1. Field of the Invention
The present invention relates to a light emitting diode (LED) lamp, and more particularly to an LED lamp having a heat sink for improving heat dissipation efficiency of the LED lamp.
2. Description of Related Art
An LED lamp is a type of solid-state lighting that utilizes light-emitting diodes (LEDs) as a source of illumination. The LED lamp is intended to be a cost-effective yet high quality replacement for incandescent and fluorescent lamp because of the LED making features of long-term reliability, environment friendliness and low power consumption.
A conventional LED lamp comprises a heat sink and a plurality of LED modules having LEDs attached on an outer surface of the heat sink to dissipate heat generated by the LEDs. The outer surface of the heat sink generally is a plane. When the LED lamp works, the LEDs mounted on the planar outer surface of the heat sink only form a flat light source, whereby the illumination area and angle of the LED lamp are limited. In addition, the heat sink of the conventional LED lamp cannot efficiently dissipate the heat generated by the LEDs.
What is needed, therefore, is an LED lamp having a large illumination area and angle. Furthermore, the LED lamp has a good heat dissipation efficiency.
An LED lamp includes a plurality of LED modules, a heat absorbing member, a heat sink and an envelope. The heat absorbing member comprises a plurality of inclined top boards oriented toward different lateral directions and a plurality of horizontal bottom boards located below and connecting with corresponding top boards. A plurality of air passages is defined between the top board and the bottom board. Each of the LED modules is attached on a corresponding top board. The heat sink thermally connects with the heat absorbing member. The envelope is mounted on the heat sink and engages with the heat sink to enclose the heat absorbing member and LED modules therein. The envelope is made of transparent material such as glass or plastic.
Other advantages and novel features of the present invention will become more apparent from the following detailed description of an embodiment/embodiments when taken in conjunction with the accompanying drawings.
Many aspects of the present invention can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present invention. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
Referring to
Referring to
The heat absorbing member 30 is made from metal such as aluminum. The heat absorbing member 30 consists of four heat absorbing portions 31. Each of the heat absorbing portions 31 comprises a triangular bottom board 32, a top board 34 mounted above the bottom board 32 and a plurality of connecting boards 36 interconnecting the bottom board 32 and the top board 34. The top board 34 is inclined while the bottom board 32 is horizontal.
The top board 34 has an isosceles trapezoid configuration. An acute angle is defined between the top board 34 and the bottom board 32. The top board 34 intersects the bottom board 32 at an edge 342 which is parallel to an outer edge 324 of the bottom board 32. The outer edge 324 is spaced from the edge 342 and located outside the edge 342. A projection of the top board 34 on the bottom board 32 laps over the bottom board 32.
The connecting board 36 is perpendicular to the bottom board 32. These connecting boards 36 are parallel to each other, and are spaced from each other to define a plurality of air passages (not shown) therebetween. Heights of the connecting boards 36 are gradually increased along a direction from the outer edge 324 inwardly toward a center of the heat absorbing member 30.
Referring to
Referring to
The envelope 50 has a bowl-shaped construction. The envelope 50 is generally made of transparent material such as plastic, glass, or other suitable material availing to transmit light. The envelope 50 is mounted on the top of the heat sink 40, and engages with the heat sink 40 to define a receiving space in order to receive the LED modules 20 and the heat absorbing member 30 therein.
In assembly of the LED lamp 10, the LED modules 20 are mounted on the heat absorbing member 30 via screws (not shown). The bottom boards 32 of the heat absorbing member 30 and the conducting member 110 are mounted on the heat sink 40, and then the envelope 50 engages with the periphery of the platform 46 of the heat sink 40 to define a waterproof space in order to receive the heat absorbing member 30 and the LED modules 20 therein.
The shell 60 is disposed on a lateral end of the heat sink 40. The shell 60 has a part received in the cutout of the heat sink 40, and another part thereof protruded from the base 40.
In use of the LED lamp 10, when the LEDs 24 of the LED modules 20 emit light, heat generated by the LEDs 24 is absorbed by the heat absorbing member 30 and then transferred to the heat sink 40 by the conducting member 110. Most of the heat is dispersed into ambient cool air by the fins of the fin unit 44. Thus, a temperature of the LEDs 24 is decreased and the LED lamp 10 has an improved heat dissipation efficiency for preventing the LEDs 24 from overheating. Additionally, due to the acute angle defined between the top board 34 and the bottom board 32 and four heat absorbing portions 31 symmetrically disposed around the central axis of the heat absorbing member 30, the top boards 34 of the heat absorbing member 30 are oriented toward different directions. Consequently, the LED modules 20 attached on the top boards 34 are also oriented toward different directions; therefore, light radiated from the LED modules 20 is distributed over a large region.
It is to be understood, however, that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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200810066773.4 | Apr 2008 | CN | national |