Patent Application
20160201891
The present application relates generally to heat dissipation systems. More particularly, the present application relates to an LED assembly that efficiently dissipates heat from the LED.
Light emitting diodes (“LEDs”) are energy efficient devices that emit light. LEDs are typically more durable and require less power than conventional lighting technology, making them ideal for lights that are frequently in use, such as, for example, street lights. However, LEDs generally produce heat as a by-product of light production and such heat can damage the surrounding structure or LED if it not effectively dissipated.
Currently, LED heat dissipation assemblies include a heat sink with, for example, fins that dissipate the heat from the lighting device to the environment. The heat sink is typically connected to the LED so heat can be conducted directly or indirectly from the LED to the heat sink, and ultimately, away from the lighting device.
Conventional heat dissipation assemblies require direct or near direct connection between the heat sink and LED to effectively receive and dissipate the heat. The heat sink must also be exposed to the outside atmosphere to disperse the excess heat away from the LED device, thus causing concerns of corrosion and the like. These spatial constraints, in addition to the necessary bulk of the heat sink, limit the locations for other parts of the LED device and inefficiently dissipate heat.
The present application discloses a lighting device that includes a heat sink coupled to a heat dissipation structure. The heat dissipation structure can include an extension portion with heat conduits that are operatively connected to the LED to receive and emit heat from the LED. The heat conduits efficiently conduct heat from the LED to the heat sink, which then emits the heat away from the lighting device, so as to protect the internal components of the lighting device, while still enabling distal placement of the heat sink relative to the LED.
In particular, the present application discloses a lighting device including a light emitting structure, a housing adapted to house the light emitting structure, a reflector disposed within the housing and adapted to reflect light emitted from the light emitting structure, and a heat dissipation structure coupled to the housing and including a heat conduit operatively coupled to the light emitting structure to receive heat therefrom, and a heat sink distally disposed relative to the light emitting structure and operatively coupled to the heat conduit to receive the heat therefrom and to dispense the heat away from the light emitting structure.
Also disclosed is a heat dissipation structure including a cap, an extension portion extending from the cap, a body extending from the extension portion, a light emitting device coupled to the cap, a heat conduit operatively coupled to the light emitting device and adapted to transfer heat away from the light emitting device, and a heat sink distally disposed relative to the light emitting device and operatively coupled to the heat conduit and adapted to receive heat from the heat conduit and dispense the heat away from the heat dissipation structure.
For the purpose of facilitating an understanding of the subject matter sought to be protected, there are illustrated in the accompanying drawings embodiments thereof, from an inspection of which, when considered in connection with the following description, the subject matter sought to be protected, its construction and operation, and many of its advantages should be readily understood and appreciated.
While this invention is susceptible of embodiments in many different forms, there is shown in the drawings, and will herein be described in detail, a preferred embodiment of the invention with the understanding that the present disclosure is to be considered as an exemplification of the principles of the invention and is not intended to limit the broad aspect of the invention to embodiments illustrated.
The present application discloses a lighting device that includes a heat sink operatively connected to and distally disposed relative to an LED. The heat generated through operation of the LED is transferred to the heat sink through one or more heat conduits to allow greater spatial variability of the lighting device and protect the internal components of the lighting device.
As shown in
A driver 170 can also be included in the upper housing 105 to control operation of the lighting device 100. For example, the driver 170 can control the times at which the lighting device 100 is illuminated, and the frequency or intensity at which the lighting device is illuminated. The driver 170 can also control output of power to lighting structures such as LEDs so as not to under-power or over-power the LEDs and cause a malfunction.
The heat dissipation structure 125 will now be discussed with reference to
The upper housing 105 and lower housing 110 can be any structure that allows for a clamshell-type housing configuration. As shown, the upper housing 105 is circular shaped with an enclosed top portion, but any shape or size of the upper housing 105 can be implemented without department from the spirit and scope of the present invention. Similarly, the lower housing 110 is also circular in shape and defines an opening for the lens 135, so as to allow light to be emitted from the light emitting structure 200 and into the desired lighting area.
The upper gasket 115 and lower gasket 120 can be any composition and any shape to allow for a mechanical seal between the necessary components. For example, the upper gasket 115 can provide a seal between the reflector 140 and the lens 135. Similarly, the lower gasket 120 can provide a seal between the lens 135 and lower housing 110. The upper 115 and lower 120 gaskets can be made of any material, for example, silicon or rubber, and need not create an air-tight or liquid-tight seal.
The lens 135 allows light to be emitted away from the lighting device 100 and onto the illumination area. The lens 135 can be transparent and/or colored so long as light is allowed to pass through in some manner. The lens 135 can be made of any material, and in a preferred embodiment is made of clear acrylic.
The heat sink 130 can be any structure that dispenses heat away from the light emitting structure 200 to the environment. As shown, the heat sink 130 includes fins to increase the surface area of the heat sink 130 and allow more heat to dissipate from the lighting device 100. However, any structure or any material can be implemented as the heat sink 130 so long as the structure dispenses heat away from the lighting device 100.
The light emitting structure 200 can be any object or device that emits light. For example, the light emitting structure can be an LED, light bulb, fluorescent bulb, liquid crystal display (LCD), plasma screen, or any other device capable of emitting light. In a preferred embodiment, the light emitting structure 200 is an LED.
The heat conduit 205 can be made of any material and can be any structure that allows for the transfer of heat from the light emitting structure 200 towards the heat sink 130. As shown, the heat conduit 205 includes a linear portion 205a located proximate the cap 175, and accordingly, proximate the heat emitting structure 200, so as to receive the heat from the heat emitting structure 200. The heat conduit 205 can also include an angled portion 205b extending from the linear portion 205a and located proximate the heat sink 130. In this manner, the heat conduit 205 can transmit heat from the light emitting structure 200 towards the heat sink 130, and due to the greater surface area contact between the angled portion 205b and the heat sink 130, can transmit more of the heat away from the light emitting structure 200 and ultimately away from the lighting device 100. The heat conduit 205 can be tubular in nature, i.e., can be hollow inside, to allow for even greater surface area to dissipate heat. Also, the heat conduit 205 can include multiple heat conduits, and is not limited to a singular heat conduit 205.
The light emitting structure 200 can be coupled to the heat dissipation structure 125 at the cap 175, as shown. In this manner, the heat dissipation structure 125 can transfer the heat from the light emitting structure 200 towards an area of the lighting device 100 where spatial constraints are not as prevalent. This arrangement allows for the heat sink 130 to be disposed in a variety of different areas on the lighting device 100, therefore allowing greater variability in engineering the lighting device 100.
As discussed herein, the term “coupled” is intended to refer to any connection, direct or indirect, and is not limited to a direct connection between two or more elements of the disclosed invention. Similarly, “operatively coupled” is not intended to mean any direct connection, physical or otherwise, and is merely intended to define an arrangement where two or more elements communicate through some operative means (e.g., through conductive or convective heat transfer, or otherwise).
The matter set forth in the foregoing description and accompanying drawings is offered by way of illustration only and not as a limitation. While particular embodiments have been shown and described, it will be apparent to those skilled in the art that changes and modifications may be made without departing from the broader aspects of Applicant's contribution. The actual scope of the protection sought is intended to be defined in the following claims when viewed in their proper perspective based on the prior art.
