1. Technical Field
The present disclosure generally relates to LED lamps, and particularly to a LED lamp with an encircled LED modules and encapsulation
2. Description of the Related Art
Light emitting diodes (LEDs) have many advantages, such as high luminosity, low operational voltage, low power consumption, compatibility with integrated circuits, easy driving, long-term reliability, and environmental friendliness. All of these reasons have promoted the LEDs as a widely used light source. Light emitting diodes are commonly applied in lighting applications.
LED illumination apparatuses must overcome heat dissipation challenges. An LED lamp is commonly arranged with LED lighting module on the top and heat dissipation element at the periphery. The heat dissipation efficiency of LED lamp is limited. This will reduce the lifespan of the LED lamp. Also, the LED lamp will be too hot to touch during disconnection. This adds to the inconvenience of using the LED lamp.
What is needed, therefore, is an LED lamp, which can improve heat dissipation efficiency and convenience of using the lamp, and ameliorate the described limitations.
Many aspects of the disclosure can be better understood with reference to the drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the LED lamp. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the views.
Embodiments of an LED lamp as disclosed are described in detail here with reference to the drawings.
Referring to
In this embodiment, the heat dissipation end 164 is planar and is at the top portion of the LED lamp 10, and the heat dissipation element 16 is an inverted trapezoidal hollow body. The heat dissipation element 16 can be Cu, Sn, Al, Au, Ag, Mo, W, Mg, or an alloy thereof, or ceramic material such as AlO, AlN, or BeO. The heat dissipation element 16 can also be high radiant material, such as Alumite, with emissivity exceeding 0.7. The electrical sleeve 14 connects to an electrical connection base (not shown), for example, a bulb socket, for power supply. The electrical sleeve 14 can be E14, E17, E26, E27, GU10, PAR30, or MR16 type.
The encapsulation 18 encircles the at least one LED module 12 on the heat dissipation element 16 and covers a part of the heat dissipation element 16. The encapsulation 18 connects to the electrical sleeve 14 near the fixable end 164 of the heat dissipation element 16. The encapsulation 18 includes a top end 182 opposite to the electrical sleeve 14. The top end 182 is a plane and coplanar with the heat dissipating end 164 of the heat dissipation element 16. The encapsulation 18 can be resin, epoxy, silicone, polycarbonate (PC), noryl, polybutylene terephthalate (PBT), polyphthalamide (PPA), polypropylene (PP), polymethyl methacrylate (PMMA), glass fiber, TiO2, CaCO3, or a combination thereof. The encapsulation 18 is not thermal conductive so that the temperature of the encapsulation 18 will be lower than that of the heat dissipation element 16.
The at least one LED module 12 is electrically connected to the electrical sleeve 14 through a circuit board (not shown) for supplying power. Thus, the electrical conductive path and the thermal conductive path of the LED lamp 10 are separated. The encapsulation 18, which is not thermal conductive will be the main contact (gripping) part of the LED lamp when disconnecting the LED lamp from the power supply. The heat dissipating end 164 of the heat dissipation element 16 is exposed to air for heat dissipation.
Referring to
Referring to
Referring to
Referring to
It is to be understood, however, that even though numerous characteristics and advantages of the disclosure have been set forth in the foregoing description, together with details of the structures and functions of the embodiment(s), the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 99127656 | Aug 2010 | TW | national |