Light emitting diode (LED) lighting systems are becoming more prevalent as replacements for older lighting systems. LED systems are an example of solid state lighting (SSL) and have advantages over traditional lighting solutions such as incandescent and fluorescent lighting because they use less energy, are more durable, operate longer, can be combined in multi-color arrays that can be controlled to deliver virtually any color light, and generally contain no lead or mercury. A solid-state lighting system may take the form of a lighting unit, light fixture, light bulb, or a “lamp.”
An LED lighting system may include, for example, a packaged light emitting device including one or more light emitting diodes (LEDs), which may include inorganic LEDs, which may include semiconductor layers forming p-n junctions and/or organic LEDs (OLEDs), which may include organic light emission layers. Light perceived as white or near-white may be generated by a combination of red, green, and blue (“RGB”) LEDs. Output color of such a device may be altered by separately adjusting supply of current to the red, green, and blue LEDs. Another method for generating white or near-white light is by using a lumiphor such as a phosphor. Still another approach for producing white light is to stimulate phosphors or dyes of multiple colors with an LED source. Many other approaches can be taken.
In some embodiments, a lamp comprises an enclosure comprising a tube, the tube being at least partially optically transmissive. At least one LED is in the enclosure and is operable to emit light through the tube when energized through an electrical path. The at least one LED is mounted on a substrate. A first pair of pins are rotatable relative to the enclosure and are in the electrical path. An electrical conductor electrically couples the first pair of pins to the electrical path. The electrical conductor is biased into engagement with an electrical contact on the substrate.
The enclosure may comprise a glass tube having a first diffusion layer. The first diffusion layer may comprise an etched inner surface of the tube. The glass tube may comprise a second diffusion layer. The second diffusion layer may comprise a media impregnated with a diffuser applied to an outer surface of the tube. The enclosure may comprise a plurality of LEDs where the plurality of LEDs are mounted on the substrate and extend for substantially the length of the tube. The substrate may comprise a low thermally conductive layer and a metal layer in the electrical path. The substrate may be mounted offset from a centerline of the tube. The substrate may be secured to the tube using an adhesive. The substrate may comprise a flex circuit. The flex circuit may be secured to the tube. The flex circuit may be secured to the tube using an adhesive. The flex circuit may be secured to the end caps and may be suspended in the tube. The flex circuit may comprise a plurality of subcircuits where the plurality of subcircuits are mechanically and electrically coupled to one another. The plurality of subcircuits may be identical to one another. The plurality of subcircuits may comprise a primary pad and a secondary pad connected in parallel to the primary pad. One LED may be mounted on one of the primary pad and the spare pad to vary the distance between the LED and an adjacent LED. A component may be mounted on the flex circuit between the LED and the adjacent LED. The substrate may be trapped between a support surface and the electrical conductor. The first pair of pins may be mounted on an end cap such that the first pair of pins rotate relative to the electrical conductor. The first pair of pins may be mounted in a control member where the control member rotates relative to the end cap. The control member may comprise a spacer that extends into a slot on the end cap. The substrate may be positioned between a support surface and the electrical conductor such that the spacer separates the electrical conductor from the support surface when the control member is in a first orientation relative to the end cap. The spacer may be moved to allow the electrical conductor to move into engagement with the substrate when the control member is in a second orientation relative to the end cap. A lock may prevent the control member from moving from the second position to the third position. The control member may be movable from the second position to a third position to rotate the pins relative to the at least one LED.
In one embodiment, a method of assembling a LED lamp comprises providing a tube; inserting an LED assembly into the tube, the LED assembly comprising an LED mounted on a substrate; mounting an end cap on the tube, the end cap comprising a support surface for the substrate and a conductor spaced from the supporting surface, wherein mounting the end cap on the tube comprises locating the substrate on the supporting surface between the supporting surface and the conductor; moving the conductor into engagement with an electrical contact on the substrate after the end cap is mounted on the tube.
In some embodiments a lamp comprises an enclosure comprising a tube, the tube being at least partially optically transmissive and having a first end and a second end. A LED is in the enclosure operable to emit light through the tube when energized through an electrical path. At least one pin is mounted adjacent a first end and a second end of the tube, the pins being in the electrical path. The LED is mounted on a flex circuit and the flex circuit is mounted in the tube without a heat sink.
In some embodiments a lamp comprises an enclosure comprising a tube, the tube being at least partially optically transmissive and having a first end and a second end. A LED is in the enclosure operable to emit light through the tube when energized through an electrical path. A first pin is mounted adjacent the first end of the tube and a second pin is mounted adjacent a second end of the tube, the first pin and the second pin being in the electrical path. The LED is mounted on a substrate comprising a low thermally conductive layer and a metal layer in the electrical path. The substrate is mounted in the tube without a heat sink.
The flex circuit and substrate may be suspended in the tube between the first end and the second end. A first end cap may be connected to the first end and a second end cap may be connected to the second end. The flex circuit and substrate may be suspended from the first end cap and the second end cap. The flex circuit and substrate may be suspended from the first end cap by a first electrical conductor and from the second end cap by a second electrical conductor. The first electrical conductor and the second electrical conductor may be in the electrical path. The first electrical conductor may be electrically coupled to the first pin and the second electrical conductor may be electrically coupled to the second pin. The flex circuit and substrate may be adhered to the tube. The flex circuit and substrate may be is mounted offset from a centerline of the tube. The flex circuit and substrate may comprise longitudinal edges where, the longitudinal edges contacting the interior of the tube
Embodiments of the present invention now will be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like numbers refer to like elements throughout.
It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present invention. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items.
It will be understood that when an element such as a layer, region or substrate is referred to as being “on” or extending “onto” another element, it can be directly on or extend directly onto the other element or intervening elements may also be present. In contrast, when an element is referred to as being “directly on” or extending “directly onto” another element, there are no intervening elements present. It will also be understood that when an element is referred to as being “connected” or “coupled” to another element, it can be directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being “directly connected” or “directly coupled” to another element, there are no intervening elements present.
Relative terms such as “below” or “above” or “upper” or “lower” or “horizontal” or “vertical” or “top” or “bottom” may be used herein to describe a relationship of one element, layer or region to another element, layer or region as illustrated in the figures. It will be understood that these terms are intended to encompass different orientations of the device in addition to the orientation depicted in the figures.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” “comprising,” “includes” and/or “including” when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms used herein should be interpreted as having a meaning that is consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Unless otherwise expressly stated, comparative, quantitative terms such as “less” and “greater”, are intended to encompass the concept of equality. As an example, “less” can mean not only “less” in the strictest mathematical sense, but also, “less than or equal to.”
The terms “LED” and “LED device” as used herein may refer to any solid-state light emitter. The terms “solid state light emitter” or “solid state emitter” may include a light emitting diode, laser diode, organic light emitting diode, and/or other semiconductor device which includes one or more semiconductor layers, which may include silicon, silicon carbide, gallium nitride and/or other semiconductor materials, a substrate which may include sapphire, silicon, silicon carbide and/or other microelectronic substrates, and one or more contact layers which may include metal and/or other conductive materials. A solid-state lighting device produces light (ultraviolet, visible, or infrared) by exciting electrons across the band gap between a conduction band and a valence band of a semiconductor active (light-emitting) layer, with the electron transition generating light at a wavelength that depends on the band gap. Thus, the color (wavelength) of the light emitted by a solid-state emitter depends on the materials of the active layers thereof. In various embodiments, solid-state light emitters may have peak wavelengths in the visible range and/or be used in combination with lumiphoric materials having peak wavelengths in the visible range. Multiple solid state light emitters and/or multiple lumiphoric materials (i.e., in combination with at least one solid state light emitter) may be used in a single device, such as to produce light perceived as white or near white in character. In certain embodiments, the aggregated output of multiple solid-state light emitters and/or lumiphoric materials may generate warm white light output having a color temperature range of from about 2200K to about 6000K.
Solid state light emitters may be used individually or in combination with one or more lumiphoric materials (e.g., phosphors, scintillators, lumiphoric inks) and/or optical elements to generate light at a peak wavelength, or of at least one desired perceived color (including combinations of colors that may be perceived as white). Inclusion of lumiphoric (also called ‘luminescent’) materials in lighting devices as described herein may be accomplished by direct coating on solid state light emitter, adding such materials to encapsulants, adding such materials to lenses, by embedding or dispersing such materials within lumiphor support elements, and/or coating such materials on lumiphor support elements. Other materials, such as light scattering elements (e.g., particles) and/or index matching materials, may be associated with a lumiphor, a lumiphor binding medium, or a lumiphor support element that may be spatially segregated from a solid state emitter.
As shown in
UL approved tombstone connectors 210.
Because LED based solid state lamps use less energy, are more durable, operate longer, can be combined in multi-color arrays that can be controlled to deliver virtually any color light, and generally contain no lead or mercury the conversion to, or replacement of fluorescent lighting systems with, LED lighting systems is desired. In some existing replacement lamps the entire fluorescent fixture including the troffer must be replaced. The conversion from a fluorescent light to a solid state LED based light may be time consuming and expensive. In the system of the invention, a traditional fluorescent light may be converted to an LED based solid state lamp quickly and easily by replacing the fluorescent bulb with an LED lamp. The LED lamp fits into the same housing as the fluorescent tube and uses the existing tombstone connectors to provide current to the LED lamp. The LED lamp of the invention allows a traditional fluorescent light to be converted to a solid state LED lamp without requiring specialized tools, equipment or training.
In one embodiment the LED lamp 1 comprises an optically transmissive tube 2 that retains the LED assembly 4 and that acts as a lens for transmitting light from the lamp. The tube 2 covers the LED assembly 4 and creates a mixing chamber 6 for the light emitted from the LEDs 10. In the drawings the tube 2 is shown as transparent in order to show the interior structure of the lamp. In actual use the tube 2 may be provided with a diffuser layer or layers, as shown in
In one embodiment the tube 2 has a generally circular cross-section and has a length and a diameter suitable for use in existing light fixtures that use tombstone connectors. For example, in one common application the tube has a diameter of approximately 1 inch and a length that together with the end caps 60 is sized to fit into a 48 inch light fixture housing. While a specific length has been described it will be appreciated that the lamp may be made in any suitable length including standard and non-standard lengths. Moreover, while a standard one inch diameter lamp is described the lamp may be made in any suitable diameter including standard and non-standard diameters. While a circular tube has been described the tube may also be formed in other cross-sectional shapes such as an oval, other rounded shape, faceted, squared off or other non-circular profile.
The LED lamp 1 comprises an LED assembly 4 that may be supported by and secured in the tube 2. The LED assembly 4 may comprise a plurality of LEDs or LED packages 10 that are mounted on a substrate 20. The LEDs 10 may extend the length of, or substantially the length of, the tube 2 to create a desired light pattern. The LEDs 10 may be arranged such that the light pattern extends the length of, or for a substantial portion of the length of, the tube 2 and emits a similar light pattern as a traditional fluorescent bulb. While in one embodiment the LEDs 10 extend in a line for substantially the entire length of the tube 2, the LEDs 10 may be arranged in other patterns and may extend for less than substantially the entire length of the base if desired. For example, the LEDs may be disposed along the edges of the supporting substrate 20 and directed toward the middle of the lamp. The LEDs may be directed into a waveguide. The substrate may have a multi-faceted support surface where the faces extend at angles relative to one another. For example as shown in
The LEDs 10 may be mounted on a substrate 20 that provides physical support for the LEDs 10 and provides an electrical path for providing electrical power to the LEDs 10. The electrical path provides power to the LEDs 32 and may comprise the connectors 94 to a power source, substrate 20 and intervening lamp electronics 22. The substrate 20 may comprise a flex circuit 20a where the flex circuit 20a may comprise a flexible layer of a dielectric material such as a polyimide, polyester or other material to which a layer of copper or other electrically conductive material is applied such as by adhesive. Electrical traces are formed in the copper layer to form electrical pads for mounting the electrical components such as LEDs 10 and lamp electronics 22 on the flex circuit and for creating the electrical path between the components. In other embodiments the substrate 20 may comprise a PCB such a PCB FR4 board. A PCB FR4 board comprises a thin layer of copper foil laminated to one, or both sides of an FR4 glass epoxy panel. The FR4 copper-clad sheets comprise circuitry etched into copper layers to make the PCB FR4 board. In both the PCB FR4 board and the flex circuit the copper metal layer is supported on a low thermally conductive layer, either a glass epoxy panel or a polyimide layer, where the LEDs are mounted in the enclosure on the LED board without a heat sink.
The copper layer of the PCB FR4 board or flex circuit may be covered by a cover coat that may be a thin paint later or soldermask that is primarily used to position the components during the reflow process. The copper layer is thermally exposed in that this cover coat layer is not thermally insulating and heat may be transferred from the copper layer to the surrounding air. Other embodiments of a flex circuit or PCB FR4 board may also be used.
In some embodiments the flex circuit 20a may be supported on a base 24 where the base 24 may be made of a rigid, thermally conductive material such as aluminum. While aluminum may be used, other rigid, thermally conductive materials may be used to form the base 24. While the base 24 may be a planar member as shown in
The LEDs 10 may be provided in a wide variety of patterns and may include a wide variety of different types and colors of LEDs to produce light in a wide variety of colors and/or light patterns. Example embodiments of interfacing one or more LEDs to AC-output lighting ballasts are described in a related U.S. patent application entitled “LED LIGHTING APPARATUS FOR USE WITH AC-OUTPUT LIGHTING BALLASTS” by Zhang et al., Attorney Docket No. 5308-1954TSIP, the disclosure of which is incorporated by reference herein in its entirety. Example embodiments of interfacing LED strings to fluorescent emergency lighting ballasts are described in a related U.S. patent application entitled “EMERGENCY LIGHTING CONVERSION FOR LED STRINGS” by McBryde et al., Attorney Docket No. 5308-2049TSIP, the disclosure of which is incorporated by reference herein in its entirety. One embodiment of a LED lamp and suitable LED structure is shown and described in U.S. patent application Ser. No. 12/873,303 entitled “Troffer-Style Fixture” filed on Aug. 31, 2010, which is incorporated by reference herein in its entirety. In one embodiment the LEDs are positioned at regular intervals in a repeating pattern. For example in one embodiment XH-G LEDs manufactured and sold by CREE INC. may be used. The LEDs may be arranged in a line at spaced intervals of 10-11 mm over the length of the substrate 20 where the substrate 20 extends for the length of tube 10. For a 48 inch lamp in some embodiments between approximately 80 and 200 LED may be used, and more particularly between about 100 and 150 LEDs may be used, and, in one embodiment of a 48 inch lamp, approximately 105 LEDs may be used. In other embodiments 105 XQB LEDs manufactured and sold by CREE INC. may be used to create the LED assembly. The spacing and number and types of LEDs may vary to change the performance characteristics of the lamp. The lamp may be operated at between approximately 10W to 300W but more particularly may be operated between 18W and 24 W.
A 48 inch lamp includes a tube 2 and substrate 20 that are slightly smaller than 48 inches to allow room for the end caps 60 such that the flex circuit may be approximately 46 inches long. It will be appreciated that the production of a 46 inch long flex circuit may be technologically difficult or cost prohibitive. In some embodiments the 46 inch flex circuit 20a may be created using a plurality of smaller identical flex subcircuits 20b that are physically and electrically coupled to one another to create a flex circuit of the desired length. For example, with existing commercially available technologies the length of a flex circuit may be limited to approximately 19 inches. Thus, to create a 46 inch flex circuit three smaller identical flex subcircuits 20b are used that are physically and electrically coupled to one another where each subcircuit 20b is approximately 15-16 inches in length. While a plurality of smaller flex subcircuits coupled together to form a larger flex circuit may be used, a single large flex circuit may be used where practical.
Flex circuits are typically formed in a long ribbon where the ribbon comprises a plurality of identical flex circuits. The ribbon may be cut to a desired length. Thus, for example, to create a 46 inch flex circuit a continuous ribbon of identical 15-16 inch subcircuits is created where the ribbon is cut every three subcircuits to create a single flex circuit of approximately 46 inches (composed of three 15-16 inch identical subcircuits) suitable for use in a 48 inch lamp.
In some applications the electronics 22 for the LEDs 10 are mounted to the flex circuit 20a at one or both ends of the flex circuit and the LEDs are evenly spaced along the length of the flex circuit. In some embodiments some of the electronic components may be larger than the desired spacing between the LEDs such that the placement of the electronic components on the flex circuit may affect the spacing between the LEDs 10. In some embodiments the difference in spacing is visually noticeable. For example, in one embodiment the desired spacing between the LEDs 10 may be approximately 10-11 mm as previously described. In some applications electrical components, for example a large inductor 23, may have a footprint that is larger than 11 mm such that the component may not fit between two evenly spaced adjacent LEDs.
To minimize the visual effect of such components on the emitted light pattern, the flex circuit 20a may be provided at certain locations with two electrical pads arranged in parallel with one another where the two pads comprise a primary pad that is evenly spaced from the adjacent pads and a spare pad that is spaced at a different distance from the adjacent pads. One or the other of the coupled pads may be used to vary the spacing of the LEDs 10 slightly to accommodate other components. Referring to
This technique may also be used to accommodate other components of the lamp in addition to electrical components where the placement of the LEDs may interfere with the other components. In some embodiments the mounting structure for mounting the end caps 20 to the tube 2 and to the LED assembly 4 may interfere with the placement of the outermost LEDs, as will be explained. To accommodate the mounting structure the outermost LED pads may be arranged in a primary/spare parallel pair 25a, 25b where the spare pad 25b may be used to create additional space for the mounting structure. The use of primary/spare parallel pads may be used in any location along the substrate where the location of the LEDs may have to be varied from the evenly spaced primary locations. In embodiments where the LEDs do not have to be evenly spaced, or where the spacing of the LEDs is not affected by other components, or where the circuit is not made of a plurality of identical subcircuits the use of primary/spare parallel pads may be eliminated. For example, in one embodiment the lamp electronics may be mounted on the end caps rather than on the substrate 20. Further, in some embodiments the primary locations may not be evenly spaced. The use of spare pads coupled in parallel to selected ones of the primary pads may be advantageously used where in some circumstances LEDs may need to be mounted in alternate secondary locations.
In some embodiments the substrate 20 such as the flex circuit 20a or PCB FR4 board may be mounted directly to the tube 2. In one embodiment the substrate 20 may be mounted directly to the tube 2 using an adhesive. For example an adhesive, epoxy or other similar bonding agent (collectively “adhesive”) may be applied to one side of the tube along the length of the tube. The adhesive may be applied as spaced drops or it may be applied as a line of adhesive. The substrate may be inserted into the tube with the back side of the substrate facing the adhesive. The substrate is pressed against the adhesive and the adhesive cures to fix the substrate against the tube. In embodiments where a base is used to support the substrate, the base may be adhered to the tube. Further, the adhesive may be applied to the substrate or base rather than to the tube.
In one embodiment, an elongated arm 50 is inserted into the tube 2 from one open end of the tube as represented by arrow A in
To facilitate the explanation of the structure of the lamp, the side of the lamp behind the LEDs 32 is referred to as the back of the lamp and the side of the lamp facing the LEDs 32 is referred to as the front of the lamp. In the drawings the bottom portion of the lamp is the back of the lamp and the top portion of the lamp is the front of the lamp. The lamp is shown in the drawings with the LEDs 32 facing upward, but in a typical use the lamp is located in a ceiling fixture where the LEDs 32 face downward. Thus, in a typical use the front of the lamp faces outwardly and downwardly from the fixture and the back of the lamp faces inwardly and upwardly. The horizontal centerline of the lamp is a theoretical plane that is at the center or diameter of the tube and is parallel to the substrate 20. The height of the tube is the vertical distance between the back of the tube and the front of the tube along an axis that is generally at a right angle to the horizontal centerline.
As illustrated in the figures the substrate 20 is arranged in the tube 2 such that it is positioned offset from the horizontal centerline of the tube 2 such that the substrate is disposed closer to the back of the tube than the front of the tube. Locating the substrate 20 offset from the centerline of the tube, provides a larger mixing chamber in front of the LEDs and provides for more backlight due to the light reflecting towards the back of the tube from the diffuse tube. The substrate 20 is arranged such that it is disposed at a distance from the front of the enclosure that is preferably below the horizontal centerline of the tube 2. In some embodiments the substrate 20 is more than 66% of the height of the tube from the front of the tube, in others embodiments the substrate 20 is more than 75% of the height of the tube from the front of the tube, in other embodiments the substrate 20 is more than 85% of the height of the tube from the front of the tube, and in some embodiments the substrate 20 is more than 90% of the height of the tube from the front of the tube. Another mechanism for effectuating this mixing and increased backlight is to make the width of the substrate 20 narrower relative to the width of the tube. As the width of the substrate is decreased the board will sit lower in the tube, i.e. closer to the back of the tube. A narrower substrate 20 also allows more light to be emitted from the tube as backlight because the narrower substrate blocks less light. Similar to where the board sits in the tube, the width of the tube 2 can also be decreased to less than 50% of the diameter of the tube, less than 33% of the diameter of the tube, less than 25% of the diameter of the tube, or less than 15% of the diameter of the tube. The tube 2 is arranged such that to the lateral sides of the LEDs 10 there is no structure to block light emitted by the LEDs. In some embodiments the longitudinal edges of the substrate 20 engage the sides of the tube 2. The planar LED substrate 20 and base 24, if used, do not obstruct light emitted laterally from the LEDs 10. The tube 2, in some embodiments, may be configured such that the width of the tube 2 at its widest portion is larger than the width of the substrate 20. In other words the ratio of the substrate width to the maximum tube width is less than 1. As a result, light may be emitted from the tube 2 as backlight that is not blocked by the substrate 20. As a result of this arrangement some of the light generated by the LEDs 10 is directed as backlight in a direction behind the plane of the LEDs 10. Some of the light emitted by the LEDs may be emitted directly as backlight while other light emitted by the LEDs may be reflected off of the tube and emitted as backlight. The backlight creates a light distribution pattern that is similar to the light distribution pattern of a traditional fluorescent system. It will be understood that in a traditional fluorescent system the fluorescent tube generates light over 360 degrees. As a result, some of the light generated by the fluorescent tube is reflected from the fixture housing. The backlight generated by the LEDs 10 may be directed toward and reflected from the fixture housing such that the LED lamp of the invention provides a visual appearance similar to the of a fluorescent tube. Such an arrangement provides an LED lighting system that provides a light distribution pattern that is similar to legacy fluorescent tube lights. In some embodiments, the LEDs may be center mounted with greater side emitting optical profiles such as CREE XPQ LEDs. In some embodiments a prismatic lens or parabolic reflectors may be used to create a desired light distribution. Further, combinations of different types of LEDs may be used to create a variety of light patterns and intensities. Moreover, the light distribution can also be effected by the shape of the tube which can be circular oval or other shapes. While the arrangement of the substrate 20 in the enclosure has been described with respect to a generally cylindrical tube 2, the principles also apply to a tube having a different cross-sectional shape. In non-circular cross-sections, the height of the tube may be considered the distance between the front and back of the optically transmissive enclosure and the width of the tube may be considered the distance transverse to the height at the enclosure's widest part.
In embodiments using a flex circuit or a PCB FR4 board mounted in a tube as described herein, the copper of the flex circuit 20 or PCB FR4 board provides sufficient heat transfer from the LEDs to the air in the interior of tube 2 that a heat sink structure is not used. The LEDs may operate at a steady state where heat is transferred from the flex circuit or PCB such as a PCB FR4 board to the air in the tube and to the ambient environment at a rate that a heat sink is not required. The LEDs are driven at a relatively low current such that the amount of heat generated by the LEDs is low enough that the heat transfer from the LEDs via the flex circuit or PCB such as a PCB FR4 board is sufficient to operate the LEDs at a steady state without a heat sink structure. By using efficient LEDs operated at low current the heat generated by the LEDs may be dissipated from the LED assembly using only the copper layer in the flex circuit or PCB such as a PCB FR4 board.
The LED assembly may comprise three sets of LEDs where the LEDs of each set are connected in series with the sets connected in parallel. Approximately 35-50 LEDs may be used in each string. In one embodiment the 137 total LEDs may be operated at 137V with each LED string operating at about 77 mA. In another embodiment 120 total LEDs may be operated at about 120V with each string at 65 mA. In another embodiment 105 total LEDs may be operated at 105V with each string at 59 mA. The LED assembly uses a relatively large number of LEDs, approximately 100-150 total LEDs, operated at relatively low current such that relatively little heat is generated by the LEDs such that the metal layer in the flex circuit, PCB such as FR4 PCB board is sufficient to dissipate heat from the LEDs at a steady state operation. The LEDs may be operated at less than 100 mA and in some embodiments may operate at between approximately 30-100 mA and may be operated at between 50-80 mA. Due to operating constraints of existing ballasts and safety requirements, embodiments of the present invention have an operating voltage of about 150V or less.
In one embodiment, LEDs may be used that generate greater than about 115 Lumens per Watt (LPW). The lamp operates at least approximately 100 LPW and in some embodiments may be between approximately 100 LPW and 140 LPW and in some embodiments may be between approximately 100 LPW and 110 LPW. In a lamp as shown and described, the system efficiency loss is approximately 15% such that for a particular LPW operation of the lamp, the LEDs typically must be approximately 15%, or greater, more efficient than the efficiency of the lamp. Suitable LEDs are XQ LEDs and XH LEDs manufactured by CREE INC. The lamp operates at these efficiencies while having a correlated color temperature (CCT) of between about 3000 and 4000K and more particularly between about 3,500 and 4000K at the LPW. In one embodiment the LEDs are spaced approximately greater than 7 mm apart, such as 8-15 mm apart or about 10-12 mm apart center to center with an input power of approximately 20 Watts. A thermally exposed copper layer having a width of between approximately 12 mm and 17 mm provides good thermal control and dissipates enough heat from the LEDs to provide an efficient steady state operation at approximately 2100 Lumens output. In some embodiments the thermally exposed copper layer may be reduced to as low as 7 mm, however, the solder point temperature may increase to a level that may reduce the life of the LEDs. A thermally exposed copper layer having a width of between approximately 7 mm and 12 mm reduces lumen output to about 1900 Lumens of the LEDs.
In some embodiments 105 LEDs are used in a 48 inch lamp providing light having a CRI of between approximately 70 and 95 and more particularly between approximately 78 and 85 and in one embodiment the CRI is approximately 90. The LEDs may be operated between approximately 100 and 120 Lumens per Watt (LPW) and more particularly between approximately 100 and 110 LPW. In some embodiments the LPW of the LEDs may be greater in order to achieve a lamp efficiency of greater than about 110-115 LPW. In some embodiments the lamp may have a total Lumen output of between 1750-2500 Lumens, such as 1900-2250 Lumens. The lamp may have a total Lumen output of over 2000 Lumens, such as 2000-2250 Lumens, and in one embodiment the lamp has a total Lumen output of approximately 2159 Lumens. The lamp of the invention may have an optical efficiency of over approximately 75% and in some embodiments may have an optical efficiency of between approximately 75% and 98% and more particularly between approximately 88% and 95% and in one embodiment the efficiency is approximately 89%.
End caps 60 may be provided at the opposite ends of the tube 2 to close the interior mixing chamber 6 of LED lamp 1 and to support the electrical connectors 94 for connecting to the tombstone connectors 210 of the housing. The end caps 60 and tube 2 together define an enclosure that retains the LEDs 10. The enclosure is at least partially optically transmissive through the tube 2.
The end caps 60 are identical such that the structure and operation of one end cap will be described. The end cap 60 comprises an internal chamber 62 defined by a side wall 61 and an end wall 63 dimensioned and shaped to closely receive the tube 2. In one embodiment the tube 2 is slid into the chamber 62 and is closely received by the side wall 61. The end caps 60 may be secured to the tube 2 using adhesive, a friction fit, mechanical engagement structures, separate fasteners and/or the like. To properly position the substrate 20 relative to the end cap 60, an alignment member 70 may extend from the internal chamber 62 of end cap 60 that engages the underside of the substrate 20 to position the substrate at the proper elevation relative to the end cap 60 and to provide support a support surface 71 for the substrate 20. The alignment member 70 may have a ramped support surface 71 to guide the substrate 30 into the end cap 60. The support surface 71 may be planar to support the substrate such as flex circuit 20a in a flat position.
The end wall 63 defines a semicircular slot 72 for receiving the control member 76. The side wall 61 also comprises a bearing surface 75 on which the electrical control member 76 rides and a pair of stops 77 for limiting rotation of the control member 76 relative to the end cap 60 as will be described. The rotating control member 76 is fixed to the end cap 60 such that the control member 76 may rotate relative to the end cap 60 but is otherwise fixed to the end cap 60. In one embodiment, the rotating control member 76 includes a body 77 that is disposed outside of the end cap, a spacer 78 that extends from the body 77 into the aperture 72, and a stop 79 that also extends from body 77 and into aperture 72. The stop 79 and spacer 78 may slide in aperture 72 such that the control member 76 may rotate relative to the end cap 60. The stop 79 and spacer 78 are provided with locking portions 80 that engage the interior surface of end wall 63 to retain the stop 79 and spacer 78 in the slot 72. When the locking portions 80 are positioned inside of the slot 72 the locking portions 80 are disposed behind the end wall 63. The stop 79 and spacer 78 are dimensioned such that the end wall 63 is trapped between the locking portions 80 and the body 77 of the control member 76 but the control member 76 is free to rotate relative to the end wall 63. In one embodiment, the stop 79 and spacer 78 and/or the end wall 63 may deform to allow the locking portions 80 to be inserted into the slot 72. The rotating control member 76 may be provided with a protruding area 84 that forms a lever that may be easily accessed by a user to rotate the control member 76 during installation of the lamp as will be described. The protruding area 84 may be provided with a flange or flanges 81 that create a slot or slots 82 for receiving the bearing surface 75 of the end cap 60 such that the control member 76 is also secured to the end cap 60 by the engagement of the bearing surface 75 with the flanges 81. The protruding area 84 may be knurled to enhance the user's grip on the control member and facilitate the rotation of the control member 76. The control member 76 may also use a detent 77 and tang 79 arrangement between the control member 76 and the end cap 60 to temporarily “lock” the control member relative to the end cap and to provide feedback to the user as to the proper position of the end cap. Other mechanisms for mounting the rotating member to the end caps may also be used.
The control member 76 supports a pair of pins 94 such that rotation of the control member 76 rotates pins 94. The pins 94 are mounted in apertures 96 in the body 77 and are positioned and dimensioned such that the pins 94 are able to mechanically and electrically engage the tombstone connectors 210. In some embodiments a single pin 94 may be used to complete the electrical connection where the second pin may be used only to provide physical support for the lamp in the tombstone connectors. The pins 94 may be insert molded into the control member 76 or the pins 94 may be fixed in the control member 76 using any suitable connection mechanism including a press fit, adhesive, mechanical connector or the like. The pins 94 extend through the control member 76 such that a portion of the pins communicate with the interior of the lamp to create contact pads 96.
Conductors 104 are electrically coupled to the pins 94 and to electrical contacts 106 formed on the LED substrate 20 to complete the electrical path between the pins 94 and the LED assembly 4. The conductors 104 may comprise resilient members that may be biased into engagement with contacts 106 on the LED substrate 20. The conductors 104 comprise resilient members made of an electrically conductive material such as copper. Each conductor has a first end supported in slots 100 formed in the end wall 63 of the end cap 60 such that contact pads 102 are created on the exterior of the end cap. The opposite ends of the conductors 104 extend into the internal space 62 of the end cap 60 where the conductors 104 make contact with electrical contacts 106 on the substrate 20. The conductors 104 are configured and supported such that the free ends of the conductors 104 are biased into engagement with the contacts 106. An insulator 116 may be provided between the conductors 104 to electrically insulate the conductors from one another. An electrical path may be created between the pins 94 and the substrate 20 to provide both sides of critical current to the LED assembly when the pads 96 of pins 94 are in contact with pads 102 of conductors 104 and the conductors 104 are biased into engagement with electrical contacts 106 on the substrate 20.
Referring to
Because the lamp of the invention is intended to be used as a replacement for standard fluorescent tubes the pins 94 are positioned in the same relative location as the pins on a standard fluorescent tube such that the lamp of the invention may be used in standard fluorescent housings and with standard tombstone connectors. The length of the lamp 1 of the invention may also be dimensioned to fit standard fluorescent bulb length housings such that the lamp 1 extends between a pair of tombstone connectors 210 with the pins 94 extending into and engaging the tombstone connectors.
Operation and assembly of the end caps will now be described. To assemble the end cap 60 the conductors 104 are inserted in the slots 100 such that the distal ends of the conductors 104 are positioned in the interior 62 of the end cap 60. The control member 76 is mounted to the end cap 60 by inserting the stop 79 and the spacer 78 into the circular slot 72 and snapping the flanges 81 over the bearing surface 75. The control member 76 is constrained to rotate relative to the end cap 60. During assembly of the control member 76 to the end cap 60, the spacer 78 is disposed between the ends of the conductors 104 and the support surface 71 to move the ends of the conductors 104 away from the support surface 71 to create a gap between the conductors 104 and the support surface 71 for receiving the substrate 20. The stop 79 is inserted into opening 106 formed at the distal end of the slot 72. This position of the control member 76 relative to the end cap 60 is the assembly position and is shown in
The spacer 78 is used to create a gap between the support surface 71 and the conductors 104 because a flex circuit, because of its flexibility, requires a near zero insertion force. If the substrate is rigid or if a flexible substrate is mounted on a rigid base the substrate may be inserted between the conductors 104 and the support surface 71 where the rigid substrate deforms the conductors 104 to create the bias between the conductors and the substrate.
With the control member 76 in the assembly position, the end cap 60 is fit onto the end of the tube 2 and is secured thereto as previously described. As the tube 2 is slid into the end cap 60 the substrate 20 slides over the support surface 71 and is positioned in the gap created by spacer 78 between the conductors 102 and the support surface 71.
After the end cap 60 is mounted on the tube 2, the control member 76 is then rotated to the operational position of
When the control member 76 is rotated to the operational position of
To assemble the lamp of the invention, an LED substrate 20 is populated with LEDs 10 and lamp electronics as previously described. The LED substrate 20 is inserted into the tube 2 and is secured to and supported by the tube 2 as previously described. The end caps 60 are mounted on the tube 2 as previously described and the control member 76 is rotated to the operational position to complete the assembly. Because a relatively large number of LEDs 10 are used that may be operated at relatively low power to generate sufficient lumens to comply with existing standard for fluorescent tubes, the LEDs do not generate high heat. As a result, in addition to providing the electrical connection between the LEDs and other lamp electronics the copper layer of the substrate 20 is sufficient to function as a heat sink to dissipate heat generated by the LEDs 10 to the air or other gas in the tube 2. The tube 2 dissipates the heat to the ambient environment to create a steady state temperature that does not adversely affect the operation of the LEDs.
To retrofit an existing fluorescent fixture, the existing fluorescent tubes 213 are removed from the fixture housing. The control members 76 are positioned in the operational position of
In an alternate embodiment the electrical pads 102 formed on the exterior of the end caps 60 may be arranged, such as in an arc of a circle, such that the pins 94 are always in contact with the electrical pads 102. Because the pins 94 are rotatable relative to the tube 2, the tube 2 may be rotated relative to the pins 94 after the lamp is mounted in the housing to provide more directional light.
While the LED lamp 1 has been described herein as a retrofit of a traditional fluorescent light, the LED lamp 1 and the assembly method described herein may also be used to make new LED based fixtures. An LED lamp 1 as described herein may be manufactured as a complete subassembly and may be attached to a new housing 200 as described to create a new fixture.
In an alternate embodiment the substrate may be mounted in the lamp without being attached to the tube as shown in
An embodiment of an end cap 160 usable in the embodiments of
To engage the conductors 164 with the clip 152, a hole 166 may be formed in the control member 76 and a second hole 168, aligned with hole 166, is formed in the end wall 63 of the housing 160. An elongated tool 170 may be inserted into the holes 166, 168 to push the conductors 164 to a deformed position where the substrate 20 may be inserted under the conductors 164 as the end cap 160 is inserted onto the tube 2. When the tool 170 is removed, the conductors 164 return to the undeformed state where the hook 166 is biased into engagement with the clip 152 such that the conductors 164 exerts a tension force on the substrate 20 sufficient to suspend the substrate 20 in the tube 2 with minimum sag or vibration. The substrate 20 is supported between the end caps 60 at either end of the tube 2 such that the substrate 20 is pulled between the end caps 60 and is supported under tension. The substrate 20 is suspended in the tube 2 such that it is spaced from the tube 2 and is supported only at its ends by the engagement of the conductors 164 with the clips 152.
While a clip 152 has been shown that is mounted to the substrate 20, the engagement structure may comprise reinforced electrically conductive eyelets that extend through the substrate 20 or other structures. The conductor 164 may have a distal end configured as other than a hook provided it can engage the engagement structure on the substrate.
In some embodiments the rotation of the ends of the conductors 164 during assembly of the end caps 160 to the tube 2 may interfere with the LEDs 110 mounted at the ends of the substrate 20 adjacent the mounting structure 150. To allow for movement of the conductors 164, the pads located at the ends of the substrate may be provided with paired parallel primary and spare pads as previously described to allow the LEDs to be moved slightly away from the end of the substrate to accommodate movement of the conductors 164.
In some embodiments the pins 94 may be mounted to the end caps in a fixed position such that the pins 94 do not rotate relative to the lamp as shown in
Although specific embodiments have been shown and described herein, those of ordinary skill in the art appreciate that any arrangement, which is calculated to achieve the same purpose, may be substituted for the specific embodiments shown and that the invention has other applications in other environments. This application is intended to cover any adaptations or variations of the present invention. The following claims are in no way intended to limit the scope of the invention to the specific embodiments described herein.
This application claims benefit of priority under 35 U.S.C. §119(e) to the filing date of U.S. Provisional Application No. 61/919,192, as filed on Dec. 20, 2013, which is incorporated herein by reference in its entirety.
Number | Date | Country | |
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61919192 | Dec 2013 | US |