The present invention is directed to electronic components, and more particularly to a universal holder assembly for light emitting diodes (LEDs).
The use of high intensity LEDs for general-purpose illumination, and in specialty lighting applications such as architectural and video display applications, has increased in recent years. Typically, manufacturers of LED lighting assemblies design assemblies that are customized for the specific LED devices that are used in the illuminated displays. The electrical interconnections and thermal characteristics of the assemblies are often treated as secondary issues, and dealt with separately from the mechanical and esthetic aspects of the lighting fixture. This frequently results in thermal and interconnection problems with the LED assembly packaging. The heat accumulation may damage the LEDs themselves, resulting in shorter useful life of the LEDs, or cause damage to the light fixture housings such as warping and discoloration.
What is needed is a standard holder for high-intensity LEDs that integrates electrical and thermal connections in a single receptacle. Other features and advantages will be made apparent from the present specification. The teachings disclosed extend to those embodiments that fall within the scope of the claims, regardless of whether they accomplish one or more of the aforementioned needs
In one aspect, the present invention is directed to a universal mounting assembly. The mounting assembly supports high intensity LEDs in a lighting fixture. The mounting assembly includes a holder portion and a receptacle portion. The holder portion includes a peripheral sidewall defining a cavity for accepting a printed circuit board assembly. A support member is disposed along the peripheral sidewall to support the printed circuit board assembly. A plurality of electrical contact elements are provided for connecting LEDs mounted on the printed circuit board. A thermal conduction member is configured to thermally communicate with the printed circuit board assembly. The receptacle portion is configured to removably engage the holder portion. The receptacle portion has a plurality of contact sockets configured to conductively engage the plurality of electrical contact elements of the holder portion, to interconnect the plurality of contact elements to external wires of the light fixture. An aperture is arranged in the receptacle portion to accept the thermal conduction member; wherein the thermal conduction member passes through the aperture and into a space for dissipating heat from the printed circuit board.
In another embodiment, the present invention is directed to a universal mounting assembly for supporting high intensity LEDs in a lighting fixture. The mounting assembly has a holder portion with a peripheral sidewall defining a cavity for accepting a printed circuit board assembly. At least one support member is disposed along the peripheral sidewall to support the printed circuit board assembly containing LEDs. A plurality of electrical contact elements is provided within the holder portion to connect to external wires of the light fixture. A thermal conduction member is in thermal communication with the printed circuit board assembly. An aperture in the holder portion is arranged to accept the thermal conduction member. The thermal conduction member passes through the aperture and into a space for dissipating heat from the printed circuit board.
In another embodiment, the present invention is directed to a mounting assembly for supporting at least one high intensity LED in a lighting fixture. The mounting assembly has a first portion and a second portion. The first portion includes a frame portion and a plurality of integral electrical conductors. The integral electrical conductors are arranged about a perimeter of the frame for connection to corresponding electrical contact pads disposed on a PCB. At least one high intensity LED is mounted on the PCB. The second portion is retentively engageable in thermal contact with the first portion. The second portion extends axially from the first portion for dissipation of heat from the PCB disposed within the first portion. The second portion has a cavity to connect it to the first portion, and has at least one base portion of the second portion to support the first portion within the cavity.
Other features and advantages of the present invention will be apparent from the following more detailed description of the preferred embodiment, taken in conjunction with the accompanying drawings which illustrate, by way of example, the principles of the invention.
Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts.
The present invention is a universal LED connector assembly that accepts a conventional LED printed circuit board (PCB) containing at least one high intensity LED. The PCB can be of conventional construction, or may include thermally conductive cladding such as aluminum. Each LED circuit board represents a component or pixel of a larger image or light source. The LED connector assembly is designed to be independent of the actual LED device that is used. The LED PCBs are for use in various architectural and general-purpose lighting fixtures, signs and video displays, traffic signals and various other applications using high intensity LEDs. The lighting fixture typically provides a housing or structure that supports the LED light source. The structure provides power connections to the LED light source, and provides openings through which the light shines when the light source (or sources) is energized. When used herein, the word lighting fixture is meant to include all general and specific-application LED devices that employ high intensity LEDs, and not limited to lighting fixtures for building illumination. Examples of lighting fixtures include track mounted spotlights utilizing incandescent bulbs, and walkway lights using incandescent or halogen bulbs.
Referring to
A heat sink 18 is supported within the holder portion 12 by an internal support ring 42, and is retained in position by a circular locking clip 30 or other similar spacer. The heat sink 18 contacts the bottom side of the LED PCB assembly 16 and extends downward below the bottom edge 32 of the holder portion 12. The heat sink 18 extends into and through the connector portion 14 when the holder portion 12 is engaged, and provides a thermal path for dissipating heat generated by the LED PCB assembly 16. The heat sink may be constructed of any suitable thermal conductor. By way of example and not by limitation, the heat sink material may be copper, aluminum or die-cast zinc. In an alternate embodiment, the heat sink 18 may also be a heat pipe. In the drawings the heat sink 18 is shown as a generally circular cylinder with a flat circular head portion 58, however, the shape may vary depending on the application to provide additional exposed surface for heat dissipation. For example, the heat sink 18 may include heat fins, fluting, or other shapes for increased heat dissipation, as will be readily appreciated by those persons skilled in the art. Thermally conductive grease or thermally conductive pad may be applied to the flange or head portion 58 to promote the transfer of heat from the LED PCB 16.
The LED PCB assembly 16 preferably snaps into position in the holder portion 12 and is retained by angled tips 60 of contact fingers 34 connected to contact pins 22. The contact fingers 34 and contact pins 22 provide electrically conductive paths to lead wires 36a-36d, through contact sockets 24. A spring 38 applies compressive force between the heat sink 18 and the bottom of LED PCB assembly 16, while simultaneously applying a normal force to the contact fingers 34. A washer 40 rests on the locking clip 30 and retains the spring 38 in position between washer 40 and LED PCB assembly 16.
Referring to
In another embodiment shown in
The connector portion 14 may optionally be eliminated within the scope of the invention. Referring again to
Referring next to
Referring next to
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed as the best mode contemplated for carrying out this invention, but that the invention will include all embodiments falling within the scope of the appended claims.
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