Patent Grant
9193560
1. Field of the Invention
The present invention relates to a leader member, a substrate, a substrate cartridge, a substrate-processing apparatus, a leader-connecting method, a method of manufacturing a display element, and an apparatus for manufacturing a display element.
2. Description of Related Art
As display elements configuring display devices such as display apparatuses, for example, organic electroluminescence (organic EL) elements are known. The organic EL element has a configuration in which an anode and a cathode are formed on a substrate, and an organic light-emitting layer interposed between the anode and the cathode is included. In the organic EL element, holes are injected to the organic light-emitting layer from the anode, holes and electrons are combined together in the organic light-emitting layer, and display light is acquired in accordance with emitted light at the time of the combing thereof. In the organic EL element, for example, an electric circuit connected to the anode and the cathode and the like are formed on the substrate.
As one of techniques for manufacturing an organic EL element, for example, a technique called a roll-to-roll method (hereinafter, simply referred to as a “roll method”) is known (for example, see PCT Publication No. 2006/100868). The roll method is a technique in which one sheet-shaped substrate wound around a roller located on the substrate supplying side is sent out, the substrate is conveyed while the sent substrate is wound around a roller located on the substrate recovering side, and a light-emitting layer, an anode, a cathode, an electric circuit, and the like that configures an organic EL element are sequentially formed on the substrate until the substrate is wound after being sent off.
In the configuration disclosed in PCT Publication No. 2006/100868, for example, a roller used for sending out the substrate and a roller used for winding the substrate are configured so as to be detachable from a manufacturing line. The detached rollers, for example, are conveyed to another manufacturing line and can be installed to another manufacturing line so as to be used. In such a configuration, the transmission and the reception of the substrate between the rollers and the manufacturing line and the transmission and the reception of the substrate within the manufacturing line are frequently performed.
However, in the above-described configuration, for example, countermeasures are not set in the conveyance between the rollers and the manufacturing line, the conveyance within the manufacturing line, and the like, and there is a possibility of the occurrence of a problem from the viewpoint of the precision of the conveyance of a substrate.
The object of the aspects of the present invention is to improve the precision of the conveyance of a substrate.
According to a first aspect of the present invention, there is provided a leader member including: a connection portion that is connected to a substrate; and a position reference portion that is used at least for aligning the substrate with the connection portion.
According to a second aspect of the invention, there is provided a substrate including: a substrate main body that is conveyed in a predetermined direction; and a leader that is connected to an end portion of the substrate main body, wherein the leader member according to the present invention is used as the leader.
According to a third aspect of the invention, there is provided a substrate cartridge including a cartridge main body that houses a substrate, wherein the substrate according to the present invention is housed as the substrate.
According to a fourth aspect of the invention, there is provided a substrate-processing apparatus including: a substrate-processing unit that processes a substrate; a substrate carrying-in unit that carries the substrate in the substrate-processing unit; and a substrate carrying-out unit that carries out the substrate from the substrate-processing unit, wherein the substrate cartridge according to the present invention is used as at least one of the substrate carrying-in unit and the substrate carrying-out unit.
According to a fifth aspect of the invention, there is provided a leader-connecting method for connecting a leader member to a substrate, the leader-connecting method including: aligning the substrate with the leader member; and connecting the substrate and the leader member to each other after the alignment of the substrate and the leader member.
According to a sixth aspect of the invention, there is provided a method of manufacturing a display element, the method including: processing the substrate by using the substrate-processing unit; and conveying a substrate to the substrate-processing unit by using the leader member according to the present invention.
According to a seventh aspect of the invention, there is provided an apparatus for manufacturing a display element, the apparatus including: a conveying unit that conveys the leader member according to the present invention that is connected to a substrate; and a substrate-processing unit that processes the substrate.
According to the aspects of the present invention, the precision of the conveyance of a substrate can be improved.
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.
(Film Substrate and Leader Member)
As illustrated in
The leader member LDR is a sheet-shaped member that is formed in an approximate rectangular shape in the plan view. As examples of a material configuring the leader member LDR, there are stainless steel, plastic, and the like. In an area of the leader member LDR along one side (a left side in the
The film substrate FB has a configuration in which the stair portion 201 of the leader member LDR is bonded to an end portion Fa of the film F through thermal welding or an adhesive. As above, the stair portion 201 of the leader member LDR is used as a connection portion that is connected to the film F having flexibility. The leader member LDR is bonded to slightly protrude from the film F in the extending direction of the side 200a. Accordingly, in the extending direction of the side 200a, the entire end portion of the film F is covered with the leader member LDR.
In this embodiment, as an example of the film F of the connection destination of the leader member LDR, there is a band-shaped film that has flexibility and is used by being wound in a roll shape, and the like. As the composition material of the film, for example, a film having heat resistance, stainless steel, or the like can be used. For example, as the material of the resin film, polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl copolymer resin, polyvinylchloride resin, cellulosic resin, polyamide resin, polyimide resin, polycarbonate resin, polystyrene resin, polyvinyl acetate resin, or the like can be used. For example, the size of the film F on the shorter side direction (the vertical direction in
It is preferable that the film F have a low thermal expansion coefficient such that the size thereof does not change, for example, even when the film First and second stages receives heat of about 200° C. is received. For example, the thermal expansion coefficient may be lowered by mixing inorganic filler into the resin film. As examples of the inorganic filler, there are titanium oxide, zinc oxide, alumina, and silicon oxide.
The leader member LDR according to this embodiment is formed to have rigidity higher than the film F. As specific examples of such a configuration, there are a configuration in which the thickness of the leader member LDR is formed to be larger than that of the film F, a configuration in which a material having rigidity higher than that of the composition material of the film F is used as the composition material of the leader member LDR, and the like. In this embodiment, as illustrated in
By configuring the rigidity of the leader member LDR to be higher than that of the film F, for example, the end portion Fa of the film F is supported. Accordingly, in a case where the film F is handled such as the film F being conveyed, wound up, or sent out, the end portion Fa of the film F is protected from being bent, deformed, or the like.
As illustrated in
As illustrated in
With respect to the position reference portion 202, a film-side position reference portion Fd is formed on the film F. For example, the film-side position reference portion Fd is formed as the same mark (a mark of three lines) as that of the position reference portion 202. For example, each film-side position reference portion Fd is disposed in each of both end portions of the film F in the shorter side direction. The distance between the two film-side position reference portions Fd in the shorter side direction is the same as a distance between two position reference portions 202 in the same direction. In this embodiment, by aligning the position of the position reference portion 202 disposed in the leader member LDR with the position of the film-side position reference portion Fd disposed in the film F, the positions are matched between the leader member LDR and the film F. Accordingly, the position alignment with the leader member LDR and the film F can be performed with high precision.
For example, at positions deviated from the stair portion 201 in the plan view in the leader member LDR, a plurality of opening portions 203 is disposed. The plurality of opening portions 203 are arranged in the same direction as the extending direction of the side 200a on which the stair portion 201 is formed. The plurality of opening portions 203, for example, is arranged with a predetermined gap interposed therebetween. In each opening portion 203, for example, a portion such as a conveying member that maintains the leader member LDR is inserted into each opening portion so as to hang thereon. Accordingly, the leader member LDR can be conveyed in an easy manner. In addition, a configuration for easy conveying of the leader member LDR is not limited to the configuration in which the plurality of opening portions 203 is arranged but may be a configuration in which there is only one opening portion 203. In addition, the shape of the opening portion 203 is not limited to the rectangle as illustrated in
In addition, the configuration is not limited to the configuration in which the opening portions 203 are disposed in the leader member LDR but a configuration may be employed in which, for example, a concave portion not passing through the front and rear sides of the leader member LDR is disposed. Even in a case where the concave portion is formed, a configuration is formed in which a part of the conveying member or the like can be hanging thereon. In addition, a configuration may be employed in which notch portions are formed on sides other than the side 200a of the leader member LDR on which the stair portion 201 is formed. Even in such a case, a configuration is formed in which a part of the conveying member or the like can hang on the notched portion.
In an area of the leader member LDR, for example, between the position reference portion 202 and the opening portion 203, an information-maintaining portion 204 is disposed. In the information-maintaining portion 204, for example, a one-dimensional barcode pattern as illustrated in
(Substrate Cartridge)
Next, the configuration of a substrate cartridge that houses the above-described film substrate FB will be described. In the description presented below, for convenience of the description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system.
The cartridge main body 2 is a portion that houses the sheet substrate FB. As illustrated in
As shown in
The lid portion 25 is disposed in the end portion of the housing portion 20 on the +Y side or the end portion on the −Y side. The lid portion 25 is detachably attached to the housing portion 20. By detachably attaching the lid portion 25 to the housing portion 20, the inside of the housing portion 20 can be directly accessed. As an opening/closing mechanism of the lid portion 25, for example, a configuration in which screw threads engaging with each other are disposed in the lid portion 25 and the housing portion 20 may be employed or a configuration in which the lid portion 25 and the housing portion 20 are connected to each other by a hinge mechanism may be employed.
The substrate-driving mechanism 24 is a portion that performs an operation of winding up the film substrate FB and an operation of sending out the film substrate FB. The substrate-driving mechanism 24 is disposed inside the housing portion 20. The substrate-driving mechanism 24 includes a roller portion (shaft portion) 26 and a guide portion 27. The roller portion 26, as illustrated in
The rotation shaft member 26a is a cylinder-shaped member that is formed from high-rigidity metal such as aluminum. The rotation shaft member 26a is supported to be rotatable, for example, through an opening portion 25a and a bearing member 25b disposed in the center portion of the lid portion 25. In such a case, the center shaft of the rotation shaft member 26a, for example, in a state of being parallel to the Y direction, and the rotation shaft member 26a is rotated in the θY direction.
The rotation shaft member 26a is connected to a rotation driving mechanism that is not illustrated in the figure. By controlling the driving of the rotation driving mechanism, the rotation shaft member 26a is rotated around the center shaft as its center. The rotation driving mechanism, as illustrated in
The diameter expansion portion 26b is formed to have a uniform thickness on the surface of the rotation shaft member 26a. The diameter expansion portion 26b is formed so as to rotate integrally with the rotation shaft member 26a. The cylindrical portion 26c is formed to have a uniform thickness on the surface of the diameter expansion portion 26b in the cross-sectional view. The cylindrical portion 26c is bonded so as to cover the periphery of the diameter expansion portion 26b. Accordingly, the cylindrical portion 26c is configured to be integrally rotated together with the rotation shaft member 26a and the diameter expansion portion 26b.
In the concave portion 26e, an engagement mechanism 28 that is inserted into the opening portions 203 of the leader member LDR so as to be engaged therewith is disposed. The engagement mechanism 28 includes a claw member 28a and a pressing member 28b. The claw member 28a is disposed so as to be inserted into or detachable from the opening portions 26d. The pressing member 28b is an elastic member that presses the claw member 28a such that the claw member 28a protrudes from the opening portions 26d to the outer face of the cylindrical portion 26c. The pressing member 28b is configured to be elastically transformed by causing the claw member 28a to apply a force to the inner diameter side. The claw member 28a is configured to be housed inside the opening portions 26d according to the elastic transformation of the pressing member 28b.
In this embodiment, in a case where a film substrate FB is not wound, the claw member 28a is in the state of being protruded from the outer face of the cylindrical portion 26c by the pressing member 28b. The cylindrical portion 26c is formed by using a material having sufficient adhesiveness for bonding the film substrate FB.
In addition, as illustrated in
The tip end member 27b is connected to the other end of the rotation member 27a in the cross-sectional view. The tip end member 27 is formed so as to have an arc-shaped curved face in the cross-sectional view. The film substrate FB is configured to be guided to the roller portion 26 through the +Z-side curved face that is disposed in the tip end member 27b and has an arc shape in the cross-sectional view. The tip end member 27b is configured to be rotated integrally with the rotation member 27a. For example, in a case where the rotation member 27a is rotated in a direction (the outward direction in the diameter direction of the roller portion 26) in a direction separating away from the roller portion 26, the tip end member 27b is brought into contact with the inner circumference of the housing portion 20. Accordingly, a contact between the tip end member 27b and the film substrate FB wound around the roller portion 26 is avoided.
The mounting unit 3 is a portion that is connected to a substrate-processing unit 102. The mounting unit 3, for example, is disposed in the +X-side end portion of a protruded portion 23 disposed in the housing portion 20. The mounting unit 3 includes an insertion portion 3a that is used for a connection with the substrate-processing unit 102. In a case where the substrate cartridge 1 is used as a substrate-supplying unit 101, the mounting unit 3 is connected to a supply-side connection portion 102A of the substrate-processing unit 102. On the other hand, in a case where the substrate cartridge 1 is used as a substrate-recovering unit 103, the mounting unit 3 is connected to a recovery-side connection portion 102B of the substrate-processing unit 102. In a case where the mounting unit 3 is connected to one of the substrate-supplying unit 101 of the substrate-processing unit 102 and the substrate-recovering unit 103, the mounting unit 3 is connected so as to be detachably attached thereto.
In the mounting unit 3, an opening portion 34 and a second opening portion 35 are disposed. The opening portion 34 is an opening portion disposed on the +Z side, and the film substrate FB is carried in or out between the opening portion 34 and the cartridge main body 2. In the cartridge main body 2, the film substrate FB is housed through the opening portion 34. The film substrate FB housed in the cartridge main body 2 is sent out to the outside of the cartridge main body 2 through the opening portion 34.
The second opening portion 35 is an opening portion that is disposed on the −Z side, and a band-shaped second substrate SB other than the film substrate FB is carried in or out between the second opening portion 35 and the cartridge main body 2. As such a second substrate SB, for example, there is a protective substrate that protects the element forming face of the film substrate FB or the like. As the protective substrate, for example, inserting paper or the like can be used. The second opening portion 35, for example, is arranged so as to be spaced from the opening portion 34. For example, the second opening portion 35 is formed to be the same size and shape as the opening portion 34. In addition, as the material of the second substrate SB according to this embodiment, a material having conductivity such as a stainless steel thin plate (for example, having a thickness equal to or less than 0.1 mm or the like) may be used. In such a case, when the second substrate SB is housed in the cartridge main body 2 together with the film substrate (sheet substrate) FB, by electrically connecting the second substrate SB to the cartridge main body 2, the charging of the film substrate (the sheet substrate) FB can be prevented.
As illustrated in
The second substrate-guiding portion 37 is a portion that guides the second substrate SB between the mounting unit 3 and the substrate-conveying portion 21. The second substrate-guiding portion 37 includes second substrate-guiding members 37a, 37b, and 37c. The second substrate-guiding members 37a and 37b are arranged so as to face each other with a space 37d interposed therebetween in the Z direction, and the opposing faces are disposed so as to be approximately parallel to the XY plane. The second substrate-guiding member 37c is tiltedly arranged such that the second substrate SB is guided to the +Z side. In particular, the −X-side end portion of the second substrate-guiding member 37c is arranged in a state being tilted to the +Z side with respect to the +X-side end portion.
The second substrate-conveying portion 36 conveys the second substrate SB between the mounting unit 3 and the substrate-conveying portion 21. The second substrate-conveying portion 36 is arranged between the second substrate-guiding members 37a and 37b and the second substrate-guiding member 37c. The second substrate-conveying portion 36 includes a main driving roller 36a and a driven roller 36b. The main driving roller 36a is disposed so as to be rotatable, for example, in the θY direction and is connected to a rotation driving mechanism not illustrated in the figure. The driven roller 36b is arranged so as to have a space from the main driving roller 36a such that the second substrate SB is interposed between the main driving roller 36a and the driven roller 36b.
The substrate-conveying portion 21 conveys the film substrate FB and the second substrate SB between the mounting unit 3 and the housing portion 20. The substrate-conveying portion 21 includes a tension roller (tension mechanism) 21a and a measurement roller (measurement portion) 21b. The tension roller 21a is a roller that applies tension to the film substrate FB and the second substrate between the roller portion 26 and the tension roller 21a. The tension roller 21a is disposed so as to be rotatable in θY direction. For example, a rotation mechanism not illustrated in the figure is connected to the tension roller 21a. In addition, the tension roller 21a and the measurement roller 21b may be disposed so as to be respectively movable in the Z direction shown in
The measurement roller 21b is a roller that has a diameter smaller than that of the tension roller 21a. The measurement roller 21b is arranged so as to have a predetermined gap between the tension roller 21a and the measurement roller 21b such that the film substrate FB and the second substrate SB are interposed between the tension roller 21a and the measurement roller 21b. A configuration may be employed in which the size of the gap between the measurement roller 21b and the tension roller 21a can be adjusted so as to interpose only the film substrate FB or both the film substrate FB and the second substrate SB therebetween. The measurement roller 21b is a driven roller that is rotated in accordance with the rotation of the tension roller 21a.
By rotating the tension roller 21a in the state in which the film substrate FB is interposed between the tension roller 21a and the measurement roller 21b, the film substrate FB can be conveyed in the winding-up direction and the sending-out direction of the film substrate FB while tension is applied to the film substrate FB.
The substrate-conveying portion 21 includes a detection portion 21c that detects, for example, the rotation number or the rotation angle of the measurement roller 21b. As the detection portion 21c, for example, an encoder or the like is used. According to the detection portion 21c, for example, the conveying distance of the film substrate FB through the measurement roller 21b or the like can be measured.
For example, in a case where the film substrate FB is inserted through the opening portion 34, and the second substrate SB is inserted through the second opening portion 35, the film substrate FB and the second substrate SB are guided by the substrate-guiding portion 22 and the second substrate-guiding portion 37, thereby joining together in a joining portion 39. At this time, the film substrate FB and the second substrate SB jointed in the joining portion 39 are conveyed by the substrate-conveying portion 21 in the state of being joined. At this time, the substrate-conveying portion 21 presses the film substrate FB and the second substrate SB so as to be brought into tight contact with each other. Accordingly, the substrate-conveying portion 21 also serves as a pressing mechanism that presses the second substrate SB to the film substrate FB.
(Organic EL Element and Substrate-Processing Apparatus)
Next, the configuration of an organic EL element as an example of an element manufactured by using the above-described film substrate FB will be described.
As illustrated in
As illustrated in
As can be understood from
This organic EL element 50 is appropriately used not only in a display apparatus such as a display apparatus but also a display unit of an electronic apparatus or the like. In such a case, for example, the organic EL element 50 formed in a panel state is used. In manufacturing such an organic EL element 50, a substrate needs to be formed in which thin film transistors (TFTs) and pixel electrodes are formed. In order to form one or more organic compound layers (light-emitting element layers) including the light-emitting layer on the pixel electrodes formed on the substrate with high precision, it is necessary to easily form the partition walls BA (bank layer) in boundary areas of the pixel electrodes with high precision.
The substrate-processing apparatus 100 is an apparatus that forms the organic EL element 50 illustrated in
In the description presented below, the positional relationship between members will be described by referring to the XYZ orthogonal coordinate system, used in
The substrate-supplying unit 101 is connected to a supply-side connection portion 102A that is disposed in the substrate-processing unit 102. The substrate-supplying unit 101 supplies the film substrate FB, for example, wound in a roll shape to the substrate-processing unit 102. The substrate-recovering unit 103 recovers the film substrate FB that has been processed by the substrate-processing unit 102. As the substrate-supplying unit 101 and the substrate-recovering unit 103, for example, the above-described substrate cartridge 1 is used.
As illustrated in
The conveying unit 105 includes a plurality of rollers RR (conveying sections) arranged at positions disposed along the X direction. The film substrate FB is configured to be conveyed in the X-axis direction also in accordance with the rotation of the rollers RR. The roller RR may be a rubber roller that is interposed between both faces of the film substrate FB may be a racket-attached roller RR in a case where the film substrate FB has perforations. Some rollers RR out of such rollers RR can be moved in the Y axis direction that is perpendicular to the conveying direction. In addition, the conveying unit 105 is not limited to the rollers RR, and, for example, a configuration may be employed in which a plurality of belt conveyers (conveying sections) that can adsorb at least the leader member LDR through air.
The element-forming section 106 includes a partition wall-forming portion 91, an electrode-forming portion 92, and a light-emitting layer-forming portion 93. The partition wall-forming portion 91, the electrode-forming portion 92, and the light-emitting layer-forming portion 93 are arranged in this order from the upstream side to the downstream side in the conveying direction of the film substrate FB. Hereinafter, each configuration of the element-forming section 106 will be sequentially described.
The partition wall-forming portion 91 includes an imprint roller 110 and a thermal transfer roller 115. The partition wall-forming portion 91 forms the partition walls BA for the film substrate FB sent out from the substrate-supplying unit 101. In the partition wall-forming portion 91, the film substrate FB is pressed by the imprint roller 110, and the film substrate FB is heated up to a temperature equal to or higher than the glass transition point by the thermal transfer roller 115 such that the pressed partition walls BA maintain the shape. Accordingly, the mold shape formed on the roller surface of the imprint roller 110 is configured to be transferred to the film substrate FB. The film substrate FB is configured to be heated, for example, to be about 200° C. by the thermal transfer roller 115. In addition, the imprint roller 110 and the thermal transfer roller 115 may be configured to have the function of the above-described conveying unit 105 as the conveying section. Furthermore, the above-described conveying section may be configured to be movable at least in the conveying direction (X direction) of the leader member LDR in correspondence with the length of the leader member LDR in the conveying direction.
The roller surface of the imprint roller 110 is mirror-finished, and a fine imprint mold 111 configured by using a material such as SiC or Ta is attached to the roller surface. The fine imprint mold 111 forms a stamper used for the wiring of a thin film transistor and a stamper used for a color filter.
The imprint roller 110 forms alignment marks AM on the film substrate FB by using the fine imprint mold 111. In order to form the alignment marks AM on both sides in the Y axis direction that is the widthwise direction of the film substrate FB, the fine imprint mold 111 includes a stamper used for the alignment marks AM.
The electrode-forming portion 92 is disposed on the +X side of the partition wall-forming portion 91 and, for example, forms a thin film transistor using an organic semiconductor. More particularly, after forming the gate electrode G, the gate-insulating layer I, the source electrode S, the drain electrode D, and the pixel electrode P as illustrated in
As the material of the thin film transistor (TFT), an organic semiconductor may be used although the thin film transistor is of an inorganic semiconductor system. As a thin film transistor of an inorganic semiconductor, although a thin film transistor of an amorphous silicon system is known, a thin film transistor using an organic semiconductor may be used as well. By configuring a thin film transistor by using such an organic semiconductor, the thin film transistor can be formed by using a printing technique or a liquid droplet-coating technique. In addition, a field-effect transistor (FET) as illustrated in
The electrode-forming portion 92 includes a liquid droplet-coating apparatus 120, a thermal treatment apparatus BK, a cutting apparatus 130, and the like.
In this embodiment, as the liquid droplet-coating apparatus 120, for example, a liquid droplet-coating apparatus 120G that is used when the gate electrode G is formed, a liquid droplet-coating apparatus 120I that is used when the gate-insulating layer I is formed, a liquid droplet-coating apparatus 120SD that is used when the source electrode S, the drain electrode D, and the pixel electrode P are formed, a liquid droplet-coating apparatus 120OS that is used when the organic semiconductor OS is formed, and the like are used.
In the liquid droplet-coating apparatus 120, a plurality of nozzles 122 is formed. Each nozzle 122 is disposed on a face of the liquid droplet-coating apparatus 120 that faces the film substrate FB. The nozzles 122, for example, are arranged along the Y axis direction, and, for example, two rows (nozzle rows) of the nozzles 122 are formed. The control section 104 can perform liquid droplet coating from all the nozzles 122 or can individually adjust the timing of liquid droplet coating from each nozzle 122.
As the liquid droplet-coating apparatus 120, for example, an ink jet type or a dispenser type can be employed. As examples of the ink jet type, there are a charging control type, a compression vibration type, an electromechanical transduction type, an electro-thermal conversion type, an electrostatic attraction type, and the like. According to the liquid droplet-coating method, the material is effectively used, and a material of a desired amount can be precisely arranged at a desired position. In addition, the amount of one droplet of metal ink that is used for coating by using the liquid droplet-coating method, for example, is 1 to 300 nano grams.
As illustrated in
The metal ink is a liquid in which conductive bodies having a particle diameter of about 5 nm are stabilized and dispersed in a room-temperature solvent, and, as the material of the conductive bodies, carbon, silver (Ag), gold (Au), or the like is used. The compound that forms the organic semiconductor ink may be either a monocrystalline material or an amorphous material and may be either a low-molecular-weight material or a high-molecular-weight material. As examples of a preferable compound that forms the organic semiconductor ink, there are a monocrystal or π-conjugated-system high-molecular-weight compound of a condensed ring system aromatic hydrocarbon compound that is represented by pentacene, triphenylene, anthracene, or the like.
The thermal treatment apparatus BK is arranged on the +X side (the downstream side in the substrate conveying direction) of each liquid droplet-coating apparatus 120. The thermal treatment apparatus BK, for example, can emit a hot air, far-infrared rays, or the like to the film substrate FB. The thermal treatment apparatus BK dries or bakes liquid droplets with which the film substrate FB is coated so as to be hardened by using the radiated heat.
The cutting apparatus 130 is disposed on the +X side of the liquid droplet-coating apparatus 120SD and on the upstream side of the coating apparatus 120OS. The cutting apparatus 130 cuts off the source electrode S and the drain electrode D formed by the liquid droplet-coating apparatus 120SD, for example, by using laser light or the like. The cutting apparatus 130 includes a light source, which is not illustrated in the figure, and a galvanometer mirror 131 that projects laser light emitted from the light source onto the film substrate FB.
As the kind of the laser light, laser of a wavelength that is absorbed in the metal film to be cut may be used, and, as the wavelength-converted laser, second, third, or fourth harmonic waves such as YAG may be used. In addition, by using pulse-type laser, thermal diffusion is prevented, and damage to portions other than the cut portion can be reduced. In a case where the material is aluminum, femtosecond laser of a wavelength of 760 nm is preferable.
In this embodiment, for example, a femtosecond laser irradiation unit that uses titanium sapphire laser is used as the light source. The femtosecond laser irradiation unit is configured to emit laser light LL, for example, as a pulse in the range of 10 KHz to 40 KHz.
In this embodiment, since the femtosecond laser is used, processing in the order of sub-microns can be performed, and a gap between the source electrode S and the drain electrode D, which determines the performance of a field-effect transistor, can be correctly cut. The gap between the source electrode S and the drain electrode D, for example, is in the range of about 3 μm to 30 μm.
Other than the above-described femtosecond laser, for example, carbon dioxide laser, green laser, or the like can be used. In addition, other than the laser, a configuration may be employed in which the substrate is mechanically cut by using a dicing saw or the like.
The galvanometer mirror 131 is arranged in the optical path of the laser light LL. The galvanometer mirror 131 reflects the laser light LL emitted from the light source onto the film substrate FB. The galvanometer mirror 131 is disposed so as to be rotatable, for example, in the θX direction, the θY direction, and the θZ direction. By rotating the galvanometer mirror 131, the emission position of the laser beam LL is changed.
By using both the partition wall-forming portion 91 and the electrode-forming portion 92, a thin film transistor and the like can be formed by using a printing technique or a liquid droplet-coating method without using a so-called photolithographic process. For example, in a case where only the electrode-forming portion 92, for which a printing technique, a liquid droplet-coating method, or the like is used, is used, there is case where a thin film transistor and the like may not be formed with high precision due to blurring or spreading of ink.
In contrast to this, by using the partition wall-forming portion 91, the partition walls BA are formed, whereby blurring and spreading of ink are prevented. In addition, the gap between the source electrode S and the drain electrode D, which determines the performance of a thin film transistor, is formed through laser processing or mechanical processing.
The light-emitting layer-forming portion 93 is arranged on the +X side of the electrode-forming portion 92. The light-emitting layer-forming portion 93 forms a light-emitting layer IR, a pixel electrode ITO, and the like on the film substrate FB on which electrodes are formed. The light-emitting layer-forming portion 93 includes a liquid droplet-coating apparatus 140 and the thermal treatment apparatus BK.
The light-emitting layer IR formed by the light-emitting layer-forming portion 93 contains a host compound and a phosphorescent compound (also referred to as a phosphorescent light-emitting compound). The host compound is a compound that is contained in the light-emitting layer. The phosphorescent compound is a compound in which light emission is observed from an excited triplet and emits phosphorescent light at room temperature.
In this embodiment, as the liquid droplet-coating apparatus 140, for example, a liquid droplet-coating apparatus 140Re that forms a red light-emitting layer, a liquid droplet-coating apparatus 140Gr that forms a green light-emitting layer, a liquid droplet-coating apparatus 140B1 that forms a blue light-emitting layer, a liquid droplet-coating apparatus 140I that forms an insulating layer, a liquid droplet-coating apparatus 140IT that forms a transparent electrode ITO, and the like are used.
As the liquid droplet-coating apparatus 140, similarly to the above-described liquid droplet-coating apparatus 120, an inkjet type or a dispenser type can be employed. In a case where, for example, a hole transport layer, an electron transport layer, and the like are disposed as the constituent elements of the organic EL element 50, an apparatus (for example, a liquid droplet-coating apparatus, or the like) that forms such layers is separately disposed.
The liquid droplet-coating apparatus 140Re coats the pixel electrode P with an R solution on the upper side. In the liquid droplet-coating apparatus 140Re, the amount of ejection of the R solution is adjusted such that the film thickness after drying is 100 nm. As the R solution, for example, a solution is used which is acquired by dissolving a red dopant material in 1,2-dichloroethane in polyvinyl carbazole (PVK) as a host material.
The liquid droplet-coating apparatus 140Gr coats the pixel electrode P with a G solution on the upper side. As the G solution, for example, a solution is used which is acquired by dissolving a green dopant material in 1,2-dichloroethane in PVK as a host material.
The liquid droplet-coating apparatus 140B1 coats the pixel electrode P with a B solution on the upper side. As the B solution, for example, a solution is used which is acquired by dissolving a blue dopant material in 1,2-dichloroethane in PVK as a host material.
The liquid droplet-coating apparatus 120I coats a part of the gate bus line GBL or the source bus line SBL with electrically-insulated ink. As the electrically insulating ink, for example, ink of a polyimide-system resin or urethane-system resin is used.
The liquid droplet-coating apparatus 120IT coats the red, green, and blue light-emitting layers with ITO (Indium Tin Oxide) on the upper side. As the ITO ink, a compound acquired by adding tin oxide (SnO2) of several % to indium oxide (In2O3) or the like is used. In addition, an amorphous material such as IDIXO (In2O3—ZnO) that can be used for manufacturing a transparent conductive film may be used. It is preferable that the transmittance of the transparent conductive film be equal to or higher than 90%.
The thermal treatment apparatus BK is arranged on the +X side (the downstream side in the substrate conveying direction) of each liquid droplet-coating apparatus 140. The thermal treatment apparatus BK, similarly to the thermal treatment apparatus BK used by the electrode-forming portion 92, for example, can emit a hot wind, far-infrared rays, or the like to the film substrate FB. The thermal treatment apparatus BK dries or bakes liquid droplets with which the film substrate FB is coated so as to be hardened by using the radiated heat.
The alignment section 107 includes a plurality of alignment cameras CA (CA1 to CA8) disposed in the X direction. The alignment camera CA may be configured to perform imaging by using CCDs or CMOSs under the illumination of visible light and detect the position of an alignment mark AM by processing the captured image or may emit laser light to the alignment mark AM and detect the position of the alignment marks AM by receiving the scattering light.
The alignment camera CA1 is arranged on the +X side of the thermal transfer roller 115. The alignment camera CA1 detects the position of the alignment mark AM formed by the thermal transfer roller 115 on the film substrate FB. The alignment cameras CA2 to CA8 are arranged on the +X side of the thermal treatment apparatus BK. The alignment cameras CA2 to CA8 detect the position of the alignment mark AM of the film substrate FB that has passed through the thermal treatment apparatus BK.
There is a case where the film substrate FB expands or contracts in the X axis direction and the Y axis direction by passing through the thermal transfer roller 115 and the thermal treatment apparatus BK. By arranging the alignment camera CA on the +X side of the thermal transfer roller 115 that performs a thermal treatment as above or the +X side of the thermal treatment apparatus BK, the positional deviation of the film substrate FB due to thermal deformation or the like can be detected.
The detection results acquired by the alignment cameras CA1 to CA8 are configured to be transmitted to the control section 104. For example, the control section 104 is configured to perform adjustment of the coating position and the coating timing of ink for the liquid droplet-coating apparatus 120 and the liquid droplet-coating apparatus 140, adjustment of the supply speed of the film substrate FB from the substrate-supplying unit 101 or the conveying speed of the roller RR, adjustment of the movement according to the roller RR in the Y direction, and adjustment of the cutting position, the cutting timing, and the like of the cutting apparatus 130 based on the detection results of the alignment cameras CA1 to CA8.
The leader member-attaching apparatus 300, for example, is an apparatus that cuts the film F of the film substrate FB and attaches the leader member LDR to the cut portion. Inside the substrate-processing unit 102, one or a plurality of leader member attaching apparatuses 300 is disposed. In this embodiment, a total of two leader member attaching apparatuses 300 are disposed, including one disposed between the partition wall-forming portion 91 and the electrode-forming portion 92 and one disposed between the electrode-forming portion 92 and the light-emitting layer-forming portion 93.
The leader member-attaching apparatus 300, for example, includes a cutting unit that cuts a film F, a position reference-forming unit that forms a film-side position reference portion Fd on the film F, a position-aligning unit which performs position alignment with the position reference portion of the leader member LDR and the film-side position reference portion Fd of the film F, and the like.
The information-detecting apparatus 400, for example, is an apparatus that detects information maintained in the information-maintaining section 204 of the leader member LDR. The information detected by the information-detecting apparatus 400, for example, is supplied to the control section 104. The information-detecting apparatus 400, for example, is disposed on the upstream side of the partition wall-forming portion 91 of the substrate-processing unit 102. By arranging the information-detecting apparatus 400 on the upstream side of the partition wall-forming portion 91, before the partition wall-forming process that is the substantially first process of the substrate-processing unit 102 to the film substrate FB, the information of the film substrate FB is supplied to the substrate-processing unit 102 (or the control section 104). Since the substrate-processing unit 102 can perform each process such as the partition wall-forming process based on the information, an optimal process according to the information on the film substrate FB is performed. Here, a position at which the information-detecting apparatus 400 is arranged is not limited to the upstream side of the partition wall-forming portion 91 but may be any position within the substrate-processing unit 102 as long it is a position at which the information maintained in the information-maintaining section 204 can be read out. In a case where the information maintained in the information-maintaining section 204 is used for the process inside the substrate-processing unit 102, it is preferable that the information-detecting apparatus 400 be disposed further on the upstream side than the substrate-processing unit 102. In addition, in this embodiment, the reader member-attaching apparatus 300 may be arranged further on the upstream side than the partition wall-forming portion 91 and may be an apparatus that attaches the leader member LDR to a predetermined position of the film substrate FB.
In this embodiment, for example, in a case where a one-dimensional barcode is formed as the information-maintaining section 204, a one-dimensional barcode-reading apparatus is used as the information-detecting apparatus 400. In addition, in a case where a two-dimensional barcode is formed as the information-maintaining section 204, a two-dimensional barcode-reading apparatus is used as the information-detecting apparatus 400. Similarly, in a case where an IC tag or a pattern of memory elements is formed as the information-maintaining section 204, an apparatus that can read out information maintained therein is used as the information-detecting apparatus 400. It is apparent that an apparatus having a function of being able to read out a plurality of types of information including at least a part of the types described above may be used as the information-detecting apparatus 400.
(Manufacturing Operation of Film Substrate)
Next, the process of manufacturing the above-described film substrate FB will be described.
First, as illustrated in
Next, as illustrated in
Next, as illustrated in
Next, as illustrated in
In a position-aligning process, by using the film-side position reference portions Fd disposed on the film F and the position reference portions 202 disposed in the leader member LDR, a position of the film F in the vertical direction in the figure and a position of the film F in the horizontal direction in the figure are detected (position-detecting process), and the attached position of the leader member LDR is adjusted based on the detected position. In the position-detecting process, for example, by using the alignment cameras CA300 and CA301, the film-side position reference portions Fd and the position reference portions 202 are detected. For example, before the position-aligning process, the position reference portions 202 are formed in the leader member LDR.
In a connection process, for example, as illustrated in
In this embodiment, since the film F is aligned with the leader member LDR, an area (an element-forming area 60 to be described later) of the film F in which the organic EL element 50 is formed is indirectly aligned with the leader member LDR. In this embodiment, since the leader member LDR is conveyed by the conveying unit 105 with high precision, the element-forming area 60 of the film F is aligned by the leader member LDR with high precision.
(Operation of Housing Film Substrate in Substrate Cartridge)
Next, a housing operation for housing the film substrate FB in the substrate cartridge 1 configured as described above will be described.
As illustrated in
The film substrate FB inserted through the opening portion 34 is guided to the substrate-conveying portion 21 by the substrate-guiding portion 22. In the substrate-conveying portion 21, the film substrate FB is conveyed to the housing portion 20 side while being inserted between the tension roller 21a and the measurement roller 21b. The film substrate FB passing through the substrate-conveying portion 21 on the housing portion 20 side is guided while being bent in the −Z direction according to its weight. In this embodiment, since the guide portion 27 is disposed on the −Z side of the film substrate FB, the film substrate FB is guided to the roller portion 26 along the rotation member 27a and the tip end member 27b of the guide portion 27.
When the tip end of the film substrate FB arrives at the cylindrical portion 26c of the roller portion 26, the claw member 28a protruding from the cylindrical portion 26c is inserted into the inside of the opening portion 203 disposed in the leader member LDR of the film substrate FB. Since each portion of the roller portion 26 is integrally rotated in this state, the film FB is wound around the cylindrical portion 26c in a state in which the claw member 28a is engaged with the opening portion 203 of the leader member LDR.
After the film substrate FB is wound around the roller portion 26, for example, by one revolution, as illustrated in
In addition, the film substrate FB is slowly wound around the cylindrical portion 26c, and the claw member 28a is pressed to the rotation shaft member 26a side by the wound film substrate FB. Depending on this pressing force, the pressing member 28b is elastically transformed, whereby the claw member 28a is housed in the concave portion 26e. After the film substrate FB is wound, the film substrate FB is conveyed while adjusting, for example, the rotation speed of the tension roller 21a and the rotation speed of the rotation shaft member 26a such that the film substrate FB is not bent between the roller portion 26 and the substrate-conveying portion 21. After a predetermined length of the film substrate FB is wound up, for example, an outer portion of the opening portion 34 of the film substrate FB is cut off. As above, the film substrate FB is housed in the substrate cartridge 1.
(Operation of Substrate-Processing Apparatus)
Next, the operation of the substrate-processing apparatus 100 configured as described above will be described.
In this embodiment, a connection operation of connecting the substrate cartridge 1 housing the film substrate FB as the substrate-supplying unit 101 to the supply-side connection portion 102A, a film substrate FB-supplying operation performed through the substrate cartridge 1 by using the substrate-supplying unit 101, an element-forming operation by using the substrate-processing unit 102, and an operation of detaching the substrate cartridge 1 are sequentially performed.
First, a connection operation of the substrate cartridge 1 will be described.
As illustrated in
In the connection operation, position alignment with the mounting unit 3 and the supply-side connection portion 102A is performed in the state in which the substrate cartridge 1 is held by the holder (for example, the same configuration as that of the holder HD illustrated in
Next, the supply operation will be described. In order to supply the film substrate FB to the substrate-processing unit 102, for example, the rotation shaft member 26a (the roller portion 26) of the substrate cartridge 1 and the tension roller 21a are rotated in a direction opposite to that at the time of the housing operation. As illustrated in
Next, the element-forming operation will be described. In the element-forming operation, elements are formed on the film substrate FB by the substrate-processing unit 102 while the film substrate FB is supplied from the substrate-supplying unit 101 to the substrate-processing unit 102. In the substrate-processing unit 102, the film substrate FB is conveyed by the roller RR.
In the substrate-processing unit 102, first, information maintained in the information-maintaining section 204 of the leader member LDR is detected by the information-detecting apparatus 400. The control section 104, for example, acquires information transmitted from the information-detecting apparatus 400 and controls the operation of the substrate-processing unit 102, which is performed thereafter, based on the process information. In addition, the control section 104 detects whether or not the roller RR is deviated in the Y axis direction and corrects the position by moving the roller RR in a case where there is a deviation. Furthermore, the control section 104 additionally performs the correction of the position of the film substrate FB.
The film substrate FB supplied from the substrate-supplying unit 101 to the substrate-processing unit 102, first, is conveyed to the partition wall-forming portion 91. In the partition wall-forming portion 91, the film substrate FB is pressed while being interposed between the imprint roller 110 and the thermal transfer roller 115, and partition walls BA and alignment marks AM are formed on the sheet substrate through heat transfer.
As illustrated in
In addition, for easy peel-off of the film substrate FB after pressing of the imprint mold 11 for the film substrate FB, it is preferable that the cross-sectional shapes of the gate-forming area 52 and the source-drain-forming area 53 be in the shape of “V” or “U” in the cross-sectional view. As another shape, for example, the cross-sectional shapes thereof may be a rectangle in the cross-sectional view.
As illustrated in
In
Subsequently, the film substrate FB is conveyed to the electrode-forming portion 92 by the conveying roller RR. In the electrode-forming portion 92, coating using liquid droplets is performed by each liquid droplet-coating apparatus 120, whereby electrodes are formed on the film substrate FB.
On the film substrate FB, first, the gate bus line GBL and the gate electrode G are formed by the liquid droplet-coating apparatus 120G.
As illustrated in
After the gate-forming area 52 is coated with metal ink, the film substrate FB is conveyed such that the portion coated with the metal ink is located on the −Z side of the thermal treatment apparatus BK. The thermal treatment apparatus BK performs a thermal treatment for the metal ink with which the film substrate FB is coated on the upper side, thereby drying the metal ink.
Next, the film substrate FB is conveyed to the −Z side of the liquid droplet-coating apparatus 120I. In the liquid droplet-coating apparatus 120I, the film substrate FB is coated with an electrically insulating ink. In the liquid droplet-coating apparatus 120I, for example, as illustrated in
After the coating is performed by using the electrically insulating ink, the film substrate FB is conveyed to the −Z side of the thermal treatment apparatus BK, and a thermal treatment is performed for the electrically insulating ink by the heat treatment apparatus BK. In accordance with the thermal treatment, the electrically insulating ink is dried, whereby the gate-insulating layer I is formed. In
After the gate-insulating layer I is formed, the film substrate FB is conveyed to the −Z side of the liquid droplet-coating apparatus 120SD. In the liquid droplet-coating apparatus 120SD, the source-drain-forming area 53 of the film substrate FB is coated with metal ink. To a portion of the source-drain-forming area 53 that exceeds the gate-insulating layer I, for example, metal ink is discharged, for example, in the order of 1 to 9 shown in
After the discharge of the metal ink, the film substrate FB is conveyed to the −Z side of the heat treatment apparatus BK, and a drying process for the metal ink is performed. After the drying process is performed, conductive bodies contained in the metal ink are laminated in a thin film state, whereby the source bus line SBL, the source electrode S, the drain electrode D, and the anode P are formed. In this step, a state is formed in which the source electrode S and the drain electrode D are connected to each other.
Next, the film substrate FB is conveyed to the −Z side of the cutting apparatus 130. The film substrate FB is cut by the cutting apparatus 130 between the source electrode S and the drain electrode D.
After cutting between the source electrode S and the drain electrode D is performed, the film substrate FB is conveyed to the −Z side of the liquid droplet-coating apparatus 120OS. An organic semiconductor layer OS is formed on the film substrate FB by the liquid droplet-coating apparatus 120OS. Organic semiconductor ink is discharged to an area located on the film substrate FB that overlaps the gate electrode G over the source electrode S and the drain electrode D.
After the discharge of the organic semiconductor ink, the film substrate FB is conveyed to the −Z side of the thermal treatment apparatus BK, and a drying process is performed for the organic semiconductor ink. After the drying process, a semiconductor contained in the organic semiconductor ink is laminated in a thin film state, and, as illustrated in
Subsequently, the film substrate FB is conveyed to the light-emitting layer-forming portion 93 by the conveying roller RR (see
After the formation of the light-emitting layers IR, an insulating layer I is formed in the film substrate FB through the liquid droplet-coating apparatus 140I and the thermal treatment apparatus BK, and a transparent electrode ITO is formed through the liquid droplet-coating apparatus 140IT and the thermal treatment apparatus BK. Through such a process, the organic EL element 50 illustrated in
In the element-forming operation, in the process of forming the organic EL element 50 while conveying the film substrate FB as above, in order to prevent the occurrence of deviations of the film substrate FB in the X direction, the Y direction, and the θZ direction, an alignment operation is performed. Hereinafter, the alignment operation will be described with reference to
In the alignment operation, a plurality of alignment cameras CA (CA1 to CA8) disposed in each portion appropriately detects the alignment marks AM formed on the film substrate FB and transmits the detection results to the control section 104. The control section 104 performs the alignment operation based on the transmitted detection results.
For example, the control section 104 detects the transfer speed of the film substrate FB based on the imaging intervals of the alignment marks AM detected by the alignment cameras CA (CA1 to CA8) and the like and determines whether the roller RR is rotated, for example, at a predetermined speed. In a case where it is determined that the roller RR does not rotate at the predetermined speed, the control section 104 applies feedback by issuing an instruction for adjustment of the rotation speed of the roller RR.
In addition, for example, the control section 104 detects whether or not there is a positional deviation of the alignments AM in the Y axis direction based on the imaging results of the alignment marks AM and detects whether or not there is the positional deviation of the film substrate FB in the Y axis direction. In a case where the positional deviation is detected, the control section 104 detects whether or not the positional deviation is continued for some degree of time in the state in which the film substrate FB is conveyed.
When a case where the time during which the positional deviation occurred was a short time, it is corresponded by changing a nozzle 122, which performs coating of liquid droplets, out of a plurality of nozzles 122 of the liquid droplet-coating apparatus 120. In a case where the deviation of the film substrate FB in the Y axis direction is continued for a long time, the position of the film substrate FB in the Y axis direction is corrected by moving the roller RR.
In addition, for example, the control section 104 detects whether or not there is a deviation of the film substrate FB in the θZ direction based on the positions of the alignment marks AM, which are detected by the alignment cameras CA, in the X axis and Y axis directions. In a case where a positional deviation is detected, the control section 104, similarly to a case where a positional deviation in the Y axis direction is detected, detects how long the positional deviation has continued in the state in which the film substrate FB is conveyed.
When a case where the time during which the positional deviation occurred was a short time, it is corresponded by changing a nozzle 122, which performs coating of liquid droplets, out of a plurality of nozzles 122 of the liquid droplet-coating apparatus 120. In a case where the deviation is continued for a long time, the position of the film substrate FB in the θZ direction is corrected by moving two rollers RR, which are disposed at positions with the alignment camera CA that has detected the deviation interposed therebetween, in the X direction or the Y direction.
Next, the detachment operation will be described. For example, after the organic EL element 50 is formed on the film substrate FB, and the film substrate FB is recovered, the substrate cartridge 1 used as the substrate-supplying unit 101 is detached from the substrate-processing unit 102.
In the detachment operation, the mounting unit 3 is moved in the −X direction so as to be excluded from the supply-side connection portion 102A. The mounting unit 3 is excluded.
As above, since the leader member LDR according to this embodiment includes the connection portion (stair portion 201) that is connected to the film F having flexibility and the position reference portions 202 used for position alignment at least with the film F and the connection portion (stair portion 201), the leader member LDR can be connected to a desired position of the film F with high precision.
In addition, since the film substrate FB according to this embodiment has flexibility and includes the film F conveyed in a predetermined direction and the leader member LDR according to this embodiment that is connected to the end portion of the film F, the end portion of the film F is precisely protected. Accordingly, the deformation of the film F such as bending or distortion, which is generated due to the conveyance of the film substrate FB, can be decreased.
In addition, since the substrate cartridge 1 according to this embodiment includes the cartridge main body 2 that houses the film substrate FB, the film substrate FB can be housed in a state in which bending, distortion, or the like hardly occurs. Furthermore, since the substrate cartridge 1 according to this embodiment includes the cartridge main body 2 that houses the film substrate FB, the housed film can be sent out in a state in which bending, distortion, or the like hardly occurs.
Furthermore, the substrate-processing apparatus 100 according to this embodiment includes the substrate-processing unit 102 that processes the film substrate FB, the substrate-supplying unit 101 that carries in the substrate-processing unit 102, and the substrate-recovering unit 103 that carries out the film substrate FB from the substrate-processing unit 102, and the substrate cartridge 1 according to this embodiment is used as at least one of the substrate-supplying unit 101 and the substrate-recovering unit 103, whereby the film substrate FB that is supplied in the state in which bending, distortion, or the like hardly occurs can be processed, and the film substrate after processing can be housed.
In addition, the leader-connecting method according to this embodiment is a leader-connecting method for connecting the leader member LDR to the film F having flexibility and includes position alignment with the film F and the leader member LDR and connecting the film F and the leader member LDR after the position alignment with the film F and the leader member LDR, whereby the leader member LDR can be connected to a desired position of the film F with high precision.
The technical scope of the present invention is not limited to the above-described embodiments, and appropriates change may be made thereto in the range not departing from the concept of the present invention.
In the above-described embodiment, regarding the size of the leader member LDR, for example, the size of the leader member LDR in the X direction can be set to be longer than the gap between rollers RR that are adjacent in the conveying direction (X direction) out of the rollers RR disposed in the substrate-processing unit 102. Accordingly, the leader member LDR is conveyed in the state of being supported by at least two or more rollers RR, whereby the leader member LDR can be conveyed more reliably.
In particular, as illustrated in
In addition, as illustrated in
In addition, for example, in a case where the size L3 of the leader member LDR in the X direction is smaller than the gap L1 between the entrance-side roller RR and the exit-side roller RR in each processing portion such as the partition wall-forming portion 91 or the electrode-forming portion 92 of the substrate-processing unit 102, as illustrated in
In addition, as illustrated in
Furthermore, as illustrated in
The Bernoulli pad 504, for example, includes a Bernoulli mechanism that generates negative pressure in accordance with the movement of the film substrate FB, and makes the film substrate FB to approach the Bernoulli pad 504 side. Since the negative pressure generating face of the Bernoulli pad 504 is disposed along the moving direction of the film substrate FB, the film substrate FB is prevented from being wound into the thermal transfer roller 115.
For example, the cover member 505 is disposed so as to vacate an area brought into contact with the fine imprint mold 111 out of the thermal transfer roller 115 and cover both end portions of the film substrate FB in the X direction. Accordingly, the film substrate FB is moved along the outer face of the thermal transfer roller 115.
In addition, for example, although in the above-described embodiment, a configuration has been described in which the substrate is conveyed in the state in which tension is applied to the film substrate FB inside the substrate-processing unit 102, the present invention is not limited thereto, and, for example, as illustrated in
In the bank portion 510, first, as illustrated in
In addition, in the above-described embodiment, although a configuration has been described as an example, in which a mark or the like is formed as the position reference portion 202 of the leader member LDR, the present invention is not limited thereto. For example, as illustrated in
In the example illustrated in
In a case where the position alignment is performed by using the notched portions 520 and 530, first, the leader member LDR is arranged such that the notched portions 520 and 530 and the film F partially overlap each other. Thereon, for example, for the sides 520a and 530a, distances ΔX1 and ΔX2 that are distances from the corner side Fa of the film F are acquired. In addition, for the side 520b of the leader member LDR located on the −Y side and the side 530b thereof located on the +Y side, distances ΔY1 and ΔY2 that are distances from the side Fg of the film F, which is located on the −Y side, and the side Fh, which is located on the +Y side, are respectively acquired. Thereafter, for example, the attachment position of the leader member LDR is adjusted such that ΔX1=ΔX2 and ΔY1=ΔY2. According to this configuration, position alignment can be performed without forming any additional mark on the film F side.
| Number | Date | Country | Kind |
|---|---|---|---|
| P2009-263752 | Nov 2009 | JP | national |
This is a Continuation Application of International Application No. PCT/JP2010/070544, filed Nov. 18, 2010, which claims priority to Japanese Patent Application No. 2009-263752, filed on Nov. 19, 2009. The contents of the aforementioned applications are incorporated herein by reference.
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| Number | Date | Country | |
|---|---|---|---|
| 20120231694 A1 | Sep 2012 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/JP2010/070544 | Nov 2010 | US |
| Child | 13475368 | US |
