1. Technical Field
The present disclosure relates to light emitting diode (LED) illuminating devices and, particularly, to an LED illuminating device with heat dissipation module.
2. Description of Related Art
Compared to traditional light sources, LEDs have advantages, such as high luminous efficiency, low power consumption, and long service life. To dissipate heat from LED lamps, a type of heat sink called “sunflower heat sink” is often used in LED lamps having a plurality of LEDs. The sunflower heat sink has a post-shaped conductive member and a plurality of fins extending outward and radially from a circumferential surface of the conductive member. One problem with this type of LED illuminating device is its large size and heavy weight. In addition, dust tends to cumulate in the spaces between the fins, which affects heat dissipation.
Therefore, there is room for improvement in the art.
Many aspects of the embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views, and all the views are schematic.
Embodiments of the present disclosure are now described in detail, with reference to the accompanying drawings.
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The base 20 is shaped like a hollow cone and consists of two half cone-like hollow housings joined together. The base 20 includes a first end 21 and a second end 22 whose diameter is smaller than the diameter of the first end 21. A recess 23 is defined in the top surface of the first end 21 for receiving the LED substrate 40. The LED substrate 40 is fixed in the recess 23 with screws 42. The base 20 is made of metal with good heat conductivity, such as copper or aluminum. In another embodiment, the base plate 20 can be made of ceramic. A heat-conductive medium (not shown) is arranged between the LED substrate 40 and the top surface of the first end 21, for transferring the heat generated by the LEDs 41 from the LED substrate 40 to the base 20. In the embodiment, the heat-conductive medium can be a graphite sheet, heat-conductive glue or heat-conductive ceramic. The connector 30 is connected with the second end 22.
The bulb 10 is fixed on the first end 21 of the base 20. The light beams emitting from the LEDs 41 pass through the bulb 10 and spread out. The bulb 10 can be made of transparent or translucent material mixed with light diffusion particles to improve the light scattering effect of the light. In another embodiment, a scatter layer or a film of scatter material can be arranged on the surface of the bulb 10 to scatter the light beams emitting from the LEDs 41, thus achieving a homogeneous illuminating effect.
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It is to be understood, however, that even though numerous characteristics and advantages of the present disclosure have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the present disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the present disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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201010609080.2 | Dec 2010 | CN | national |