1. Field of the Invention
The present invention relates to a light emitting diode (LED) lamp, and more particularly to a recessed LED lamp incorporating an improved heat sink for dissipating heat more efficiently and reducing a cost thereof.
2. Description of Related Art
As an energy-efficient light, an LED lamp has a trend of substituting the fluorescent lamp for indoor lighting purpose; in order to increase the overall lighting brightness, a plurality of LEDs are often incorporated into a signal lamp, in which how to efficiently dissipate heat generated by the LEDs becomes a challenge.
Conventionally, the LED lamp utilize a heat dissipating structure having a shape like a sunflower: a heat sink has a cylindrical post and a plurality of fins extending outwardly and radially from a circumference of the post. A bottom face of the post is used for thermally connecting with LEDs of the LED lamp. Thus, heat generated by the LEDs is conducted to the fins via the post, and dispersed to the surrounding environment from the fins.
Unfortunately, when such a conventional heat sink is used in the LED lamp, it cannot effectively dissipate heat generated by the LEDs since the LEDs act as multiple heat-generating centers, which require a heat sink with a large base to contact with the multiple heat-generating centers. However, the post of the sunflower-type heat sink cannot have a large base to contact with the LEDs due to the limitation of geometry of the cylindrical post. In addition, since in the sunflower-type heat sink, heat generated by the LEDs is firstly transferred vertically to the post and then horizontally to the fins via the post, the heat dissipating efficiency is not good enough to timely dissipate the heat generated by the LEDs.
Furthermore, the sunflower-type heat sink requires a high cost of manufacture.
What is needed, therefore, is an LED lamp with an improved heat sink which can overcome the above-mentioned disadvantages.
An LED lamp includes a housing, a printed circuit board received in the housing, a plurality of LEDs mounted on the printed circuit board, a casing surrounding the housing, a pair of arms resiliently and pivotably attached on the casing, and a heat sink secured below the housing. The heat sink includes a base contacting the printed circuit board, a rectangular plate which is larger than the base being integrally formed with and extending outwardly from a bottom face of the base and a plurality of fins extending downwardly from the plate. Heat generated by the LEDs can be conducted to the base and then to the plate. From the plate, the heat is vertically transferred to the downwardly extending fins to be dissipated to surrounding atmosphere. The base has opposite arced sides which are provided with threads for threadedly engaging with threads of the housing.
Other advantages and novel features of the present invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings, in which:
Many aspects of the present apparatus can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present apparatus. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
Referring to
The housing 10 has a cylindrical configuration with a top face recessed downwardly to form a tapered space (not labeled). A bottom face of the tapered space defines a plurality of evenly distributed holes 12 thereon, for receiving the plurality of LEDs 22 therein. A pair of rectangular ears 14 are designed in an opposing relationship at a circumference of the housing 10, wherein each of the pair of rectangular ears 14 extends in a direction along a height of the housing 10, and has a top portion lower than the top face of the housing 10, and a bottom portion coplanar with a bottom face of the housing 10. The housing 10 is hollow and defines a large opening (viewed from
The casing 40 consists of an annular sidewall 42 surrounding the circumference of the housing 10, and a flange 44 extending outwardly and horizontally from a top of the annular sidewall 42. The annular sidewall 42 is disposed around an upper portion of the housing 10 with the flange 44 coplanar with the top face of the housing 10 (illustrated in
Each of the pair of arms 50 includes a spiral portion 52 and a rectangular portion 54 formed inclinedly from the spiral portion 52 and abutting against the outer periphery of the flange 44 of the casing 40. The spiral portion 52 is retained in a corresponding one of the pair of grooves 420 of the casing 40 by inserting the ribs 421 into the spiral portion 52, whereby the arms 50 are resiliently and pivotably attached to the annular sidewall 42 of the casing 40. The spiral portion 52 is able to provide a resilient force to the rectangular portion 54 to thereby force it returning its original position, when the rectangular portion 54 is rotated from the original position. The rectangular portion 54 is for resiliently abutting against a rear side of the wall panel or the ceiling, to thereby sandwich the wall panel or the ceiling with the flange 44 of the casing 40, which is for closely abutting against a front side of the wall panel or the ceiling, whereby the LED lamp is secured in the wall panel or the ceiling.
The plurality of LEDs 22 are distributed on the printed circuit board 20 in a triangle relationship. The printed circuit board 20 has a diameter less than that of the opening in the housing 10. The printed circuit board 20 is accommodated horizontally in the opening of the housing 10 with the plurality of LEDs 22 received within the plurality of holes 12. The LEDs 22 are visible from an outside of the LED lamp, and light generated by the LEDs 22 can emit to the outside of the LED lamp.
Also referring to
Since all of the plurality of LEDs 22 are located within a periphery of the base 32 of the heat sink 30, the heat generated by the plurality of LEDs 22 is able to be conducted to the base 32 via the printed circuit board 20 directly. Therefore, the heat can be dissipated rapidly and sufficiently, and an overheat or a malfunction of the plurality of LEDs 22 is thus prevented. Moreover, since the heat sink 20 is provided with the plate 34 which is larger than the base 32 and integral with the base 32, the heat absorbed by the base 32 can be quickly spread to the plate 34, from which the heat is directly and downwardly transferred to the fins 36 to be dissipated to ambient air. Thus, the heat generated by the LEDs 22 can be timely dissipated to enable the LEDs 22 to work within their predetermined temperature range.
It is believed that the present invention and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.
Number | Date | Country | Kind |
---|---|---|---|
200710125124.2 | Dec 2007 | CN | national |