1. Technical Field
The present disclosure relates to LED (light emitting diode) lamps and, more particularly, to an LED lamp having enhanced waterproofing.
2. Description of Related Art
LEDs are well known solid state light sources, in which current in a forward direction at a junction, comprising two different semiconductors, electrons and cavities generate light. LEDs provide advantages of resistance to shock and practically limitless lifetime under specific conditions. When deployed in a lamp, LEDs offer a cost-effective yet high quality alternative to incandescent and fluorescent fixtures.
An LED lamp generally requires a plurality of LEDs mostly driven at the same time, which results in a rapid rise in operating temperature of the LEDs. However, since the lamps lack effective heat dissipation capability, continuous operation of the LEDs can cause instability in light emitted from the LEDs. Consequently, the LED lamp usually comprises a heat sink contacting the LEDs to dissipate the heat generated thereby. When the LED lamp is used outdoors for illumination, dust and moisture may enter the LED lamp, causing current leakage or short circuit, or other contamination of the LEDs. A conventional waterproof structure of an LED lamp includes a waterproof gasket and a groove defined in an envelope which correspondingly covers the LEDs. The envelope is disposed on the heat sink. The waterproof gasket received in the groove is sandwiched between the envelope and the heat sink. However, this conventional structure requires multiple through holes defined in the envelope for multiple screws respectively extending through the envelope and screwing into the heat sink. For the envelope generally made from specific transparent materials, such as glass, the work in forming the through holes in the envelope is relatively difficult and may result in a high defect rate of products. In addition, rainwater can creep through the holes of the envelope to enter an inside of the LED lamp. Thus, such engagement of the envelope to the heat sink by extending screws through the envelope has drawbacks.
What is needed, therefore, is an improved LED lamp which can overcome the described disadvantages.
Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
Referring to
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The heat sink 20 is integrally made of a metal with high heat conductivity, such as copper, aluminum, or an alloy thereof. The heat sink 20 comprises an elongated base 22, a plurality of spaced fins 24 extending upwardly from a top face of the base 22 and a plurality of spaced fixing brackets 26, to which the LED modules 30 are respectively attached, extending downwardly from a bottom face of the base 22. The base 22 is a rectangular plate. A width of the base 22 is substantially the same as that of the vertical section 120 of the frame 12, and a thickness of the base 22 is less than a distance between the protrusion 16 and the engaging flange 14. The base 22 is longer than the lamp bracket 10 so that an end of the base 22 would extend beyond the bracket 10, when the heat sink 20 is assembled on the lamp bracket 10. Each of the fixing brackets 26 comprises two rectangular plates (not labeled) extending from the bottom face of the base 22 inclinedly and towards each other, whereby a cross-section of the fixing bracket 26 is V-shaped. The two plates of each fixing bracket 26 and the base 22 cooperatively define a triangle space (not labeled) therebetween. The fixing brackets 26 are in alignment with each other and extend in a lengthwise direction of the base 22.
Each of the LED modules 30 comprises a printed circuit board 32 having a rectangular shape, and a plurality of LEDs 34 mounted on the printed circuit board 32 and arranged evenly in a lengthwise direction of the printed circuit board 32. The LED modules 30 are thermally fixed on outer faces of the plates of the fixing brackets 26, respectively.
The light-guiding board 40 has a configuration corresponding to that of the fixing bracket 26 of the heat sink 20, whereby the light-guiding board 40 can be correspondingly fixed on the fixing bracket 26 of the heat sink 20 and cover the LED modules 30 mounted thereon. The light-guiding board 40 defines a plurality of tapered cavities 42 in which the LEDs 34 of the LED modules 30 are received, whereby when the LEDs 34 are activated, a part of light emitted from the LEDs 34 is able to emit to outside directly, and remaining part of the light is reflected by inner faces of the cavities 42; thus, a high-intensity illumination is obtained.
The envelope 50 has a cuboid configuration and defines a cavity (not labeled) in a top face thereof. An annular fixing flange 52 extends outwardly and horizontally from a circumference of a top end of the envelope 50. An annular groove (not labeled) is defined in a top face of the fixing flange 52 for receiving a waterproof gasket 54 therein. The waterproof gasket 54 abuts against the bottom face of the base 22 to thereby hermetically seal the cavity of the envelope 50. The envelope 50 is made of transparent material such as plastic, glass, or other suitable material availing to transmit light.
Referring to
It is believed that the present embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.
Number | Date | Country | Kind |
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2008 1 0305304 | Oct 2008 | CN | national |
Number | Name | Date | Kind |
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7766510 | Lee | Aug 2010 | B2 |
Number | Date | Country | |
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20100110683 A1 | May 2010 | US |