The present disclosure claims priority to Chinese patent application No. 201910673225.6, filed to the China National Intellectual Property Administration on Jul. 24, 2019, the disclosure of which is hereby incorporated by reference in its entirety.
The present disclosure relates to a technical field of Light-Emitting Diodes (LEDs), for example, an LED line backlight source liquid crystal display screen.
Backlight of a Liquid Crystal Display (LCD) in a related technology basically uses a phosphor white light LED (Light Emitting Diode) lamp bead to provide a backlight light source. With a development of a technology, it is found that the phosphor white light LED lamp bead has following disadvantages: 1. a color of the phosphor white light LED lamp bead is fixed and can not be adjusted; and 2. a color gamut of the phosphor white light LED lamp bead is not wide enough. Therefore, the backlight source of an LCD screen known to inventors can not meet the requirements of a small-size display screen for the color gamut and brightness of the LCD screen.
Some embodiments of the present disclosure provide an LED line backlight source liquid crystal display, as to avoid the above situation.
Some embodiments of the present disclosure provide an LED line backlight source liquid crystal display screen, including liquid crystal glass and a light guide plate, the light guide plate is disposed on a side of the liquid crystal glass, and the light guide plate has a first end and a second end that are arranged oppositely, the first end and the second end are both extended to an outside of the liquid crystal glass, an outside of an end surface of the first end and an outside of an end surface of the second end are both provided with an LED line backlight source, and the LED line backlight source includes an circuit substrate which is of elongated shape, a side of the circuit substrate close to the light guide plate is provided with at least one row of light-emitting assemblies, and each row of the light-emitting assemblies includes a plurality of red, green, and blue (RGB) light-emitting units arranged at intervals along a length direction of the circuit substrate.
In the drawings:
1. liquid crystal glass; 2. light guide plate; 21. first end; 22. second end; 23. first light guide portion; 24. second light guide portion; 25. third light guide portion; 3. LED line backlight source; 31. circuit substrate; 311. chip mounting layer; 3111. accommodating groove; 3112. separating plate; 31121. side surface; 3113. chamber; 3114. step; 3115. overflow glue groove; 312. circuit layer; 32. RGB light-emitting unit; 321. first chip; 322. second chip; 323. third chip; 324. common electrode; 325. first control electrode; 326. second control electrode; 327. third control electrode; and 33. encapsulation glue.
In descriptions of embodiments of the present disclosure, unless otherwise clearly specified and limited, terms “connected”, “linked”, and “fixed” should be interpreted broadly, for example, it may be a fixed connection or a detachable connection, or integrated; it may be a mechanical connection, or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, or it may be an internal communication of two members or an interaction relationship between the two members. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present disclosure may be understood in specific situations.
In the embodiments of the present disclosure, unless otherwise clearly specified and limited, a first feature “above” or “below” a second feature may include direct contact between the first and second features, or include that the first and second features are not in direct contact but in contact through another feature between them. Moreover, the first feature “on”, “above” and “over” the second feature includes that the first feature is directly above and obliquely above the second feature, or it is merely indicated that the level of the first feature is higher than that of the second feature. The first feature “under”, “below” and “beneath” the second feature includes that the first feature is directly below and obliquely below the second feature, or it is merely indicated that the level of the first feature is smaller than that of the second feature.
Referring to
In some embodiments, the light guide plate 2 includes a first light guide portion 23, a second light guide portion 24 and a third light guide portion 25 that are sequentially connected, herein a size of the second light guide portion 24 is matched with a size of the liquid crystal glass 1, the first light guide portion 23 and the third light guide portion 25 are both located outside the liquid crystal glass 1. A width of one end, away from the liquid crystal glass 1, of the first light guide portion 23 is greater than a width of one end, connected to the second light guide portion 24, of the first light guide portion 23. A width of one end, away from the liquid crystal glass 1, of the third light guide portion 25 is greater than a width of one end, connected with the second light guide portion 24, of the third light guide portion 25. One end, away from the liquid crystal glass 1, of the first light guide portion 23 is the above first end 21. One end, away from the liquid crystal glass 1, of the third light guide portion 25 is the above second end 22. Exemplarily, widths of the first light guide portion 23 and the third light guide portion 25 are gradually increased from a contact point with the second light guide portion 24 toward a direction away from the second light guide portion 24. Exemplarily, the first light guide portion 23 and the third light guide portion 25 are a trapezoidal structure. A length of the LED line backlight source 3 is matched with lengths of end portions of the adjacent first light guide portion 23 and third light guide portion 25. Through a design of gradually increasing the widths of the first light guide portion 23 and the third light guide portion 25, a light on the most edge is condensed, and there is enough light on an edge portion of the display screen, so that the brightness of the edge and middle portions of the display screen is more uniform, to avoid that it is bright in a middle and dark on edges.
In some embodiments, the light guide plate 2 is transparent glass or transparent plastic with a light transmittance greater than or equal to 90%. Exemplarily, the transparent glass is colorless transparent common glass, colorless transparent tempered glass, colored transparent common glass, colored transparent tempered glass, or other special glass.
In some embodiments, the liquid crystal glass 1 is Thin Film Transistor (TFT) liquid crystal glass. Exemplarily, the liquid crystal glass 1 is common liquid crystal glass or high-transparent liquid crystal glass.
In some embodiment, the circuit substrate 31 is provided with at least two rows of light-emitting assemblies, and rows of the at least two rows of the light-emitting assemblies are arranged at intervals along the width direction of the circuit substrate 31. A plurality of rows of the light-emitting assemblies can enhance a display brightness of the LED line backlight source liquid crystal display screen.
In some embodiments, referring to
In some embodiments, a member on the member mounting layer is mainly an Integrated Circuit (IC) chip, a resistor, a capacitor and the like or a connector pin welding layer.
In some embodiments, the chip mounting layer 311 is combined with the circuit layer 312 in a lamination manner. The lamination manner achieves the separate manufacture of the circuit layer 312 and the chip mounting layer 311, and it is convenient for forming the accommodating groove 3111 and mounting the RGB light-emitting units 32.
In other embodiments, the chip mounting layer 311 is also combined with the circuit layer 312 in a 3D printing manner. This manner makes a combination tightness degree of the chip mounting layer 311 and the circuit layer 312 higher, and it does not need to prepare a laminated plate in advance. The chip mounting layer 311 is directly formed on the surface of the circuit layer 312, the operation is convenient, and the precision is high.
In some embodiments, a groove wall of the accommodating groove 3111 on the chip mounting layer 311 is white, so that the light reflection effect is better.
In some embodiments, a depth of the accommodating groove 3111 is H, and a height of the RGB light-emitting unit 32 is h, herein 1.5h≤H≤4h. This design makes the accommodating groove 3111 have an enough depth to accommodate chips of the RGB light-emitting units 32, and provide a space for encapsulation glue 33. At the same time, a thickness of the entire LED line backlight source 3 is reduced as much as possible, so that the LED line backlight source liquid crystal display screen achieves a narrow frame design.
In some embodiment, referring to
In some embodiments, each chamber 3113 is internally provided with one RGB light-emitting unit 32. All the RGB light-emitting units 32 of the LED line backlight source 3 are separated by the separating plates 3112, namely each RGB light-emitting unit 32 is placed in one independent chamber 3113, so a better light mixing effect and anti-cross-light effect is achieved.
In some embodiment, the chip mounting layer 311 has a first side surface attached to the circuit layer 312 and a second side surface arranged opposite to the first side surface, and an upper end surface of the separating plate 3112 is flush with the second side surface. In other embodiments, the upper end surface of the separating plate 3112 is lower than the second side surface.
In some embodiments, the accommodating groove 3111 is internally provided with the encapsulation glue 33, and the encapsulation glue 33 encapsulates the RGB light-emitting units 32 in the accommodating groove 3111 by modes of dispensing, mold-pressing or injection-molding.
In this embodiment, an upper surface of the formed encapsulation glue 33 after being formed is a flat surface or a convex arc surface. Referring to
The encapsulation glue 33 is internally mixed with a homogenizing material, and the homogenizing material is cobalt dioxide or organopolysiloxane.
The separating plate 3112 is also provided with an anti-overflow glue structure, referring to
In an embodiment, the anti-overflow glue structure includes a concave structure arranged on at least one side surface of the separating plate 3112.
Referring to
The separating plate 3112 has two side surfaces 31121 that are arranged oppositely, and two side surfaces 31121 are both provided with the steps 3114. This design prevents the encapsulation glue 33 on both sides of the separating plate 3112 from overflowing, and reduces the mutual influence.
In some embodiment, the side surface 31121 is provided with a step 3114, or the side surface 31121 is provided with at least two steps 3114, and a width of the step 3114 is gradually reduced from a bottom of the chamber 3113 to a chamber opening. This design is not only strengthen the buffering of the encapsulation glue 33 and guarantee that the encapsulation glue 33 does not overflow at all, but also reduces the manufacturing difficulty.
The anti-overflow glue structure is not limited to the concave structure arranged on the side surface 31121 of the separating plate 3112, but also is an overflow glue groove 3115 arranged on the upper end surface of the separating plate 3112. Referring to
In some embodiments, the overflow glue groove 3115 is an arc-shaped groove. The arc-shaped groove slows down the flow rate of the encapsulation glue 33, and prevents the encapsulation glue 33 from overflowing due to the excessive speed during glue injection.
In addition, in some embodiments, both the step 3114 and the overflow glue groove 3115 is disposed on the separating plate 3112, as to improve the anti-overflow glue effect.
In some embodiments, referring to
In other embodiments, the chips with the same color are divided into a plurality of groups, the chips with the same color in each group are connected in series, and the plurality of the groups is connected in parallel. For example, all the first chips 321 of the plurality of the RGB light-emitting units 32 are divided into M1 groups, each group of the M1 groups includes N1 first chips 321, the N1 first chips 321 in the each group are connected in series and the second electrode of the last first chip 321 in this group forms the first control electrode 325, and M1 first control electrodes 325 are electrically connected. All the second chips 322 of the plurality of the RGB light-emitting units 32 are divided into M2 groups, each group of the M2 groups includes N2 second chips 322, the N2 second chips 322 in each group are connected in series and the second electrode of the last second chip in this group forms the second control electrode 326, and the M2 second control electrodes 326 are electrically connected. All the third chips 323 of the plurality of the RGB light-emitting units 32 are divided into M3 groups, each group of the M3 groups includes N3 third chips 323, the N3 third chips 323 in each group are connected in series and the second electrode of the last third chip 323 in this group forms the third control electrode 327, and the M3 third control electrodes 327 are electrically connected. The first electrode of the first chip 321 in each group of the serially connected first chips 321, the first electrode of the first second chip 322 in each group of the serially connected second chips 322, and the first electrode of the first third chip 323 in each group of the serially connected third chips 323 are electrically connected to form the common electrode 324.
Herein, the numbers of M1, M2, and M3 are set to be the same or different. Similarly, the numbers of N1, N2, and N3 are set to be the same or different.
In this embodiment, the first chips 321, the second chips 322 and the third chips 323 are arranged at intervals along the length direction of the circuit substrate 31.
In descriptions of the description, the descriptions with reference to terms “an embodiment”, “example”, and the like means that the specific features, structures, materials or characteristics described in combination with the embodiment or example is included in at least one embodiment or example of the present disclosure. In the description, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics may be combined in an appropriate manner in at least one embodiment or example.
Number | Date | Country | Kind |
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201910673225.6 | Jul 2019 | CN | national |
Filing Document | Filing Date | Country | Kind |
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PCT/CN2020/098757 | 6/29/2020 | WO |