1. Field of the Invention
The present invention is directed to the art of electrical connectors having contacts arranged thereon in a high-density manner, and especially to a land grid array (LGA) contact configured with a pair of cantilever arms upon which are mechanically elastically pressed to electrically bridge an electrical substrate such as a printed circuit board (PCB) and a integrated circuit (IC) interface such as an LGA package.
2. Description of the Prior Art
With the development of electronic components toward the miniaturization and high-density trends, the electronic components are devised to be increasingly small and arranged in a more and more compact manner. Especially in the electronic connector field, contacts or terminals are configured to be increasingly small, and planted on corresponding housings in a high-density manner.
During the development of the electronic connector field, one big problem is encountered. As well known in the electronic connector field, the closer arrangement of adjacent contacts on housings, and the higher inductance among the adjacent contacts. To decrease inductance between the contacts, it is an efficient and preferred way to bring impedance of each contact down.
Previously, the contact 90 shown in
A developed manner is invented to improve the contact 90 of
However, the terminal 80 has a U-shaped and cantilever-like configuration. This relatively complex configuration may bring much trouble in accurately designing or/and manufacturing a length of the terminal 80. Further, if the distal end 84 is formed to be longer than normal or standard, the distal end 84 abuts against on the retention portion 83 while a pad of the IC package is pressed on a topmost engaging portion 85 of the terminal 80. Additionally, the distal end 84 and a part of the retention portion 83 on which the distal end 84 abuts have relatively inferior resilient characteristics. As a result, the IC package is prone to be supported by the engaging portions 85, instead of a housing (not shown) receiving the terminals 80. Abutting of the distal end 84 against on the part of the retention portion 83 is relatively unreliable, speak differently, engagement between the terminals 80 and the IC package is unreliable. Additionally, if the distal end 84 is formed to be shorter than normal or standard, the distal end 84 may be prone to unreliably electrically engage with the retention portion 83, even can not touch the retention portion 83.
Accordingly, a new and secure contact, which can overcome all the above-mentioned disadvantages, is desired.
Accordingly, one main object of the invention is to provide an electrical contact with ability to securely and efficiently assure low impedance thereof.
To fulfill the above object, an electrical contact is provided according to the present invention. The electrical contact has a retention body and a pair of arms extending respectively from opposite sides of the retention body for electrically mating with corresponding conductive members, respectively. Each arm is formed with a hand. In use, the two hands of the pair of arms are pressed against each other to resiliently deform to make mating parts of the two hands move toward each other and abut against each other to establish an extra electrical path on the contact.
With this configuration of the contact compared with the prior contacts, the hands can be devised to be relatively long enough so that the hands both can resiliently deform to assuredly make the mating parts thereof engage with each other in use. Secure and steady electrical engagement between the hands can still be assured, and the impedance of the contact is securely and efficiently decreased.
The features of the present invention which are believed to novel are set forth with particularity in the appended claims. The invention, together with its objects and the advantages thereof, may be best understood by reference to the following detailed description taken in conjunction with the accompanying drawings, in which like reference numerals identify like elements and in which:
Reference will now be made to the drawings to describe the present invention in detail.
Referring to
The electrical connector 100 comprises a dielectric housing 10 of substantially rectangular configuration and a plurality of contacts 50 planted on the housing 10.
The housing 10 has a substantially rectangular bottom floor 11 and four side walls 12 end to end raised from edges of the bottom floor 11. The floor 11 and the side walls 12 cooperatively define a cavity 13 for engagingly receiving the IC package 40 therein. One side wall 12 is formed with a pair of spaced first cantilever arms 121 each having an engaging part thereof extended into the cavity 13. Another side wall 12 adjacent said one side wall 13 is formed with a second cantilever arm 123 with a pressing part in the cavity 13. The engaging parts and the pressing part are used to cooperatively position the IC package 40 in the cavity 13 in a horizontal plane parallel to the bottom floor 11.
The floor 11 has top and bottom surfaces 111, 112, and defines a substantially rectangular array of contact-passageways 113 between the top and bottom surfaces 111, 112.
Referring also to
Referring to
An upper resilient arm 52 upwardly and outwardly extends from a top side of the retention body 51, and is formed with an upper engaging section 520 at a distal end thereof. An upper resilient leg 53 downwardly and inwards extends from the upper engaging section 520, and is formed with an upper mating section 54 near a distal end thereof.
A lower resilient arm 55 has a configuration similar to the upper arm 52. The lower arm 55 downwardly and outwardly extends from a bottom side of the retention body 51, and is formed with a lower engaging section 550 at a distal end thereof. A lower resilient leg 56 upwardly and inwards extends from the lower engaging section 550, and is formed with a lower mating section 57 near a distal end thereof.
The upper arm 52, the upper engaging section 520, the upper leg 53 and the upper mating section 54 are respectively corresponded to the lower arm 55, the lower engaging section 550, the lower leg 56 and the lower mating section 57 in a vertical direction.
With the configuration of the contact 50, the upper leg 53 and the lower leg 57 can be devised to be long enough to assure engagement between the upper mating section 54 and the lower mating section 57 in use.
Referring to
Referring also to
In use, the connector 100 is sandwiched between the PCB 60 and the IC package 40 which are parallel to each other, with each upper engaging section 520 corresponding to a top pad 42 arranged on the IC package 40 and each lower engaging section 550 corresponding to a bottom pad 62 arranged on the PCB 60.
The PCB 60 or/and the IC package 40 is urged to close toward each other, thereby making the top and bottom pads 42, 62 press against the upper and lower engaging sections 520, 550, respectively.
Further pressing, the upper and lower arms 52, 55 are bent to generate elastic force to assure steadily mechanical and electrical engagement between the top and bottom pads 42, 62 and the upper and lower engaging sections 520, 550.
When the upper and lower arms 52, 55 are bent to the degree that the upper mating section 54 and a corresponding lower mating section 57 touch each other, an extra electrical path on the contact 50 is established. As a result, impedance of the contact 50 is decreased.
When the contact 50 is further compressed by the IC package 40 or/and the PCB 60, the upper and lower legs 53, 56 both elastically deform in a plane parallel to the height direction of the housing 10. The IC package 40 and the PCB 60 are fastened to the housing 10, instead of the contacts 50. This further strengthens steady engagement between the upper and lower engaging sections 520, 550 and the top and bottom pads 42, 62.
Until the electrical connector 100 is fully engaged with the IC package 40 and the PCB 60, the upper and lower engaging sections 520, 550 fully mate with the top and bottom pads 42, 62 and the upper and lower mating sections 54, 57 engage with each other. Two electrical paths are completely bridged between the IC package 40 and the PCB 60 by the electrical connector 100.
Since the upper leg 53 and the lower leg 57 of each contact 50 can be devised to be long enough and thus have good resilient characteristics to assure engagment between the upper mating section 54 and the lower mating section 57 in use, the IC package 40 can be securely mounted on the housing 10, instead of being unreliably supported by all of the upper engaging sections 520. Reliable electrical engagement between the IC package 40 and the contacts 50 is assured.
Furthermore, although the present invention has been described with reference to a preferred embodiment, it is not to be construed as being limited thereto. Various alterations and modifications can be made to the embodiments without in any way departing from the scope or spirit of the present invention as defined in the appended claims.
Number | Date | Country | Kind |
---|---|---|---|
93201656 | Feb 2004 | TW | national |
This application is related to application Ser. No. 10/635,626, filed on Aug. 5, 2003 and allowed, and application Ser. No. 10/658,430, filed on Sep. 8, 2003 and now pending.