The subject matter herein generally relates to a lens module and an electronic device having the lens module.
With the miniaturization of electronic products, the lens module is an important component in electronic products, and its size design will have a greater impact on the overall sizes of electronic products.
Therefore, there is room for improvement within the art.
Implementations of the present disclosure will now be described, by way of embodiments, with reference to the attached figures.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale, and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.
The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings, in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean “at least one.”
The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, Group, series, and the like.
In at least one embodiment, the circuit board 10 may be a flexible circuit board, a rigid circuit board, or a rigid-flexible circuit board. In an embodiment, the circuit board 10 is a rigid-flexible circuit board including a first rigid portion 12, a second rigid portion 14, a flexible portion 16 connecting the first rigid portion 12 and the second rigid portion 14.
At least one electronic connecting element 18 is mounted on a surface of the second rigid portion 14. When the lens module 100 is applied to an electronic device 200 (shown in
Referring to
The base 30 is mounted on the surface of the first rigid portion 12 with the photosensitive chip 20.
Referring to
The base 30 is a hollow structure, and connects to the circuit board 10 by a first adhesive layer 82. A through hole 32 is defined on the base 30 to correspond to the photosensitive region 22 of the photosensitive chip 20. The through hole 32 is circular. An inner surface of the base 30 surrounds to define the through hole 32. A first thread 34 is formed on the inner surface of the base 30. A portion of a surface of the base 30 facing the circuit board 10 is recessed toward a surface of the base 30 facing away from the circuit board 10 to define a first recess 36. The first recess 36 communicates with the through hole 32. The photosensitive chip 20 is received in the first recess 36.
The filter 40 is circular. A second thread 42 is formed on a sidewall of the filter 40 to cooperate with the first thread 34. The filter 40 is engaged with the first thread 34 of the base 30 by the second thread 42. So that the filter 40 can be fixed on the base 30 without an adhesive structure between the filter 40 and the base 30, thereby reducing a size of the lens module 100 along a direction perpendicular to the sidewall of the filter 40.
In at least one embodiment, the photosensitive chip 20 may be substantially rectangular. A second adhesive layer 84 is formed on a surface of the non-photosensitive region 24 facing away from the first rigid portion 12, to adsorb dirt and dust generated by meshing the filter 40 and base 30, thereby preventing the dirt and the dust from entering the photosensitive region 22. As a result, a yield rate of the lens module 100 can be improved.
In at least one embodiment, the lens holder 50 is mounted on the surface of the base 30 facing away from the circuit board 10 by a third adhesive layer 86. The lens holder 50 may be generally cuboid. A receiving hole 52 is defined on the lens holder 50.
The lens 60 is received in the receiving hole 52 of the lens holder 50. The lens 60 and the lens holder 50 may be assembled or integrally formed. In at least one embodiment, the lens 60 and the lens holder 50 are integrally formed. The lens 60 includes a first lens portion 62, a second lens portion 64 and a third portion 66. The second lens portion 64 is located between the first lens portion 62 and the third lens portion 66. A diameter of the second lens portion 64 is less than a diameter of the first lens portion 62, and a diameter of the third lens portion 66 is less than the diameter of the second lens portion 64. In at least one embodiment, the first lens portion 62, the second lens portion 64 and the third portion 66 may be integrally formed.
The lens module 100 may further include a protective part 70. A second recess 70 is defined on the protective part 70 to receive the lens 60. The protective part 70 cooperates with the lens holder 50 to protect the lens 60, for example, to prevent dust from contaminating the lens 60.
Referring to
It is to be understood, even though information and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the present embodiments, the disclosure is illustrative only; changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the present embodiments to the full extent indicated by the plain meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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201910751018.8 | Aug 2019 | CN | national |