This application is related to a co-pending U.S. patent application entitled “LED ILLUMINATION DEVICE” (Ser. No. 12/486,722) and filed in the same day as the instant application. The co-pending U.S. patent application is assigned to the same assignee as the instant application. The disclosure of the above-identified application is incorporated herein by reference.
1. Technical Field
The present disclosure relates to light emitting diode (LED) illuminating devices, and particularly to an LED illuminating device with high heat dissipating efficiency.
2. Description of Related Art
In recent years, LEDs are preferred for use in illuminating devices rather than CCFLs (cold cathode fluorescent lamps) and other traditional lamps due to LEDs excellent properties, including high brightness, long lifespan, wide color range, and etc.
For an LED, about eighty percents of the power consumed thereby is converted into heat. Generally, an LED illuminating device includes a plurality of LEDs arranged on a substrate to obtain a desired brightness and illumination area. However, the plurality of LEDs generate a large amount of heat during operation which endangers the normal operation of the LEDs of the LED illuminating device. A highly efficient heat dissipation device is necessary in order to timely and adequately remove the heat generated by the LED illuminating device. Otherwise, the brightness, lifespan, and reliability of the LED illuminating device will be seriously affected.
For the foregoing reasons, therefore, there is a need in the art for an LED illuminating device which overcomes the limitations described.
Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
Referring to
The heat sink 21 includes an elongated metal base 211 and a plurality of spaced metal fins 212 integrally extending from the base 211. The base 211 is substantially rectangular, and has a top surface 210 and an opposite bottom surface 213. The fins 212 extend vertically and upwardly from the top surface 210 of the base 211 and have a uniform height.
The heat sink 21 is provided with a receiving space 214 at a top side thereof. The receiving space 214 is located adjacent to a left end of the heat sink 21, and formed by cutting out the fins 212 and a portion of the base 211 of the left end of the heat sink 21. Alternatively, the receiving space 214 can be provided at other positions of the top side of the heat sink 21, such as at a center position of the top side of the heat sink 21. Still alternatively, the receiving space 214 can be integrally formed during the formation of the heat sink 21 by aluminum extrusion, wherein the fins 212 are formed to have an original length the same as that shown in
The light-emitting module 10 includes a light source 11 provided with a plurality of LEDs 122, and an elongated light penetrable tube 131. The light source 11 is thermally attached to the bottom surface 213 of the base 211 of the heat sink 21. The bottom surface 213 of the base 211 functions as a heat-absorbing surface for the light source 11, and the top surface 210 of the base 211 functions as a heat-spreading surface for the light source 11.
The light source 11 includes a light bar 12. Referring to
When the light bar 12 is mounted to the bottom surface 213 of the base 211, a layer of thermal interface material (TIM) may be applied between the substrate 121 and the bottom surface 213 to eliminate an air interstice therebetween, to thereby enhance a heat conduction efficiency between the light bar 12 and the base 211. Alternatively, the substrate 121 of the light bar 12 can be attached to the bottom surface 213 of the base 211 fixedly and intimately through surface mount technology (SMT). Still alternatively, the substrate 121 can be omitted and the circuits of the substrate 121 are integrally formed on the heat sink 21, whereby an interface between the substrate 121 and the base 211 of the heat sink 21 can be eliminated and a thermal resistance between the LEDs 122 and the base 211 is reduced.
The light penetrable tube 131 is a hollow cylinder. The heat sink 21 and the light bar 12 of the light source 11 are received in the light penetrable tube 131. Two opposite supporting members 1313 are formed on an inner surface of the light penetrable tube 131 and extend along an axial direction of the light penetrable tube 131. The two opposite supporting members 1313 are located at a lower portion of the light penetrable tube 131 and spaced from each other. Two lateral sides of the substrate 121 of the light bar 12 are located under the two supporting members 1313, respectively. Each lateral side of the substrate 121 is sandwiched between a bottom surface of a corresponding supporting member 1313 and the inner surface of the light penetrable tube 131. The base 211 of the heat sink 21 is sandwiched between the two supporting members 1313, with two lateral sides of the base 211 contacting with the two supporting members 1313, respectively. The heat sink 21 and an upper portion of the light penetrable tube 131 cooperatively define a heat dissipation chamber 1314 therebetween. The fins 212 of heat sink 21 are accommodated in the heat dissipation chamber 1314.
The light penetrable tube 131 defines a plurality of air exchanging holes 1311 through the upper portion thereof and located above the heat sink 21. The air exchanging holes 1311 communicate the outer environment with the heat dissipation chamber 1314. The air exchanging holes 1311 include a plurality of first through holes 1315 located at a topmost portion of the light penetrable tube 131 and evenly spaced from each other along the axial direction of the light penetrable tube 131, and a plurality of second through holes 1316 located at two lateral sides of the first through holes 1315. The second through holes 1316 are lower than the first through holes 1315 and evenly spaced from each other along the axial direction of the light penetrable tube 131.
A plurality of light guiding protrusions 132 are formed on the inner surface of the lower portion of the light penetrable tube 131 under the light bar 12 of the light source 11 and extend along the axial direction of the light penetrable tube 131. The light guiding protrusions 132 are arranged closely to each other along a circumferential direction of the light penetrable tube 131. Light emitted by the LEDs 122 of the light source 11 is evenly diffused to the outer environment by the light guiding protrusions 132 of the light penetrable tube 131, to thereby expand the illumination area of the LED illuminating device 100 and reduce glare from the LED illuminating device 100.
The electrical module 30, which provides drive power, control circuit and power management for the light source 11, includes a circuit board 31, two end covers 33 (i.e., left end cover and right end cover), and two pairs of pins 333. The two end covers 33 are arranged at two opposite ends of the light penetrable tube 131. Each end cover 33 is connected with one pair of the pins 333. Referring to
The circuit board 31 is accommodated in the receiving space 214 of the heat sink 21 and fixed to the base 211 of the heat sink 21 via a plurality of mounting poles 312.
In assembly of the LED illuminating device 100, the circuit board 31 is accommodated in the receiving space 214 of the heat sink 21. The light bar 12 of the light source 11 is securely and thermally attached to the bottom surface 213 of the base 211, with a peripheral edge of the light bar 12 extending outwardly beyond a peripheral edge of the heat sink 21. The heat sink 21 and the light source 11 are cooperatively inserted in and mounted to the light penetrable tube 113. The circuit board 31 is electrically connected to the electrodes 123 of the light bar 12 and inner ends of the pins 333 of the left end cover 33 via a plurality of wires 311. The connecting section 332 of the left end cover 33 is inserted inwardly into a left end of the light penetrable tube 131 till the projecting ring 331 abutting the left end of the light penetrable tube 131. At the same time, two opposite lateral sides of a left end of the substrate 121 are inserted in the positioning grooves 334 of the left end cover 33, and the projecting beads 336 of the connecting section 332 of the left end cover 33 are received in the engaging holes 336 of the left end of the light penetrable tube 131. The right end cover 33 is mounted to a right end of the light penetrable tube 131 in a manner similar to that of the left end cover 33 mounted to the left end of the light penetrable tube 131.
During operation, the circuit board 31 is electrically connected to the light source 11 and the pairs of the pins 333 of the left end cover 33, whereby an external power source can supply electric current to the LEDs 122 through the pairs of the pins 333 and the circuit board 31 to cause the LEDs 122 to emit light. The light of the LEDs 122 travels through the lower portion of the light penetrable tube 131 to an outside for lighting.
A large amount of heat is generated by the LEDs 122 during the operation of the LED illuminating device 100. As the light bar 12 of the light source 11 is thermally attached to the heat sink 21, the heat generated by the LEDs 122 can be conducted to the heat sink 21 for dissipation. Air in the heat dissipation chamber 1314 is heated by heat transferred to the base 211 and the fins 212 of the heat sink 21, and then flows upwardly. The heated, upwardly flowing air escapes to ambient atmosphere particularly via the first through holes 1315 of the air exchanging holes 1311. Cooling air in the ambient atmosphere enters into the heat dissipation chamber 1314 particularly via the second through holes 1316 of the air exchanging holes 1311 and via air venting holes 335 of the two end covers 33, whereby a natural air convection is circulated through the heat dissipation chamber 1314 for continuously dissipating the heat generated by the LEDs 122 and the circuit board 31. Thus, the LEDs 122 can be kept working at a lower temperature, and the brightness, lifespan, and reliability of the LED illuminating device 100 will be improved.
Referring to
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It is to be understood, however, that even though numerous characteristics and advantages of the disclosure have been set forth in the foregoing description, together with details of the structure and function of the disclosure, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
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Number | Date | Country | |
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