Patent Grant
7828464
1. Field of the Invention
The present invention relates to an LED lamp structure and system, and particularly relates to an LED lamp structure and system with high-efficiency heat-dissipating function.
2. Description of the Related Art
LED (Light-Emitting Diode) has some advantages better than traditional light source, such as small size, save power, good light-emitting efficiency, long usage life, high-speed operation response, no poison pollution as radiation and mercury. In recent years, LED has been used popularly. Hence, the tradition light-emitting device is replaced by LED with high brightness such as high power LED due to the progress of high technology.
However, the heat-dissipating efficiency of the LED is bad. A heat-guiding element or a heat-dissipating element needs to assist the LED to guide or dissipate heat out in order to operate the LED in a low temperature. Hence it is very important job for designers to deign an LED lamp device with high-efficiency heat-dissipating function
One particular aspect of the present invention is to provide an LED lamp structure and system with high-efficiency heat-dissipating function. The present invention use a heat-dissipating module with radial-shape fins for supplying high-efficiency heat-dissipating function to high power LED. Hence LEDs of the present invention are used in a low temperature to ensure that the usage life of the LEDs is increased.
In order to achieve the above-mentioned aspects, the present invention provides an LED lamp structure with high-efficiency heat-dissipating function, including: a heat-dissipating module, a light-emitting module, and a power-transmitting module.
The heat-dissipating module has a plurality of heat-dissipating fins, and the heat-dissipating fins are combined together to form a radial shape and a receiving space. The light-emitting module is received in the receiving space of the heat-dissipating module. The power-transmitting module is electrically connected with the light-emitting module. Moreover, the light-emitting module includes a substrate with a positive conductive track and a negative conductive track, two inner conductive pins, at least one light-emitting element electrically connected with the positive conductive track and the negative conductive track via the two inner conductive pins, a fluorescent colloid covered on the at least one light-emitting element, and a light-shielding frame body for covering a peripheral face of the fluorescent colloid and only exposing a top surface of the fluorescent colloid.
Furthermore, the LED lamp structure further includes a casing module. The casing module has a top board body, a bottom board body mated with the top board body, and a joint board body disposed between the top board body and the heat-dissipating fins. Both the top board body and the joint board body have an opening for exposing the light-emitting module. Alternatively, each heat-dissipating fin has a top side and a bottom side respectively contacted with the joint board body and the bottom board body, or each heat-dissipating fin has a top side contacted with the joint board body and a bottom side separated from the bottom board body by a predetermined distance.
In order to achieve the above-mentioned aspects, the present invention provides an LED lamp system with high-efficiency heat-dissipating function, including a plurality of LED lamp structures and a power supply plug.
Each LED lamp structure includes a heat-dissipating module, a light-emitting module, and a power-transmitting module. The heat-dissipating module has a plurality of heat-dissipating fins, and the heat-dissipating fins are combined together to form a radial shape and a receiving space. The light-emitting module is received in the receiving space of the heat-dissipating module. The power-transmitting module is electrically connected with the light-emitting module. The power supply plug is electrically connected with the power-transmitting module of each LED lamp structure.
According to different heat-dissipating needs, the heat-dissipating fins of each heat-dissipating module have different embodiment aspects, as follows:
1. Each heat-dissipating fin of each heat-dissipating module has a stacked portion and a fined portion extended forward and upward from a lateral side of the stacked portion. Each light-emitting module is correspondingly disposed on the stacked portions of the heat-dissipating fins of each heat-dissipating module.
2. Each heat-dissipating fin of each heat-dissipating module has a stacked portion and a fined portion extended forward and upward from a lateral side of the stacked portion. In addition, each LED lamp structure further includes a heat-dissipating substrate received in the corresponding receiving space and disposed on top surfaces of the corresponding stacked portions. The heat-dissipating substrate has a peripheral face abutting against inner lateral sides of the corresponding fined portions. The light-emitting modules are respectively disposed on the corresponding heat-dissipating substrates.
3. Each heat-dissipating fin of each heat-dissipating module has a stacked portion and a fined portion extended forward, upward and downward from a lateral side of the stacked portion. In addition, each LED lamp structure further includes a heat-dissipating substrate abutting against bottom surfaces of the corresponding stacked portions and inner lateral sides of the corresponding fined portions. Each light-emitting module is disposed on the stacked portions of each corresponding heat-dissipating module.
4. Each heat-dissipating fin of each heat-dissipating module has a fixed portion and a fined portion extended upward from the fixed portion. In addition, each LED lamp structure further includes a heat-dissipating substrate abutting against inner lateral sides of the fixed portions of each corresponding heat-dissipating module. The light-emitting modules are respectively disposed on the corresponding heat-dissipating substrates.
5. Each heat-dissipating fin of each heat-dissipating module has an embedded portion and a fined portion extended forward, upward and downward from a lateral side of the embedded portion. In addition, each LED lamp structure further includes a heat-dissipating substrate. The heat-dissipating substrate has a plurality of concave grooves formed on a peripheral face thereof and corresponding to the embedded portions, and each embedded portion of each heat-dissipating fin is embedded into the concave groove in order to make the peripheral face of the heat-dissipating substrate abut against inner lateral sides of the fined portions. The light-emitting modules are disposed on the corresponding heat-dissipating substrates, respectively.
Hence, the LED lamp structure and system can provides high-efficiency heat-dissipating function for increasing the usage life of LEDs of the present invention, high power LED especially.
It is to be understood that both the foregoing general description and the following detailed description are exemplary, and are intended to provide further explanation of the invention as claimed. Other advantages and features of the invention will be apparent from the following description, drawings and claims.
The various objects and advantages of the present invention will be more readily understood from the following detailed description when read in conjunction with the appended drawings, in which:
The heat-dissipating module 1a has a plurality of heat-dissipating fins 10a. The heat-dissipating fins 10a are combined together to form a radial shape and a receiving space 11a formed at a central position of the heat-dissipating module 1a. Hence, the heat-dissipating module 1a is a heat-dissipating module with radial fins.
Moreover, each heat-dissipating fin 10a has a stacked portion 100a and a fined portion 101a extended forward and upward from a lateral side of the stacked portion 100a. The heat-dissipating module 1a has a plurality of through holes 102a formed between each two stacked portions 100a. In addition, the stacked portions 100a are stacked with each other to make the heat-dissipating fins 10a stacked with each other and combined together.
In the first embodiment, the stacked portions 100a are left and right stacked with each other to make the heat-dissipating fins 10a stacked with each other and combined together. According to different needs, the stacked portions 100a can be up and down stacked with each other to make the heat-dissipating fins 10a stacked with each other and combined together.
Furthermore, the light-emitting module 2 is received in the receiving space 11a of the heat-dissipating module 1a and is disposed on the stacked portions 100a. The light-emitting module 2 includes a substrate 20 with a positive conductive track 201 and a negative conductive track 202, two inner conductive pins (210, 211), at least one light-emitting element 21 electrically connected with the positive conductive track 201 and the negative conductive track 202 via the two inner conductive pins (210, 211), a fluorescent colloid 22 covered on the at least one light-emitting element 21, and a light-shielding frame body 23 for covering a peripheral face of the fluorescent colloid 22 and only exposing a top surface of the fluorescent colloid 22.
In addition, the power-transmitting module 3 is electrically connected with the light-emitting module 2. The power-transmitting module 3 has two leading wires 30 electrically connected with the positive conductive track 201 and the negative conductive track 202 of the substrate 20, respectively.
Referring to
Referring to
The heat-dissipating module 1b has a plurality of heat-dissipating fins 10b. The heat-dissipating fins 10b are combined together to form a radial shape and a receiving space 11b formed at a central position of the heat-dissipating module 1b. Hence, the heat-dissipating module 1b is a heat-dissipating module with radial fins.
Moreover, each heat-dissipating fin 10b has a stacked portion 100b and a fined portion 101b extended forward and upward from a lateral side of the stacked portion 100b. The heat-dissipating module 1b has a plurality of through holes 102b formed between each two fined portions 101b. The two leading wires 30 of the power-transmitting module 3 pass through any two of the through holes 102b. In the second embodiment, the stacked portions 100b are left and right stacked with each other to make the heat-dissipating fins 10b stacked with each other and combined together.
Hence the difference between the second embodiment and the first embodiment is that the LED lamp structure B of the second embodiment uses the heat-dissipating substrate 5b that is received in the receiving space 11b, and is disposed on top surfaces 1000b of the stacked portions 100b and among the heat-dissipating fins 10b. In addition, the heat-dissipating substrate 5b has a peripheral face abutting against inner lateral sides 1010b of the fined portions 101b. The light-emitting module 2 is disposed on the heat-dissipating substrate 5b. According to different heat-dissipating needs, the heat-dissipating substrate can be designed as a hollow or solid heat-dissipating substrate. According to different design spaces, the shape of the heat-dissipating substrate 5b can be cylindrical shape or any shape such as rectangle or polygon.
Referring to
The heat-dissipating module 1c has a plurality of heat-dissipating fins 10c. The heat-dissipating fins 10c are combined together to form a radial shape and a receiving space 11c formed at a central position of the heat-dissipating module 1c. Hence, the heat-dissipating module 1c is a heat-dissipating module with radial fins.
Moreover, each heat-dissipating fin 10c has a stacked portion 100c and a fined portion 101c extended forward, upward and downward from a lateral side of the stacked portion 100c. The heat-dissipating module 1c has a plurality of through holes 102c formed between each two fined portions 101c. The two leading wires 30 of the power-transmitting module 3 pass through any two of the through holes 102c. In the third embodiment, the stacked portions 100c are left and right stacked with each other to make the heat-dissipating fins 10c stacked with each other and combined together.
Hence the difference between the third embodiment and the second embodiment is that a top side of the heat-dissipating substrate 5c of the third embodiment abuts against bottom surfaces 1000c of the stacked portions 100c and inner lateral sides 1010c of the fined portions 101c. In addition, the heat-dissipating substrate 5c has a peripheral face abutting against inner lateral sides 1010c of the fined portions 101c. The light-emitting module 2 is disposed on the stacked portions 100c.
Referring to
The heat-dissipating module 1d has a plurality of heat-dissipating fins 10d. The heat-dissipating fins 10d are combined together to form a radial shape and a receiving space 11d formed at a central position of the heat-dissipating module 1d. Hence, the heat-dissipating module 1d is a heat-dissipating module with radial fins.
Moreover, each heat-dissipating fin 10d has a fixed portion 100d and a fined portion 101d extended upward from the fixed portion 100d. The heat-dissipating module 1d has a plurality of through holes 102d formed between each two fixed portions 100d. The two leading wires 30 of the power-transmitting module 3 pass through any two of the through holes 100d.
Hence the difference between the fourth embodiment and other embodiments (the first, second, and third embodiments) is that the heat-dissipating substrate 5d has a peripheral face abutting against inner lateral sides 1000d of the fixed portions 100d. The light-emitting module 2 is disposed on the stacked portions 100c. In addition, the light-emitting module 2 is disposed on the heat-dissipating substrate 5d.
Referring to
The heat-dissipating module 1e has a plurality of heat-dissipating fins 10e. The heat-dissipating fins 10e are combined together to form a radial shape and a receiving space 11e formed at a central position of the heat-dissipating module 1e. Hence, the heat-dissipating module 1e is a heat-dissipating module with radial fins.
Moreover, each heat-dissipating fin 10e has an embedded portion 100e and a fined portion 101e extended forward, upward and downward from a lateral side of the embedded portion 100e. The heat-dissipating module 1e has a plurality of through holes 102e formed between each two fined portions 101e. The two leading wires 30 of the power-transmitting module 3 pass through any two of the through holes 102e.
Hence the difference between the fifth embodiment and other embodiments is that the heat-dissipating substrate 5e has a plurality of concave grooves 40e formed on a peripheral face thereof and corresponding to the embedded portions 100e. Each embedded portion 100e of each heat-dissipating fin 10e is embedded into the concave groove 40e in order to make the peripheral face of the heat-dissipating substrate 5e abut against inner lateral sides 1010e of the fined portions 101e. In addition, the light-emitting module 2 is disposed on the heat-dissipating substrate 5e.
The heat-dissipating module 1′ has a plurality of heat-dissipating fins 10′. The heat-dissipating fins 10′ are combined together to form a radial shape and a receiving space 11′ formed at a central position of the heat-dissipating module 1′. The light-emitting module 2′ is received in the receiving space 11′ of the heat-dissipating module 1′. The power-transmitting module is electrically connected with the light-emitting module 2′.
Moreover, the power supply plug 3′ is electrically connected with the power-transmitting module of each LED lamp structure F. In other words, each power-transmitting module has a positive leading wire and a negative leading wire (not shown) electrically connected with a positive side 31′ and a negative side 32′ of the power supply plug 3, respectively.
Furthermore, the casing module 4′ has a top board body 40′, a bottom board body 41′ mated with the top board body 40′, and a joint board body 42′ disposed between the top board body 40′ and the heat-dissipating fins 10′. Both the top board body 40′ and the joint board body 42′ have an opening (400′, 420′) for exposing the light-emitting modules 2′. In addition, the top board body 40′ and the bottom board body 41′ are assembled and screwed together via many screws S. According to different usage needs, the LED lamp system further includes a plurality of fins 5′ disposed between the top board body 40′ and the bottom board body 41′. The fins 5′ are combined together to surround the LED lamp structures F.
However, the LED lamp structures F arranged and assembled as a streetlamp structure is not used to limit the present invention. The LED lamp structures F can be arranged and assembled as any shape. For example, the LED lamp structures F is arranged and assembled straightly as a desk lamp.
Moreover, the LED lamp structures (A, B, C, D, E) of the above-mentioned embodiments can be applied to the LED lamp system of the present invention. In other words, according to user's needs, the LED lamp structure F can be replaced by any one type of the LED lamp structures (A, B, C, D, E).
In conclusion, the present invention use a heat-dissipating module with radial-shape fins for supplying high-efficiency heat-dissipating function to high power LED. Hence LEDs of the present invention are used in a low temperature to ensure that the usage life of the LEDs is increased. In other words, the LED lamp structure and system can provides high-efficiency heat-dissipating function for increasing the usage life of LEDs of the present invention, high power LED especially.
Although the present invention has been described with reference to the preferred best molds thereof, it will be understood that the invention is not limited to the details thereof. Various substitutions and modifications have been suggested in the foregoing description, and others will occur to those of ordinary skill in the art. Therefore, all such substitutions and modifications are intended to be embraced within the scope of the invention as defined in the appended claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 96124784 A | Jul 2007 | TW | national |
| Number | Name | Date | Kind |
|---|---|---|---|
| 6782941 | Lee | Aug 2004 | B2 |
| 20060250800 | Chang et al. | Nov 2006 | A1 |
| Number | Date | Country | |
|---|---|---|---|
| 20090009999 A1 | Jan 2009 | US |
