Claims
- 1. Improved leadframe for packages of integrated power device, comprising a monolithic body including a generally rectangular perimetric frame, a plurality of leads, a dissipator and at least one interconnection line supported by said frame, a plurality of leads mutually connected and supported by means of said at least one interconnection line, said dissipator extending in a depressed plane with respect to said frame and being connected to said frame and to said leads in at least three mutually spaced and non-aligned points, said frame being connected to said dissipator by means of s-like shape fingers which extend in three dimensions.
- 2. Leadframe according to claim 1, wherein said dissipator is connected to said frame in two points and is connected at a further point to a central lead of said plurality of leads.
- 3. Leadframe according to claim 2, wherein said frame has one side connected to the ends of at least some of said leads and the opposite side connected to said dissipator in said two points.
- 4. Leadframe according to claim 3, wherein said dissipator is substantially shaped like a T which has a transverse portion which extends substantially parallel to said opposite side of the frame and a stem which extends from said transverse portion toward said leads, said plurality of leads having free ends arranged in a U-like shape around said stem of said dissipator, said connections extending from the corners of said transverse portion which face said opposite side of said frame.
- 5. Leadframe according to claim 4, wherein said fingers extend in a direction which is substantially perpendicular to said opposite side of said frame, define a curve of approximately 180° and continue with step-like connections which are connected to said corners of the transverse portion.
- 6. Leadframe according to claim 4, wherein said stem of the dissipator is connected to said central lead by means of a step-like connection.
- 7. Package for integrated power devices, comprising a plastic case in which a chip of semiconductor material is embedded, a dissipator for supporting a chip and a plurality of leads which protrude partially from said plastic case, wherein said dissipator is integral with at least one of said leads and is connected thereto by means of a step-like connection, said dissipator being surrounded by said plastic case so that its face which supports said chip is completely covered by said plastic case and its opposite outer face extends flush with one of the larger surfaces of said plastic case, said dissipator having portions in the shape of a three-dimensional S which extend inside said plastic case and end at an intermediate portion of a lateral surface of said plastic case which is opposite to said leads.
- 8. Package according to claim 7, wherein said dissipator is shaped like a T having a transverse portion which extends parallel to said lateral surface of said plastic case and a stem portion which extends from said transverse portion toward said leads.
- 9. A leadframe for an integrated circuit package, comprising:a monolithic body including a generally rectangular perimetric frame and at least one interconnection line supported thereby; a plurality of leads supported by said at least one interconnection line; a dissipator extending in a depressed plane with respect to said frame; and at least one connection finger that connects said dissipator to said frame, said at least one connection finger being curved in each of at least two orthogonal planes.
- 10. The leadframe of claim 9, wherein said at least one connection finger includes at least two connection fingers.
- 11. The leadframe of claim 10, wherein said at least two connection fingers are constructed and arranged so that pressure exerted on the frame is transmitted to said dissipator.
- 12. The leadframe of claim 10, wherein said perimetric frame includes four sides, and wherein said at least two connection fingers include two connection fingers that are each connected to a first side of said frame.
- 13. The leadframe of claim 12, wherein said first side extends substantially parallel to said interconnection line.
- 14. The leadframe of claim 13, further comprising a connection tab that connects said dissipator to said frame.
- 15. The leadframe of claim 14, wherein said connection tab is integrally connected to one of said plurality of leads.
- 16. The leadframe of claim 15, wherein the connection tab is curved in only a single plane.
- 17. The leadframe of claim 10, further comprising a connection tab that connects said dissipator to said frame; and whereinsaid connection tab and said at least two connection fingers are constructed and arranged so that pressure exerted on the frame is transmitted to said dissipator.
- 18. A package for an integrated circuit, comprising:a plastic case for embedding a chip of semiconductor material; a plurality of leads extending from said plastic case; and a dissipator for supporting the chip, the dissipator being integrally connected to at least one of said leads, said dissipator having at least one connection finger that extends inside said plastic case and ends at a lateral surface of said plastic case, said at least one connection finger being curved in each of at least two orthogonal planes.
- 19. The package of claim 18, wherein said at least one connection finger includes at least two connection fingers.
- 20. The package of claim 19, further comprising a connection tab that integrally connects said dissipator to said at least one of said leads.
- 21. The package of claim 20, wherein the connection tab is curved in only a single plane.
- 22. The package of claim 21, wherein said dissipator is surrounded by said plastic case so that its face which supports said chip is completely covered by said plastic case and its opposite outer face extends flush with a surface of said plastic case and wherein said opposite outer face is uncovered by said plastic case.
- 23. The package of claim 18, wherein said dissipator is surrounded by said plastic case so that its face which supports said chip is completely covered by said plastic case and its opposite outer face extends flush with a surface of said plastic case and wherein said opposite outer face is uncovered by said plastic case.
- 24. An integrated circuit, comprising:a dissipator having first and second faces; a chip of semiconductor material supported on said first face of said dissipator; a plurality of leads, each coupled to said chip, wherein at least one of said plurality of leads is integral with said dissipator and formed from a same piece of material; and a plastic case that completely encases said chip and completely covers said first face of said dissipator, said plurality of leads extending from said plastic case.
- 25. The integrated circuit of claim 24, wherein said second face of said dissipator is not encased by said plastic case.
- 26. The package of claim 18, wherein said dissipator and the at least one of said leads integrally connected to the dissipator are formed from a same piece of material.
- 27. The package of claim 18, wherein the plastic case includes a plurality of lateral sides, and each of the plurality of leads extends from a same lateral side of the plastic case.
- 28. The package of claim 22, wherein said dissipator and the at least one of said leads integrally connected to the dissipator are formed from a same piece of material.
- 29. The package of claim 28, wherein the plastic case includes a plurality of lateral sides, and each of said plurality of leads extends from a first lateral side of the plastic case.
- 30. The package of claim 29, wherein each of the at least two connection fingers ends flush with a lateral side of the plastic case other than the first lateral side of the plastic case.
- 31. The package of claim 18, wherein the plastic case includes a plurality of lateral sides, and the at least one connection finger ends flush with a first lateral side of the plastic case.
- 32. The package of claim 31, wherein each of said plurality of leads extends from a second lateral side of the plastic case.
- 33. The integrated circuit of claim 24, wherein the plastic case includes a plurality of lateral sides, and each of said plurality of leads extends from a first lateral side of the plastic case.
- 34. The integrated circuit of claim 33, further comprising at least one connection finger that is formed from said same piece of material and is integral with said dissipator.
- 35. The integrated circuit of claim 34, wherein said at least one connection finger is curved.
- 36. The integrated circuit of claim 35, wherein said at least one connection finger ends flush at a second lateral side of said plastic case.
- 37. The integrated circuit of claim 35, wherein said at least one connection finger is curved in each of at least two orthogonal planes.
- 38. The integrated circuit of claim 24, wherein the plastic case is a continuous, integral component.
- 39. The package of claim 18, wherein the at least one connection finger is exposed at the lateral surface of said plastic case.
Priority Claims (1)
Number |
Date |
Country |
Kind |
19445 A/90 |
Feb 1990 |
IT |
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Parent Case Info
This application is a continuation of application Ser. No. 08/228,649, filed Apr. 18, 1994, now abandoned, which is a reissue of Ser. No. 07/656,386.
US Referenced Citations (9)
Foreign Referenced Citations (2)
Number |
Date |
Country |
0124678 |
Sep 1979 |
JP |
0053752 |
Mar 1986 |
JP |
Non-Patent Literature Citations (2)
Entry |
Hitachi Power Mosfet Data Book, Aug., 1995, #D11, p. 201, 2SK511, Silicon N-Channel MOS FET. |
International Rectifier, Product Digest, Short Form Catalog 90, HEXFET Power MOSFETs Case Outlines, pp. 1 and 140, 1990. |
Divisions (1)
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Number |
Date |
Country |
Parent |
07/656386 |
Feb 1991 |
US |
Child |
08/674661 |
|
US |
Continuations (1)
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Number |
Date |
Country |
Parent |
08/228649 |
Apr 1994 |
US |
Child |
07/656386 |
|
US |
Reissues (1)
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Number |
Date |
Country |
Parent |
07/656386 |
Feb 1991 |
US |
Child |
08/674661 |
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US |