Lead-free alloy plating method

Information

  • Patent Grant
  • 6342146
  • Patent Number
    6,342,146
  • Date Filed
    Tuesday, July 27, 1999
    25 years ago
  • Date Issued
    Tuesday, January 29, 2002
    22 years ago
  • Inventors
  • Examiners
    • Wong; Edna
    Agents
    • Myers; Jeffrey D.
    • Peacock; Deborah A.
    • Pangrle; Brian J.
Abstract
A continuous plating system which is horizontal, allows for submersion of the entire article to be plated, and is useful for alloy plating. The invention provides a link/hinge conveyor system, the conveyor acts as the conductor, numerous processes/baths are possible, and difficult to plate alloys, such as a tin/bismuth plate can be produced. Homogeneous alloys are possible with the present invention. Also disclosed are novel dryer, rinse and reflow systems for use with the continuous plating system.
Description




BACKGROUND OF THE INVENTION




1. Field of the Invention (Technical Field)




The present invention relates to a plater which continuously plates articles. The invention is suitable for single substance or alloy plating. The invention further provides novel rinse and dryer methods and devices.




2. Background Art




There are numerous continuous platers in the prior art. For instance, U.S. Pat. No. 2,142,829, entitled “Plating Machine” to J. F. Trudeau; U.S. Pat. No. 2,255,922, entitled “Return Type Fast Transfer Machine” to V. Finston; U.S. Pat. No. 2,428,141, entitled “Process for Cleaning, Stripping, and Polishing Metal Surfaces” to T. E. Burkhardt; U.S. Pat. No. 2,387,160, entitled “Article Handling Apparatus” to W. W. Loney; U.S. Pat. No. 4,189,360, entitled “Process for Continuous Anodizing of Aluminum” to Woods, et al.; U.S. Pat. No. 4,263,122, entitled “Electrocoating Equipment” to Urquhart; and Meaker Variable Speed Plating Machine pamphlet; all disclose a single bath continuous plating system. However, these references do not disclose multiple baths. In addition, the '122, '360 and '141 patents do not teach a horizontal system, but lower and lift articles or parts to be plated into the bath. The '160 patent describes plating only a portion of the article, leaving the rest above the plating bath. U.S. Pat. No. 2,043,698, entitled “Method and Apparatus for Spacing Electrodes” to J. P. Dyer discloses spacing anodes for a plating operation.




Other prior art patents disclose multiple plating baths or processes, such as U.S. Pat. No. 3,266,308, entitled “Electrochemical Treating and Apparatus” to H. Pochapsky, et al.; U.S. Pat. No. 3,657,097, entitled “Selective Plating Machines” to Baldock, et al.; U.S. Pat. No. 4,377,461, entitled “Tab Plater for Circuit Boards or the Like” to Lovejoy; U.S. Pat. No. 4,501,650, entitled “Workpiece Clamp Assembly for Electrolytic Plating Machine” to Maron; U.S. Pat. No. 4,539,090, entitled “Continuous Electroplating Device” to Francis; and U.S. Pat. No. 4,812,211, entitled “Process and System for Electrodeposition Coating” to Sakai. The '211 and '309 patents disclose complicated movement systems; the '211 patent provides for the articles to be plated to be disposed in baskets. The '211, '090, '650, '097 and '461 patents all disclose chain conveyor systems, some with hoists for lowering and lifting the parts into the baths/processes. The '090, '650, '097, and '461 patents all disclose plating only a portion of the article, rather than submerging the entire article into the plating tank.




The present invention, on the other hand, allows for multiple bath plating, alloy plating, submersion of the entire article, a novel horizontal conveyor/drive system and recycling of most process streams.




SUMMARY OF THE INVENTION (DISCLOSURE OF THE INVENTION)




The present invention is of a continuous plating system and method for plating articles comprising: multiple baths, wherein at least one bath comprises a plating bath; a continuous conveyor system for passing the articles through the multiple baths comprising a drive, a conveyor comprising altemating links and hinges, and numerous carriers for attaching numerous articles to the conveyor; and a conductor for providing electricity to the articles while being conveyed. In describing the present invention, the words “bath” and “station” are interchangeable, for example, a rinse station is equivalent to a rinse bath and a drying station is equivalent to a drying bath. In the preferred embodiment, the links comprise feet to be driven by the drive and the feet provide electrical current continuity between the conductor and the carriers. A preferred support bar for the conveyor is made of a synthetic resin polymer (e.g., Teflon), and the conveyor and the carriers are preferably (silver) plated to provide electrical conductivity. The plating bath comprises at least one anode for plating the anode substance onto the articles, an upper tank disposed within a lower tank for providing overflow and recirculation of a plating solution, a narrow opening and a narrow exit corresponding substantially in shape and width to the articles (and preferably comprising adjustments for changing the shape and size of the opening and exit), multiple pumps for providing even plating conditions to the articles, and multiple spray jets for providing even circulation and plating to the articles. Internal guides are best used within at least one of the multiple baths for preventing sway of the articles and external guides external to at least one of the multiple baths for providing ease of movement of the articles into the bath. The articles may be flat or non-planar. The carriers preferably have hooks which hook into an opening in the articles. The system preferably has an oval configuration and applies additional direct current by exposed cable or brushes. The system best further comprises a dryer in line with the continuous plating system and positioned after the multiple baths, the dryer comprising: a box comprising a heated fluid; an entry opening for the articles to enter the box; and an exit opening for the articles to exit the box, as well as a wicking device (such as a mesh material in the box) to help remove moisture from the articles. The system also best employs a rinse system in line with the continuous plating system and positioned after the multiple baths, the rinse system comprising: a first rinse station wherein a substance from the multiple baths is rinsed from the articles, the first rinse station comprising an effluent with a higher concentration of the substance; and at least one additional rinse station wherein the substance Is further rinsed from the articles, the additional rinse station comprising an effluent with a lower concentration of the substance; and for recycling effluent from the rinse station back into the continuous plating system (preferably with at least four rinse stations). The articles are preferably completely submerged within the plating bath(s). Most preferably, the plating system comprises: at least three plating baths, wherein the first bath comprises a substance to be plated on the articles, the second bath comprises a different substance to be plated on the articles and the third bath comprises the same substance as the first bath to be plated on the articles, the substances comprising an alloy plate (preferably tin and bismuth) on the articles; a continuous conveyor system for passing the articles through the multiple baths comprising a drive, a conveyor, and numerous carriers for attaching numerous articles to the conveyor; and a conductor for providing electricity to the articles while being conveyed. Most preferably, the system uses at least five plating baths in the following order and comprising the following in solution to be plated on the articles: fin, bismuth, tin, bismuth and tin. However, the system can be used to plate many metal alloys, including tin, bismuth, lead, titanium, cadmium, nickel, and zinc, and combinations thereof. Further, the system preferably has at least one bath comprises a plating bath, and the other baths comprise at least one process bath selected from the group consisting of cleaning, electrocleaning, degreasing, rinsing, drying, fluxing, reflowing and stripping, most preferably at least the following baths in the following order a cleaning bath; a rinsing bath; a plating bath; and a rinsing bath, preferably with a drying station subsequent to the final rinsing bath. The conveyor may comprise the conductor, so as to provide electricity to the articles while being conveyed thereon. Here, synthetic resin polymer bars (e.g., Teflon) may be used to support the conveyor.




The invention Is also of a continuous plating system and method for plating articles comprising: multiple baths, wherein at least one bath comprises a plating bath; a horizontal continuous conveyor system for passing the articles through the multiple baths while completely submerging the articles in the multiple baths, comprising a drive, a conveyor, and numerous carriers for attaching numerous articles to the conveyor; and a conductor for providing electricity to the articles while being conveyed. At least one of the multiple baths should comprise a stripping bath positioned after the plating bath for stripping the carriers of a substance plated on the carriers in the plating bath.




The invention is also of a continuous plating system and method for plating articles comprising: multiple baths, wherein at least one bath comprises a plating bath, and the other baths comprise at least one process bath selected from the group consisting of cleaning, electrocleaning, degreasing, rinsing, drying, fluxing, reflowing and stripping; a continuous conveyor system for passing the articles through the multiple baths comprising a drive, a conveyor, and numerous carriers for attaching numerous articles to the conveyor; and a conductor for providing electricity to the articles while being conveyed. In the preferred embodiment, at least the following baths in the following order are employed: a cleaning bath; a rinsing bath; a plating bath; and a rinsing bath, and preferably a drying station subsequent to the final rinsing bath.




The invention is additionally of a continuous plating system and method for alloy plating of articles comprising: at least three plating baths, wherein the first bath comprises a substance to be plated on the articles, the second bath comprises a different substance to be plated on the articles and the third bath comprises the same substance as the first bath to be plated on the articles, the substances comprising an alloy plate on the articles; a continuous conveyor system for passing the articles through the multiple baths comprising a drive, a conveyor, and numerous carriers for attaching numerous articles to the conveyor; and a conductor for providing electricity to the articles while being conveyed. The system best further comprises a dryer in line with the continuous plating system and positioned after the multiple baths, the dryer comprising: a box comprising a heated fluid; an entry opening for the articles to enter the box; and an exit opening for the articles to exit the box, as well as a wicking device (such as a mesh material in the box) to help remove moisture from the articles. The system also best employs a rinse system in line with the continuous plating system and positioned after the multiple baths, the rinse system comprising: a first rinse station wherein a substance from the multiple baths is rinsed from the articles, the first rinse station comprising an effluent with a higher concentration of the substance; and at least one additional rinse station wherein the substance is further rinsed from the articles, the additional rinse station comprising an effluent with a lower concentration of the substance; and for recycling effluent from the rinse station back into the continuous plating system (preferably with at least four rinse stations). The articles are preferably completely submerged within the plating bath(s). Most preferably, the plating system comprises: at least three plating baths, wherein the first bath comprises a substance to be plated on the articles, the second bath comprises a different substance to be plated on the articles and the third bath comprises the same substance as the first bath to be plated on the articles, the substances comprising an alloy plate (preferably tin and bismuth) on the articles; a continuous conveyor system for passing the articles through the multiple baths comprising a drive, a conveyor, and numerous carriers for attaching numerous articles to the conveyor; and a conductor for providing electricity to the articles while being conveyed. Most preferably, the system uses at least five plating baths in the following order and comprising the following in solution to be plated on the articles: tin, bismuth, tin, bismuth and tin. However, the system can be used to plate many metal alloys, including tin, bismuth, lead, titanium, cadmium, nickel, and zinc, and combinations thereof. Further, the system preferably has at least one bath comprising a plating bath, and the other baths comprise at least one process bath selected from the group consisting of cleaning, electrocleaning, degreasing, rinsing, drying, fluxing, reflowing and stripping, most preferably at least the following baths in the following order a cleaning bath; a rinsing bath; a plating bath; and a rinsing bath, preferably with a drying station subsequent to the final rinsing bath. The conveyor may comprise the conductor, so as to provide electricity to the articles while being conveyed thereon. Here, synthetic resin polymer bars (e.g., Teflon) may be used to support the conveyor.




The invention is still further of a continuous plating system and method for plating articles comprising: multiple baths, wherein at least one bath comprises a plating bath; and a continuous conveyor system for passing the articles through the multiple baths comprising a drive, a conveyor comprising a conductor for providing electricity to the articles while being conveyed, and numerous carriers for attaching numerous articles to the conveyor. The preferred embodiment preferably comprises synthetic resin polymer bars (e.g., Teflon) to support the conveyor when no direct current is present.




The invention is yet further of a continuous plating system and method for plating articles comprising multiple baths, wherein at least one bath comprises a plating bath; a horizontal continuous conveyor system for passing the articles through the multiple baths comprising a drive, a conveyor, and numerous carriers for attaching numerous articles to the conveyor, and a conductor for providing electricity to the articles while being conveyed; the invention further comprising: a dryer in line with the continuous plating system and positioned after the multiple baths, the dryer comprising: a box comprising a heated fluid; an entry opening for the articles to enter the box; and an exit opening for the articles to exit the box. The preferred embodiment includes a wicking device for wicking moisture from the articles, such as a mesh material disposed in the box (preferably at the bottom), and internal guides for stabilizing the articles within the box.




The invention is additionally of a continuous plating system and method for plating articles comprising multiple baths, wherein at least one bath comprises a plating bath; a horizontal continuous conveyor system for passing the articles through the multiple baths comprising a drive, a conveyor, and numerous carriers for attaching numerous articles to the conveyor; and a conductor for providing electricity to the articles while being conveyed; the invention further comprising: a rinse system in line with the continuous plating system and positioned after the multiple baths, the rinse system comprising: a first rinse station wherein a substance from the multiple baths is rinsed from the articles, the first rinse station comprising an effluent with a higher concentration of the substance; and at least one additional rinse station wherein the substance is further rinsed from the articles, the additional rinse station comprising an effluent with a lower concentration of the substance; and for recycling effluent from the rinse station back into the continuous plating system. Preferably, the improvement employs at least four rinse stations.




A primary object of the present invention is to provide a continuous, multiple bath plating system, capable of single substance or alloy plating.




Another object of the present invention is to provide a continuous plating system which allows for submersion of the entire article into each bath.




Yet another object of the present invention is to provide for a continuous, horizontal conveyor system, which utilizes links and hinges.




Another object of the present invention is to provide recycling of most process streams.




A primary advantage of the present invention is that numerous articles can be plated in a short time frame, in an efficient and low cost manner.




Another advantage of the present invention is that alloy plating can be provided, including homogeneous alloys.




Other objects, advantages and novel features, and further scope of applicability of the present invention will be set forth in part in the detailed description to follow, taken in conjunction with the accompanying drawings, and in part will become apparent to those skilled in the art upon examination of the following, or may be learned by practice of the invention. The objects and advantages of the invention may be realized and attained by means of the instrumentalities and combinations particularly pointed out in the appended claims.











BRIEF DESCRIPTION OF THE DRAWINGS




The accompanying drawings, which are incorporated into and form a part of the specification, illustrate several embodiments of the present invention and, together with the description, serve to explain the principles of the invention. The drawings are only for the purpose of illustrating a preferred embodiment of the invention and are not to be construed as limiting the invention. In the drawings:





FIG. 1

is a perspective view of the continuous rack plater of the present invention;





FIG. 2

is a top flowchart view of the preferred embodiment of the invention of

FIG. 1

;





FIG. 3

is a side view of the preferred hook and rail configuration of the invention of

FIG. 1

;





FIG. 4

is a cutaway end view of the preferred hook and rail configuration of the invention of

FIG. 1

;





FIG. 5

is a pulley assembly configuration of the invention of

FIG. 1

;





FIG. 6

is a cutaway end view of the preferred tank entry configuration of the invention of

FIG. 1

for flat parts to be plated;





FIG. 7

is a cutaway end view of an alternative tank entry configuration of the invention of

FIG. 1

for angled parts to be plated;





FIG. 8

is a top view of the preferred plating tank configuration of the invention of

FIG. 1

;





FIG. 9

is a perspective view of the preferred dryer configuration of the invention of

FIG. 1

;





FIG. 10

is a flowchart view of the preferred rinse configuration of the invention of

FIG. 1

;





FIG. 11

is a flowchart of an alternative embodiment for alloy plating using the invention of

FIG. 1

;





FIG. 12

is a scanning electron photomicrograph of Sn/Bi coating in SEI mode at 700×magnification;





FIG. 13

is a scanning electron photomicrograph of Sn/Bi coating in composition mode at 700×magnification; and





FIG. 14

is a perspective view of the reflow portion of the invention of FIG.


1


.











DESCRIPTION OF THE PREFERRED EMBODIMENTS




Best Modes for Carrying Out the Invention




The present invention relates to a continuous rack plater for continuously plating of flat parts and parts with angles or relief. The invention allows for plating with single or multiple substances.




With reference to the drawings, continuous rack plater


10


provides for plating of numerous, multiple parts (e.g., see a flat part


12


shown in

FIGS. 6 and 9

and an angled part


86


in FIG.


7


). The parts


12


to be plated are loaded or otherwise placed


13


on hooks


16


disposed on conveyor belt


18


. The loading


13


and unloading


44


may be accomplished by a human operator or by automatic equipment (not shown) (e.g., a ramp which pushes the parts


12


off). Conveyor belt


18


travels (see

FIGS. 2 and 10

) around drive pulley


20


on one end and idler pulleys


22


,


22


′ and


22


″. Drive gear


24


powers and drives drive pulley


20


so that conveyor belt


18


, with hooks


16


containing parts


12


, can revolve through various cycles, equipment and processes (preferred embodiments discussed below). The invention is not limited to the particular cycles and processes described herein, as any steps, cycles, processes, solutions, substances to be plated, etc., can be used in accordance with the present invention. The term “plating” as used throughout the specification and claims is intended to include all forms of electrochemical processing such as electroplating, electroforming, electrocoating, electrodeposition, coating, stripping, alloying, and the like.




In the first step of the present invention, parts


12


are disposed on conveyor


18


. The hooks


16


shown in the drawings are only one possible means for disposing the parts


12


to be plated on conveyor


18


, and are particularly useful when the parts have a hole therethrough


17


. Different sized hooks can be used for different articles and are easily removed and replaced on the conveyor. Other attachment means, e.g., slots, magnets, wires, strips, holes, etc., may be used for disposing parts


12


to be plated on conveyor


18


.




Conveyor belt


18


acts as a conductor for the plating. In the preferred embodiment, continuous rack plater


10


is in an oval configuration so that power lines and piping lines can be more easily provided to the plater


10


.




Reference is made to

FIG. 2

of the invention which illustrates a typical process embodiment of the invention of FIG.


1


. The arrows show the direction of travel of conveyor


18


. As shown in this flowchart, parts


12


are loaded


13


onto conveyor


18


. If the parts


12


are dirty or oily they can pass through a cleaner or degreaser


26


. A typical degreaser, useful in the present invention, comprises a spray box with nozzles which spray a detergent solution on the parts. The spray nozzles can be made to provide turbulent flow (e.g., using a narrow nozzle) or laminar flow (e.g., using a wide nozzle), depending on the extent of the degreasing


26


necessary and the stability of the parts


12


. The parts


12


are then rinsed


28


(e.g., with spray nozzles) and can then be cleaned again in an electrocleaner


30


(e.g., a standard plater's detergent solution with anodes or cathodes (e.g., hanging over the edges) for scrubbing hydrogen or oxygen on the surface of the parts


12


). After electrocleaner


30


, parts


12


are rinsed again


32


(e.g., with spray nozzles). Parts


12


then travel through an acid bath


34


(e.g., typical plater's acid bath solution) to remove very light oxides (e.g., rust) and neutralize any remaining detergent. Parts


12


are then rinsed


36


again (e.g., with spray nozzles) prior to entering the plating bath


38


. Plating bath


38


contains typical platers solutions for plating substances (e.g., nickel or other metals or alloys) onto parts


12


. After parts


12


exit plating bath


38


they are rinsed


40


(e.g., with spray nozzles) and then dried in dryer


42


(e.g., using hot air). Preferably, parts


12


are subjected to a blower


39


prior to the dryer


42


to remove much of the rinse stream


40


. Parts


12


are then unloaded


44


and are complete. Hooks


16


which are now empty of parts


12


are then stripped


46


(e.g., using typical stripping solutions) and then rinsed


48


prior to being reloaded


13


for plating on continuous rack plater


10


. As can be seen, the number and types of tanks and stations and processes depend entirely on the part to be plated, the thickness and final characteristics desired, the incoming character of the part, etc. For instance, some parts may not require cleaning or rinsing, whereas other parts may required multiple plating steps. The present invention is not limited to the particular processes described herein.




With reference to

FIGS. 3 and 4

, the preferred attachment of hook


16


to conveyor


18


is shown. Conveyor (which acts as a conductor) preferably comprises individual links


50


,


50


′ (e.g., made of brass or steel and plated with silver or other conductive and corrosion protection coatings). Hooks


16


,


16


′ are preferably attached to links


50


,


50


′ via a washer S


2


, screw


54


and nut


56


. Link


50


comprises slots


58


,


58


′ and foot


60


to be driven by drive gear


20


. Foot


60


aids travel of link


50


on conductor bar or synthetic resin polymer bar (e.g., Teflon)


62


and provides current continuity between conductor bar


62


and hook


16


. Hinge pin


64


attaches individual links


50


,


50


′ to each other to form continuous conveyor


18


, while providing flexibility for turning corners in e.g., an oval configuration. The conveyor link arrangement allows direct motion power transfer from the drive gear and is suitable for most applications. A chain drive (not shown) could be used to help with heavier articles.




Drive gear


20


comprises a top gear only (corresponding to top slot


58


(see FIG.


3


)) or a top and bottom gear (corresponding to top and bottom slots


58


′,


58


(see FIG.


3


)) for heavier loads. Drive gear rotates about a motor driven shaft. A variable speed motor turns the shaft by means of a direct drive or belt and pulleys or chain and sprockets. The drive shaft is attached to the drive gear


20


. Spacers in the drive gear mechanism


20


provide for recesses for foot


60


and screw arrangement


54


.




As shown in

FIGS. 3 and 4

, conveyor


18


travels on conductor bar


62


by aid of link foot


60


. Conductor bar


62


is supported by angle


92


and secured by connector (e.g., screw


94


). Angle


92


is fasted to inverted angle


96


by a screw/washer/nut arrangement


98


. Inverted angle


96


is secured to structure support


100


by a screw/nut/washer arrangement


102


. Conveyor


18


is given vertical support by outer guide


104


which is attached to inverted angle


96


by a screw/washer/nut arrangement


106


. Interior vertical support is provided by inner guide


108


which is attached to angles


92


and by a screw/washer/nut arrangement


110


.





FIG. 5

illustrates, in detail, the pulley arrangement for allowing conveyor


18


to rotate through the system. Idler


22


rotates about shaft


112


. Idler


22


comprises recesses


114


,


114


′ for foot


60


and screw arrangement


54


, respectively, on hook


16


.




Direct current for plating is passed to parts


12


being plated through hook


16


, link


50


, link foot


60


, conductor bar


62


, cable connector


66


, and conductor bar/cable connector screw


94


. Additional direct current can be supplied to links


50


,


50


′ by means of exposed cable (e.g., copper cable) or brushes. Silver plating of the conductor/conveyor bar


18


aids corrosion protection, direct current power transfer, and provides a surface with high lubricity for the conveyor link feet


60


, which are also preferably silver plated.




As can be seen, other part attachment devices besides hooks


16


can be utilized in accordance with the present invention. Likewise, hooks


16


or other attachment devices may be attached to conveyor


18


by various means. The present invention is not limited to the particular embodiments shown.




Conveyor belt


18


pulls hooks


16


and parts


12


to be plated through slots


72


in the ends of process tanks or boxes


74


, as shown in

FIGS. 6 and 7

.

FIG. 6

shows an embodiment of the invention for flat parts whereas

FIG. 7

shows an embodiment of the invention with angled or non-planar parts. Tanks


74


can be for any type of fluid process (e.g., cleaning, degreasing, acid treatment, rinsing, plating, stripping, etc.). The slots


72


need to be wide enough for part


12


to pass through, but narrow enough to keep solutions in tanks


74


. Overflow or solution which exits tanks


74


may go to an outer tank or reservoir tank (e.g., see overflow tank


76


and reservoir tank


78


).

FIG. 6

illustrates a narrow slot


72


for allowing passage of a narrow, flat part


12


.

FIG. 7

illustrates an alternate slot


84


for an angled part


86


. Horizontal flaps


88


,


88


′, typically on the outside of the tank, allow for horizontal adjustment of the slot


84


around part


86


and vertical flaps


90


,


90


′, typically on the inside of the tank allow for vertical adjustment of angled part


86


. As can be seen, slots in tanks or boxes may need to be adjusted for each part to be plated.





FIG. 6

illustrates that tanks or boxes


74


may comprise entry/exit guides


116


,


116


′ to aid parts


12


from entering and leaving tanks


74


. Additional guides


118


may be placed inside the tanks


74


to prevent parts


12


from swaying due to fluid turbulence or high pressure spray. Guides


116


,


118


may be made of any material which is resistant to the solution in the tank, such as stainless steel wire, plastic covered wire, plastic chord or plastic framework.





FIG. 8

is a top view of the preferred plating tank


38


of the present invention. Anode baskets


82


or anodes which hang over or present at the edges of the plating tank (not shown) may be utilized in accordance with the present invention. As can be appreciated by one skilled in the art, any type of anode configuration may be utilized in accordance with the present invention. Anode baskets


82


may contain chips, slugs, sheets or other anode material being plated. Electrical leads are provided to anode baskets


82


. Mesh (not shown) may be placed over anode baskets


82


to prevent particle contamination of the tank


74


.




In the preferred embodiment, smaller tanks (e.g., upper overflow tank


76


) are disposed within larger tanks (e.g., reservoir tank


78


) so that tank solutions can be allowed to overflow and recirculate via pumps


80


(FIG.


2


). Solution jets may be provided to tanks to improve circulation of solutions. Multiple pumps may be provided within individual tanks, particularly in larger tanks such as the plating tank, so that the solution may remain homogeneous and at the same temperature throughout. Tanks


74


are preferably made of a material resistant to the solution contained in the tanks. Acrylic, polypropylene, and steel lined with rubber, are generally suitable for typical metal plating tanks.





FIG. 10

shows the preferred rinse arrangement


40


following plating


38


. Rinsing following plating is tripled or quadrupled in order to remove all plating chemicals from the surface of the plated part


12


. After plating


38


, the preferred embodiment for rinsing


40


comprises multiple boxes


126


(e.g., 3-4 boxes). These rinse boxes


126


may be joined to save space. The reservoirs can be placed beneath the nickel tank. The reservoirs for


126


,


28


,


32


,


36


, and


48


can be placed under the dryer. In the preferred embodiment, each rinse box


126


comprises a separate rinse reservoir for evaporation. After plating


38


, the first rinse box


126


′ may have a high metal concentration, the next box


126


″ will have a lesser metal concentration, the next box


126


′″ a lower concentration, and so on, until the last box


126


′″″ has nearly clean water. Deionized water is preferably used to make up the reservoirs. If the plating bath


38


is heated, such as in nickel plating, the metal laden water from the first reservoir can be used to replace the loss of volume in the plating bath


38


due to evaporation. The water in the second reservoir is then pumped to the first reservoir; the water in the third reservoir is pumped to the second reservoir, and the water emptied from the final reservoir is replaced with more deionized water. This system has been found to eliminate the need for effluent treatment of metal.





FIG. 9

shows the preferred convection dryer of the present invention. Wet, plated parts


12


are dried in a countercurrent, hot-air convection dryer


42


. Dryer


42


comprises a box in which the hot air is introduced to the part


12


with or without nozzles. A bottom mesh wicking screen


120


may be utilized to wick away moisture from part


12


by touching the bottom of part


12


, resulting in a spot-free part


12


. Dryer


42


box and/or wick screen


120


may be adjusted upwards or downwards to accommodate the size and shape of the part


12


. Hot air enters dryer


42


through a duct


122


that supplies hot air to the dryer


42


, preferably on two sides of the dryer


42


. Air guides


124


direct the hot air towards the opposite end of the dryer


42


.

FIG. 9

also illustrates slot


72


through which hook


16


and part


12


enters dryer


42


.




After plated articles


12


have been removed from hooks


16


, pass through a stripping box


46


, where an anodic stripping fluid removes plating built up from the hook tips. This process allows hooks


16


to be used for a longer period of time without maintenance or replacement. A cathode (not shown) in the stripping box


46


is negatively charged, while hook


16


is positively charged. The cathode may sit on the bottom of strip tank


46


and rise up the tank sides, where it is connected cathodically to direct current.




In the preferred embodiment of the invention, most fluid streams are recycled or reintroduced into the process stream. The invention utilizes countercurrent rinsing as follows: Fresh rinse water is recirculated after the nickel rinses. This water slowly overflows to the acid rinse and is recirculated there. Next, the water overflows to the electrocleaner rinse, recirculated, overflowed to the degrease rinse, recirculated, overflowed to the hook strip rinse, and recirculated, and finally drained. One water source thereby provides rinsing for five operations.




In an alternative embodiment of the invention, shown in

FIG. 11

, alloy plating is possible using the plater


10


of the present invention.

FIG. 11

is one example of numerous types of alloy plating possible, namely tin/bismuth plating. For instance, short lead frame strips used in the integrated circuit industry could be plated in accordance with the alloy method of the present invention. Tin/bismuth is preferable to tin/lead plating due to the inherent environmental problems with lead. Heretofore, it has not been possible to easily and inexpensively plate tin/bismuth in a homogeneous manner. Nor, was it possible due to the voltage differences required to plate tin and bismuth in the same bath. The multiple plate process of the present invention overcomes these problems.

FIGS. 12 and 13

illustrate scanning electron photomicrographs of the resulting homogeneous alloy structure of tin/bismuth plating. In

FIG. 11

, one process for fin/bismuth or other alloy plating (such as tin/lead plating, titanium/cadmium, tin/nickel, and tin/zinc) is as follows, many of which steps are similar or the same and described above in reference to FIG.


2


: load parts


13


; degrease


26


; rinse


28


; clean


30


; rinse


32


; acid clean


34


; rinse


36


; tin plating


128


; bismuth plating


130


; tin plating


132


; bismuth plating


134


; fin plating


136


; rinse


40


; flux


138


; reflow


140


; unloading part


44


; strip hooks


46


; rinse hooks


48


; and reload parts


13


. The differences in the alloy plating is that different baths are used for each metal (some baths


128


,


132


and


136


for tin, and other baths


130


and


134


for bismuth). As can be appreciated by one skilled in the art, there could be one bath for each alloy or multiple alloys. Likewise, some alloy plating is achievable in a single tank (not shown). For tin/bismuth, five to seven layers achieve a good product, with the final layer being tin. The alloy weight composition can be regulated by the length of time in the various tanks or by the amount of direct current in the various tanks. If the same electrolyte is used in the tin tank and the bismuth tank, such as methane sulfonic acid, or fluroboric acid, then there is no need for rinsing between the tin and bismuth tanks. Alternatively, rinsing can be provided between plating tanks. If tin is the final plate, then there is no need for metal saving rinses, as tin is not considered an environmental hazard. Following plating of the metal layers, the articles/parts


12


pass through a flux spray


138


or flux bath and then to a heated reflow station


140


. The period of time in the reflow station


140


can be as short as a few seconds and be accomplished by infrared radiation, hot oil designed for reflow, or by vapor phase with solvent designed for such. Wash and dry steps might be required to remove residues from the reflow


140


step (not shown). The method of reflow will determine if wash and dry steps are required. Optimization of the length of time in the reflow station


140


is based on the amount of tin intermetallics with the basic material required for adhesion, and the thickness and number of the layers desired. According to the present invention, a reflow station serves several purposes, for example, but not limited to, to heat at least one metal on an artide thereby causing a melting of the at least one metal and/or causing a melting and/or fusing of at least two metals. Means for transferring heat to an artide comprise, for example, but are not limited to, use of heat transfer fluids and electromagnetic heating (e.g., eddy current heating and the like).




If the reflow time is too long, an increase in grain size may result along with some undesirable degree of alloy separation. For a reflow comprising hot oil, or another heat transfer fluid, reflow walls comprising a synthetic resin polymer, e.g., Teflon, are constructed and spaced to specific dimensions based on, for example, article dimensions and/or conveyor speed. Such walls also act to insulate the heat transfer fluid. With reference to

FIG. 14

, in most instances wall height exceeds article height to allow for flow of heat transfer fluid from at least one point near the top of the walls, e.g., ports


144


,


144


′,


144


″,


144


′″ shown in

FIG. 14

, while spacing between walls always exceeds article width. For example, a lead frame may have a width of approximately 0.010 inches and a printed circuit board may have a slightly thicker width—wall spacing will exceed such widths to allow for passing of the article. With reference to

FIG. 14

, heat transfer fluid flowing from the ports


144


,


144


′,


144


″,


144


′″ of the reflow walls


142


,


142


′ contacts the article and is subsequently collected in catch tray


146


or the like and transferred to a reservoir primarily or exclusively by gravity driven flow. The collected fluid is then available for recycle through the walls. In situations where synthetic resin wall material is inadequate, reflow walls comprise a different material, e.g., stainless steel. A different material is usable alone or in conjunction with a synthetic resin polymer, especially when the different material adds integrity and/or provides for flow channels within the wall. The surfaces of any construction material used are modifiable to reduce friction between the passing article and reflow wall.




In preferred embodiments of the present invention a reflow station, or reflow bath, comprises at least one wall comprising metal and/or synthetic resin polymer. Such walls may further comprise flow channels for flow of a heat transfer fluid. Again, any reflow station wall comprises a height greater than or equal to the artide height while another dimension of the wall is determinable in comparison to a width of the article, e.g., the widest horizontal dimension of the article. Of course, when two walls


142


,


142


′, as shown in

FIG. 14

, are present, spacing between the two walls exceeds a chosen dimension of the passing article. To further ensure ease of passage, at least one wall comprises friction reduction means for reducing friction between the at least one wall and the article. In addition, at least one wall may comprise insulation means to insulate heat transfer fluid, especially when the at least one wall insulates heat transfer fluid proximate to a passing article. In a preferred embodiment of the present invention, articles are submerged by heat transfer fluid when passing through a reflow station.




INDUSTRIAL APPLICABILITY




The invention is further illustrated by the following non-limiting example.




EXAMPLE 1




The present invention, as depicted in

FIG. 1

, was used to plate nickel onto steel parts. The conveyor speed was approximately 3-4 feet per minute, with


1-1.5 revolutions per minute of drive gear. The plater was run continuously for several months (


3 shifts per day), producing hundreds of thousands of parts. The plater was 30′ in length with approximately 180 hooks. One flat part plated was for the bottom of a cellular phone charger. One angular part plated was a lever on a weedeater. The present invention was tested to 750 amps of direct current for nickel plating. Auxiliary brush or exposed cable contacts were placed approximately every 18″ to solve arcing problems. The processes shown in the flowchart of

FIG. 2

were used for flat and angled parts. The parts had a hole in them which allowed for disposing the parts on the hooks. The nickel plating tank arrangement consisted of an approximately 300 gallon tank inside a 400 gallon tank. Anodes were placed in baskets. Each small rinse box (except for final rinse arrangement) was approximately 5″ long. The sizes of the various components were as follows: degreaser, electrocleaner and acid stations, 48″×12″ wide×8″ high; degreaser, electrocleaner and acid reservoir tanks, 60 gallons, 60″×18″ wide×16″ high; rinse boxes, 5″×9″ wide×9″ tall; rinse reservoirs, 16″×16″×16″, 17 gallon; rinse water flow, 3 gpm; nickel rinse reservoirs #1 and #2, 60″×22″×20″ deep, 110 gallon; nickel rinse reservoirs #3 and #4, 30″×22″×20″ deep, 55 gallon; and rinse box flows, 0.5 gpm, spray or laminar. A major benefit of the plater is it's ability to achieve thickness uniformity. Large, automated platers using racks to hold the articles are unable to plate with low standard deviations.




The preceding example can be repeated with similar success by substituting the generically or specifically described reactants and/or operating conditions of this invention for those used in the preceding example.




Although the invention has been described in detail with particular reference to these preferred embodiments, other embodiments can achieve the same results. Variations and modifications of the present invention will be obvious to those skilled in the art and it is intended to cover in the appended claims all such modifications and equivalents. The entire disclosures of all references, applications, patents, and publications cited above, are hereby incorporated by reference.



Claims
  • 1. A method for plating of articles to permit subsequent formation of an alloy, the method comprising:a) providing at least three plating baths, wherein the first bath comprises a first single metal other than lead to be plated on the articles, the second bath comprises a second single metal other than lead different from the first metal to be plated on the articles and the third bath comprises the first single metal to be plated on the articles, wherein the first single metal comprises tin and the second single metal comprises bismuth; b) passing the articles through the multiple baths; and c) providing electricity by a conductor to the articles while passing through the multiple baths; wherein after passing through the multiple baths the articles must be heated in order that the metals fuse into an alloy and thereby to plate the articles.
  • 2. The method of claim 1 wherein the step of providing baths comprises providing at least five plating baths in the following order and comprising the following in solution to be plated on the articles: tin, bismuth, tin, bismuth and tin.
  • 3. The method of claim 1 wherein the step of providing baths comprises providing baths of at least two metals selected from the group consisting of tin, bismuth, titanium, cadmium, nickel, and zinc.
  • 4. The method of claim 1 wherein the step of providing baths comprises providing a plating bath comprising at least one anode for plating the anode substance onto the articles.
  • 5. The method of claim 1 wherein the step of providing baths comprises providing a plating bath comprising an upper tank disposed within a lower tank for providing overflow and recirculation of a plating solution.
  • 6. The method of claim 1 wherein the step of providing baths comprises providing a plating bath comprising a narrow opening and a narrow exit corresponding substantially in shape and width to the articles.
  • 7. The method of claim 6 wherein the step of providing plating baths comprises providing an opening and exit comprising adjustment means for changing the shape and size of the opening and exit.
  • 8. The method of claim 1 wherein the step of providing plating baths comprises providing a plating bath comprising multiple pumps for providing even plating conditions to the articles.
  • 9. The method of claim 1 wherein the step of providing plating baths comprises providing a plating bath comprising multiple spray jets for providing even circulation and plating to the articles.
  • 10. The method of claim 1 further comprising providing internal guides within at least one of the multiple baths for preventing sway of the articles.
  • 11. The method of claim 1 further comprising providing external guides external to at least one of the multiple baths for providing ease of movement of the articles into the bath.
  • 12. The method of claim 1 wherein the articles comprise flat articles.
  • 13. The method of claim 1 wherein the articles comprise non-planar articles.
  • 14. The method of claim 1 further comprising performing the method within an oval configuration.
  • 15. The method of claim 1 further comprising providing additional direct current means.
  • 16. The method of claim 15 wherein providing additional direct current means comprises providing exposed cable or brushes.
  • 17. The method of claim 1 further comprising providing a dryer positioned in-line after the multiple baths, the dryer comprising a box comprising a heated fluid, an entry opening for the articles to enter the box, and an exit opening for the articles to exit the box.
  • 18. The method of claim 17 further comprising providing means for wicking moisture from the articles.
  • 19. The method of claim 18 wherein providing wicking means comprises providing a mesh material disposed in the box.
  • 20. The method of claim 1 further comprising providing a rinse system in-line with and positioned after the multiple baths, the rinse system comprising a first rinse station wherein a substance from the multiple baths is rinsed from the articles, the first rinse station comprising an effluent with a higher concentration of the substance, at least one additional rinse station wherein the substance is further rinsed from the articles, the additional rinse station comprising an effluent with a lower concentration of the substance, and means for recycling effluent from the rinse station back for use within the method.
  • 21. The method of claim 20 comprising providing at least four rinse stations.
  • 22. The method of claim 1 wherein the passing step comprises completely submerging the articles within the plating baths.
  • 23. The method of claim 1 wherein the step of providing baths comprises providing at least three plating baths, and the other baths comprise at least one process bath selected from the group consisting of cleaning, electrocleaning, degreasing, rinsing, drying, fluxing, reflowing and stripping.
  • 24. The method of claim 23 wherein the step of providing baths comprises providing at least the following baths in the following order:a cleaning bath; a rinsing bath; a plating bath; and a rinsing bath.
  • 25. The method of claim 24 further comprising drying the articles using a drying station subsequent to the final rinsing bath.
  • 26. The method of claim 1 wherein the step of providing electricity comprises providing a conductor for providing electricity to the articles while being conveyed.
CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation-in-part application of U.S. patent application Ser. No. 08/679,734, entitled “Continuous Rack Plater,” filed Jul. 12, 1996, now U.S. Pat. No. 5,985,106 which claims priority to U.S. Ser. No. 60/001,171 filed Jul. 14, 1995, the specification of which is incorporated herein by reference.

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Non-Patent Literature Citations (1)
Entry
Product publication: Meaker Variable speed Plating Machine (Dec. 5, 1932).
Provisional Applications (1)
Number Date Country
60/001171 Jul 1995 US
Continuation in Parts (1)
Number Date Country
Parent 08/679734 Jul 1996 US
Child 09/361785 US