the metals of sub-groups IV, V and VI of the periodic system and/or Al, Si, Fe, Ni, Co, Y, La or a mixture thereof.
  • 16. Layer system as in claim 15, characterized in that the metals of the hard-metal layer and/or the cover layer are compounds with N, C, O, B or mixtures thereof, the compound with N or CN being preferred.
  • 17. Layer system as in claim 15 or 16, characterized in that the hard-metal layer comprises TiN, TiCN, AlTiN, AlTiCN, AlCrN or AlCrCN and the cover layer comprises AlCrN, AlCrCN, Cr2O3 or Al2O3, in particular γ-Al2O3 or α-Al2O3.
  • 18. Layer system as in one of the claims 15 to 17, characterized in that the intermediate layer and/or the hard-metal layer includes a multi-stratum layer.
  • 19. Layer system as in one of the claims 15 to 18, characterized in that the intermediate layer and the mixed-crystal layer and/or the cover layer and the mixed-crystal layer are disposed in the form of an alternating multi-stratum layer.
  • 20. Layer system as in one of the claims 15 to 18, characterized in that the layer system has an overall layer thickness of more than 10 μm, preferably more than 20 μm.
  • 21. Layer system as in one of the claims 15 to 18, characterized in that the mixed-crystal layer has a thickness of more than 5 μm, preferably more than 8 μm.
  • 22. Vacuum coating method for producing a mixed-crystal layer of a multi-oxide on a workpiece, whereby an electric arc discharge takes place in an oxygenous process-gas atmosphere between at least one anode and a target constituting the cathode of an arc source, characterized in that on the target surface only a small, if any, external magnetic field is generated essentially perpendicular to the target surface, including a vertical component Bz and a smaller, essentially radial or surface-parallel component Br, in support of the vaporization process, the target being an alloy target whose composition essentially corresponds to that of the mixed-crystal layer that is deposited with a corundum structure.
  • 23. Method as in claim 22, characterized in that the composition of the metals in the mixed-crystal layer, scaled to the total metal content, does not differ for the respective constituent metals by more than 10, preferably not more than 5 and especially not more than 3 percent from the concentrations in the target composition.
  • 24. Method as in claims 22 and 23, characterized in that the vertical component Bz on the target surface is set at between 3 and 50 but preferably between 5 and 25 Gauss.
  • 25. Method as in one of the claims 22 to 24, characterized in that for generating the small magnetic field, an excitation current is fed to a magnetic system consisting of at least one axially polarized coil and having a geometry similar to the circumference of the target.
  • 26. Method as in one of the claims 22 to 25, characterized in that for the arc discharge the minimum of one arc source is simultaneously fed both a direct current and a pulsed or alternating current.
  • 27. Vacuum coating method for producing a mixed-crystal layer of a multi-oxide on a workpiece, whereby in an oxygenous process-gas atmosphere a first arc- or sputtering-source electrode, constituting the target, and a second electrode deposit a coating on the workpiece, said source being simultaneously fed a direct current or direct voltage as well as a pulsed or alternating current or a pulsed or alternating-current voltage, characterized in that the target is an alloy target whose composition essentially corresponds to that of the mixed-crystal layer and that the latter is deposited with a corundum structure.
  • 28. Method as in claim 27, characterized in that the composition of the metals in the mixed-crystal layer, when scaled to the total metal content, does not differ for the respective constituent metals by more than 10 at %, preferably not more than 5 at % and especially not more than 3 at % from the concentrations in the target composition.
  • 29. Method as in claims 27 and 28, characterized in that the source is an arc source and that the second electrode is separated from the arc source or constitutes the anode of the arc source.
  • 30. Method as in claim 29, characterized in that both electrodes are connected to and powered by a single pulsed-current power supply.
  • 31. Method as in claim 30, characterized in that the second electrode serves as the cathode of another arc vaporizing source which latter as well is connected to and powered by a DC power supply.
  • 32. Method as in claim 30, characterized in that the second electrode serves as the cathode of a sputtering source, in particular a magnetron source, which latter as well is connected to and powered by a power supply, in particular a DC power supply.
  • 33. Method as in claim 30, characterized in that the second electrode is in the form of an evaporation crucible and is powered as the anode of a low voltage arc evaporator.
  • 34. Method as in one of the claims 26 to 33, characterized in that the DC power supply and the pulsed current supply are decoupled by means of an electrical decoupling filter which preferably contains at least one hold-off diode.
  • 35. Method as in one of the claims 26 to 34, characterized in that the DC power supply is operated with a base current in a manner whereby the plasma discharge at the sources, especially at the arc evaporation sources, is maintained in an essentially continuous mode.
  • 36. Method as in one of the claims 26 to 35, characterized in that the pulsed current or pulsed voltage power supply is operated with pulse edges whose pulse slopes are steeper than 2.0 V/ns, preferably at least in the range from 0.02 V/ns to 2.0 V/ns and preferably at least in the range from 0.1 V/ns to 1.0 V/ns, leading to a high-power discharge.
  • 37. Method as in one of the claims 26 to 35, characterized in that the pulsed current power supply is operated at a frequency in the range from 1 kHz to 200 kHz.
  • 38. Method as in one of the claims 26 to 36, characterized in that the pulsed current power supply is operated with a varying pulse-width ratio setting.
  • 39. Method as in one of the claims 26 to 37, characterized in that a pulsed magnetic field is applied on at least one arc source.
  • 40. Method as in claim 38, characterized in that the magnetic field is pulsed by the pulsed current or by part of the pulsed current of the arc source.
  • 41. Method as in one of the claims 22 to 39, characterized in that at least one arc source is either not cooled or is heated.
  • 42. Method as in one of the claims 22 to 40, characterized in that the sources are operated with a process gas that consists at least 80%, preferably 90% and most desirably 100% of oxygen.
  • 43. Method as in one of the claims 22 to 41, characterized in that the coating temperature is set below 650° C., preferably below 550° C.
  • 44. A tool or component for use at high temperatures and/or subject to strong chemical exposure, characterized in that it is coated with a layer system described in one of the claims 1 to 21.
  • 45. A tool or component as in claim 43 characterized in that at least in the areas exposed to wear the base material of the tool consists of tool steel, HSS high-speed steel, a PM steel or an HM, cermet or CBN sintered metal and that at least in the areas exposed to wear the base material of the component consists of a cold-working steel, HSS high-speed steel, a PM steel or an HM, cermet, SiC, SiN or CBN sintered material grade or of polycrystalline diamond.
  • 46. Tool as in claim 43, characterized in that it is a cutting tool, especially an interchangeable cutting insert consisting of HSS, HM, cermet, CBN, SiN, SiC or a PM steel or that it is a diamond-coated interchangeable insert.
  • 47. Tool as in claim 43, characterized in that it is a non-cutting shaping tool, in particular a forging tool.
  • 48. Tool as in claim 43, characterized in that it is a die-casting tool.
  • 49. Component as in claim 43, characterized in that the component is a part of a combustion engine, in particular a fuel injection nozzle, a piston ring, a tappet, or a turbine blade.