BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an LED chip package structure and a method for making the same, and particularly relates to an LED chip package structure with different LED spacings and a method for making the same.
2. Description of Related Art
FIG. 1 shows a flowchart of a method for making an LED chip package structure of the prior art. The known method includes: providing a plurality of packaged LEDs that have been packaged (S100); providing a strip substrate body that has a positive electrode trace and a negative electrode trace (S102); and then arranging each packaged LED on the strip substrate body in sequence and electrically connecting a positive electrode and a negative electrode of each packaged LED with the positive electrode trace and the negative electrode trace of the substrate body (S104).
However, with regard to the known first method, each packaged LED needs to be firstly cut from an entire LED package structure, and then each packaged LED is arranged on the strip substrate body via SMT process. Hence, the known first packaging process is time-consuming.
SUMMARY OF THE INVENTION
The present invention provides an LED chip package structure with different LED spacings and a method for making the same. The present invention provides a plurality of LED chips that are separated from each other by totally different spacings or partially different spacings according to user's requirement.
Moreover, because the LED chips are arranged on a substrate body via an adhesive or a hot pressing method, the process for the LED chip package structure is simple and less time is needed for the manufacturing process. Furthermore, the LED chip package structure can be applied to any type of light source such as a back light module, a decorative lamp, a lighting lamp, or a scanner.
A first aspect of the present invention is an LED chip package structure with different LED spacings, including: a substrate unit, a light-emitting unit, and a package colloid unit.
Furthermore, the light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit, and the LED chips are separated from each other by totally different spacings or partially different spacings. The package colloid unit covers the LED chips.
Moreover, the LED chip package structure of the present invention further includes seven embodiments, as follows:
First embodiment: The package colloid unit is a strip fluorescent colloid corresponding to the LED chips.
Second embodiment: The package colloid unit is a strip fluorescent colloid corresponding to the LED chips, and the strip fluorescent colloid has a colloid cambered surface formed on its top surface and a colloid light-exiting surface formed on its front surface. In addition, a frame unit covers the strip fluorescent colloid for exposing the lateral side of the strip fluorescent colloid only.
Third embodiment: The package colloid unit has a plurality of fluorescent colloids corresponding to the LED chips.
Fourth embodiment: The package colloid unit has a plurality of fluorescent colloids corresponding to the LED chips. A frame unit has a plurality of frame layers, and each frame layer is formed around the lateral side of each fluorescent colloid for exposing the top surface of each fluorescent colloid only.
Fifth embodiment: The package colloid unit has a plurality of fluorescent colloids corresponding to the LED chips. A frame unit is formed around the lateral sides of the fluorescent colloids for exposing the top surface of each fluorescent colloid only.
Sixth embodiment: The package colloid unit has a plurality of fluorescent colloids corresponding to the LED chips, and each fluorescent colloid has a colloid cambered surface formed on its top surface and a colloid light-exiting surface formed on its front surface. A frame unit has a plurality of frame layers respectively covering the fluorescent colloids for exposing the lateral sides of the fluorescent colloids only.
Seventh embodiment: The package colloid unit has a plurality of fluorescent colloids corresponding to the LED chips, and each fluorescent colloid has a colloid cambered surface formed on its top surface and a colloid light-exiting surface formed on its front surface. A frame unit covers the fluorescent colloids for exposing the lateral sides of the fluorescent colloids only.
A second aspect of the present invention is a method for making an LED chip package structure with different LED spacings, including: providing a substrate unit; electrically arranging a light-emitting unit on the substrate unit, and the light-emitting unit having a plurality of LED chips that are separated from each other by totally different spacings or partially different spacings; and covering the LED chips with a package colloid unit.
Moreover, the method of the present invention further includes seven embodiments, as follows:
First embodiment: The package colloid unit is a strip fluorescent colloid corresponding to the LED chips.
Second embodiment: The package colloid unit is a strip fluorescent colloid corresponding to the LED chips, and the strip fluorescent colloid has a colloid cambered surface formed on its top surface and a colloid light-exiting surface formed on its front surface. In addition, the method further includes: providing a frame unit that covers the strip fluorescent colloid for exposing the lateral side of the strip fluorescent colloid only.
Third embodiment: The package colloid unit has a plurality of fluorescent colloids corresponding to the LED chips.
Fourth embodiment: The package colloid unit has a plurality of fluorescent colloids corresponding to the LED chips. In addition, the method further includes: providing a frame unit that has a plurality of frame layers, and each frame layer is formed around the lateral side of each fluorescent colloid for exposing the top surface of each fluorescent colloid only.
Fifth embodiment: The package colloid unit has a plurality of fluorescent colloids corresponding to the LED chips. In addition, the method further includes: providing a frame unit that is formed around the lateral sides of the fluorescent colloids for exposing the top surface of each fluorescent colloid only.
Sixth embodiment: The package colloid unit has a plurality of fluorescent colloids corresponding to the LED chips, and each fluorescent colloid has a colloid cambered surface formed on its top surface and a colloid light-exiting surface formed on its front surface. In addition, the method further includes: providing a frame unit that has a plurality of frame layers respectively covering the fluorescent colloids for exposing the lateral sides of the fluorescent colloids only.
Seventh embodiment: The package colloid unit has a plurality of fluorescent colloids corresponding to the LED chips, and each fluorescent colloid has a colloid cambered surface formed on its top surface and a colloid light-exiting surface formed on its front surface. In addition, the method further includes: providing a frame unit that covers the fluorescent colloids for exposing the lateral sides of the fluorescent colloids only.
Furthermore, there are five different arrangements of LED chips, as follows:
First arrangement: The spacings between each two LED chips are from rarefaction to condensation.
Second arrangement: The spacings between each two LED chips are from condensation to rarefaction.
Third arrangement: The spacings between each two LED chips are from center rarefaction to outer condensation.
Fourth arrangement: The spacings between each two LED chips are from center condensation to outer rarefaction.
Fifth arrangement: The spacings between each two LED chips are alternate rarefaction and condensation.
Sixth arrangement: The spacings between each two LED chips are alternate condensation and rarefaction.
Therefore, because the LED chips are arranged on a substrate body via an adhesive or a hot pressing method, the process for the LED chip package structure is simple and less time is needed for the manufacturing process.
It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed. Other advantages and features of the invention will be apparent from the following description, drawings and claims.
BRIEF DESCRIPTION OF THE DRAWINGS
The various objects and advantages of the present invention will be more readily understood from the following detailed description when read in conjunction with the appended drawings, in which:
FIG. 1 is a flowchart of a method for making an LED chip package structure of the prior art;
FIG. 2A is a schematic view of a first arrangement of LED chips according to the present invention;
FIG. 2B is a schematic view of a second arrangement of LED chips according to the present invention;
FIG. 2C is a schematic view of a third arrangement of LED chips according to the present invention;
FIG. 2D is a schematic view of a fourth arrangement of LED chips according to the present invention;
FIG. 2E is a schematic view of a fifth arrangement of LED chips according to the present invention;
FIG. 2F is a schematic view of a sixth arrangement of LED chips according to the present invention;
FIG. 3 is a flowchart of a method of making an LED chip package structure with different LED spacings according to the first embodiment of present invention;
FIGS. 3A to 3C are schematic diagrams of an LED chip package structure with different LED spacings according to the first embodiment of the present invention, at different stages of the packaging processes, respectively;
FIG. 3D is a cross-sectional view along line 3D-3D in FIG. 3C;
FIG. 4 is a flowchart of a method of making an LED chip package structure with different LED spacings according to the second embodiment of present invention;
FIGS. 4A to 4B are schematic diagrams of an LED chip package structure with different LED spacings according to the second embodiment of the present invention, at different partial stages of the packaging processes, respectively;
FIG. 4C is a cross-sectional view along line 4C-4C in FIG. 4B;
FIG. 5 is a flowchart of a method of making an LED chip package structure with different LED spacings according to the third embodiment of present invention;
FIG. 5A is a schematic diagram of an LED chip package structure with different LED spacings according to the third embodiment of the present invention;
FIG. 5B is a cross-sectional view along line 5B-5B in FIG. 5A;
FIG. 6 is a flowchart of a method of making an LED chip package structure with different LED spacings according to the fourth embodiment of present invention;
FIGS. 6A to 6B are schematic diagrams of an LED chip package structure with different LED spacings according to the fourth embodiment of the present invention, at different partial stages of the packaging processes, respectively;
FIG. 6C is a cross-sectional view along line 6C-6C in FIG. 6B;
FIG. 7 is a flowchart of a method of making an LED chip package structure with different LED spacings according to the fifth embodiment of present invention;
FIGS. 7A to 7B are schematic diagrams of an LED chip package structure with different LED spacings according to the fifth embodiment of the present invention, at different partial stages of the packaging processes, respectively;
FIG. 7C is a cross-sectional view along line 7C-7C in FIG. 7B;
FIG. 8 is a flowchart of a method of making an LED chip package structure with different LED spacings according to the sixth embodiment of present invention;
FIGS. 8A to 8B are schematic diagrams of an LED chip package structure with different LED spacings according to the sixth embodiment of the present invention, at different partial stages of the packaging processes, respectively;
FIG. 8C is a cross-sectional view along line 8C-8C in FIG. 8B;
FIG. 9 is a flowchart of a method of making an LED chip package structure with different LED spacings according to the seventh embodiment of present invention;
FIGS. 9A to 9B are schematic diagrams of an LED chip package structure with different LED spacings according to the seventh embodiment of the present invention, at different partial stages of the packaging processes, respectively; and
FIG. 9C is a cross-sectional view along line 9C-9C in FIG. 9B.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
FIGS. 2A-2E show five schematic views of five different arrangements of LED chips according to the present invention, respectively.
Referring to FIG. 2A, there are many different spacings (a1, a2, a3, a4, a5, a6, a7, a8) between each two LED chips L1 are from rarefaction to condensation. Hence, the spacings (a1, a2, a3, a4, a5, a6, a7, a8) are from large to small such as a1>a2>a3>a4>a5>a6>a7>a8.
Referring to FIG. 2B, there are many different spacings (b1, b2, b3, b4, b5, b6, b7, b8) between each two LED chips L2 are from condensation to rarefaction. Hence, the spacings (b1, b2, b3, b4, b5, b6, b7, b8) are from small to large such as b1<b2<b3<b4<b5<b6<b7<b8.
Referring to FIG. 2C, there are many different spacings (c1, c2, c3, c4, c5, c6, c7, c8) between each two LED chips L3 are from center rarefaction to outer condensation. Hence, the spacings (c1, c2, c3, c4, c5, c6, c7, c8) are from center large to outer small such as c4=c5>c3=c6>c2=c7>c1=c8.
Referring to FIG. 2D, there are many different spacings (d1, d2, d3, d4, d5, d6, d7, d8) between each two LED chips L4 are from center condensation to outer rarefaction. Hence, the spacings (d1, d2, d3, d4, d5, d6, d7, d8) are from center small to outer large such as c4=c5<c3=c6<c2=c7<c1=c8.
Referring to FIG. 2E, there are many different spacings (e1, e2, e3, e4, e5, e6, e7, e8) between each two LED chips L5 are alternate rarefaction and condensation. Hence, the spacings (e1, e2, e3, e4, e5, e6, e7, e8) are alternate large and small such as e1=e3=e5=e7>e2=e4=e6=e8.
Referring to FIG. 2F, there are many different spacings (f1, f2, f3, f4, f5, f6, f7, f8) between each two LED chips L6 are alternate condensation and rarefaction. Hence, the spacings (f1, f2, f3, f4, f5, f6, f7, f8) are alternate small and large such as f1=f3=f5=f7<f2=f4=f6=f8.
Although above-mentioned LED chips are arranged by a COB (Chip On Board) process, it should not be used to limit the present invention. Any arrangement method is protected under the claims of the present invention, such as SMD (Surface Mounted Device).
Next, following LED chip package structure of the present invention has seven embodiments using the first arrangement of LED chips in FIG. 2A, as follow:
Referring to FIGS. 3, 3A to 3C and 3D, the first embodiment provides a method for making an LED chip package structure with different LED spacings, including as follows:
Step S200 is: referring to FIGS. 3 and 3A, providing a substrate unit 1 that has a substrate body 10, and a positive electrode trace 11 and a negative electrode trace 12 respectively formed on the substrate body 10.
Moreover, the substrate unit 1 can be a PCB (Printed Circuit Board), a flexible substrate, an aluminum substrate, a ceramic substrate, or a copper substrate according to user's requirement. In addition, the substrate body 10 has a metal layer 10A and a bakelite layer 10B formed on the metal layer 10A. Both the positive electrode trace 11 and the negative electrode trace 12 can be aluminum circuits or silver circuits.
Step S202 is: referring to FIGS. 3 and 3B, electrically arranging a light-emitting unit 2 on the substrate body 10, and the light-emitting unit 2 having a plurality of LED chips 20 that are separated from each other by totally different spacings or partially different spacings. Furthermore, each LED chip 20 has a positive electrode 201 and a negative electrode 202 respectively and electrically connected with the positive electrode trace 11 and the negative electrode trace 12 of the substrate unit 1.
Step S204 is: referring to FIGS. 3, 3C and 3D, covering the LED chips 20 with a package colloid unit 4a. In addition, the package colloid unit 4a is a strip fluorescent colloid corresponding to the LED chips 20. The strip fluorescent colloid is formed by mixing silicon and fluorescent powders or mixing epoxy and fluorescent powders.
Referring to FIGS. 4, 4A to 4B and 4C, the steps from S300 to S302 of the second embodiment are same as the steps from S200 to S202 of the first embodiment. In other words, the illustration of S300 is the same as FIG. 3A of the first embodiment, and the illustration of S302 is the same as FIG. 3B of the first embodiment.
Step S304 is: referring to FIGS. 4 and 4A, after the step of S302, the method of the second embodiment further includes: covering the LED chips 20 with package colloid unit 4b, and package colloid 4b having a colloid cambered surface 40b formed on its top surface and a colloid light-exiting surface 41b formed on its front surface. In addition, the package colloid unit 4b is a strip fluorescent colloid corresponding to the LED chips 20. Therefore, the strip fluorescent colloid has the colloid cambered surface 40b formed on its top surface and the colloid light-exiting surface 41b formed on its front surface.
Step S306 is: referring to FIGS. 4, 4B and 4C, covering the package colloid unit 4b (the strip fluorescent colloid) with a frame unit 5b for exposing the lateral side (the colloid light-exiting surface 41b) of the package colloid unit 4b (the strip fluorescent colloid) only. In addition, the frame unit 5b can be an opaque frame layer.
Referring to FIGS. 5 and 5A to 5B, the steps from S400 to S402 of the third embodiment are same as the steps from S200 to S202 of the first embodiment. In other words, the illustration of S400 is the same as FIG. 3A of the first embodiment, and the illustration of S402 is the same as FIG. 3B of the first embodiment. In addition, referring to FIGS. 5A and 5B, after the step of S402, the method of the third embodiment further includes: covering the LED chips 20 with a plurality of fluorescent colloids 40c (S404). The fluorescent colloids 40c are combined to form a package colloid unit 4c, and each fluorescent colloid 40c is formed by mixing silicon and fluorescent powders or mixing epoxy and fluorescent powders.
Referring to FIGS. 6, 6A to 6B and 6C, the steps from S500 to S502 of the fourth embodiment are same as the steps from S200 to S202 of the first embodiment. In other words, the illustration of S500 is the same as FIG. 3A of the first embodiment, and the illustration of S502 is the same as FIG. 3B of the first embodiment.
Moreover, referring to FIGS. 6, 6A and 6B, after the step of S502, the method of the fourth embodiment further includes: covering the LED chips 20 with a plurality of fluorescent colloids 40d (S504), and then providing a frame unit 5d that has a plurality of frame layers 50d, and each frame layer 50d being formed around the lateral side of each fluorescent colloid 40d for exposing the top surface of each fluorescent colloid 40d only (S506). In addition, the fluorescent colloids 40d are combined to form a package colloid unit 4d, and the frame layers 50d are a plurality of opaque frame layers.
Referring to FIGS. 7, 7A to 7B and 7C, the steps from S600 to S602 of the fifth embodiment are same as the steps from S200 to S202 of the first embodiment. In other words, the illustration of S600 is the same as FIG. 3A of the first embodiment, and the illustration of S602 is the same as FIG. 3B of the first embodiment.
Moreover, referring to FIGS. 7, 7A and 7B, after the step of S602, the method of the fifth embodiment further includes: covering the LED chips 20 with a plurality of fluorescent colloids 40e (S604), and then forming a frame unit 5e around the lateral sides of the fluorescent colloids 40e for exposing the top surface of each fluorescent colloid 40e only. In addition, the fluorescent colloids 40e are combined to form a package colloid unit 4e, and the frame unit 5e is an opaque frame layer.
Referring to FIGS. 8, 8A to 8B and 8C, the steps from S700 to S702 of the sixth embodiment are same as the steps from S200 to S202 of the first embodiment. In other words, the illustration of S700 is the same as FIG. 3A of the first embodiment, and the illustration of S702 is the same as FIG. 3B of the first embodiment.
Moreover, referring to FIGS. 8 and 8A, after the step of S702, the method of the sixth embodiment further includes: covering the LED chips 20 with a plurality of fluorescent colloids 40f, each fluorescent colloid 40f having a colloid cambered surface 400f formed on its top surface and a colloid light-exiting surface 401f formed on its front surface (S704). In addition, the fluorescent colloids 40f are combined to form a package colloid unit 4f.
Referring to FIGS. 8, 8B and 8C, after the step of S704, the method of the sixth embodiment further includes: providing a frame unit 5f that has a plurality of frame layers 50f respectively covering the fluorescent colloids 40f for exposing the lateral sides of the fluorescent colloids 40f only (S706). In addition, the frame layers 50f are a plurality of opaque frame layers.
Referring to FIGS. 9, 9A to 9B and 9C, the steps from S800 to S802 of the seventh embodiment are same as the steps from S200 to S202 of the first embodiment. In other words, the illustration of S800 is the same as FIG. 3A of the first embodiment, and the illustration of S802 is the same as FIG. 3B of the first embodiment.
Moreover, referring to FIGS. 9 and 9A, after the step of S802, the method of the seventh embodiment further includes: covering the LED chips 20 with a plurality of fluorescent colloids 40g, each fluorescent colloid 40g having a colloid cambered surface 400g formed on its top surface and a colloid light-exiting surface 401g formed on its front surface (S804). In addition, the fluorescent colloids 40g are combined to form a package colloid unit 4g.
Referring to FIGS. 9, 9B and 9C, after the step of S804, the method of the seventh embodiment further includes: covering the fluorescent colloids 40g with a frame unit 5g for exposing the lateral sides of the fluorescent colloids 40g only (S806). In addition, the frame unit 5g is an opaque frame layer.
In conclusion, the present invention provides a plurality of LED chips that are separated from each other by totally different spacings or partially different spacings according to user's requirement.
Moreover, because the LED chips are arranged on a substrate body via an adhesive or a hot pressing method, the process for the LED chip package structure is simple and less time is needed for the manufacturing process. Furthermore, the LED chip package structure can be applied to any type of light source such as a back light module, a decorative lamp, a lighting lamp, or a scanner.
Although the present invention has been described with reference to the preferred best molds thereof, it will be understood that the invention is not limited to the details thereof. Various substitutions and modifications have been suggested in the foregoing description, and others will occur to those of ordinary skill in the art. Therefore, all such substitutions and modifications are intended to be embraced within the scope of the invention as defined in the appended claims.
Patent Grant
8138508
