1. Field
The present disclosure relates generally to liquid-filled light emitting diode (LED) bulbs, and more specifically to an LED bulb with a chassis configured to provide passive convective liquid cooling of LEDs.
2. Description of Related Art
Traditionally, lighting has been generated using fluorescent and incandescent light bulbs. While both types of light bulbs have been reliably used, each suffers from certain drawbacks. For instance, incandescent bulbs tend to be inefficient, using only 2-3% of their power to produce light, while the remaining 97-98% of their power is lost as heat. Fluorescent bulbs, while more efficient than incandescent bulbs, do not produce the same warm light as that generated by incandescent bulbs. Additionally, there are health and environmental concerns regarding the mercury contained in fluorescent bulbs.
Thus, an alternative light source is desired. One such alternative is a bulb utilizing an LED. An LED comprises a semiconductor junction that emits light due to an electrical current flowing through the junction. Compared to a traditional incandescent bulb, an LED bulb is capable of producing more light using the same amount of power. Additionally, the operational life of an LED bulb is orders of magnitude longer than that of an incandescent bulb, for example, 10,000-100,000 hours as opposed to 1,000-2,000 hours.
While there are many advantages to using an LED bulb rather than an incandescent or fluorescent bulb, LEDs have a number of drawbacks that have prevented them from being as widely adopted as incandescent and fluorescent replacements. One drawback is that an LED, being a semiconductor, generally cannot be allowed to get hotter than approximately 120° C. As an example, A-type LED bulbs have been limited to very low power (i.e., less than approximately 8 W), producing insufficient illumination for incandescent or fluorescent replacements.
One potential solution to this problem is to use a large metallic heat sink attached to the LEDs and extending away from the bulb. However, this solution is undesirable because of the common perception that customers will not use a bulb that is shaped radically different from the traditionally shaped A-type form factor bulb. Additionally, the heat sink may make it difficult for the LED bulb to fit into preexisting fixtures.
In one exemplary embodiment, a light emitting diode (LED) bulb includes a base, a shell connected to the base forming an enclosed volume, a chassis disposed within the shell, and a plurality of LEDs disposed with the shell. The LED bulb also includes a thermally conductive liquid disposed within the enclosed volume. The LEDs and the chassis are immersed in the thermally conductive liquid. The chassis has a first opening and a second opening. The second opening is spaced from the first opening to facilitate a passive convective flow of the thermally conductive liquid to exchange a first volume of the thermally conductive liquid interior the chassis with a second volume of the thermally conductive liquid exterior the chassis.
The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.
The following description is presented to enable a person of ordinary skill in the art to make and use the various embodiments. Descriptions of specific devices, techniques, and applications are provided only as examples. Various modifications to the examples described herein will be readily apparent to those of ordinary skill in the art, and the general principles defined herein may be applied to other examples and applications without departing from the spirit and scope of the various embodiments. Thus, the various embodiments are not intended to be limited to the examples described herein and shown, but are to be accorded the scope consistent with the claims.
Various embodiments are described below, relating to LED bulbs. As used herein, an “LED bulb” refers to any light-generating device (e.g., a lamp) in which at least one LED is used to generate the light. Thus, as used herein, an “LED bulb” does not include a light-generating device in which a filament is used to generate the light, such as a conventional incandescent light bulb.
As used herein, the term “liquid” refers to a substance capable of flowing. Also, the substance used as the thermally conductive liquid is a liquid or at the liquid state within, at least, the operating ambient temperature range of the bulb. An exemplary temperature range includes temperatures between −40° C. to +40° C. Also, as used herein, “passive convective flow” refers to the circulation of a liquid without the aid of a fan or other mechanical devices driving the flow of the thermally conductive liquid.
Shell 101 may be made from any transparent or translucent material such as plastic, glass, polycarbonate, or the like. Shell 101 may include dispersion material spread throughout the shell to disperse light. The dispersion material prevents LED bulb 100 from appearing to have one or more point sources of light.
Base 110 of LED bulb 100 includes a connector base 115 for connecting the bulb to a lighting fixture. In the present embodiment, connector base 115 has threads for insertion into a conventional light socket in the U.S. It should be appreciated, however, that connector base 115 may be any type of connector, such as a screw-in base, a dual-prong connector, a standard two- or three-prong wall outlet plug, bayonet base, Edison Screw base, single pin base, multiple pin base, recessed base, flanged base, grooved base, side base, or the like.
A thermally conductive liquid 111 is disposed within the enclosed volume formed by shell 101 and base 110. Thermally conductive liquid 111 may be any thermally conductive liquid, mineral oil, silicone oil, glycols (PAGs), fluorocarbons, or other material capable of flowing. It may be desirable to have the liquid chosen be a non-corrosive dielectric. Selecting such a liquid can reduce the likelihood that the liquid will cause electrical shorts and reduce damage done to the components of LED bulb 100.
In the present exemplary embodiment, LED bulb 100 includes a liquid-volume compensator mechanism to facilitate thermal expansion of thermally conductive liquid 111 contained in the LED bulb 100. In the exemplary embodiment depicted in
LED bulb 100 includes LEDs 103 disposed within shell 101 and immersed in thermally conductive liquid 111. LED bulb 100 also includes a chassis 117, which is also disposed within shell 101 and immersed in thermally conductive liquid 111. Chassis 117 may be formed from a thermally conductive material, such as aluminum, copper, brass, magnesium, zinc, or the like. As will be described in more detail below, chassis 117 has a first opening 118 and a second opening 119, which is spaced from first opening 118, to facilitate a passive convective flow of thermally conductive liquid 111 to transfer heat generated by LEDs 103 to shell 101.
With reference to
Support structure 107 is preferably formed from a composite laminate material. Support structure 107 may comprise a thermally conductive material (e.g., aluminum, copper, brass, magnesium, zinc, or the like) to act as a heat sink and conduct heat energy away from LEDs 103. In the present embodiment, each LED 103 mounted on support structure 107 may be angled such that the plurality of LEDs 103 emits light that projects radially outward from the center of shell 101 to emulate the isotropic emission of point light source. It should be recognized, however, that LEDs 103 need not be angled. Also, LEDs 103 can be mounted directly to chassis 117 rather than to support structure 107.
As depicted in
With reference to
With reference to
As mentioned above and depicted in
Chassis 117 separates the warmer volume of thermally conductive liquid within chassis 117 (volume 111B) from the cooler volume of thermally conductive liquid exterior the chassis 117 (volume 111A). This separation causes a thermal gradient that, when combined with openings 118 and 119, facilities the liquid to flow and intermix the cooler to the warmer regions of LED bulb 100. For example, since the volume of thermally conductive liquid within chassis 117 (volume 111B) heats faster than the surrounding liquid, an upward flow of thermally conductive liquid is generated within chassis 117. The warmer liquid rises through opening 118 passing from the interior to the exterior of chassis 117.
Once heated, the thermally conductive liquid reaches the top portion of shell 101. Heat is conductively transferred to shell 101, causing the volume of thermally conductive liquid exterior the chassis 117 (volume 111A) to cool. As the liquid cools, its density increases, thereby causing the liquid to fall. In one example, as illustrated by
Once reaching the bottom of shell 101, the volume of thermally conductive liquid exterior the chassis 117 (volume 111A) flows inwards through opening 119 and rises within chassis 117 as heat generated by LEDs 103 warms the liquid. The heated volume of thermally conductive liquid within chassis 117 (volume 111B) is again guided within the chassis 117 as described above. The described convective cycle continuously repeats during operation of LED bulb 100 to cool LEDs 103. It should be appreciated that the convective flow described above represents the general flow of liquid within shell 101. One of ordinary skill in the art will recognize that some of the thermally conductive liquid may not reach the top and bottom of shell 101 before being cooled or heated sufficiently to cause the liquid to fall or rise. It should also be recognized that the convective flow created by chassis 117 can supplement the convective flow created by mounts 202 and channels 204 (
Once the heated, thermally conductive liquid reaches the top (previously side) portion of shell 101, heat is conductively transferred to shell 101, causing the volume of thermally conductive liquid exterior the chassis 117 (volume 111A) to cool. As the volume of thermally conductive liquid exterior the chassis 117 (volume 111A) cools, its density increases, thereby causing the liquid to fall. In one example, as illustrated by
As illustrated by the front view of
Once reaching the bottom of shell 101, the thermally conductive liquid flows through opening 119, situated towards the bottom, and rises within chassis 117 as heat generated by LEDs 103 warms the liquid. The heated volume of thermally conductive liquid within chassis 117 (volume 111B) is again guided through the chassis as described above. The described convective cycle continuously repeats during operation of LED bulb 100 to cool LEDs 103. It should be appreciated that the convective flow described above represents the general flow of liquid within shell 101. One of ordinary skill in the art will recognize that some of the thermally conductive liquid may not reach the top and bottom of shell 101 before being cooled or heated sufficiently to cause the liquid to fall or rise. It should also be recognized that the convective flow created by chassis 117 can supplement the convective flow created by mounts 202 and channels 204 (
Once the heated, thermally conductive liquid reaches the top (previously bottom) portion of shell 101, heat is conductively transferred to shell 101, causing a volume of thermally conductive liquid exterior the chassis 117 (volume 111A) to cool. As the thermally conductive liquid cools, its density increases, thereby causing the cooler liquid to fall. Since the heated, thermally conductive liquid is forced up and outwards in an upside-down vertical orientation, the cooled, thermally conductive liquid falls down the sides of shell 101. This allows the volume of thermally conductive liquid exterior the chassis 117 (volume 111A) to remain in contact with shell 101 for a greater period of time, allowing more heat to be conductively transferred to shell 101. In addition, since the downward flow of thermally conductive liquid is concentrated along the surface of shell 101, the shear force between the upward flowing liquid at the center of LED bulb 100 and the downward flowing liquid along the surface of shell 101 is reduced, thereby increasing the convective flow liquid within LED bulb 100.
Once reaching the bottom (previously top) of shell 101, the volume of thermally conductive liquid exterior the chassis 117 (volume 111A) may move through opening 118 and rise as heat generated by LEDs 103 warms the liquid. The described convective cycle continuously repeats during operation of LED bulb 100 to cool LEDs 103. It should be appreciated that the convective flow described above represents the general flow of liquid within shell 101. One of ordinary skill in the art will recognize that some of thermally conductive liquid may not reach the top and bottom of shell 101 before being cooled or heated sufficiently to cause the liquid to fall or rise. It should also be recognized that the convective flow created by chassis 117 can supplement the convective flow created by mounts 202 and channels 204 (
The following examples demonstrate heat distribution within a bulb around a chassis and how the addition of openings 118 and 119 facilitate an effective passive convection flow of the thermal conductive liquid that cools the LEDs. In each of the examples, body portion 117A and cap portion 117B are made of aluminum and form chassis 117. Shell 101 is made from transparent polycarbonate and encloses the silicone oil and the chassis. To account for thermal expansion of the silicone oil, a compressible bladder is added within the shell and chassis that expands and contracts accordingly. For simplicity, the temperature on the outside wall of shell 101 is maintained at 70 degrees Celsius and 6.2 Watts of heat is applied to the side of cap portion 117B.
The model extrudes in three dimensions using a field solver that discretizes mesh nodal points to resolve solutions for the heat equations for the polycarbonate shell, aluminum chassis, and the diaphragm, as well as the fluid flow heat transfer equations of the silicone oil. Further, each exemplar model orients the top portion of LED bulb 100 positioned upright and vertical in which shell 101 is disposed vertically above base 110.
A. Model with Opening 118
The inner chassis passive convective flow cycle has a large volume of heated silicon oil contained within cap portion 117B since the silicone oil is exposed to a large portion of the heated chassis with limited access to cooler silicone oil near the shell surface. As illustrated in
The outer chassis passive convective flow cycle has a large volume of colder silicon oil since the silicone oil is exposed to a large portion of the shell surface. Heated silicon oil exterior the chassis 117 (volume 111A) rises along the surface of cap portion 117B to the surface of shell 101 and remains in contact with shell 101 for a greater period of time, allowing more heat to be conductively transferred to shell 101. The silicone oil impinges on the outside surface of chassis 117, thereby providing significant cooling to the chassis as depicted in
It should be appreciated that the passive thermal convective flow cycles described above represent the general flow of liquid within shell 101. One of ordinary skill in the art will recognize that some of the silicone oil may not reach the top and bottom of shell 101 before being cooled or heated sufficiently to cause the silicon to fall or rise.
B. Model with Openings 119
This configuration impedes the exchange between the cooler volume of silicone oil exterior the chassis 117 (volume 111A) and the warmer volume of silicone oil within the chassis 117 (volume 111B). The exchange is limited to opening 119. Thus, as depicted in
The inner chassis passive convective flow cycle is driven by the interaction of the large volume of silicone oil within cap portion 117B and the coolness of the compressible bladder in the center of chassis 117, which creates a thermal gradient sufficient to cool some of the heated silicon oil within cap portion 117B. The cooler compressible bladder diaphragm causes the silicone oil to fall preferentially along the cooler region that is in close proximity to the compressible bladder. The silicone oil then heats and rises along the warmer chassis 117 toward cap portion 117B. Upon warming, some of the silicone oil may exchange through opening 119 and rise in close proximity to the exterior of the chassis. However, as shown in
The volume of silicone oil exterior the chassis 117 (volume 111A) exhibits a similar heating and cooling cycle where cap portion 117B heats the silicone oil and rises in close proximity to the surface of cap portion 117B. The silicone oil is brought into close proximity to the surface of shell 101, cools, and falls along the surface of shell 101. The falling silicone oil remains in contact with shell 101 for a large period of time, allowing more heat to be conductively transferred to shell 101. The colder silicone oil impinges on the outside surface of chassis 117, drastically cooling the chassis region below opening 119 as depicted in
C. Model with Openings 118 and 119
As illustrated in
Another minor passive thermal flow cycle example includes volume of silicone oil within the chassis 117 (volume 111B) that cools in proximity to the compressible bladder in the center of chassis 117. The cooler silicone oil falls and is directed in proximity to the compressible bladder towards base 110. The silicone oil then heats and rises along the warmer body portion 117A toward cap portion 117B and again cools in proximity to the compressible bladder where the cycle begins again. It should be recognized that the silicone oil in this minor cycle intermixes the main cycle described above when the oil is in close proximity to the chassis interior, thereby providing greater exchange between the cooler volume of silicone oil exterior the chassis 117 (volume 111A) and the warmer volume of silicone oil within the chassis 117 (volume 111B).
D. Model with Openings 118 and 119 Near Base
This configuration improves the model illustrated in
Although the invention has been described in conjunction with particular embodiments, it should be appreciated that various modifications and alterations may be made by those skilled in the art without departing from the spirit and scope of the invention. Embodiments may be combined and aspects described in connection with an embodiment may stand alone.