This application incorporates the entire disclosures of the following applications by reference: U.S. Provisional Application Nos. 61/220,019, filed on Jun. 24, 2009 and 61/265,149, filed Nov. 30, 2009, U.S. application Ser. No. 12/817,807 filed on Jun. 17, 2010, U.S. application Ser. No. 13/492,177, filed on Jun. 8, 2012 and U.S. Provisional Application No. 62/039,695 filed on Aug. 20, 2014.
The present disclosure relates generally to lighting using solid state light sources such as light-emitting diodes or lasers and, more specifically, to lighting devices for various applications that use conic sections and various structural relationships to provide an energy-efficient long-lasting life source.
This section provides background information related to the present disclosure which is not necessarily prior art.
Providing alternative light sources is an important goal to reduce energy consumption. Alternatives to incandescent bulbs include compact fluorescent bulbs and light-emitting diode (LED) light bulbs. The compact fluorescent light bulbs use significantly less power for illumination. However, the materials used in compact fluorescent bulbs are not environmentally friendly.
Various configurations are known for light-emitting diode lights. Light-emitting diode lights last longer and have less environmental impact than compact fluorescent bulbs. Light-emitting diode lights use less power than compact fluorescent bulbs. However, many compact fluorescent bulbs and light-emitting diode lights do not have the same light spectrum as incandescent bulbs. They are also relatively expensive. In order to achieve maximum life from a light-emitting diode, heat must be removed from around the light-emitting diode. In many known configurations, light-emitting diode lights are subject to premature failure due to heat and light output deterrents with increased temperature.
Energy Star has purposed luminous intensity distribution requirements for omni-directional lamps. The luminous intensity is measured within each vertical plane at a five degree vertical angle increment from 0° to 135° degrees. This is illustrated in
This section provides a general summary of the disclosure, and is not a comprehensive disclosure of its full scope or all of its features.
The present disclosure provides a lighting assembly that is used for generating light and providing a long-lasting and thus cost-effective unit. The examples provided in the present disclosure improve the distribution of light around and through the light assembly.
In one aspect of the disclosure, a lighting assembly includes a cover having an upper portion and a redirection portion. The cover has a longitudinal axis and a housing that is coupled to the cover. A lamp base is coupled to the housing. A circuit board is disposed within the housing. The circuit board has a plurality of light sources thereon. An internal redirection element is coupled to the circuit board and has a curvilinear shaped surface for reflecting a first portion of light from the plurality of light sources through the redirection portion of the cover and transmitting a second portion of light therethrough.
The drawings described herein are for illustrative purposes only of selected examples and not all possible implementations, and are not intended to limit the scope of the present disclosure.
Corresponding reference numerals indicate corresponding parts throughout the several views of the drawings.
The following description is merely exemplary in nature and is not intended to limit the present disclosure, application, or uses. For purposes of clarity, the same reference numbers will be used in the drawings to identify similar elements. As used herein, the phrase “at least one of A, B, and C” should be construed to mean a logical (A or B or C), using a non-exclusive logical OR. It should be understood that steps within a method may be executed in different order without altering the principles of the present disclosure.
It should be noted that in the following figures various components may be used interchangeably. For example, several different examples of control circuit boards and light source circuit boards are implemented. As well, various shapes of light redirection elements and heat sinks are also disclosed. Various combinations of heat sinks, control circuit boards, light source circuit boards, and shapes of the light assemblies may be used. Various types of printed traces and materials may also be used interchangeably in the various examples of the light assembly.
In the following figures, a lighting assembly is illustrated having various examples that include solid state light sources such as light-emitting diodes (LEDs) and solid state lasers with various wavelengths. Different numbers of light sources and different numbers of wavelengths may be used to form a desired light output depending upon the ultimate use for the light assembly. The light assembly provides an opto-thermal solution for a light device and uses multiple geometries to achieve the purpose.
The light assemblies described herein may be used for various purposes such as but not limited to household lighting, display lighting, horticultural lighting and aqua-cultural lighting. The light assemblies may be tuned to output various wavelengths through the use of coating and films depending on the various application.
Referring now to
The housing 16 may have heat sinking capabilities. In the following example a heat sinking configuration is set forth. The present heat sinking configuration is set forth in U.S. application Ser. No. 12/817,807, filed on Jun. 17, 2010 and Ser. No. 13/492,177 filed on Jun. 8, 2012, the disclosures of which are incorporated by reference herein. However, various configurations and heat sinks may be used. The housing 16 is adjacent to the base 14. The housing 16 may be directly adjacent to the base 14 or have an intermediate portion therebetween. The housing 16 may be formed of a metal or other heat-conductive material such a thermally conductive plastic, plastic or combinations thereof. One example of a suitable metal is aluminum. The housing 16 may be formed in various ways including stamping, extrusion, plastic molding such as over-molding or combinations thereof. Another way of forming the housing 16 includes injected-molded metals such as Zylor®. Thicksoform® molding may also be used. In one constructed example the housing 16 was formed with a first portion 20 and a second portion 22. The first portion 20 is formed of an aluminum material and the second portion 22 is formed at least partially of thermally-conductive plastic. The second portion 22 may also be formed of a portion of thermally-conductive plastic and non-thermally-conductive plastic. Thermally-conductive plastic may be used in higher temperature portions toward the lamp base while non-thermally-conductive less expensive plastic may be used in other portions of the second portion. The formation of the housing 16 will be described further below.
The housing 16 may be formed to provide an air channel 24 formed therein. The air channel 24 has a first cross-sectional area located adjacent to the cover 18 that is wider than the cross-sectional area proximate the lamp base 14. The channels 24 provide convective cooling of the housing 16 and light assembly 10. The tapered cross-sectional area provides a nozzle effect which speeds the velocity of air through the channel 24 as the channel 24 narrows. An inlet 26 to the channel 24 is provided between the second portion 22 and the cover 18. An air outlet 28 provides an outlet from the channel 24. Air from the outlet 28 is travelling at a higher speed than at the inlet 26. Arrows A indicate the direction of input air through the inlet 26 to the channels 24 and arrows B provide the outflow direction of air from the channels 24.
The plurality of channels 24 are spaced around the light assembly 10 to provide distributed cooling.
The housing 16 may define a first volume 29 within the light assembly 10. As will be described below, the first volume 29 may be used to accommodate a control circuit board or other circuitry for controlling the light-emitting diodes or other light sources therein.
The housing 16 may have various outer shapes including a hyperboloidal shape. The housing 16 may also be a free-form shape.
The housing 16 and cover 18 form an enclosure around a substrate or circuit board 30 having light sources 32. The base 14 may also be included as part of the enclosure.
The light assembly 10 includes the substrate or circuit board 30 used for supporting solid state light sources 32. The circuit board 30 may be thermally conductive and may also be made from heat sink material. Solder pads of the light sources may be thermally and/or electrically coupled to radially-oriented copper sectors or circular conductive elements over-molded onto a plastic base to assist in heat conduction. In any of the examples below, the circuit board 30 may be part of the heat sinking process.
The light sources 32 have a high lumen-per-watt output. The light sources 32 may generate the same wavelength of light or may generate different wavelengths of light. The light sources 32 may also be solid state lasers. The solid state lasers may generate collimated light. The light sources 32 may also be light-emitted diodes. A combination of different light sources generating different wavelengths may be used for obtaining a desired spectrum. Examples of suitable wavelengths include ultraviolet or blue (e.g. 450-470 nm). Multiple light sources 32 generating the same wavelengths may also be used. The light sources 32 such as light-emitting diodes generate low-angle light 34 and high-angle light 36. High-angle light 36 is directed out through the cover 18. Three light sources 32 are shown on each half of the light assembly. However the light sources 32 represent three rings of light sources 32. Only one ring may be used. However, two or more rings may be used depending on the desired total Lumen output of the light assembly.
The cover 18 may be a partial spheroid, partial ellipsoid or combinations thereof in shape. The cover 18 may share the longitudinal axis 12. In this example both a spheroidal portion 38 and a partial rotated ellipsoidal portion that may be referred to as a redirection portion 40 are formed into the cover 18. That is, the different cover portions 38, 40 may be monolithic or integrally formed. The cover 18 may be formed of a transparent or translucent material such as glass or plastic. In one example, the cover 18 is formed of polyethylene terephthalate (PET). PET has a crystalline structure that allows heat to be transferred therethrough. Heat may be transferred form the housing 16 into the cover because of the direct contact therebetween. The spherical portion 38 of the cover 18 may be designed to diffuse light and minimize backscattered light trapped within the light assembly 10. The spheroid portion 38 of the cover 18 may be coated with various materials to change the light characteristics such as wavelength or diffusion. An anti-reflective coating may also be applied to the inside of the spheroidal portion 38 of the cover 18. A self-radiating material may also be used which is pumped by the light sources 32. Thus, the light assembly 10 may be formed to have a high color rendering index and color perception in the dark.
Often times in a typical light bulb, the low-angle light is light not directed in a working direction. Low angle light is usually wasted since it is not directed out of the fixture into which the light assembly is coupled.
A portion of the low-angle light 34 may be redirected out of the cover 18 using the redirection portion 40. The redirection portion 40 may be various shapes including a partial spheroid, partial paraboloid, partial ellipsoid, or free-formed shape. The redirection portion 40 may also be shaped to direct the light from the light sources 32 to a central or common point 42 as shown by light ray 34A. The redirection portion 40 may have a coating for wavelength or energy shifting and spectral selection. Coating one or both of the cover 18 and the redirection portion may be performed. Multiple coatings may also be used. The common point 42 may be the center of the spheroid portion of the cover 18.
The redirection portion 40 may have a reflective or partially reflective coating 44 used to increase the reflectivity or change the transmittance thereof. However, certain materials upon forming may not require the coating 44. For example, some plastics, when blow-molded, provide a shiny or reflective surface such as PET. The redirection portion 40 may be formed of the naturally formed reflective surface generated when blow-molding plastic.
The cover 18 may also be formed of partially reflected material. As was described above, a portion of the light rays directed to the redirection portion 40 may also travel through the cover material and directed in a downward direction as illustrated by light ray 34B.
It should be noted that when referring to various conic sections such as an ellipsoid, paraboloid or hyperboloid only a portion or part of the conic section that is rotated around an axis may be used for a particular surface. In a similar manner, portions of a spheroid may be used.
The circuit board 30 may be in direct contact (or indirect contact through an interface layer 50) with the housing 16, and, more specifically to the first portion 20 the housing 16. The housing 16 may include a plurality of fins 52 that extend longitudinally and radially outwardly to form the channels 24. The fins 52 may be spaced apart to allow heat to be dissipated therefrom. As will be described further below, the channels 24 may be formed between an inner wall 54 of the first portion 20, an outer wall 56 of the second portion 22 and the fins 52 that may be formed of a combination of both the first portion 20 and the second portion 22 of the housing 16.
The housing 16 may thus conduct heat away from the light sources 32 of the circuit board for dissipation outside the light assembly. The heat may be dissipated in the housing and the fins 52. Heat may also be transferred into the cover 18 directly from the housing conduction. In this manner heat may be transferred longitudinally by the housing 16 in two directly opposite directions.
The circuit board 30 may also include a receiver 60 for receiving commands from a remote control. The receiver 60 may be various types of receiver including but not limited to an RF receiver or an infrared receiver. Openings 62 may be used for communicating air between the first volume 29 and a second volume 61 within the cover 18. Heated air that is in the cover 18 may be transmitted or communicated into the first volume 29 and through an opening 62 within the first portion 20 of the housing 16 to vent air into the channels 24. The opening 62 will be further described below.
The heated air within the cover 18 may conduct through the cover 18 and circuit board 30 to the housing as well as being communicated through the openings 62.
An internal redirection element 70 is used to redirect or partially transmit both high angle light and low angle light from the light sources 32. The internal redirection elements 70 may be formed of totally reflective material or coated with a totally reflective material. Internal means internal to the light assembly. The internal redirection element 70 may be stamped from metal or formed of a plastic material. The internal redirection element 70 also acts as a heat transfer element. A reflective coating 72 may be provided on the surface of the internal redirection element whether the material is plastic or metal. The coatings may also be reflecting in a portion of the spectrum. The material of the internal direction element may also comprise nanoparticles for wavelength shifting. Coatings may also be used for wave length shifting. A tight mesh material may also be molded within the internal redirection element 70. The mesh material 74 may act as a heat sink to direct heat toward the circuit board and into the heat sinking area below the circuit board. The mesh material 74 may also have wave length shifting details of the formation of the internal redirection element 70 which will be described further below. In general, the internal redirection element 70 is “horn” or bell shaped and is supported by the circuit board. Supporting elements (described below) are not illustrated in
The material of the element 70 may also transmit light as well as reflect light. Controlling the transmittance and reflectance through choice of materials allows ultimate control of the output and direction of the output of the light assembly. If a material that is not light transmissive is used, holes may be formed through the element 70 to allow light therethrough. The area of the holes may vary depending on the desired light output characteristics. For example, 80% of the light may be reflected while 20% is transmitted through element 70.
Referring now to
Although only six light sources 32 are illustrated in
The circuit board 30 may be made out of various materials to form a thermally-conductive substrate. The solder pads of the light sources may be connected to radial-oriented copper sectors or circular conductive elements that are over-molded into a plastic base to conduct heat away from the light sources. By removing the heat from the area of the light sources, the lifetime of the light assembly 10 may be extended. The circuit board 30 may be formed from two-sided FR4 material, heat sink material, or the like. If the board material is electrically conductive, the electrical traces may be formed on a non-conductive layer that is formed on the electrically conductive surface of the circuit board.
Referring now to
Each sector 130, 132 may be disposed on a non-conductive circuit board 30′. As mentioned above, the circuit board 30′ may also be formed of a heat sink material. Should the heat sink material be electrically conductive, a non-conductive pad or layer may be placed between the sectors 130, 132 and the circuit board 30′.
The opening 114 is illustrated as a circle. The opening 114 may also be replaced by smaller openings for coupling a wire or wires from a control circuit board thereto. Such an example will be described further below.
Referring now to
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Snaps 341 may be used to secure the redirection element to the circuit board 30.
To facilitate manufacturing, grip holes 350 may be placed through the internal redirection element. The grip holes 350 allow manufacturing equipment to pick and place the internal redirection element relative to the circuit board during the manufacturing process.
Referring now to
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In
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Light ray 720 reflects from the redirection element 70 toward the redirection portion 40 to the center of the light assembly 10″. Light 722 reflects from the redirection element 70′″ and exits the cover 18 from the light source.
Referring now to
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It should be noted that the transmitting portion 810 may be formed together with the translucent portion 820 in a two-step or two-shot molding process.
Referring now to
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As can be seen, the amount of light for up lighting and down lighting may be controlled using modified versions of the internal redirection element. By using the various examples, the amount of redirected light can be controlled to achieve a desired performance. The ratio of the luminance of a middle portion Lmiddle of the light illustrated in
The foregoing description of the examples has been provided for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention. Individual elements or features of a particular example are generally not limited to that particular example, but, where applicable, are interchangeable and can be used in a selected example, even if not specifically shown or described. The same may also be varied in many ways. Such variations are not to be regarded as a departure from the invention, and all such modifications are intended to be included within the scope of the invention.
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