Patent Grant
8585248
1. Field of the Invention
The present invention relates to luminaires, for light-emitting diode (LED) illumination, having efficient thermal dissipation.
2. Description of the Prior Art and Related Information
Commercial spaces often employ overhead recessed fluorescent lighting. Such recessed lighting is becoming less efficient than newer alternatives, and often use hazardous materials such as mercury.
Further, fluorescent lights generally lack adequate dimming capability. Accordingly, either all of the lights remain on, or dimming is somewhat accomplished by shutting off banks of lights, or by using expensive, step-wise, dimming ballasts.
Other LED downlight alternatives have exhibited high glare from direct view of the LEDs. Diffusing lenses often absorb too much light to compete in efficiency.
There is, therefore, a need for an improved luminaire for efficient illumination.
The present invention may be embodied in a luminaire comprising a plurality of side heat sinking side panels, a plurality of printed circuit boards, and a middle heat sinking panel having a plurality of side apertures and having a diffusely reflective surface. Each printed circuit board has an electrically-insulated back surface and has a selectively electrically-insulated front surface having exposed electrical contacts coupled to light emitting diodes. Each printed circuit board is sandwiched between a respective side heat sinking panel and the middle heat sinking panel with a compressive force and with at least one light emitting diode associated with each side aperture directing light toward the diffusely reflective surface for illumination of an area facing the diffusely reflective surface.
In more detailed features of the invention, each printed circuit board may be a flexible printed circuit board. Each printed circuit board may have a solder mask layer on the front surface, a front copper layer comprising the exposed electrical contacts, an electrically insulative polyimide layer, a rear copper layer, and a solder mask layer on the back surface. The front copper layer may include at least one thermal contact for thermally coupling to a light emitting diode. The rear copper layer may have an area substantially equal to an area of the electrically-insulated back surface. Each of the front and rear copper layers may comprise 3 ounce per square foot copper. The front and rear copper layers are not in electrical contact with the heat sinking panels. Alternatively, each printed circuit board may have a solder mask layer on the front surface, a front copper layer comprising the exposed electrical contacts, an electrically insulative polyimide layer, and a rear aluminum layer on the back surface. Each light emitting diode may emit at least 60 lumens of visible light using an electrical input of 1.5 watts.
The present invention also may be embodied in a luminaire comprising a plurality of side heat sinking panels, a middle heat sinking panel including a diffusely reflective surface, and a plurality of printed circuit boards. Each side heat sinking panel has a plurality of apertures. Each printed circuit board has an electrically-insulated back surface and has a selectively electrically-insulated front surface having exposed electrical contacts coupled to light emitting diodes. Each first printed circuit board is sandwiched between a respective side heat sinking panel and the middle heat sinking panel with a compressive force and with at least one light emitting diode associated with each aperture directing light toward the diffusely reflective surface for illumination of an area facing the diffusely reflective surface.
At least a portion of the diffusely reflective surface may have a curved shape, a faceted shape, or a shape of a pyramid. In addition, at least a portion of the diffusely reflective surface may be an enclosure cover that may be removable from the middle heat sinking panel for access to an enclosure. The luminaire may further include a lens in at least a portion of an illumination opening formed by the middle heat sinking panel and the plurality of side heat sinking panels.
In addition, the present invention may be embodied in a luminaire comprising a heat sinking panel including a diffusely reflective surface, and a plurality of printed circuit boards. Each printed circuit board may have a selectively electrically-insulated front surface having exposed electrical contacts coupled to light emitting diodes. Also, each printed circuit board may have a back surface that is electrically isolated from the front surface. The back surface of each printed circuit board may be thermally coupled to the heat sinking panel with the light emitting diodes directing light toward the diffusely reflective surface for illumination of an area facing the diffusely reflective surface.
The accompanying drawings illustrate embodiments of the present invention and, together with the description, serve to explain the principles of the invention.
With reference to
At the bottom of the luminaire 10 is a part 17 (with the 45 degree bend) can be a reflective surface (reflecting up) or partially reflective (reflecting up) and partially transmissive (allowing light through downward). This part 17 may also be a curved or faceted lens to provide alternative light distribution in the space below. An opening 19 allows light to exit the luminaire. Generally, the luminaire includes four side heat sinking panels 14 such that the center of the middle heat sinking panel 12 has the appearance of an inverted pyramid, for providing an even distribution of light.
Each printed circuit board 18 may be a flexible printed circuit board. Each printed circuit board may have a solder mask layer 32 on the front surface 22, a front copper layer 34 comprising the exposed electrical contacts, 24 and 26, an electrically insulative polyimide layer 36, a rear copper layer 38, and a solder mask layer on the back surface 40. The front copper layer may include at least one thermal contact for thermally coupling to a light emitting diode. The rear copper layer may have an area substantially equal to an area of the electrically-insulated back surface. Each of the front and rear copper layers may comprise 3 ounce per square foot copper (about 107 microns thick). The front and rear copper layers are not in electrical contact with the heat sinking panels 12 and 14. Each light emitting diode may emit at least 60 lumens of visible light using an electrical input of 1.5 watts.
With reference to
Each printed circuit board may be removable and very thin. Each of the panels, 12 and 14, may provide conductive and convective heat sinking.
Thus, by using dual or parallel thermal paths to the heat sinking panels of the respective sandwich through the front surface 22 and through the back surface 20 of the printed circuit board 18, the equivalent thermal resistance to ambient may be significantly reduced. Also, the relatively thick and large surface areas on the front copper layer, thermally connected to the thermal junction of the LED (often the LED cathode), along with a relatively thick second copper layer 38 (or thermal conduction layer 46) that is electrically isolated, permits efficient heat transfer through a very thin printed circuit board 18.
With further reference to
The plurality of printed circuit boards 18 each may be a flexible printed circuit board. Each light emitting diode 30 may emit at least 60 lumens of visible light using an electrical input of 1.5 watts. The luminaire may further include a lens 57 in at least a portion of an illumination opening formed by the middle heat sinking panel 54 and the plurality of side heat sinking panels 52. Surfaces of the heat sinking panels, 52 and 54, and the lens 57, may have holes to allow airflow for better convective cooling.
At least a portion of the diffusely reflective surface 56 may have a curved shape, a faceted shape, or a shape of a pyramid. In addition, at least a portion of the diffusely reflective surface may be an enclosure cover 58 that may be removable from the middle heat sinking panel 54 for access to an enclosure 59. The enclosure may house power and control equipment and connections. The removable enclosure cover allows access to the power and control equipment and connections through the illumination opening, e.g., from below a ceiling mounted luminaire 50.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
This application claims the benefit of U.S. Provisional Application No. 61/374,256, filed Aug. 16, 2010, which application is incorporated herein by reference.
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| Number | Date | Country | |
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| 61374256 | Aug 2010 | US |
