Lid for a microelectronic package

Information

  • Patent Grant
  • D407382
  • Patent Number
    D407,382
  • Date Filed
    Thursday, October 24, 1996
    28 years ago
  • Date Issued
    Tuesday, March 30, 1999
    25 years ago
Abstract
Description
Claims
  • We claim the ornamental design for a lid for a microelectronic package, as shown and described.
US Referenced Citations (6)
Number Name Date Kind
D206327 Keys Nov 1966
D358805 Siegel et al. May 1995
D395638 Koyama et al. Jun 1998
3255055 Ross Jun 1966
5055971 Fundala et al. Oct 1991
5089929 Hilland Feb 1992