In the accompanying drawings:
Preferred embodiments are explained below with reference to the accompanied drawings.
An LED lighting device according to the first embodiment of the present invention is composed of a light emission part 1 provided with LEDs and a heat radiator for the LEDs, a power source part 2 generating a current to be supplied to the LEDs from a commercial power source, and an air circulation part 3 for circulating ambient air. The light emission part 1 and the power source part 2 are thermally separated by the air circulation part 3. The light emission part 1 is, as shown in
A front face of the heat radiation base 10 is covered with an opaque white translucent cover 18 which radiates light emitted from the plurality of LED chips 16 (six chips in this embodiment) mounted on the LED substrate 17 and diffuses the light in a planar form.
The power source part 2 is provided with a screw base 21 to be screwed to a socket of a lighting device using a commercial power source (100V), a contact 22 which is insulated from the screw base 21, a case 23 made of insulating material such as plastic of which base end portion is adhered and fixed to the screw base 21, a power source substrate 24 fixed to an inside of the case 23 with a screw or an adhesive, and a cover plate 25 for closing an opening on a top of the case 23 and for fixing the leg portions 15 of the heat radiation base 10 thereto. In the present embodiment, the heat radiation base 10 is fixed to the cover plate 25 by inserting fixing tabs 15a formed on distal ends of the leg portions 15 into holes formed in the cover plate 25 and bending or turning protruding portions of the fixing tabs 15a. However, other fixing means such as screws may be employed.
Inside the case 23, lead wires 26 and 27 are connected to the screw base 21 and the contact 22 by soldering or the like at base ends thereof and to terminals of the power source substrate 24 at distal ends thereof. Electric power which has been converted from AC 100V to a constant direct current by electric or electronic components mounted on the power source substrate 24 is led to the LED substrate 17 provided on the substrate attaching face 12 of the heat radiation base 10 by a lead wire 28, thereby supplying a predetermined current to the LED chips 16.
In each of the cover plate 25 and the heat radiation base 10, a hole for passing the lead wire 28 is formed. In the cover plate 25, it is also possible to form a hole for cooling air inside the case 23. In this case, the position and size of the hole must be designed so as to meet the safety standard for preventing electric shock or the like.
In the first embodiment described above, by putting the screw base 21 into a socket of the same type as an incandescence light bulb, a voltage of 100V alternate current is supplied from the screw base 21 and the contact 22 to a circuit of the power source substrate 24 through the lead wires 26 and 27. Then, a direct current of a predetermined voltage is generated by electric or electronic components mounted on the power source substrate 24, including a resistor, a diode, a zener diode, or a transistor, thereby supplying a predetermined current to the LED substrate 17 through the lead wire 28.
Heat generated from a resistor or a semiconductor component mounted on the power source substrate 24 increases the temperature of the air inside the case 23, which, however, is cooled down by a surface of the case 23. On the other hand, heat generated when the plurality of LED chips 16 mounted on the LED substrate 17 emit light is transmitted to the heat radiation base 10 and released to the outside from the fins 13 on the outer periphery, the fins 14 on the inner periphery of the hole 11, and the leg portions 15. Air which is brought into contact with surfaces of the fins 13 and 14 and the leg portions 15 and heated decreases in its specific gravity and goes up, causing convection, thereby being replaced by the air having lower temperature. At this time, depending on the direction of the LED lighting device in use, the fins that are located at the positions hindering the convection of the air brought into contact with the fins 13 and 14 has lower cooling efficiency. However, since the fins 13, the fins 14 and the leg portions 15 are disposed at different positions toward different directions, respectively, either of the fins or leg portions contributes to improvement in cooling efficiency, which leads to enhancement of heat radiation effect as a whole.
Furthermore, heat generated from the power source part 2 is separated from the light emission part 1 by the leg portions 15, and gaps between the leg portions 15 serve as the air circulation part 3. Therefore, the heat generated from the power source part 2 does not affect the light emission part 1, and thus it is sufficient to take into account only the structure of the heat radiation from the heat radiation part 10, which facilitates designing of the device.
As shown in
The power source part 2 is provided with a screw base 21 to be screwed to a socket of a lighting device using a commercial power source (100V), a contact 22 which is insulated from the screw base 21, a case 35 made of insulating material such as plastic of which base end portion is adhered and fixed to the screw base 21, a power source substrate 36 fixed to an inside of the case 35 with a screw or an adhesive, and a cover plate 37 for closing an opening on a top of the case 35 and for fixing the leg portions 34 of the heat radiation base 30 thereto.
The second embodiment differs from the first embodiment in that the plurality of fins 32 formed on the outer periphery of the heat radiation base 30 extend in a direction perpendicular to a central axis of the hole 31 of the heat radiation base 30 and are layered in a direction parallel to the central axis and that the case 35 is formed in a two-staged cylindrical shape. By forming the fins 32 in the direction as described above, when the LED lighting device is arranged to face in a lateral direction in use, the heat radiation effect is improved compared to the fins 13 directed as in the first embodiment.
Since the remaining structures and actions of the second embodiment are the same as those of the first embodiment, the explanations are omitted.
As shown in
While there has been described what is at present considered to be a preferred embodiment of the invention, it will be understood that various modifications may be made thereto, and it is intended that the appended claims cover all such modifications as fall within the true spirit and scope of the invention.
Number | Date | Country | Kind |
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JP2006-203778 | Jul 2006 | JP | national |