The present invention relates to an LED illumination apparatus provided with a heat sink and a cooling fan.
Various types of illumination apparatuses using an LED element with high efficiency and long life have been put into practical use. However, in the illumination apparatus using the LED element, when the temperature inside the main body case of the illumination apparatus rises due to heat generated from the LED element, light emitting efficiency of the LED is deteriorated to reduce light output of the illumination apparatus, and the lifetime of the LED element is shortened.
In order to cope with these problems, the LED apparatuses generally adopt a configuration in which cooling is performed with a plurality of fins provided on the back side of a substrate mounting the LED element thereon (see, for example, Patent Document 1). Further, there are known LED illumination apparatuses that perform cooling using a fan device (see, for example, Patent Document 2).
[Patent Document 1] Japanese Patent Application Publication No. 2007-042755
[Patent Document 2] Japanese Patent Application Publication No. 2011-165351
Among such various illumination apparatuses using the LED element, there are known downsized LED illumination apparatuses that are used by being attached to a wearing article such as glasses or a headband or clothing. When such an illumination apparatus is attached to a person's head, the face direction coincides with the light irradiation direction, so that illumination along the visual line direction is possible. Thus, illumination apparatuses of such a type are optimal for use in locally illuminating the hands of a worker, etc.
However, in the downsized LED illumination apparatus, a heat radiation amount is small since the entire surface area is small. Thus, even though the plurality of fins formed on the back side of the substrate mounted with the LED element are fitted to a groove part formed in the casing of the illumination apparatus so as to increase a contact area between the substrate and the casing as in the LED illumination apparatus of Patent Document 1, high heat radiation effect cannot be obtained since the sizes of the substrate and casing are limited.
Further, when the fan is used to form an air flow path in an illumination part to introduce air from outside to the LED element, as in the LED illumination apparatus of Patent Document 2, airtightness in the illumination part is degraded, which may result in reduction in illuminance due to dust and moisture entering the casing.
The present invention has been made in view of the above points, and the object thereof is to provide an LED illumination apparatus capable of efficiently cooling the LED element using a cooling fan while maintaining airtightness inside the illumination part.
To solve the above problems, an LED illumination apparatus according to the present invention includes: an LED substrate on which an LED package is mounted; a base having a concave part for housing the LED substrate; a heat sink; a cooling fan; and a casing housing the LED substrate, base, heat sink, and cooling fan. The heat sink is constituted of a rectangular flat plate which is thermally connected to a surface of the base opposite to the surface in which the concave part is formed and a plurality of rib-shaped first heat radiation fins which are disposed on a heat radiation surface of the flat plate opposite to the surface thereof thermally connected to the base such that both ends of each thereof protrude outward from a pair of opposing sides of the flat plate. The base is formed into a shape from which the part of each first heat radiation fin that protrudes from the flat plate is exposed in a state where the first heat radiation fins are disposed on the heat radiation surface. The cooling fan takes in air from a surface of the casing on the side that the LED package emits light and forms an air passage along which the taken-in air passes through the both ends of each first heat radiation fin and goes out of the casing.
In this case, by making the rotation diameter of the cooling fan substantially equal to the dimension of the first heat radiation fins in its linear direction, air taken in by the heat radiation fan hits the heat sink in the axial direction, thereby achieving efficient heat exchange.
Further, a plurality of second heat radiation fins are formed so as to protrude outward by substantially the same dimension as that of the first heat radiation fin from the end portion of a side of the flat plate other than the pair of opposing sides thereof from which the both ends of each heat radiation fin protrude, and the base is formed into a shape from which the second heat radiation fins protrude. With this configuration, heat radiation efficiency is enhanced.
Further, the LED substrate has a through hole so as to allow air in the illumination part to directly contact the base. With this configuration, heat conductivity to the base is enhanced.
According to the LED illumination apparatus, heat is absorbed by the heat sink which is brought into surface contact with the LED substrate at the flat plate. The absorbed heat is diffused to the end portions of each heat radiation fin and then heat-exchanged with air taken in by the cooling fan to be efficiently discharged.
An embodiment of the present invention will be described below with reference to the accompanying drawings.
The main body part 1A includes an LED substrate 3, a base 4, a heat sink 5, a cooling fan 6, and an installation member 7 for mounting the illumination part 1B inside a rectangular prism-shaped casing 18. A rear cover 13 having an air outlet 13a is formed in the opening surface of the casing 18 on the cooling fan 6 side.
The LED substrate 3 is formed of resin having high heat conductivity or metal (including its alloy).
A screw hole 10 for mounting, a plurality of small-diameter through holes 11, and a lead wire introducing port 25 are drilled in the LED substrate 3. Feed wires 12a and 12b connected to the respective LED chip and driver incorporated in the LED package 8 and a common ground wire 12c are made to pass through the three lead wire introducing ports 25.
The base 4 holds the LED substrate 3 and is mounted with the heat sink 5. In this case, the base 4 may not necessarily be formed of resin having high heat conductivity.
A receiving port 20 for a harness 19 inserted from outside is mounted to one side of the center part 4A. Wires in the harness 19 include a feeding wire connected to the LED package 8 and feed and ground wires connected to a cooling fan 6. Although not illustrated, a lead wire drawn out from the harness 19 is connected to the cooling fan 6 and the LED package 8.
The front surface of the base 4 serves as a contact surface with the LED substrate 3 and has a concave part 29 (see
The heat sink 5 is formed of aluminum having high heat conductivity or its alloy. As illustrated in
The outward protruding part of each heat radiation fin 17 has substantially the same dimension as that of the part of each heat radiation fin 16 that protrudes from the side of the flat plate 15 perpendicular thereto. The surface part of each of the plate-like heat radiation fins 16 and 17 extends perpendicular to the surface of the flat plate 15.
As illustrated in
As illustrated in
As illustrated in
The heat radiation effect of the LED illumination apparatus 1 having the above configuration will be described. As illustrated in
The LED substrate 3 is thus housed in the concave part 29, so that the base 4 effectively absorbs the heat from the LED substrate 3, thus making it possible to reduce a heat radiation amount from the LED substrate 3 to the illumination part 1B. Further, air in the illumination part 1B directly exchanges heat with the base 4 through the through holes 11 formed in the LED substrate 3, which also contributes to suppression of temperature rise in the illumination part 1B.
The heat transmitted to the base 4 is transmitted to the flat plate 15 of the heat sink 5 from the center part 4A of the base 4 and is then diffused to the heat radiation fins 16 and 17. In the heat radiation fins 16 and 17, the heat is conducted to their outward protruding parts. The cooling fan 6 is driven by the motor 23 to take in air in the axial direction from the air inlet 7B and forms an air passage 21 denoted by the dashed-line arrows along which the taken-in air is discharged from the air outlet 13a. Thus, in the heat radiation fins 16 and 17, the heat radially diffused outward is cooled by the air taken in by the cooling fan 6. Since the both end portions of each heat radiation fin 16 and each heat radiation fin 17 are exposed from the sides of the base 4 protruding outward from three sides of the flat plate 15, the air taken in by the cooling fan 6 passes between the surfaces of the heat radiation fins to be discharged without being blocked.
The cooling fan 6 forms the air passage 21 as described above and, thereby, the heat conducted from the LED substrate 3 to the base 4 is effectively heat-exchanged with the air taken in through the heat sink 5 to be radiated outside through the air outlet 13a.
In this case, an air passage reverse to the above-described air passage of the embodiment, along which the air flow formed by the cooling fan 6 is introduced from the air outlet 13a and discharged from the air inlet 7B is possible; however, in the case of the air passage of the embodiment, cooled air is introduced while being heat-exchanged with the side surface of the illumination part 1B, thus effectively cooling the illumination part 1B, and heat radiation efficiency can be increased by substantially 20%.
Although not illustrated, when a plurality of slits are formed in the side surfaces of the casing 18 that constitute the wind tunnel of the air from the cooling fan 6, the air is discharged from the plurality of slits as well as the air outlet 13a. Thus, the air flow rate is increased to thereby further improve heat radiation efficiency.
In the above embodiment, the receiving port 20 for the harness 19 is provided in one side of the base 4, so that the heat radiation fin (heat radiation fins 16, 17) is provided in only three sides of the flat plate 15; however, the heat radiation fin can be provided corresponding to the four sides of the base 4 depending on the layout of the receiving port 20.
Number | Name | Date | Kind |
---|---|---|---|
8115395 | Horng | Feb 2012 | B2 |
Number | Date | Country |
---|---|---|
2007-042755 | Feb 2007 | JP |
2011-165351 | Aug 2011 | JP |