The present disclosure relates to the field of a liquid crystal display (LCD), and more particularly to an LCD device, an array substrate, and a method for manufacturing the array substrate.
A thin film transistor liquid crystal display (TFT-LCD) has various characteristics such as having a small volume, lower power consumption, and being non-radiative so that the TFT-LCD plays a leading role in the present flat panel display (FPD) market. Components of the TFT-LCD are formed via an array substrate being oppositely arranged on a color film substrate.
As shown from FIG I to
In view of the above-described problems, the aim of the present disclosure is to provide an LCD device, an array substrate, and a method for manufacturing the array substrate with the advantages of signal delay of the gate scan lines
The aim of the back light module of the present disclosure is achieved by the following technical scheme: An array substrate of a liquid crystal display (LCD) device comprises a glass substrate, gate scan lines formed on the glass substrate, and a pixel electrode. An insulating layer is layered on the gate scan lines. An edge of the pixel electrode has an overlapping region with the gate scan lines, and the pixel electrode and the gate scan lines form a parasitic capacitance in the overlapping region. The overlapping region between the pixel electrode and the gate scan lines is configured with at least one protection layer that reduces the parasitic capacitance.
In one example, the protection layer is an a-Si layer. The a-Si layer has low dielectric coefficient.
In one example, the a-Si layer is layered on the insulating layer. An a-Si layer of the TFT and the a-Si layer of the protection layer are simulatenously formed in same process, therefore a etching process does not need to add again.
In one example, the a-Si layer of the protection layer and the a-Si layer of the TFT of the array substrate belong to a same layer. An a-Si layer of the TFT and the a-Si layer of the protection layer are simulatenously farmed in same process.
In one example, the pixel electrode is made of indium tin oxide (ITO). The ITO is a transparent electric conduction material, which can increase transmittance of the LCD panel.
A liquid crystal display (LCD) device comprises the above-mentioned the array substrate.
A method for manufacturing the above-mentioned the array substrate, comprising
S1: forming a metal layer on a glass substrate, and forming gate scan lines on the glass substrate by a photolithography process and etching process on the metal layer;
S2: forming an insulating layer and a protection layer on the glass substrate;
S3: forming the array substrate via a layer on the glass substrate and a layer of a pixel electrode, and forming a thin film transistor (TFT) and a pixel electrode on the glass substrate.
In one example, in step S2, the protection layer is an a-Si layer.
In one example, in step S2, the a-Si layer and the a-Si layer of the TFT are simulatenously formed.
In one example, the layer of the pixel electrode is made of indium tin oxide (ITO).
In the present disclosure, the overlapping region between the pixel electrode and the gate scan lines is configured with at least one protection layer that reduces the parasitic capacitance, and a protection is added between the pixel electrode and the gate scan lines, which reduces the parasitic capacitance of the gate scan lines 110 and the pixel electrode 130, further reduces signal delay of the gate scan lines 110, improves display effect of the LCD device, and avoids image flicker.
Legends: 100. glass substrate; 110. gate scan lines; 115. Data lines; 120. insulating layer; 130. pixel electrode; 125. protection layer; 135. overlapping region, 140. TFT.
The present disclosure will further be described in detail in accordance with the figures and the examples.
As shown in
As shown in
The a-Si layer 125 and an active layer (a-Si layer) of the TFT of the array substrate belong to a same layer. The a-Si layer 125 is layered on the insulating layer 120. Thus, the active layer (a-Si layer) of the TFT is formed, and simultaneously the a-Si layer is formed in the overlapping region 135 between the pixel electrode 130 and the gate scan lines 110 in a manufacturing process of the array substrate, therefore, which add an unneeded process that forms an organic semiconductor. Optionally, the protection layer (a-Si layer) can be formed before formation of the insulating layer, however, which adds a forming process.
In the example, the pixel electrode is made of indium tin oxide (ITO), where the data lines are also made of the 110. The ITO is a transparent electric conduction material, which can increase transmittance of the LCD panel.
A method for manufacturing an array substrate in the example comprises the following steps:
1. forming a metal layer on a glass substrate, where the metal layer is made of MO, AL, alumel, tungsten-molybdenum alloy, Cr, and Cu for example. The metal layer also is film combination of the above-mentioned materials, where gate scan lines are formed by a photolithography process and etching process on the metal layer.
2. forming an insulating layer on the glass substrate formed by the gate can lines.
3. forming a metal layer again on the glass substrate formed by the insulating layer, and forming data lines by the photolithography process and the etching process
4. forming a thin film transistor (TFT) via a layer based on the above steps comprising an active layer (a-Si layer). When the a-Si layer is etched, the a-Si layer is exposed on an overlapping region between a pixel electrode and the gate scan lines in a masking process.
5. forming the pixel electrode finally.
The present disclosure is described in detail in accordance with the above contents with the specific preferred examples. However, this present disclosure is not limited to the specific examples. For the ordinary technical personnel of the technical field of the present disclosure, on the premise of keeping the conception of the present disclosure, the technical personnel can also make simple deductions or replacements, and all of which should be considered to belong to the protection scope of the present disclosure.
Number | Date | Country | Kind |
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201210487352.5 | Nov 2012 | CN | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/CN2012/085834 | 12/4/2012 | WO | 00 | 12/24/2012 |