The present invention relates to libraries for simulating electronic circuits employing flexible substrates, recording media storing these libraries, and library generating systems.
In line with increasing downsizing and thinning of electronic devices, a flexible substrate is increasingly used for a printed circuit board inside an electronic device. To shorten a period for designing electronic devices employing printed circuit boards including flexible substrates, diversifying simulation systems have been used. In transmission line simulation used typically for noise reduction, a simulation program for electronic circuits called SPICE (Simulation Program with Integrated Circuit Emphasis) developed at the University of California, Berkeley has often been used in the past. However, in line with the increasing use of higher frequencies in electronic devices, it is becoming difficult to express electrical characteristics of printed circuit board by lumped parameter elements, such as capacitors and resistances. Therefore, the use of electromagnetic simulation is also increasing. For example, Patent Literature 1 discloses transmission line simulation of an electronic device including a printed circuit board and electronic component. This simulation combines an equivalent circuit model retaining electrical characteristics of electronic component or connector extracted from a component library and an equivalent circuit model for wiring of printed circuit board obtained by electromagnetic simulation.
Since a flexible substrate takes any 3D shape, an optimal shape of flexible substrate is not yet known at an initial design stage. Its shape cannot thus be determined. Accordingly, it is impossible to prepare an equivalent circuit model for flexible substrate using a component library in which the shape is fixed, as disclosed in Patent Literature 1. In addition, the electromagnetic simulation for calculating an equivalent circuit model for wiring of printed circuit board, which is disclosed in Patent Literature 1, executes simulation on the condition that wiring of the printed circuit board is uniformly formed in a vertical direction with respect to its cross-section. Therefore, this simulation is not applicable to simulation of a flexible substrate, which may take a complicated shape such as a shape twisted for one turn.
Patent Literature Japanese Patent Unexamined Publication No. H9-274623.
The present invention enables simulation of electronic circuit employing a flexible substrate.
A library for electronic circuit simulation of the present invention stores information on electrical characteristics and 3D shapes of a flexible substrate, and these electrical characteristics change in response to changes in the 3D shape.
Based on this library, electrical characteristics of flexible substrate change in response to changes in the 3D shape of flexible substrate. Therefore, characteristics of an electronic device employing flexible substrate can be more accurately simulated even if the shape of flexible substrate is frequently changed. In addition, there is no need to execute electromagnetic simulation every time the 3D shape of flexible substrate is changed. This is particularly suitable for the initial design stage that requires shorter simulation time as much as possible due to a continuing process of trials and errors.
Exemplary embodiments of the present invention are described below with reference to drawings.
The first exemplary embodiment of the present invention is described below with reference to
For selecting electronic components, determining circuit configuration, and designing wiring on a printed circuit board in the electronic device, computer-aided electronic circuit simulation is often used. To execute this electronic circuit simulation, a designer selects electrical characteristics of candidate electronic components and connectors that may be used in the electronic device, and also selects electrical characteristics of electrical wiring of the printed circuit board from a library prepared in advance for simulation. Then, an electronic circuit simulator combines these selected items and prepares a circuit diagram for simulation so as to determine whether or not these electrical characteristics fulfill target characteristics.
The electrical characteristics of electrical wiring of the printed circuit board are normally calculated based on electrical material characteristics of printed circuit board, such as relative permittivity and dielectric loss; and 3D shape information, which is physical dimensions including the thickness of printed circuit board and the length, width, and thickness of electrical wiring. Electrical wiring of the foregoing rigid printed circuit board rarely takes an arbitrary shape, based on rules for manufacturing printed circuit boards. Electrical wiring patterns can thus be categorized into several limited types. Accordingly, by preparing a library for electrical characteristics of these categorized electrical wirings of printed circuit boards, a designer can easily reuse the library for electronic circuit simulation. This increases the design efficiency.
However, electrical characteristics of electrical wirings of these rigid printed circuit boards are calculated on the condition that a 2D cross-section of a printed circuit board is uniform in a longer direction of electrical wiring. Therefore, this is not applicable to electrical wiring of a flexible substrate that may take any 3D shape. Even if electromagnetic simulation is applied to the entire flexible substrate so as to obtain electrical characteristics and they are used for electronic circuit simulation, it will take more than a few days for calculation if electromagnetic simulation such as a finite element method or finite-difference time-domain method is used. This is because a flexible substrate, in general, has a relatively large area compared to its thickness. Accordingly, these methods are not suitable at the initial design stage when the shape of flexible substrate is not yet determined.
Therefore, in the present invention, electrical characteristics of electrical wiring of flexible substrates are linked to 3D shape information in advance in a library. This increases the simulation efficiency at the initial design a stage of electronic devices, and leads to higher design efficiency.
If electrical characteristics of electrical wiring of flexible substrate cannot be expressed by the equivalent circuit model using lumped parameters, as shown in
This library retaining electrical characteristics, such as equivalent circuit model and S parameters, is often used in a general-purpose commercial electronic circuit simulator. Therefore, libraries are preferably prepared in a basic format. For example, in case of equivalent circuit models, SPICE format or EDIF format (Electronic Design Interchange Format) is preferably adopted.
The second exemplary embodiment of the present invention is described below with reference to
Unlike normal printed circuit boards, flexible substrates can be bent or twisted, and thus flexible substrates can have any 3D shape. Accordingly, a display unit is extremely useful for visually confirming the 3D shape so as to determine whether or not an intended design is fulfilled. In the design concept stage at which the thickness, length, and width of flexible substrate are not determined yet, i.e., the initial design stage, the shape of flexible substrate is ideally examined based on designer's free-minded ideas. On the other hand, it is troublesome to manually extract characteristic dimensions of the 3D shape, such as thickness, width, and length of the substrate and bending radius of a bending portion; after the shape of flexible substrate is freely determined. This is not suitable in the design concept stage where the shape is repeatedly changed and characteristics need to be confirmed every time.
Therefore, aforementioned troublesome work can be eliminated and the design efficiency can be drastically increased by using a computer to automatically calculate and extract characteristic 3D dimensions for determining electrical characteristics based on the 3D shape of a flexible substrate prepared.
Next, extracted 3D shape dimensions are compared with that of existing flexible substrates in a library stored in a database, and data closest to conditions of the flexible substrate prepared is used for electronic circuit simulation. Electrical characteristics of the selected flexible substrate are linked to electrical characteristics of a connector to which the flexible substrate is connected, a rigid printed circuit board to which the connector is connected, and a surface-mount electronic component. In this way a circuit diagram for simulating the entire electronic device is prepared.
In
If a flexible substrate is used in an electronic device such as folding mobile phone, the flexible substrate is assumed to be bent frequently by opening and closing the casing of mobile phone. Therefore, it is important to consider mechanical characteristics, i.e., mechanical strength, of flexible substrate in addition to the electrical characteristics in the design. Conventionally, in designing these types of electronic devices, whether electrical characteristics fulfill target values are first examined. Then, after electrical characteristics become satisfactory, mechanical characteristics including the maximum stress and bending destruction strength are evaluated. If the target mechanical characteristics are not fulfilled, a design of flexible substrate is changed, and a process starts, in general, from checking electrical characteristics again. However, in this conventional design process, an engineer for evaluating electrical characteristics and an engineer for evaluating mechanical characteristics are often different, resulting in a long design period.
Therefore, information related to mechanical characteristics, such as allowable deformation level, is stored in a library of flexible substrates in database prepared in advance, in addition to 3D shapes and electrical characteristics. By comparing this data in the library and design information on flexible substrate, simulation of electrical characteristics and whether or not mechanical characteristics achieve target values can be instantaneously evaluated at the same time.
In addition to characteristic calculator 11, an output unit for outputting a file on electrical characteristics calculated by characteristic calculator 11 in a predetermined format may be provided. The system may also include a determination unit for evaluating whether or not the 3D information input to input unit 7 exceeds an allowable deformation level, and an alarm generator for generating an alarm when the 3D shape information exceeds the allowable deformation level. If this library generating system has a function to automatically compare allowable mechanical characteristics and mechanical characteristics of designed flexible substrate, and automatically generate an alarm when exceeding the allowable level, designer's overlook can also be prevented for further effective simulation.
A library for simulating electronic circuits of flexible substrates of the present invention and the library generating system enable high-speed simulation of electronic devices employing flexible substrates. This increases the design efficiency. Accordingly, the present invention is effectively applicable to industrial fields as a method of inexpensively designing electronic devices.
Number | Date | Country | Kind |
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2007-135144 | May 2007 | JP | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/JP2008/001221 | 5/16/2008 | WO | 00 | 11/12/2009 |