RELATED APPLICATIONS
The present application is based on, and claims priority from, Taiwan Application Serial Number 098124031, filed Jul. 16, 2009, the disclosure of which is hereby incorporated by reference herein in its entirety.
FIELD OF THE INVENTION
This invention relates to a light emitting diode (LED) package, especially relates to an LED package which has a first extended electrode exposed on top surface and a second extended electrode exposed on bottom surface. The package is adaptive to be inserted into a space between a top electrode metal contact and a bottom electrode metal contact of a display system.
BACKGROUND
FIG. 1 is a prior art.
FIG. 1 is an LED cassette unit 200 which is disclosed in U.S. Pat. No. 7,445,355. The prior art LED cassette unit has a top metal electrode 21 and a bottom metal electrode 22. An insulation layer 25 is sandwiched in between the top electrode metal 21 and the bottom electrode metal 22. A center clearance is made in center of the top metal electrode 21 and the insulation layer 25 to expose center surface of the bottom electrode metal 22. An LED 20 is mounted on the bottom metal electrode 22 in the center clearance. A metal wire 24 electrically couples a top electrode of the LED 20 to the top metal electrode 21. A bottom electrode of the LED 20 electrically contacts the bottom metal electrode 22. Protection glue 23 encapsulates the metal sire 24 and the LED 20 for ensuring the quality reliability of the LED package.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a prior art.
FIGS. 2A˜2B, 3A˜3B shows different views of a first embodiment according to the present invention.
FIGS. 4A˜4B, 5A˜5B, 6A˜6D shows different views of a second embodiment according to the present invention.
DETAILED DESCRIPTION OF EMBODIMENTS
An improved manufacturing process to manufacture an LED package with a top electrode and a bottom electrode is disclosed. The process includes preparing a piece of metal sheet, forming a pair of coplanar metals—a first metal and a second metal, mounting an LED chip on an inner end of the first metal, wire-bonding top electrode of the LED chip to an inner end of the second metal, molding to protect at least the LED chip and the bonding wire, and bending an outer end of the first metal upward to form an extended flat top electrode, and bending an outer end of the second metal downward to form an extended bottom flat electrode.
FIGS. 2A˜2B and 3A˜3B shows different views of a first embodiment according to the present invention.
FIG. 2A shows a first embodiment before bending the metals according to the present invention. The process includes: (1) preparing a piece of metal sheet (not shown), (2) forming a first metal 511 and a coplanar second metal 512 by, for example, punching the single piece of metal sheet, (3) mounting an LED 50 on a first end of the first metal 511 and electrically coupling a bottom electrode of the LED 50 to the first metal 511, (4) electrically coupling a top electrode of the LED 50 to a first end of the second metal 512 through wire-bonding with a metal wire 52, and (5) protection molding with glue 53 for fixing and protecting at least the LED 50, wire 52 and inner ends of the two metals 511, 512.
FIG. 2B shows a side view of FIG. 2A. An outer end of the first metal 511 exposed outside of the glue 53 is going to be bent upward, and an outer end of the second metal 512 is exposed outside of the glue 53 is going to be bent downward.
FIG. 3A shows a top view after bending of the metals according to the present invention. The outer end of the first metal 511 is bent upward twice 90 degrees to form a top flat 511T as a first extended electrode. The outer end of the second metal 512 is bent downward twice 90 degrees to form a bottom flat 512B as a second extended electrode.
FIG. 3B shows a side view of FIG. 3A. The first metal 511 is bent to form a c-shape top flat 511T as a top electrode of the package. The second metal 512 is bent to form an inverse c-shape bottom flat 512B as a bottom electrode of the package.
FIGS. 4A˜4B, 5A˜5B, and 6A˜6D shows different views of a second embodiment according to the present invention.
FIG. 4A shows a second embodiment before bending the metals according to the present invention. The process includes: (1) preparing a single metal sheet (not shown), (2) forming an I metal 611 (first metal) and a coplanar rectangular metal 612 (second metal); the I metal 611 has a vertical beam, a first pair of horizontal legs extended from the left side of the vertical beam, and a second pair of horizontal legs extended from the right side of the vertical beam; the rectangular metal 612 is located in between two horizontal parallel legs of one of the two pairs of legs, (3) mounting an LED 60 on the beam of the I metal 611, electrically coupling a bottom electrode of the LED 60 to the I metal 611 through direct contact, (4) electrically coupling a top electrode of the LED 60 to an inner end of the rectangular metal 612 through wire-bonding with a metal wire 62, and (5) protection molding with glue 63 for fixing and protecting at least the LED 60, the bonding wire 62 and inner portion of the rectangular metal 612.
FIG. 4B shows a side view of FIG. 4A. The outer ends of the four legs of the I metal 611 expose outside of the glue 63, each of the four legs is going to be bent upward, and an outer portion of the rectangular metal 612 exposed outside of the glue 63 is going to be bent downward.
FIG. 5A shows a top view after bending the metals according to the present invention. Each of the four legs of the I metal 611 is bent upward twice 90 degrees to form four top flats 611T as extended top electrodes of the package. The outer end of the second metal 612 is bent downward twice 90 degrees to form a bottom flat 612B as an extended bottom electrode of the package.
FIG. 5B shows a side view of FIG. 5A. The two legs in the left side of the I metal 611 are bent to form a pair of c-shape metal with two top flats 611T—a first electrode and a second top electrode of the package. The two legs in the right of the I metal 611 are bent to form a pair of inverse c-shape metal with two top flats 611T as a third top electrode and a fourth top electrode of the package. The second metal 612 is bent to form an inverse c-shape metal with a bottom flat 612B as a bottom electrode of the package.
FIG. 6A shows a top view of FIG. 5A or 5B. Four top flats 611T are shown which function as extended top electrodes of the LED package.
FIG. 6B shows a bottom view of FIG. 5A or 5B. The bottom flat 612B is shown which functions as a bottom electrode of the LED package.
FIG. 6C shows a left view of FIG. 5A or 5B. Two left metal arms are shown in the left side of the package.
FIG. 6D shows a right view of FIG. 5A or 5B. Two right metal arms are shown in the right side of the package; and a metal arm of the rectangular metal 612 is shown in the right side of the package.
While several embodiments have been described by way of example, it will be apparent to those skilled in the art that various modifications may be made without departing from the spirit of the present invention. Such modifications are all within the scope of the present invention, as defined by the appended claims. The shaft door is a projection screen.
Patent Application
20110012162
