Patent Application
20160056350
The subject matter herein generally relates to light emitting diode (LED) encapsulation structures and in particular to surface-mount device (SMD) LED encapsulation structures.
LEDs are extensively applied to illumination devices due to high brightness, low working voltage, low power consumption, compatibility with integrated circuitry, simple driving operation, long life and other factors.
Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.
Several definitions that apply throughout this disclosure will now be presented.
The term “coupled” is defined as connected, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections. The connection can be such that the objects are permanently connected or releasably connected. The term “outside” refers to a region that is beyond the outermost confines of a physical object. The term “substantially” is defined to be essentially conforming to the particular dimension, shape, or other feature that the term modifies, such that the component need not be exact. For example, “substantially cylindrical” means that the object resembles a cylinder, but can have one or more deviations from a true cylinder. The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series and the like.
A light emitting diode (LED) encapsulation structure can include a reflective cup, a positive electrode plate positioned on the reflective cup, and a negative electrode plate positioned on the reflective cup and spaced from the positive electrode plate. The reflective cup can have a light emitting surface, a bottom surface opposite to the light emitting surface, two parallel first sides interconnecting with the light emitting surface and the bottom surface, and two parallel second sides interconnecting with the light emitting surface, the bottom surface and two the first sides. The positive electrode plate can include a first weld positioned on one first side, a second weld positioned on the bottom surface, and a first bent portion interconnecting with the first weld and the second weld. The negative electrode plate can include a third weld positioned on the same first side as the first weld and spaced from the first weld, a fourth weld positioned on the bottom surface and spaced from the second weld, and a second bent portion interconnecting with the third weld and the fourth weld.
The reflective cup 10 can be substantially rectangular. The reflective cup 10 can include a light emitting surface 11, a bottom surface 13 opposite to the light emitting surface 11, two parallel first sides 15 configured to interconnect with the light emitting surface 11 and the bottom surface 13, and two parallel second sides 16 configured to interconnect with the light emitting surface 11, the bottom surface 13, and two first sides 15. The reflective cup 10 can have a reflective inner surface (not shown) which is configured to reflect light emitted from the LED chip to the light emitting surface 11. Each first side 15 can include two parallel first edges 12, and two parallel second edges 14 configured to interconnect with the two first edges 12. Each second side 16 can have a third edge 17 vertical to the first edge 12 and the second edge 14. Two parallel first edges 12 and two parallel third edges 17 can be coupled to each other in an order to form the light emitting surface 11. The second edges 14 and the third edges 17 can have a same length, thus the second sides 16 can be square in shape. The reflective cup 10 can encapsulate the LED chip, and the light emitted from the LED chip can emit outside of the reflective cup 10 via the light emitting surface 11.
The positive electrode plate 30 can be positioned on the reflective cup 10 and electrically coupled to the LED chip. The positive electrode plate 30 can be substantially L-shaped, and include a first weld 32, a first bent portion 34, and a second weld 36. The first weld 32 can be substantially a rectangular plate, positioned on one first side 15, and electrically coupled to the LED chip. The second weld 34 can be substantially a rectangular plate, and positioned on the bottom surface 13. The bent portion 34 can be electrically coupled to the first weld 32 and the second weld 36. In at least one embodiment, the first weld 32, the second weld 36, and the first bent portion 34 can be integrated, for example, the positive electrode plate 30 can be made of a flexible flat electrode which can be bent to an L-shaped plate.
The structure of the negative electrode plate 50 can be substantially the same as that of the positive electrode plate 30. The negative electrode plate 50 can be positioned on the reflective cup 10, electrically coupled to the LED chip, and spaced a predetermined distance from the positive electrode plate 30. The negative electrode plate 50 can be insulated from the positive electrode plate 30.
The negative electrode plate 50 can be substantially L-shaped, and include a third weld 52, a second bent portion 54, and a fourth weld 56. The third weld 52 can be substantially a rectangular plate, positioned on one first side 15, and electrically coupled to the LED chip. The third weld 52 and the first weld 32 can be positioned on the same side 15, and spaced away from each other. The fourth weld 54 can be substantially a rectangular plate, positioned on the bottom surface 15, and spaced away from the second weld 36. The bent portion 54 can be electrically coupled to the third weld 52 and the fourth weld 56. In at least one embodiment, the third weld 52, the fourth weld 56, and the second bent portion 54 can be integrated, for example, the negative electrode plate 50 can be made of a flexible flat electrode which can be bent to an L-shaped plate.
A width of the first weld 32 along the second edge 14, the width of the second weld 36 along the third edge 17, the width of the third weld 52 along the second edge 14, and the width of the fourth weld 56 along the third edge 14, can be equal to each other. In at least one embodiment, the first weld 32, the second weld 36, the third weld 52, and the fourth weld 56 can have a different width from each other, so long as the first weld 32 and the third weld 52 are spaced and positioned on one first side 15, the second weld 36 and the fourth weld 56 are spaced and positioned on the bottom surface 13.
While the present disclosure has been described with reference to particular embodiments, the description is illustrative of the disclosure and is not to be construed as limiting the disclosure. Therefore, those of ordinary skill in the art can make various modifications to the embodiments without departing from the scope of the disclosure, as defined by the appended claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 103128565 | Aug 2014 | TW | national |
