1. Field of the Invention
The present invention relates to a LED lamp, and in particular to a LED lamp with 360-degree illumination.
2. Description of Prior Art
Since light emitting diodes (LEDs) have advantages of low electricity consumption, environmental protection, long life, small volume and toughness, they have been widely used in various fields such as automobiles, communication industries or consumptive electronic appliances to replace traditional light sources. However, the lights emitted by the LEDs are concentrated in a certain range. Thus, manufacturers in this industry continue to develop a lamp with 360-degree illumination. For example, Taiwan Patent Publication No. M306299 discloses a lamp 100 with 360-degree illumination. As shown in
However, in practice, such a structure still has some problems as follows. In order to achieve the required 360-degree illumination and brightness, it is necessary to increase the number of LEDs 130, which also increases the production cost and time for assembly. On the other hand, since there are a number of LEDs 130 that are arranged densely, the heat generated by the LEDs 130 cannot be dissipated sufficiently by the post 120. As a result, the working temperature of the LEDs 130 is so high that the life of the LEDs 130 will be deteriorated, which may increase the time and cost for maintenance.
Therefore, in order to solve the above-mentioned problems, the present Inventor proposes a reasonable and novel structure based on his deliberate research and expert experiences.
The present invention is to provide a LED lamp with 360-degree illumination, whereby all lateral surfaces of the lamp can have sufficient brightness to generate an effect of 360-degree illumination.
The present invention provides a LED lamp with 360-degree illumination, which includes: a base; a first substrate fixed on the base; a stepped structure mounted on the first substrate, the stepped structure having a first annular frame connected to the first substrate, a second substrate connected to the first annular frame, and a second annular frame connected to the second substrate, a peripheral length of the second annular frame being smaller than that of the first annular frame; and a plurality of LEDs fixed to the first substrate and the second substrate and surrounding the first annular frame and the second annular frame respectively.
In comparison with prior art, the present invention has advantageous features as follows:
The characteristics and technical contents of the present invention will be described with reference to the accompanying drawings. However, the drawings are illustrative only but not used to limit the present invention.
Please refer to
In one embodiment of the present invention, an upper portion of the base 10 and the cover 50 together form a hollow semi-spherical body. The edge of the cover 50 is provided with a plurality of hooks 51. The edge of the base 10 is provided with a plurality of troughs 11 for allowing the hooks 51 to be inserted therein. The base 10 is combined with the cover 50 to form the main body of the LED lamp, and an accommodating space is formed there between.
The first substrate 20 is a metal core printed circuit board (MCPCB) and formed into a circular shape. The first substrate 20 is fixed on the base 10. The inner edge of the base 10 is provided with a plurality of protrusions 12, whereby the first substrate 20 can be soldered or fixed otherwise on the base 10. The diameter of the first substrate 20 is slightly smaller than the inner diameter of the base 10, so that the first substrate 10 will not cover the troughs 11 to hinder the combination of the base 10 with the cover 50.
The stepped structure 30 is mounted on the first substrate 20. The stepped structure 30 includes a first annular frame 31 connected to the first substrate 20, a second substrate 32 connected to the first annular frame 31, and a second annular frame 33 connected to the second substrate 32. The peripheral length of the second annular frame 33 is smaller than that of the first annular frame 31.
The first annular frame 31 and the second annular frame 33 are made of metallic materials having good thermal conductivity (e.g. Al). The thickness of the wall of the first annular frame 31 or the second annular frame 33 is made larger, thereby increasing the thermal-conducting area. Like the first substrate 20, the second substrate 32 is also a metal core printed circuit board (MCPCB) and formed into a circular shape. In addition, the present embodiment further includes a third substrate 34 connected to the second annular frame 33. Similarly, the third substrate 34 is also a metal core printed circuit board (MCPCB) and formed into a circular shape. The LEDs 40 are fixed on the first substrate 20, the second substrate 32 and the third substrate 34 and surround the first annular frame 31 and the second annular frame 33 respectively. As shown in
Please refer to
According to the present invention, all of the LEDs 40 are not arranged densely in the same plane, but mounted on the first substrate 20, the second substrate 32 and the third substrate 34 of different heights. Further, the heat generated by the LEDs 40 can be conducted by the first annular frame 31 and the second annular frame 33 to the first substrate 20. In addition, with a heat sink 60 adhered to the other surface of the first substrate 20 and received in the base 10, the heat can be dissipated to the outside. Moreover, the heat sink 60 is formed into a ring to cooperate with the first substrate 20, thereby increasing the heat-dissipating area. Therefore, the present invention can generate a good effect of thermal conduction and heat dissipation.
Please refer to
According to the above, the present invention really demonstrates industrial applicability, novelty and inventive steps. Further, the construction of the present invention has not been seen in products of the same kind or let in public use, so that the present invention conforms to the requirements for a utility model patent.
Number | Name | Date | Kind |
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7607802 | Kang et al. | Oct 2009 | B2 |
Number | Date | Country |
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20020184209 | Jun 2002 | JP |
M306299 | Feb 2007 | TW |
Number | Date | Country | |
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20110075412 A1 | Mar 2011 | US |