The present invention relates generally to blue LED (Light-Emitting Diode) devices.
A light emitting diode (LED) is a solid state device that converts electrical energy into light. Light is emitted from an active layer of semiconductor materials sandwiched between oppositely doped layers when a voltage is applied across the doped layers. One type of commercially available LED device structure is a so-called lateral blue LED. One type of lateral blue LED involves a substrate and an N-type layer disposed over the substrate. There may be a buffer layer and a template layer and other layers disposed between the substrate and the N-type layer. A strain release layer is disposed on the N-type layer. A Multiple Quantum Well (MQW) active layer is disposed on the strain release layer. A P-type layer is disposed on the active layer. In one example, a first electrode comprising a metal portion and a transparent conductor portion makes electrical contact with the top of the P-type layer. A second electrode of metal makes electrical contact with the N-type layer. The P-type layer may be a magnesium doped layer of p-GaN (gallium nitride). The n-type layer may be a silicon doped layer of n-GaN. The active layer typically involves InGaN/GaN periods as is known in the art. The strain release layer may involve periods of InxGa1-xN/InyGa1-yN, where x≠y. Ways of improving the performance of such blue LED devices are sought.
A strain release layer adjoins the active layer in a blue LED. The strain release layer is bounded on the bottom by a first relatively-highly silicon-doped region and is also bounded on the top by a second relatively-highly silicon-doped region. The first relatively-highly silicon-doped region is a sublayer of the N-type layer of the LED. The second relatively-highly silicon-doped region is a sublayer of the active layer of the LED. The first relatively-highly silicon-doped region is also separated from the remainder of the N-type layer by an intervening sublayer that is only lightly doped with silicon. The silicon doping profile promotes current spreading. The LED has high output power (for example, 140 lumens/watt), a low reverse leakage current (for example, 0.1 microamperes), and a high ESD breakdown voltage (for example, 4000 volts).
An LED device includes a substrate, a buffer layer, an N-type layer, a strain release layer and a multiple quantum well active layer. The substrate is crystalline silicon. The buffer layer is adjacent to the substrate. The N-type layer is made of gallium nitride (GaN) and is adjacent to the buffer layer. The N-type layer includes a sublayer NSL3 that has a first silicon dopant concentration. The strain release layer has a first portion SRLP1 and a second portion SRLP2. The first portion SRLP1 is adjacent to the sublayer NSL3. The strain release layer has a second silicon dopant concentration. The active layer has a sublayer ALSL1 that is adjacent to the second portion SRLP2. The sublayer ALSL1 has a third silicon dopant concentration. Both the first silicon dopant concentration and the third silicon dopant concentration are higher than the second silicon dopant concentration.
Each of the first silicon dopant concentration and the third silicon dopant concentration exceeds 1×1018 atoms/cm3, whereas the second silicon dopant concentration is less than 5×1016 atoms/cm3. The strain release layer has a concentration of indium that is between 5×1019 atoms/cm3 and 5×1020 atoms/cm3.
Further details and embodiments and methods are described in the detailed description below. This summary does not purport to define the invention. The invention is defined by the claims.
The accompanying drawings, where like numerals indicate like components, illustrate embodiments of the invention.
Reference will now be made in detail to some embodiments of the invention, examples of which are illustrated in the accompanying drawings.
Reference will now be made in detail to some embodiments of the invention, examples of which are illustrated in the accompanying drawings. In the description and claims below, when a first layer is referred to as being disposed “over” a second layer, it is to be understood that the first layer can be directly on the second layer, or an intervening layer or layers may be present between the first and second layers. The terms such as “over”, “under”, “upper”, “lower”, “top”, “bottom”, “upward”, “downward”, “vertically”, and “laterally” are used herein to describe relative orientations between different parts of the blue LED device being described, and it is to be understood that the overall blue LED device being described can actually be oriented in any way in three-dimensional space.
Strain release layer 4 in one example includes thirty periods, where each period includes a 2 nm thick layer of InxGa1-xN, 0<x<0.12, and where each period also includes a 2 nm thick layer of InyGa1-yN, 0<y<0.12, where x≠y. Strain release layer 4 is particularly important where substrate 7 is silicon as opposed to sapphire. The N-type layer 5 of n-GaN exhibits a high level of stress where substrate 7 is silicon because of the lattice mismatch between crystalline silicon and GaN. Strain release layer 4 helps to relieve some of the strain on the GaN and InGaN lattices. Strain release layer 4 is considered to involve a first portion SRLP1 and a second portion SRLP2. SRLP1 and SRLP2 are disposed with respect to one another as illustrated in
Active layer 3 in one example includes ten periods, where each period includes a 3 nm thick quantum well layer of InGaN and a 10 nm thick quantum barrier layer of GaN. Active layer 3 is considered to involve a first sublayer ALSL1 and a second sublayer ALSL2. ALSL1 and ALSL2 are disposed with respect to one another as illustrated in
P-type layer 2 is doped with magnesium to a concentration of more than 1×1019 atoms/cm3 (for example, 2×1019 atoms/cm3). The silicon concentration in the P-type layer is below 5×1016 atoms/cm3 (for example, as close to zero atoms/cm3 as practical). P-type layer 2 has a concentration of indium of approximately 4×1018 atoms/cm3.
Inspection of line 13 of the silicon concentration profile in
In addition, relatively highly silicon-doped sublayer NSL3 in combination with relatively lightly silicon-doped sublayer NSL2 improve current spreading, and thereby increase LED output power (lumens/watt). Sublayer NSL3 is relatively conductive as compared to sublayer NSL2, so there is an increased amount of lateral current flow in sublayer NSL3 as compared to an example of an LED in which sublayers NSL2 and NSL3 are of the same conductivity.
Peak 105 corresponds to sublayer NSL3 in the N-type layer. Peak 106 corresponds to sublayer ALSL1 in the active layer. Note that peak 106 is not entirely within the active layer, but rather peak 106 is seen straddling the interface between the active layer and the strain release layer. The SIMS data of
The high concentration of indium in strain release layer 4 better relieves the strain on the GaN and InGaN lattices caused by the lattice mismatch with silicon. The lattice mismatch between GaN and crystalline silicon causes a large tensile strain on the GaN layer at the interface with the silicon. Indium is added to the GaN in order to form the larger lattice constant of InGaN. In the embodiment of LED device 1 represented by the concentrations of
In embodiments where the indium concentration is maintained relatively constant throughout strain release layer 4, the optimum range of the indium concentration is between 5×1019 atoms/cm3 and 5×1020 atoms/cm3. The concentration of indium in strain release layer 4 in the embodiment of
A second relatively-highly silicon-doped region is then formed (step 204) on the strain release layer. In one example, the second relatively-highly silicon-doped region is sublayer ALSL1 of the active layer 3 of
Although certain specific embodiments are described above for instructional purposes, the teachings of this patent document have general applicability and are not limited to the specific embodiments described above. Accordingly, various modifications, adaptations, and combinations of various features of the described embodiments can be practiced without departing from the scope of the invention as set forth in the claims.
This application is a continuation of U.S. patent application Ser. No. 14/158,440 filed Jan. 17, 2014, which is a continuation of U.S. patent application Ser. No. 13/602,145 filed Sep. 1, 2012 and issued as U.S. Pat. No. 8,669,585 on Mar. 11, 2014, which claims priority under 35 U.S.C. §119 from U.S. Provisional Application No. 61/530,972, entitled “An LED That Has Bounding Silicon-Droped Regions on Either Side of a Strain Release Layer,” filed Sep. 3, 2011, the subject matter of which is incorporated herein by reference in their entirety.
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6586762 | Kozaki | Jul 2003 | B2 |
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7211822 | Nagahama et al. | May 2007 | B2 |
RE42008 | Tanizawa et al. | Dec 2010 | E |
Number | Date | Country | |
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20150069324 A1 | Mar 2015 | US |
Number | Date | Country | |
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61530972 | Sep 2011 | US |
Number | Date | Country | |
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Parent | 14158440 | Jan 2014 | US |
Child | 14540864 | US | |
Parent | 13602145 | Sep 2012 | US |
Child | 14158440 | US |