LED lighting equipment

Information

  • Patent Grant
  • 8415889
  • Patent Number
    8,415,889
  • Date Filed
    Wednesday, July 28, 2010
    14 years ago
  • Date Issued
    Tuesday, April 9, 2013
    11 years ago
Abstract
Certain embodiments provide an LED lighting equipment including a lighting main body. An LED power device has a DC power source and a DC-DC converter having an input terminal connected to the DC power source and the DC-DC converter having an output terminal. An LED light source has a board and a plurality of LED packages; each including a plurality of LED chips connected in series. The LED packages are mounted on the board and connected in series to the output terminal of the DC-DC converter.
Description
CROSS-REFERENCE TO RELATED APPLICATION

This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2009-176307 and 2010-138780 filed on Jul. 29, 2009 and Jun. 17, 2010, the entire contents of all of which are incorporated herein by reference.


FIELD

Embodiments described herein relate generally to LED lighting equipment.


BACKGROUND

LED lighting equipment includes an LED package as a source of light mounted on a lighting main body. The LED package includes a plurality of LED chips. An LED power device of the LED lighting equipment is mounted on the lighting main body. Typically the LED package is driven by DC as compared with a traditional incandescent lamp or a compact fluorescent lamp.


Since the LED lighting equipment draws significant current to produce the desired light flux, the LED package generates heat. This heat must be dissipated, because the luminance efficiency of the LED chips falls off when the temperature of the LED chips increases. Furthermore, the LED power device generates heat as it drives the LED package. Thus, it is helpful to control the generation of heat in an LED power device.





BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1 is a vertical cross-sectional view of a LED lamp using an LED power device of the a first embodiment;



FIG. 2 is a plan view of an LED light source of the LED lamp;



FIG. 3 is a view showing a frame format of an LED package;



FIG. 4 is a circuit diagram showing an LED power device;



FIG. 5 is a graph showing the relationship between the DC output voltage of a DC power source and the AC output voltage;



FIG. 6 is a plan view of a LED light source of the LED lamp according to the second embodiment;



FIG. 7 is a circuit diagram showing an LED power device according to the second embodiment; and



FIG. 8 is a graph showing the relationship between the DC output voltage of a X power source and the AC output voltage according to the second embodiment.





DETAILED DESCRIPTION

Certain embodiments provide an LED lighting equipment including a lighting main body. An LED power device has a DC power source and a DC-DC converter having an input terminal connected to the DC power source and the DC-DC converter having an output terminal. An LED light source has a board and a plurality of LED packages, each including a plurality of LED chips connected in series. The LED packages are mounted on the board and connected in series to the output terminal of DC-DC converter.


In FIGS. 1 to 3, a LED lamp using the above-described LED power device is shown.


The LED lamp is provided with: a lighting main body having a heat dissipation member 21 and a case 24 attached to one end of the heat dissipation member 21; a base 26 attached to one end of the case 24; an LED module substrate 22, which is an LED light source, attached to the other end of the heat dissipation member 21; a globe 23 covering the LED module substrate 22; and the LED power device 25.


The heat dissipation member 21 is provided with: a heat dissipation member main body whose diameter is gradually increased from the base 26 on one end to the LED module substrate 22 on the other end; and a plurality of heat dissipation fins formed on the outer circumferential surface of the heat dissipation member main body. The heat dissipation member main body and the heat dissipation fins are formed, integrally with each other, of metallic material such as aluminum having a satisfactory heat conductivity, resin material or the like.


In the heat dissipation member main body has, on the other end, an attachment recess portion to which the LED module substrate 22 is attached. The one end of the heat dissipation member main body has a fit recess portion 21a into which the case 24 is inserted. Moreover, the heat dissipation member main body has an insertion through-hole 21b that communicates with the attachment recess portion 21a. Furthermore, on a circumferential portion on the other end of the heat dissipation member main body, a groove portion 37 is formed along the circumference to face one end of the globe 23.


The heat dissipation fins are obliquely formed such that the amount of protrusion thereof in a radial direction is gradually increased from the one end to the other end of the heat dissipation member main body. The heat dissipation fins are formed and substantially evenly spaced in a circumferential direction of the heat dissipation member main body.


The insertion through-hole 21b is formed such that its diameter gradually increases from the case 24 to the LED module substrate 22.


A ring 27 for reflecting light diffused downward from the globe 23 is attached to the groove portion 37.


The case 24 is formed of an insulating material such as PBT resin and is substantially cylindrically shaped to fit the shape of the fit recess portion 21a. The one end of the case 24 is blocked by a blocking plate serving as a case blocking portion; in the blocking plate, a communication hole 24a has substantially the same diameter as the insertion through-hole 21b and communicates with the insertion through-hole 21b. In the outer circumferential surface of an intermediate portion between the one end and the other end of the case 24, a flange portion 24b serves as an insulating portion to insulate the area between the main body of the heat dissipation member 21 and the base 26 and is continuously formed to protrude in a radial direction around the circumference.


The base 26 is E26 type; it is provided with: a cylindrical shell 26a having screw threads that are screwed into the lamp socket of an unillustrated lighting fitting; and an eyelet 26c that is formed via an insulating portion 26b in the top portion on one end of the shell 26a.


The shell 26a is electrically connected to a power supply; inside the shell 26a, between the shell 26a and the case 24, an unillustrated power line supplies power to the LED power device 25 from the shell 26a.


The eyelet 26c is electrically connected to an unillustrated ground potential and the ground potential of the LED power device 25 via a lead wire 44.


In the LED module substrate 22, over a substrate 22a that is disc-shaped in a plan view, a plurality of LED packages LeP are mounted. The substrate 22a is formed of metallic material such as aluminum having satisfactory heat dissipation. In addition, an insulating substrate such as a common printed substrate or a ceramics substrate may be used as the substrate 22a. The substrate 22a is fixed to the heat dissipation member with an unillustrated screw or the like such that the surface opposite from the surface where the LED packages LeP are mounted makes close contact with the heat dissipation member. In the substrate 22a, in a position slightly displaced with respect to the center position, an interconnection hole 22a1 communicates with the insertion through-hole 21b of the heat dissipation member. The substrate 22a may be bonded to the heat dissipation member with a silicon adhesive having excellent heat conduction or the like.


Through the interconnection hole 22a1, unillustrated wiring connects electrically between the lighting circuit of the TED power device 25 and the LED module substrate 22. In the vicinity of the interconnection hole 22a1, an unillustrated connector receiving portion for connecting a connector disposed at an end portion of the wiring is mounted on the substrate 22a.


On the outer edge portion of the LED module substrate 22, the LED packages LeP are disposed substantially spaced on the same circumference having their center in the center position of the LED module substrate 22.


The seven LED packages LeP are connected in series, as shown in FIG. 2. The LED packages LeP are connected across the output capacitor C3 of the LED lighting circuit 25 (See FIG. 4) as described below. Moreover, as shown in FIG. 3, each LED package LeP mounts and confines three LED chips Ch in the inside of a case 11, and connects the three LED chips Ch in series.


Each TED package LeP is provided with: an unillustrated bare chips Ch that emits, for example, light of blue color; and an unillustrated resin portion that is formed of material such as silicon resin covering the bare chips Ch. The resin portion contains an unillustrated fluorescence substance that is excited by part of the blue light emitted from the bare chips Ch to mainly emit light of yellow color that is the complementary color of the blue color, with the result that each LED package generates light of a white color.


The LED power device 25 is contained in the case 24. FIG. 4 illustrates the circuitry of LED power device 25.



FIG. 4 is a circuit diagram showing a first embodiment of an LED power device.


The LED power device includes a DC power source DC, a step-down chopper SDC, LED packages LeP, a self-excited drive circuit DSG and a turn-off circuit TOF. The self-excited drive circuit DSG and the turn-off circuit TOF constitute a self-excited drive circuit. In addition to these components, a start-up circuit ST is provided.


The DC-power source DC is provided with: a voltage doubler rectifier circuit whose input terminals are connected to an alternating-current power supply AC such as a commercial alternating-current power supply having, for example, a rated voltage of 100V; and smoothing capacitors C1a and C1b. The smoothing capacitors C1a and C1b are connected in series with each other to the output terminals of a bridge rectifier circuit BR. A jumper wire JW which is an example of a select element or a jumper resistor of 0Ω is connected between the bridge rectifier circuit BR and the interconnection between the smoothing capacitors C1a and C1b. Therefore, as shown in FIG. 5, the output voltage of the DC-power source is 200V, around twice the effective value of the power supply AC voltage. A capacitor C2 that is connected to the input terminals of the voltage doubler rectifier circuit BR provides noise reduction.


The step-down chopper SDC is provided with: input terminals t1 and t2 connected to the DC power source DC; output terminals t3 and t4 connected to a load; a switching element Q1; a first circuit A that includes impedance Z1 and a first inductor L1 connected in series and that is connected between the input terminal t1 and the output terminal t3; and a second circuit B that includes the first inductor L1 and a diode D1 connected in series and that is connected between the output terminals t3 and t4. An output capacitor C3, serving as a smoothing capacitor, is connected between the output terminals t3 and t4.


The switching element Q1 of the step-down chopper SDC is formed with a FET (field effect transistor); the drain and the source thereof are connected to the first circuit A. The first circuit A forms the charging circuit of the first inductor L1 via the output capacitor C3 and/or a load circuit which will be described later; the second circuit B and the diode D1 form the discharging circuit of the first inductor L1 via the first inductor L1 and the output capacitor C3 and/or the load circuit which will be described later, respectively. Although the impedance Z1 is formed with a resistor, an inductor or a capacitor having a resistance component of appropriate magnitude can be used as desired.


A plurality of LED packages are used, these LED packages are connected in series to form the load circuit and this load circuit is connected to the output terminals t3 and t4 of the step-down chopper SDC.


The self-excited drive circuit DSG is provided with a second inductor L2 that is magnetically coupled with the first inductor L1 of the step-down chopper SDC. A voltage induced in the second inductor L2 is applied, as a drive signal, between the control terminal (gate) and the drain of the switching element Q1, with the result that the switching element Q1 is kept on. The other terminal of the second inductor L2 is connected via the impedance Z1 to the source of the switching element Q1.


In addition to the configuration described above, in the self-excited drive circuit DSG, a series circuit composed of a capacitor C4 and a resistor R1 is interposed in series between one end of the second inductor L2 and the control terminal (gate) of the switching element Q1. A Zener diode ZD1 is connected between the output terminals of the self-excited drive circuit DSG, and thus an overvoltage protection circuit is formed so as to prevent the switching element Q1 from being damaged by the application of an overvoltage between the control terminal (gate) and the drain of the switching element Q1.


The turn-off circuit TOF is provided with a comparator CP1, a switching element Q2 and first and second control circuit power supplies ES1 and ES2. The terminal P1 of the comparator CP1 is a terminal on the side of the base potential of a reference voltage circuit inside the comparator CP1 and is connected to the connection point between the impedance Z1 and the first inductor L1. The reference voltage circuit is provided within the comparator CP1; it receives, from the second control circuit power supply ES2, power at a terminal P4 to generate a reference voltage and applies the reference voltage to the non-inverting input terminal of an operational amplifier within the comparator CP1. A terminal P2 is the input terminal of the comparator CP1 and is connected to the connection point between the first switching element Q1 and the impedance Z1, and thus an input voltage is applied to the inverting input terminal of the operational amplifier of the comparator CP1. A terminal. P3 is the output terminal of the comparator CP1 and is connected to the base of the switching element Q2, and thus an output voltage is applied from the comparator CP1 to the switching element Q2. A terminal P5 is connected to the first control circuit power supply ES1, and thus control power is supplied to the comparator CP1.


The switching element Q2 is formed with a transistor. Its collector is connected to the control terminal of the first switching element Q1 and its emitter is connected to the connection point between the impedance element Z1 and the first inductor L1. Therefore, when the switching element Q2 is turned on, the output terminals of the self-excited drive circuit DSG are short-circuited, with the result that the switching element Q1 is turned off. A resistor R2 is connected between the base and the emitter of the switching element Q2.


In the first control circuit power supply ES1, a series circuit composed of a diode D2 and a capacitor C5 is connected across the second inductor L2. With a voltage induced by the second inductor L2 when the first inductor L1 is charged, the capacitor C5 is charged through the diode D2, and a positive potential is output from the connection point between the diode D2 and the capacitor C5 such that a control voltage is applied to the terminal P5 of the comparator CP1.


In the second control circuit power supply ES2, a series circuit composed of a diode D3 and a capacitor C6 is connected across a third inductor L3 that is magnetically coupled to the first inductor L1. With a voltage induced by the third inductor L3 when the first inductor L1 is discharged, the capacitor C6 is charged through the diode D3, and a positive voltage is output from the connection point between the diode D3 and the capacitor C6 such that a control voltage is applied to the reference voltage circuit of the comparator CP1 and the reference voltage is generated in the reference voltage circuit.


The start-up circuit ST is composed of: a series circuit consisting of a resistor R3 connected between the drain and the gate of the first switching element Q1, and a parallel circuit including the resistor R1 and capacitor C4 of the self-excited drive circuit DSG connected in parallel with a resistor R10; and a series circuit consisting of the second inductor L2 and the output capacitor C3 in the second circuit B of the step-down chopper SDC and/or the LED packages in the load circuit. When the DC power source DC is turned on, a positive start-up voltage determined largely by the ratio between the resistance of the resistor R3 and the resistance of the resistor. R10 is applied to the gate of the first switching element Q1, with the result that the step-down chopper SDC is started up.


The operation of the circuit of the LED power device will now be described.


Synthetic electrostatic capacitance of the smoothing capacitors C1a and C1b is a comparatively low value.


When the DC power source DC is turned on, and the step-down chopper SDC is started up by the start-up circuit ST, the switching element Q1 is turned on, and a linearly increasing current starts flowing from the DC power source DC within the first circuit A through the output capacitor C3 and/or the LED packages in the load circuit. This increasing current allows a voltage whose positive polarity is on the side of the capacitor C4 to be induced in the second inductor L2 of the self-excited drive circuit DSG, and this induced voltage allows a positive voltage to be applied to the control terminal (gate) of the switching element Q1 through the capacitor C4 and the resistor R1, with the result that the switching element Q1 is kept on and that the increasing current continues to flow. At the same time, the increasing current causes a voltage drop in the impedance Z1, and the dropped voltage is applied, as an input voltage to the terminal P2 of the comparator CP1 in the turn-off circuit TOF.


As the current increases, the input voltage of the comparator CP1 increases and then exceeds the reference voltage, with the result that the comparator. CP1 is operated and this generates a positive output voltage at the terminal P3. Consequently, since the switching element Q2 in the turn-off circuit TOF is turned on, and thus the output terminals of the self-excited drive circuit DSG are short-circuited, the switching element Q1 of the step-down chopper SDC is turned off, and thus the current is interrupted.


When the switching element Q1 is turned off, electromagnetic energy stored in the first inductor L1 is discharged, with the result that a decreasing current starts flowing within the second circuit B including the first inductor L1 and the diode D1 through the output capacitor C3 and/or the LED packages in the load circuit. This decreasing current allows a voltage whose negative polarity is on the side of the capacitor. C4 to be induced in the second inductor L2 of the self-excited drive circuit DSG, and this induced voltage allows a negative potential to be applied to the capacitor C4 through the Zener diode ZD1 and also allows a zero potential to be applied to the control terminal (gate) of the switching element Q1, with the result that the switching element Q1 is kept off and that the decreasing current continues to flow.


When the discharge of the electromagnetic energy stored in the first inductor L1 is completed, and then the decreasing current reaches zero, a back electromotive force is generated in the first inductor L1, and thus the voltage induced in the second inductor L2 is reversed and the side of the capacitor C4 becomes positive. Hence, when this induced voltage allows a positive voltage to be applied to the control terminal (gate) of the switching element Q1 through the capacitor C4 and the resistor. R1, the switching element Q1 is turned on again, and thus the increasing current starts to flow again.


Thereafter, the same circuit operation as described above is repeated, and the increasing current and the decreasing current are combined together, and thus a triangular load current flows, with the result that the LED packages LeP in the load circuit LC are lit. In addition, in this embodiment, a voltage depression of the LED chip Ch at the time of lighting is 3V. Then, the voltage depression of one LED package LeP is set to 9V. Therefore, the terminal voltage of the output capacitor C3 is controlled so that the voltage depression of the LED light source 22 is set to 63V.


To achieve the foregoing, the proportion of the fifth harmonic of the input current waveform of the step-down chopper SDC is kept at 60% or less, and the voltage of the smoothing capacitors C1a and C1b is kept higher than the voltage of the output capacitor C3 over the entire range of an alternating-current voltage period, with the result that the harmonic of the input current is reduced, the step-down chopper SDC is stably operated during the entire time period of the alternating-current voltage period and it is possible to prevent the LED packages LeP from flickering.


In the above-described circuit operation, the operation of the turn-off circuit TOF is performed in two stages, one done with the comparator CP1, the other done with the switching element Q2, and thus, even if the input voltage of the comparator CP1 is 0.3 volts or less, stable and accurate operation is achieved. This makes it possible to reduce the resistance of the impedance Z1, and thus, even when an input voltage is 0.5 volts in the conventional technology, with the present invention, it is possible to reduce the power loss of the impedance Z1 by 40% or more as compared with the conventional technology.


Since the temperature characteristic of the turn-off circuit TOF is determined by the side of the comparator CP1, and thus a desired satisfactory temperature characteristic can be provided for the comparator CP1, the conventional problem in which the temperature characteristic is attributable to the temperature characteristic of the switching element Q2 is solved. Since, with respect to the temperature characteristic of the comparator CP1, for example, as the Zener diode used in the reference voltage circuit of the comparator CP1, it is easy to select the Zener diode whose temperature characteristic is slightly negative or flat, such a characteristic can be given as the temperature characteristic of the comparator CP1. Thus, it is possible to obtain an LED power device with a satisfactory temperature characteristic.


Moreover, the provision of the comparator CP1 in the turn-off circuit TOF allows the switching element Q2 to operate stably and accurately, and this reduces variations in the output of the LED power device.



FIGS. 6-8 illustrate a second embodiment for embodying an LED power device. In the embodiment, the same parts as FIGS. 2 and 4 are identified with common symbols, and their description will be omitted. This embodiment mainly differs from the first embodiment in that a full-wave rectifier circuit BR is used as the DC-power source. And that is, the jumper wire JW in FIG. 4 is removed. For this reason, as shown in FIG. 8, the output Voltage of the DC-power source is 100V.


The LED light source includes four LED packages LeP connected in series. In addition, in this embodiment, the voltage depression of the LED chip Ch at the time of lighting is 3V. Then, the voltage depression of one LED package. LeP is 9V. Therefore, the terminal voltage of the output capacitor C3 is controlled so that the voltage depression of the LED light source 22 is set to 36V.


To achieve the foregoing, the voltage of the smoothing capacitors C1a and C1b is kept higher than the voltage of the output capacitor C3 over the entire range of an alternating-current voltage period, with the result that the harmonic of the input current is reduced, the step-down chopper SDC is stably operated during the entire time period of the alternating-current voltage period and it is possible to prevent brightness of flickering of LED packages LeP.


Each above-mentioned embodiment has the following functional effect.


The LED chips are connected in a series circuit. So, even if the value of the Vf characteristic in the plurality of LED chips varies, the variation has little influence. Therefore, margin of error management of the value of Vf characteristic of the LED chips becomes easy.


Since the LED chips of the LED packages are connected in series, the drive current of these embodiments is related to the inverse of the number of LED chips, as compared with the case that the LED chips are connected in parallel. Also, the generation of heat inside the LED power device is proportional to the square of the drive current. Therefore, circuit efficiency improves, in order that the quantity of heat generated in LED lighting equipment may decrease.


Also, the temperature of the LED power device is about half compared with the case that the LED chips are connected in parallel.


As a result, the life of the LED light source and LED power device increases. Moreover, the reliability of LED power device improves.


In addition, the temperature under operation in the LED power device cannot rise easily. Therefore, less heat needs to be dissipated.


In addition, the LED light source of the embodiments is safe, because all of the LED chips turn off if any of the LED chips becomes faulty in an open mode. When the LED chips are connected in parallel, the remaining LED chips continue to generated heat.


In addition, it is possible to switch between the first and second embodiments of the DC-power source or/and the step-down chopper adding or removing the jumper wire JW of the DC power source.


While certain embodiments have been described, these embodiments have been presented byway of example only, and are not intended to limit the scope of the inventions. In practice, the structural elements can be modified without departing from the spirit of the invention. Various embodiments can be made by properly combining the structural elements disclosed in the embodiments. For example, some structural elements may be omitted from all the structural elements disclosed in the embodiments. Furthermore, structural elements in different embodiments may properly be combined. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall with the scope and spirit of the inventions.

Claims
  • 1. An LED lighting equipment, comprising; a lighting main body:an LED power device mounted on the lighting main body and including a DC power source and a DC-DC converter, the DC-DC converter including an input terminal connected to the DC power source and an output terminal; andan LED light source including a board and a plurality of LED packages, each of the LED packages including a plurality of LED chips connected in series, the LED packages being mounted on the board and connected in series to the output terminal of DC-DC converter:wherein the DC power source includes a full-wave rectifier circuit and a voltage doubler rectifier circuit, the full-wave rectifier circuit and the voltage doubler rectifier circuit including a rectification circuit, a smoothing capacitor and selection element configured for implementing one of the rectifier circuits.
  • 2. The LED lighting equipment according to claim 1, wherein: the LED power device includes an output capacitor connected to the output terminal of the DC-DC converter;the DC-DC converter is a step-down chopper including a switching element, a first circuit, and a second circuit;the first circuit is connected between the input terminal of the DC-DC converter and the output terminal of the DC-DC converter, and the first circuit includes an inductor connected to the switching element in series;the second circuit is connected with the output terminal of the DC-DC converter, and the second circuit includes a series circuit of the inductor and a free-wheel diode; andthe output capacitor is configured to operate so that the operating voltage of the output capacitor is lower than an operating voltage of the smoothing capacitor during operation.
Priority Claims (2)
Number Date Country Kind
2009-176307 Jul 2009 JP national
2010-138780 Jun 2010 JP national
US Referenced Citations (142)
Number Name Date Kind
1972790 Olley Sep 1934 A
4355853 Kourimsky Oct 1982 A
4503360 Bedel Mar 1985 A
4630182 Moroi Dec 1986 A
4939420 Lim Jul 1990 A
5323271 Shimada Jun 1994 A
5327332 Hafemeister Jul 1994 A
D356107 Watanabe et al. Mar 1995 S
5537301 Martich Jul 1996 A
5556584 Yamazaki Sep 1996 A
5585697 Cote Dec 1996 A
5607228 Ozaki et al. Mar 1997 A
5632551 Roney May 1997 A
5685628 Feger et al. Nov 1997 A
5775792 Wiese Jul 1998 A
5785418 Hochstein Jul 1998 A
5857767 Hochstein Jan 1999 A
5947588 Huang Sep 1999 A
6095668 Rykowski et al. Aug 2000 A
6111359 Work et al. Aug 2000 A
6161910 Reisenauer Dec 2000 A
6186646 Wiedemer Feb 2001 B1
6227679 Zhang et al. May 2001 B1
6234649 Katougi May 2001 B1
6294973 Kimura Sep 2001 B1
6502968 Simon Jan 2003 B1
6517217 Liao Feb 2003 B1
6525668 Petrick Feb 2003 B1
6598996 Lodhie Jul 2003 B1
6641283 Bohler Nov 2003 B1
6787999 Stimac et al. Sep 2004 B2
6793374 Begemann Sep 2004 B2
D497439 Shaw et al. Oct 2004 S
6814470 Rizkin et al. Nov 2004 B2
6936855 Harrah Aug 2005 B1
6948829 Verdes et al. Sep 2005 B2
6982518 Chou et al. Jan 2006 B2
7059748 Coushaine Jun 2006 B2
7074104 Itaya Jul 2006 B2
7111961 Trenchard Sep 2006 B2
7125146 Willis Oct 2006 B2
7144140 Sun et al. Dec 2006 B2
D534665 Egawa et al. Jan 2007 S
D535038 Egawa et al. Jan 2007 S
7165866 Li Jan 2007 B2
7198387 Gloisten et al. Apr 2007 B1
7226189 Lee et al. Jun 2007 B2
7281818 You Oct 2007 B2
7300173 Catalano Nov 2007 B2
7329024 Lynch Feb 2008 B2
7331689 Chen Feb 2008 B2
7347589 Ge Mar 2008 B2
7431477 Chou et al. Oct 2008 B2
7497596 Ge Mar 2009 B2
7625104 Zhang et al. Dec 2009 B2
7631987 Wei Dec 2009 B2
7679096 Ruffin Mar 2010 B1
7744256 Smester Jun 2010 B2
7758223 Osawa et al. Jul 2010 B2
7824075 Maxik Nov 2010 B2
7918587 Hsu et al. Apr 2011 B2
7919339 Hsu Apr 2011 B2
7947596 Takeda May 2011 B2
7963686 Hu Jun 2011 B2
8058782 Lai Nov 2011 B2
8058784 Treurniet Nov 2011 B2
8066417 Balazs Nov 2011 B2
8072130 Wang et al. Dec 2011 B2
8157418 Kraus Apr 2012 B2
8226270 Yamamoto et al. Jul 2012 B2
20020012246 Rincover et al. Jan 2002 A1
20020024814 Matsuba Feb 2002 A1
20020097586 Horowitz Jul 2002 A1
20020118538 Calon et al. Aug 2002 A1
20020145152 Shimomura Oct 2002 A1
20020195918 Matsuba et al. Dec 2002 A1
20030063476 English et al. Apr 2003 A1
20030117797 Sommers et al. Jun 2003 A1
20030117801 Lin Jun 2003 A1
20030137838 Rizkin et al. Jul 2003 A1
20030151917 Daughtry Aug 2003 A1
20040012955 Hsieh Jan 2004 A1
20040109310 Galli Jun 2004 A1
20040120156 Ryan Jun 2004 A1
20040145898 Ase et al. Jul 2004 A1
20040156191 Biasoli Aug 2004 A1
20040218385 Tomiyoshi Nov 2004 A1
20050007772 Yen Jan 2005 A1
20050024864 Galli Feb 2005 A1
20050068776 Ge Mar 2005 A1
20050073244 Chou et al. Apr 2005 A1
20050111234 Martin et al. May 2005 A1
20050162864 Verdes et al. Jul 2005 A1
20050174769 Yong Aug 2005 A1
20050243552 Maxik Nov 2005 A1
20050254246 Huang Nov 2005 A1
20060034077 Chang Feb 2006 A1
20060043546 Kraus Mar 2006 A1
20060092640 Li May 2006 A1
20060193130 Ishibashi Aug 2006 A1
20060193139 Sun Aug 2006 A1
20060198147 Ge Sep 2006 A1
20060215408 Lee Sep 2006 A1
20060219428 Chinda et al. Oct 2006 A1
20060227558 Osawa Oct 2006 A1
20060239002 Chou et al. Oct 2006 A1
20070002570 Souza Jan 2007 A1
20070041182 Ge et al. Feb 2007 A1
20070096114 Aoki May 2007 A1
20070103904 Chen May 2007 A1
20070247840 Ham Oct 2007 A1
20070279903 Negley Dec 2007 A1
20080002100 Kaneko Jan 2008 A1
20080006911 Nakahara et al. Jan 2008 A1
20080037255 Wang Feb 2008 A1
20080080187 Purinton Apr 2008 A1
20080084701 Van De Ven Apr 2008 A1
20080112170 Trott May 2008 A1
20080130298 Negley Jun 2008 A1
20080173883 Hussell Jul 2008 A1
20080289867 Owens Nov 2008 A1
20090059595 Ge Mar 2009 A1
20090116229 Dalton May 2009 A1
20090116231 Miller May 2009 A1
20090175041 Yuen et al. Jul 2009 A1
20090184616 Van de Ven Jul 2009 A1
20090184646 Devaney Jul 2009 A1
20090207602 Reed Aug 2009 A1
20090294780 Chou et al. Dec 2009 A1
20090315442 Otto Dec 2009 A1
20100026157 Tanaka Feb 2010 A1
20100060130 Li Mar 2010 A1
20100067241 Lapatovich Mar 2010 A1
20100096992 Yamamoto Apr 2010 A1
20100207534 Dowling et al. Aug 2010 A1
20100277082 Reed Nov 2010 A1
20100289396 Osawa Nov 2010 A1
20110043120 Panagotacos Feb 2011 A1
20110050133 Grajcar Mar 2011 A1
20110079814 Chen Apr 2011 A1
20110090691 Markle et al. Apr 2011 A1
20110139491 Chang Jun 2011 A1
Foreign Referenced Citations (76)
Number Date Country
1264152 Aug 2000 CN
1380704 Nov 2002 CN
1433070 Jul 2003 CN
1644978 Jul 2005 CN
1880844 Dec 2006 CN
201014266 Jan 2008 CN
201081193 Jul 2008 CN
101307887 Nov 2008 CN
201180976 Jan 2009 CN
101506934 Aug 2009 CN
101521140 Sep 2009 CN
10 2004 042186 Mar 2006 DE
20 2008 016 8 Apr 2009 DE
20 2008 016 231 Apr 2009 DE
1 215 735 Jun 2002 EP
1705421 Sep 2006 EP
2037633 Mar 2009 EP
2149742 Feb 2010 EP
2 163 808 Mar 2010 EP
57-152706 Sep 1982 JP
59-035303 Feb 1984 JP
61-35216 Feb 1986 JP
62-190366 Dec 1987 JP
63-5581 Jan 1988 JP
63-102265 May 1988 JP
64-7204 Jan 1989 JP
1-206505 Aug 1989 JP
2-91105 Mar 1990 JP
2000-083343 Mar 2000 JP
2000-173303 Jun 2000 JP
2001-243809 Sep 2001 JP
2002-525814 Aug 2002 JP
2002-280617 Sep 2002 JP
2003-016808 Jan 2003 JP
2003-059305 Feb 2003 JP
2003-59330 Feb 2003 JP
2003-92022 Mar 2003 JP
2004-6096 Jan 2004 JP
2004-119078 Apr 2004 JP
2004119078 Apr 2004 JP
2004-193053 Jul 2004 JP
2004-6096 Aug 2004 JP
2004-221042 Aug 2004 JP
2005-93097 Apr 2005 JP
2005-123200 May 2005 JP
2005-513815 May 2005 JP
2005-166578 Jun 2005 JP
2005-217354 Aug 2005 JP
2005-286267 Oct 2005 JP
2006-040727 Feb 2006 JP
3121916 May 2006 JP
2006-156187 Jun 2006 JP
2006-244725 Sep 2006 JP
2006-28646 Oct 2006 JP
2006-310057 Nov 2006 JP
2006-313717 Nov 2006 JP
2006-313718 Nov 2006 JP
2007-073306 Mar 2007 JP
2007-188832 Jul 2007 JP
2007-207576 Aug 2007 JP
2008-027910 Feb 2008 JP
2008-91140 Apr 2008 JP
2008-227412 Sep 2008 JP
2008-277561 Nov 2008 JP
2009-37995 Feb 2009 JP
2009-037995 Feb 2009 JP
2009-117342 May 2009 JP
2009-135026 Jun 2009 JP
2009-164157 Jul 2009 JP
2009-206104 Aug 2009 JP
WO 03056636 Jul 2003 WO
WO 2005024898 Mar 2005 WO
WO 2006118457 Nov 2006 WO
WO 2008146694 Dec 2008 WO
WO2009085231 Jul 2009 WO
WO 2009087897 Jul 2009 WO
Non-Patent Literature Citations (186)
Entry
English Language Translation of JP 2002-525814 published Aug. 13, 2002.
English Language Abstract of JP 2006-156187 published Jun. 15, 2006.
English Language Translation of JP 2006-156187 published Jun. 15, 2006.
U.S. Appl. No. 12/794,558.
U.S. Appl. No. 12/738,081.
Extended European Search Report issued in EP 111560003.9 on May 18, 2011.
Extended European Search Report issued in EP 08838942.4 on Jun. 1, 2011.
English Language Abstract of JP 2008-277561 published on Nov. 13, 2008.
English Language Translation of JP 2008-277561 published on Nov. 13, 2008.
English Language Abstract of JP 2008-227412 published Sep. 25, 2008.
English Language Translation of JP 2008-227412 published Sep. 25, 2008.
Japanese Office Action issued in 2005-269017 on Jan. 13, 2011.
English Language Translation of JP Office Action issued in 2005-269017 on Jan. 13, 2011.
English Language Abstract of JP 2004-221042 published Aug. 5, 2004.
English Language Translation of JP 2004-221042 published Aug. 5, 2004.
English Language Abstract of JP 63-102265 published May 7, 1988.
English Language Abstract of JP 2009-206104 published Sep. 10, 2009.
English Language Translation of JP 2009-206104 published Sep. 10, 2009.
European Search Report issued in EP 10178361.1 on Jul. 4, 2011.
Related U.S. Appl. No. 12/738 081.
English Language Abstract of JP 2001-243809, published Sep. 7, 2001.
English Language Abstract of JP Publication 01-206505 published Aug. 18, 1989.
English Language Abstract of JP Publication 2005-093097 published Apr. 7, 2005.
English Language Abstract of JP Publication 2005-123200 published May 12, 2005.
English Language Abstract of JP 2006-313718, published Nov. 16, 2006.
English Language Abstract of JP Publication 63-005581 published Jan. 11, 1988.
English Language Abstract of JP Publication 64-007402 published Jan. 11, 1989.
English Language Machine Translation of JP 2000-083343, published Mar. 21, 2000.
English Language Machine Translation of JP 2000-173303 published Jun. 23, 2000.
English Language Machine Translation of JP 2001-243809, published Sep. 7, 2001.
English Language Machine translation of JP 2003-59330 published Feb. 28, 2003.
English Language Machine Translation of JP 2004-006096 published Jan. 8, 2004.
English Language Machine Translation of JP 2004-193053 published Jul. 8, 2004.
English Language Machine Translation of JP 2005-166578 published Jun. 23, 2005.
English Language Machine translation of JP 2005-513815 published May 12, 2005.
English Language Machine translation of JP 2006-040727 published Feb. 9, 2006.
English Language Machine Translation of JP 2006-310057, published Nov. 9, 2006.
English Language Machine Translation of JP 2006-313718, published Nov. 16, 2006.
English Language Machine translation of JP 2008-91140 published Apr. 17, 2008.
English Language Machine Translation of JP 2009-37995, published Feb. 19, 2009.
English Language Machine Translation of JP 3121916, published May 10, 2006.
English Language Machine Translation of JP Publication 2005-093097 published Apr. 7, 2005.
English Language Machine Translation of JP Publication 2005-123200.
English Language Machine translation of JP-2002-280617published Sep. 27, 2002.
English Language Machine translation of JP-2005-286267 published Oct. 13, 2005.
English Language Machine translation of JP-2006-244725 published Sep. 14, 2006.
English Language Machine Translation ofJP 2003-092022 published Mar. 28, 2003.
English Language Translation of Office Action issued in corresponding Japanese Appl 2005-221571 on Oct. 20, 2009.
English Language Translation of International Search Report for PCT/JP2008/073436 mailed Mar. 24, 2009.
English translation of Office Action issued in corresponding Japanese Appl 2005-221571 on Jul. 7, 2009.
English translation of Office Action issued in corresponding Japanese Appl 2005-221571 on Aug. 25, 2009.
English Language Translation of Office Action issued in Japanese Appl 2005-221688 on Jan. 26, 2010.
Machine English language translation of JP-2003-016808 published Jan. 17, 2003.
Office Action issued in corresponding Japanese Appl 2005-221571 on Jul. 7, 2009.
Office Action issued in corresponding Japanese Appl 2005-221571 on Aug. 25, 2009.
Office Action issued in corresponding Japanese Appl 2005-221571 on Oct. 20, 2009.
Search Report of International Application No. PCT/JP2008/068625 mailed Dec. 9, 2008.
English Language Abstract of JP 2004-193053 published Jul. 8, 2004.
English Language Abstract of JP 2-91105 published Mar. 30, 1990.
English Language Abstract of JP 2000-173303 published Jun. 23, 2000.
English Language Abstract of JP 2003-092022 published Mar. 28, 2003.
English language abstract of JP-2002-280617 published Sep. 27, 2002.
English language abstract of JP-2003-016808 published Jan. 17, 2003.
English Language Abstract of 2003-59330 published Feb. 28, 2003.
English Language Abstract of JP 2005-166578 published Jun. 23, 2005.
English language abstract of JP-2005-286267 published Oct. 13, 2005.
English Language Abstract of JP 2006-040727 published Feb. 9, 2006.
English language abstract of JP-2006-244725 published Sep. 14, 2006.
English Language Abstract of JP 2008-91140 published Apr. 17, 2008.
English Language Abstract of JP 2004-006096 published Jan. 8, 2004.
Office Action issued in Japanese Appl 2005-221688 on Jan. 26, 2010.
English Language Abstract of JP 2009-37995, published Feb. 19, 2009.
English Language Abstract of JP 2000-083343, published Mar. 21, 2000.
English Language Abstract of JP 57-152706 published Sep. 21, 1982.
English Language Abstract of JP 2006-310057, published Nov. 9, 2006.
International Preliminary Report on Patentability and Written Opinion issued in PCT/JP2008/068625 mailed May 11, 2010.
Office Action issued in Japanese Appl 2005-371406 on Apr. 20, 2010.
English Translation of Office Action issued in Japanese Appl 2005-371406 on Apr. 20, 2010.
U.S. Appl. No. 12/713,230.
U.S. Appl. No. 12/825,956.
Japanese Office Action issued in JP 2008-198625 on May 26, 2010.
English Translation of Japanese Office Action issued in JP 2008-198625 on May 26, 2010.
Amendment filed in JP 2008-198625 on Jun. 28, 2010.
English Translation of Amendment filed in JP 2008-198625 on Jun. 28, 2010.
English Language Abstract of JP 2006-313717 published Nov. 16, 2006.
Machine English Translation of JP 2006-313717 published Nov. 16, 2006.
English Language Abstract of JP 2009-135026 published Jun. 18, 2009.
English Language Translation of JP 2009-135026 published Jun. 18, 2009.
English Language Abstract of JP 2002-525814 published Aug. 13, 2002.
English Language Abstract of JP 2003-059305 published Feb. 28, 2003.
English Language Translation of JP 2003-059305 published Feb. 28, 2003.
English Language Abstract of JP 2009-037995 published Feb. 19, 2009.
English Language Translation of JP 2009-037995 published Feb. 19, 2009.
English Language Abstract of JP 2007-188832 published Jul. 26, 2007.
English Language Translation of JP 2007-188832 published Jul. 26, 2007.
English Language Abstract of JP 2008-027910 published Feb. 7, 2008.
English Language Translation of JP 2008-027910 published Feb. 7, 2010.
English Language Abstract of JP 2007-207576 published Aug. 16, 2007.
English Language Translation of JP 2007-207576 published Aug. 16, 2007.
English Language Abstract of JP 2007-073306 published Mar. 22, 2007.
English Language Translation of JP 2007-073306 published Mar. 22, 2007.
U.S. Appl. No. 12/845,330.
Extended European Search Report issued in EP Appl 10006720.6 on Oct. 13, 2010.
English Language Abstract of JP 61-35216 published Feb. 2, 1086.
IPRP & WO issued in PCT/JP2008/073436 on Aug. 10, 2010.
Related U.S. Appl. No. 12/794,379.
Related U.S. Appl. No. 12/794,429.
Related U.S. Appl. No. 12/794,476.
Related U.S. Appl. No. 12/794,509.
Related U.S. Appl. No. 12/811,795.
Related U.S. Appl. No. 12/738,081.
Related U.S. Appl. No. 12/713,230.
Related U.S. Appl. No. 12/825,956.
Related U.S. Appl. No. 12/885,005.
Related U.S. Appl. No. 12/933,969.
Related U.S. Appl. No. 12/886,025.
Related U.S. Appl. No. 12/886,123.
Related U.S. Appl. No. 13/044,369.
Related U.S. Appl. No. 12/888,921.
Related U.S. Appl. No. 13/221,519.
Related U.S. Appl. No. 13/221,551.
Chinese Office Action issued in CN 201010216943 on Oct. 26, 2011.
English Language Translation of Chinese Office Action issued in CN 201010216943 on Oct. 26, 2011.
English Language Abstract of CN 101307887 published Nov. 19, 2008.
English Language Translation of JP 2009/117342 published May 28, 2009.
English Language Abstract of JP 2009/117342 published May 28, 2009.
Chinese Office Action issued in CN 201010121809.11 on Mar. 31, 2012.
English Translation of Chinese Office Action issued in CN 201010121809.11 on Mar. 31, 2012.
English Language Abstract and Claims of CN201149860 published Nov. 12, 2008.
English Language Abstract Claims of CN201072113 published Jun. 11, 2008.
English Language Abstract of CN2602514 published Feb. 4, 2004.
English Language Abstract of JP 2004-119078 published Apr. 15, 2004.
English Language Translation of JP 2004-119078 published Apr. 15, 2004.
Extended European Search Report for EP 10179580.5, dated May 24, 2012.
Chinese Office Action issued in CN 201010243165.3 on Jul. 17, 2012.
English Language Translation of Chinese Office Action issued in CN 201010243165.3 on Jul. 17, 2012.
English Language Abstract of CN 1264152 published Aug. 23, 2000.
Chinese Office Action issued in CN2010102793033 on Jul. 10, 2012.
English Language Translation of Chinese Office Action issued in CN2010102793033 on Jul. 10, 2012.
English Language Abstract of JP 2005-217354 published Aug. 11, 2005.
English Language Translation of JP 2005-217354 published Aug. 11, 2005.
English Language Abstract of JP 2006-286461 published Oct. 19, 2006.
English Language Translation of JP 2006-286461 published Oct. 19, 2006.
English Language Abstract of WO 2009/085231 published Jul. 9, 2009.
English Language Abstract of CN 1644978 published Jul. 27, 2005.
Chinese Office Action issued in CN 201010292756 dated Jun. 29, 2012.
English Language Translation of Chinese Office Action issued in CN 201010292756 dated Jun. 29, 2012.
English Language Abstract of CN 201014266 published Jan. 30, 2008.
Chinese Office Action issued in CN 2010102927860.6 dated Sep. 29, 2012.
English Language Translation of Chinese Office Action issued in CN 2010102927860.6 dated Sep. 29, 2012.
English Language Abstract of CN 201081193 published Jul. 2, 2008.
English Language Abstract of CN 1380704 published Nov. 20, 2002.
English Language Abstract of CN 101521140 published Sep. 2, 2009.
English Language Abstract of CN 101506934 published Aug. 12, 2009.
English Language Abstract of CN 201180976 published Jan. 14, 2009.
English Language Abstract of CN 1880844 published Dec. 20, 2006.
Chinese Office Action issued in CN 201010292771.4 dated Jun. 19, 20123.
English Language Translation of Chinese Office Action issued in CN 201010292771.4 dated Jun. 19, 20123.
Japanese Office Action issued in JP2009-219771 on Aug. 9, 2012.
English Language Translation of Japanese Office Action issued in JP2009-219771 on Aug. 9, 2012.
English Language Abstract of JP 2009-164157 published Jul. 23, 2009.
English Language Translation of JP 2009-164157 published Jul. 23, 2009.
U.S. Appl. No. 12/825,650.
U.S. Appl. No. 12/794,379.
U.S. Appl. No. 12/794,476.
U.S. Appl. No. 12/794,509.
U.S. Appl. No. 12/811,795.
U.S. Appl. No. 12/738,08.
U.S. Appl. No. 12/880,490.
U.S. Appl. No. 12/885,005.
U.S. Appl. No. 12/933,969.
U.S. Appl. No. 12/885,849.
U.S. Appl. No. 12/886,123.
U.S. Appl. No. 13/172,557.
U.S. Appl. No. 13/221,519.
U.S. Appl. No. 13/221,551.
Chinese Office Action issued in CN201010287917.6 dated Jun. 27, 2012.
English Language Translation of Chinese Office Action issued in CN201010287917.6 dated Jun. 27, 2012.
English Language Abstract of CN 1433070 published Jul. 30, 2003.
Chinese Office Action issued in CN 201010216943 on Jul. 11, 2012.
English Language Translation of Chinese Office Action issued in CN 201010216943 on Jul. 11,2012.
U.S. Appl. No. 12/794,429.
U.S. Appl. No. 12/886,025.
U.S. Appl. No. 13/044,369.
U.S. Appl. No. 12/888,921.
U.S. Appl. No. 13/034,959.
Related Publications (1)
Number Date Country
20110025206 A1 Feb 2011 US