Patent Application
20210055511
The subject matter relates to imaging devices, and more particularly, to a lens module and an electronic device having the lens module.
Portable electronic devices, such as cell phones, tablet computers, and multimedia players, usually include lens modules. The lens module may comprise a circuit board, an image sensor mounted on the circuit board, a hollow mounting bracket surrounding the image sensor, an optical filter mounted on the mounting bracket and facing the image sensor, and a lens unit positioned above the optical filter. The mounting bracket is made of resin, and can be formed by injection molding.
However, to allow the mounting bracket to have sufficient strength to support the optical filter, the mounting bracket may require a certain thickness, which may increase the size of the lens module. Furthermore, the mounting bracket may have a round edge chamfer at the portion that supports the optical filter, due to the characteristic of the injection molding. The round edge chamfer may reflect a portion of light from the lens unit to the image sensor, which causes stains and anomalies to appear in images and thus lowers the imaging quality.
Therefore, there is room for improvement in the art.
Implementations of the present technology will now be described, by way of embodiment, with reference to the attached figures.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous components. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.
The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series, and the like.
The image sensor 20 is glued to a surface of the circuit board 10 by a first adhesive layer (not shown) disposed in shape of a frame. The first adhesive layer can be made of optically clear adhesive (OCA). The circuit board 10 can be a rigid circuit board, a flexible circuit board, or a rigid-flexible circuit board. In an embodiment, the circuit board 10 is a rigid-flexible circuit board that comprises a first rigid board portion 101, a second rigid board portion 102, and a flexible board portion 103 positioned between the first rigid board portion 101 and the second rigid board portion 102. The image sensor 20 is glued to a surface of the first rigid board portion 101. In an embodiment, the image sensor 20 can be a Complementary Metal Oxide Semiconductor (CMOS) sensor or a Charge Coupled Device (CCD) sensor.
The second rigid board portion 102 can have an electronic connecting member 11 mounted thereon. The electronic connecting member 11 and the image sensor 20 can be at opposite surfaces of the circuit board 10. The electronic connecting member 11 can be gold fingers (edge connector) or other connector.
The mounting bracket assembly 30 is glued to the surface of the circuit board 10 (for example, on the first rigid board portion 101) which has the image sensor 20 by a second adhesive layer 301 disposed in shape of a frame. The second adhesive layer 301 can be made of OCA. Referring to
The first mounting frame 31 is made of resin, and formed by injection molding. The first mounting frame 31 is rectangular and substantially hollow, and includes a number of side portions 310 connected end-to-end. The side portions 310 cooperatively define a receiving space 311 of the first mounting frame 31. The image sensor 20 is received in the receiving space 311.
The third adhesive layer 33 is formed on a surface of the side portions 310 facing away from the circuit board 10. The third adhesive layer 33 can be made of OCA.
The second mounting frame 32 includes a hollow metal sheet 3201 formed by punching. A black oxidizing layer 3202 is formed on the metal sheet 3201 by a black anodic oxidation process. The second mounting frame 32 is divided into a first connecting ring 321, a second connecting ring 322, and a supporting ring 323. The first connecting ring 321 is fixed on the third adhesive layer 33. The outer side of the first connecting ring 321 is aligned with the outer side of the first mounting frame 310, and the inner side of the first ring 321 protrudes from the first mounting frame 31 so as to be above the receiving space 311. The second connecting ring 322 is connected to the inner side of the first connecting ring 321. The second connecting ring 322 is perpendicular to the first connecting ring 321, and protrudes into the receiving space 311. The height of the second connecting ring 322 can be substantially equal to the height of the optical filter 40. The supporting ring 323 is connected to a side of the second connecting ring 322 facing away from the first connecting ring 321. The supporting ring 323 has an opening 3230 corresponding to a sensing area (not labeled) of the image sensor 20. The supporting ring 323 can be substantially parallel to the first connecting ring 321.
Referring to
The optical filter 40 is glued to the second surface 3232 of the supporting ring 323 by a fourth adhesive layer 41 (see
The lens unit 50 is glued to the surface of the first connecting ring 321 facing away from the circuit board 10 by a fifth adhesive layer 53. The lens unit 50 comprises a lens holder 51 and a lens 52 received in the lens holder 51. The lens 52 faces the optical filter 40. In an embodiment, the lens 52 is integrally formed with the lens holder 51. The lens holder 51 and the lens 52 can be made of resin.
When in use, the optical filter 40 removes infrared light. The image sensor 20 converts the light which is received to electrical signals, and outputs the electrical signals to the circuit board 10. The circuit board 10 processes the electrical signals to form images. The lens module 100 can be mounted to other components (not shown) of the electronic device through the electronic connecting component 13.
Referring to
Since the second mounting frame 32 is made of metal, the thickness of the supporting ring 323 can be reduced while retaining the same supporting strength, which can further reduce the size of the electronic device 200. Furthermore, the second mounting frame 32 has the black oxidizing layer which can block light that would otherwise be received by the image sensor 20. Thus, flares or other defects in the image can be prevented. Moreover, the inner side of the supporting ring 323 can form the acute angle since the supporting ring 323 is formed by punching, thereby preventing the supporting ring 323 from reflecting the light towards the image sensor 20. The image quality of the lens module 100 can be improved.
Even though information and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the present embodiments, the disclosure is illustrative only. Changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the present exemplary embodiments, to the full extent indicated by the plain meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201910777559.8 | Aug 2019 | CN | national |
