Patent Application
20130294082
The present invention relates to a light bulb shaped lamp including a semiconductor light-emitting device and a lighting apparatus including the light bulb shaped lamp.
Compared to a conventional illumination light source, a light emitting diode (LED) which is a semiconductor light-emitting device is small and has high efficiency and long lifetime. Recent market needs for saving energy and resource boost the demand for a light bulb shaped lamp using an LED (hereinafter, also simply referred to as “LED light bulb”) which is substitute for a conventional incandescent light bulb using a filament coil.
It is known that the LED has such properties that an optical output decreases as the temperature increases, resulting in shortening its lifetime. In order to cope with this problem, a metal case is provided between a semispherical globe and a base in a conventional LED light bulb so as to prevent the increase in the temperature of an LED (for example, see Patent Literature (PTL) 1).
The following shall describe a conventional LED lamp disclosed in PTL 1 with reference to
As illustrated in
The outer member 14 includes a circumferential portion 15 exposed to the outside, a circular-plate light-source attachment 16 integrally formed with the circumferential portion 15, and a recess 17 formed inside the circumferential portion 15. On the upper surface of the light-source attachment 16, an LED module 18 which includes a plurality of LEDs is attached. It should be noted that an insulator 19 formed along the shape of the inner surface of the recess 17 is provided on the inner surface of the recess 17, and a lighting circuit 20 for lighting the LEDs is housed in the insulator 19.
According to the conventional light bulb shaped LED lamp 11 having the configuration described above, the outer member 14 in which the light-source attachment 16 and the circumferential portion 15 are integrally formed is used. Thus, heat generated at the LEDs is efficiently heat-conducted from the light-source attachment 16 to the circumferential portion 15. With this, the increase in the temperature of the LEDs is suppressed, thereby preventing reduction of the light output from the LEDs.
However, in the conventional light bulb shaped LED lamp in PTL 1, the LED module 18 is provided on the circular-plate light-source attachment 16 in the outer member (metal case) 14. Accordingly, the light toward the base 13 is blocked by the outer member 14, and the light is distributed differently in comparison with incandescent light bulbs. In other words, with the conventional LED light bulbs, it is difficult to achieve the light-distribution properties equivalent to those obtained in the incandescent light bulbs having filament coils.
In view of the above, as one option, the LED light bulb may be formed in a configuration same with that of an incandescent light bulb. Specifically, the configuration of such an LED light bulb includes an LED module which is used as a substitute for a filament coil installed between the two lead wires in an incandescent light bulb. In this case, the LED module is held in the air inside the globe. Accordingly, light generated at an LED is not blocked by the metal case unlike the conventional technology, thereby enabling the light-distribution properties similar to those obtained in the incandescent light bulb to be obtained also in the LED light bulb.
In the LED light bulb configured as described above, the number of chips should be increased if improvement in brightness is desired. Here, in order to increase the number of chips to be installed in a single LED module, the outer diameter of an LED substrate needs to be increased. Increase in the outer diameter of the LED module requires increase in a size of the globe. This causes the LED lamp itself to grow in size.
Growing in size of the LED light bulb is not desirable because it decreases a rate of LED light bulbs mounted on lighting devices, or decreases an appearance quality of the LED light bulb, which means that an appearance shape similar to that of the conventional incandescent light bulb cannot be maintained. To cope with the above, as one option, the multiple number of LED modules may be provided in a globe without increasing in size of the shape of a LED light bulb, using a plurality of LED modules which are combined to form a three-dimensionally structured LED module (for example, forming a U-shape by joining each of the long sides of the three rectangular substrates with one another, a hexahedral cubic shape, or a pentahedral box shape by removing a bottom surface from the hexahedral cubic shape).
However, such a three-dimensional structure has difficulty in controlling the light distribution. In addition, the LED module should be assembled in three-dimensional structure to be a polyhedron. Thus, the three-dimensional structure is undesirable also in productivity.
The present invention is made to solve the above problems, and an object of the present invention is to provide a light bulb shaped lamp capable of having an appearance shape similar to that of the conventional incandescent light bulb, including the increased number of LED chips without growing in size so as to increase the brightness, and easily controlling the light distribution. In addition to the above, the light bulb shaped lamp can also have preferable productivity and long lifetime, and is sufficiently bright.
A light bulb shaped lamp according to the present invention includes: a hollow globe having an opening; a plurality of light-emitting modules housed in the globe, each of the light-emitting modules having a semiconductor light-emitting device that is a light source; and a stem extending from the opening of the globe to an inside of the globe, the stem supporting the light-emitting modules, in which the stem penetrates at least one of the light-emitting modules, and the light-emitting modules are spaced a predetermined distance apart along an axis of the stem.
According to the present invention, the stem penetrates the light-emitting modules so as to support the light-emitting modules, so that the light bulb shaped lamp having an appearance similar to that of a conventional incandescent light bulb can be obtained, and heat radiation of the light-emitting modules can be increased by the stem thermally connected to the light-emitting modules. Therefore, the light-emitting modules can be used in plural in number and the brightness of the light bulb shaped lamp can be increased. In addition, brightness in a light-emitting direction can be increased, and part of light emitted from the light-emitting module placed on a base side can be reflected on a reverse surface of the light-emitting module placed on a globe side opposite to the base side toward back and sides of the lamp. Therefore, wide light distribution can be achieved. Each of the light emitting modules is not configured in three-dimensional structure as above, allowing light-distribution control to be easily performed. Therefore, a light bulb shaped lamp can be obtained which has a preferable productivity and long life time, and is sufficiently bright.
In the above configuration, it is desirable that the stem includes a projection for positioning at least one of the light-emitting modules.
With this, the positioning of the light-emitting module to a planned position of the stem, where the light-emitting module is to be positioned, is facilitated, thereby facilitating fixation using an adhesive. In addition, irregularity in the positioning upon mass production can be reduced. Furthermore, a contact area between the light-emitting module and the stem increases, to thereby enable the heat generated at the light-emitting module to be efficiently conducted to the stem.
In the above configuration, it is desirable that the stem is made of a material having a heat conductivity higher than a heat conductivity of a base platform included in each of the light-emitting modules.
With this, the heat generated at the light-emitting module can be conducted to the stem so as to be dissipated. Accordingly, reduction in light emission properties of the light-emitting module (semiconductor light-emitting device) and reduction in the lifetime, which are associated with increasing the temperature can be prevented.
In the above configuration, it is desirable that the light bulb shaped lamp further includes: a base which receives electric power for causing the semiconductor light-emitting device to emit light; and a case which performs insulation at least between the stem and the base, and houses a lighting circuit for lighting the semiconductor light-emitting device.
With this, the case can be used for insulation between the stem, the lighting circuit, the base, and the like.
A lighting apparatus according to the present invention includes: the aforementioned light bulb shaped lamp; and a device having a socket, in which the light bulb shaped lamp is mounted on the socket of the device.
With this, the heat in the light bulb shaped lamp can be conducted to the socket of the device through the base so as to be dissipated, to thereby prevent the reduction in the light emission properties of the LED, which is associated with the increase in the temperature. In addition, the lighting apparatus including the light bulb shaped lamp having an appearance shape similar to that of a conventional incandescent light bulb in which a filament coil is provided can be achieved.
According to the present invention, the stem penetrates a plurality of light-emitting modules so as to support the light-emitting modules. Accordingly, an appearance shape similar to that of a conventional incandescent light bulb can be achieved without enlarging the shape, and heat radiation of the light-emitting modules can be increased by the stem thermally connected to the light-emitting modules. Therefore, the number of LED chips each serving as semiconductor light-emitting device can be increased, to thereby increase brightness of the light bulb shaped lamp. In addition, the brightness in the light-emitting direction can be increased and part of the light emitted from the light-emitting module placed on a base side can be reflected on a reverse surface of the light-module placed on a globe side opposite to the base side, toward backward and sides of the lamp, to thereby achieve wide light distribution. Furthermore, the light-emitting module does not have a complicated three-dimensional structure, to thereby easily control the light distribution. With this, the light bulb shaped lamp can be obtained which has a preferable productivity and long life-time, and is sufficiently bright.
The following shall describe a light bulb shaped lamp and a lighting apparatus according to an embodiment of the present invention with reference to the drawings. It should be noted that the diagrams are schematic diagrams, and illustration is not necessarily strictly accurate. In addition, each of aspects in the embodiment described below shows a desirable specific example of the present invention. Values, shapes, materials, components, arrangement or connection between components, and the like are merely illustrative, and are not intended to limit the present invention. The present invention is limited only by a scope of the claims. Accordingly, among components described in the below-described embodiment, components not set forth in the independent claims indicating the top level concept of the present invention are not indispensable for achieving the present invention, but are described as optional components included in a more desirable embodiment.
First, a whole structure of a light bulb shaped lamp 1 according to the present embodiment is described with reference to
A light bulb shaped lamp 1 according to one embodiment of the present invention is a light bulb shaped LED lamp which substitutes for an incandescent light bulb, as shown in
The light bulb shaped lamp 1 according to the present embodiment includes an envelope 8 having the globe 2, the case 6, and the base 4.
As shown in
The globe 2 includes one end which is closed in a spherical shape and the other end which is opened. To be specific, the globe 2 is formed in such a shape that one end is hemispherically shaped, and the other end is shaped in a manner that a part of the hollow sphere extends with getting narrower in the direction apart from the center of the sphere up to an opening formed in a position apart from the center of the sphere. In the present embodiment, the globe 2 has a shape in Type A (JIS C7710) used for a typical incandescent light bulb.
It should be noted that the globe 2 is not necessarily shaped in the Type A. For example, the shape of the globe 2 may be Type G, Type E, and the like. The globe 2 may neither necessarily be translucent to visible light, nor be made of a silica glass. For example, the globe 2 may have thereon an opalescent diffusion film by being applied with silica, or may be formed by a resin member, such as an acrylic member.
The LED module 3 is a light emitting module, and is housed in the globe 2 as shown in
In the present embodiment, the LED module 3 includes two LED modules 3a and 3b, as shown in
The LED module 3 (the LED modules 3a and 3b) has a plate rectangular shape. However, the shape is not limited thereto, and a pentagon-shaped, an octagon-shaped, or other polygonal shaped LED modules may be used. Alternatively, a plurality of plate-type LED modules 3 having different shapes may be combined. Either a translucent LED module 3 or a non-translucent LED module 3 may be used. However, it is desirable to use the translucent LED module 3, because of its properties which allow the brightness in the light-emitting direction (in a downward direction opposite to the base when the base is placed upward, and the lamp is lit up) to be increased. In such a case, it is desirable that a base platform 3d used in the translucent LED module is made of a material having a high light transmittance (for example, more than or equal to 90%). In addition, the LED module 3 to be used in plural in number may emit respective light rays differentiated in colors. For example, three LED modules 3 respectively including chips having red, green, and blue light-emitting colors may be used to emit the light in which the colors are mixed. Furthermore, the LED modules 3 can be individually lighted or flickered so as to be used as illumination. The LED modules 3 having outer diameters different from each other may be combined.
As shown in
Each of the LED modules 3a and 3b may be fixedly attached to the stem component 5a using a silicone adhesive (not shown). Although the LED module 3a is placed at an edge surface of the tip component 5g, a through hole may also be provided in the LED module 3a to allow the tip component 5g to penetrate through the through hole, followed by fixing the LED module 3a to the stem 5a in the vicinity of the tip component 5g using the silicone adhere. Alternatively, the LED module 3a may be fixed to the edge surface of the tip component 5g using a screw. The above case eliminates the need for preparing the respective LED modules 3 with and without a through hole thereon.
The adhesive made of silicone resin can be used as adhesive. It is desirable to use adhesive having high heat conductivity for efficiently causing the heat of the LED modules 3 to be conducted to the stem component 5a. For example, the heat conductivity can be increased by dispersing metal microparticles in the silicone resin, or by other ways. As the adhesion, a double-sided tape may be used.
A hollow-column projection 5f like a flange which is shown in
The LED module 3 (LED modules 3a and 3b) is provided at an approximately center of the sphere shape of the globe 2. For the occasion, the center is provided, for example, inside a space having a larger inner diameter in the globe 2. As aforementioned, the LED modules 3 is placed at the center position, to thereby allow the light bulb shaped lamp 1 to obtain, upon lighting up, the omnidirectional light distribution properties approximated to the light distribution properties obtained by a typical incandescent light bulb using a conventional filament coil.
The stem 5 includes the stem component 5a and the supporting component 5b which may be individually provided or integrally formed. The stem component 5a is provided so as to extend from the opening of the globe 2 toward the inside of the globe 2.
As shown in
Since the diameter of the stem component 5a attributes to the heat radiation, the larger the diameter becomes, the more desirable the stem component 5a is. However, if the diameter is too large, the stem component 5a cannot be inserted in the globe 2. Accordingly, it is desirable for the stem component 5a to have an outer diameter smaller than an inner diameter of the opening of the globe 2. In the present embodiment, the used globe 2 has the opening with the inner diameter of 33 mm. Therefore, it is desirable for the stem component 5a to be smaller than or equal to 33 mm. However, too large diameter of the stem component 5a causes problems such as increase in weight, failure in keeping appearance quality equal to that of the conventional incandescent light bulb, or the like. In view of this, the diameter of the stem component needs to be considered appropriately.
The inclined component 5e of the stem component 5a is a reflection surface which reflects the light emitted from the LED modules 3 toward the base 4. In other words, the inclined surface can reflect the light traveling to the base 4 toward the backward of the lamp on the side of the base 4, or toward both sides of the lamp. In addition, a desired adjustment in light distribution for reflection light reflected on the reflection surface can be performed by appropriately varying an inclination angle of the inclined surface. The reflection surface can be formed by painting the inclined surface in white. In addition, the reflection surface can be formed by polishing the reflection surface to achieve mirror finish. Similarly, a surface of a first supporting component 5h of the supporting component 5b, which is placed on a side close to the stem component 5a, undergoes inclination, polish finishing, or other processing, to thereby cause the surface to work as a reflection surface. This enables the desired control in the light distribution to be performed.
Although the first stem component 5c, the second stem component 5d, and the inclined component 5e have a solid structure except a through hole for the lead wires 7 in the present embodiment, they may have a hollow structure with a constant thickness.
The LED modules 3a and 3b are electrically connected with each other by the two lead wires 7, at least one lead wire 7a for connecting the LED modules 3a and 3b and at least one lead wire 7b used for power input.
Each of one ends of the two lead wires 7 is connected, with solder and the like, to a corresponding one of two electric-power supply terminals provided on diagonally opposite corners of the LED module 3b, while each of the other ends of the two lead wires 7 passes through an inside of the first supporting component 5h from the inclined component 5e of the stem component 5a so as to be connected to the lighting circuit 9 in the case 6. The lighting circuit 9 is connected to the base 4 by the two lead wires 7b for the power input. The lead wires 7 may be connected to the LED module 3b without passing through the inside of the second stem component 5d.
Each of the LED modules 3a and 3b is connected to the corresponding one of the electric-power supply terminals via at least one of the lead wires 7a with the solder or the like. Electric power is supplied from the base 4 via the lighting circuit 9, lead wires 7, and lead wires 7b for supplying the electric power, so as to cause the LED modules 3a and 3b to emit light. A U-shaped connecting terminal may be provided in an end portion, in an electric-power supply terminal side, of each of the lead wires 7 and each of the lead wires 7a between LED modules, so as to sandwich the electric-power supply terminal of each of the LED modules 3a and 3b, so that the lead wires 7a between the LED modules and the electric-power supply terminals of the LED modules 3a and 3b are connected with solder. Alternatively, a through hole may be provided in each of the electric-power supply terminals of the LED modules 3a and 3b so as to allow the lead wires 7 to pass through, and an intermediate portion of each of the lead wires 7 may be connected to a corresponding one of the electric power supply terminals of the LED module 3b with the solder, so that the one end of each of the lead wires 7 and the corresponding one of the electric-power supply terminals of the LED module 3a may be connected with the solder or the like. When a covered lead wire is used for each of the lead wires 7, a cover of the intermediation portion of the covered lead wire is naturally removed in advance.
The LED module 3a includes a plurality of LED chips 3c, one base platform 3d on which the LED chips 3c are mounted, and a sealing member 3e for sealing the LED chips 3c. The LED module 3a is provided so that a surface on which the LED chips 3c are mounted faces the top of the globe 2. The configuration of the LED module 3b is same with that of the LED module 3a except the through hole 10 which is not provided in the LED module 3a. The LED module 3b is also provided so that a surface on which the LED chips 3c are mounted faces the top of the globe 2. The LED module 3b is provided so that the surface of the LED module 3b on which the LED chips 3c are mounted faces a reverse surface of the LED module 3a (the reverse surface of the surface on which the LED chips 3c are mounted) mounted on the edge surface of the stem.
The base platform 3d is an LED mounted substrate on which the LED chips 3c are to be mounted, and is made of a plate member having translucency to visible light. In the present embodiment, an translucent alumina substrate is used which has transmittance of 96%, and is shaped in a rectangular having a length of 22 mm, a width of 18 mm, and a thickness of 1.0 mm. The shape of the base platform 3d may be a polygon, such as a pentagon or an octagon, alternatively may be a circle.
In addition, it is desirable for the base platform 3d to be made of a member having high transmittance to the visible light. With the above configuration, the light from the LED chips 3c passes through an inside of the base platform 3d, and is also emitted from a surface of the base platform 3d on which no LED chip 3c is mounted. Accordingly, even when the LED chips 3c are mounted on only one surface (a front surface) of the base platform 3d, the light is also emitted from the other surface (a reverse surface). Therefore, the omnidirectional light distribution properties approximated to those obtained by the incandescent light bulb can be obtained. The base platform 3d may have non-translucency. The LED chips 3c may be mounted on surfaces of the base platform 3d.
It is desirable for the base platform 3d to be made of a member having high heat conductivity and high emissivity in heat radiation, for enhancing the heat radiation. To be specific, the base platform 3d is desirably a member made of a material typically called as a hard brittle material representing glass and ceramic, for example. Here, the emissivity is expressed by a proportion of a black body (perfect radiator) to the heat radiation, and covers values in a range from 0 to 1. The emissivity of a glass or a ceramic ranges from 0.75 to 0.95, so that the heat radiation approximated to that of the black body can be achieved. In practice, thermal emissivity is desirably 0.8 or greater, and more desirably 0.9 or greater.
Each of the LED chips 3c according to the present embodiment is an example of a semiconductor light-emitting device, and is a bare chip that emits monochromatic visible light. In the present embodiment, a blue LED chip 3c which emits blue light when energized is used. The LED chips 3c are mounted on a surface of the base platform 3d. In the present embodiment, a plurality of LED chips 3c are arranged circularly. With the circular arrangement, a center area in the surface of the base platform 3c where no LED chips 3c are provided can be used for the heat radiation. In other words, the heat radiation can be improved by increasing the diameter of the stem component 5a to come into contact with the center area.
The sealing member 3e is formed in a circle to cover the LED chips 3c. In the present embodiment, four sealing members 3e are formed. In addition, the sealing member 3e contains a phosphor serving as an optical wavelength conversion member, and functions as a wavelength conversion layer which performs wavelength conversion on the light emitted from the LED chips 3c. For the sealing member 3e, a phosphor-containing resin prepared by dispersing predetermined phosphor particles and light-diffusion material in a silicon resin may be used.
As phosphor particles, when the LED chips 3c are blue LED chips 3c which emit blue light, YAG yellow phosphor particles such as (Y, Gd)3Al5O12:Ce3+, Y3Al5O12:Ce3+ can be used in order to obtain white light. With this, part of the blue light emitted from the LED chips 3c is converted to yellow light with wavelength conversion by the yellow phosphor particles included in the sealing material 3e. The blue light which is not absorbed by the yellow phosphor particles and the yellow light which is converted by the yellow phosphor particles with wavelength conversion are diffused and mixed in the sealing material 3e. After that, the mixed light is emitted from the sealing material as white light.
Particles such as silica are used as the light diffusion material. In this embodiment, the translucent base platform 3d is used. Accordingly, the white light emitted from the sealing member 3e passes through the inside of the base platform 3d, and is also emitted from the surface of the base platform 3d on which no LED chips 3c are mounted. It should be noted that the wavelength conversion material included in the sealing member 3e may be a yellow phosphor such as (Sr, Ba)2SiO4:Eu2+, Sr3SiO8:Eu2+, for example. Alternatively, the wavelength conversion material may use a combination of a green phosphor such as (Ba, Sr)2SiO4:Eu2+, Ba3Si6O12N2:Eu2+ and a red phosphor such as CaAlSiN3:Eu2+, Sr2(Si, Al)5(N, O)8:Eu2+.
The sealing member 3e may not necessarily be made of a silicon resin, and may be made of an organic material such as fluorine series resin or an inorganic material such as a low-melting-point glass or a sol-gel glass. Since the inorganic material is superior to the organic material in heat-resistance properties, the sealing member 3e made of the inorganic material is advantageous to increasing luminance.
Alternatively, the sealing member 3e may be provided on a surface of the base platform 3d on which no LED chips 3c are mounted. Such a surface of the base platform 3d includes a reverse surface, a side surface, or the like. With this, blue light which passes through the inside the base platform 3d and is emitted from the surfaces on which no LED chips 3c are mounted is also converted to yellow light with the wavelength conversion. Accordingly, it is possible to allow the color of light emitted from the surfaces on which no LED chips 3c are mounted to be closer to the color of light emitted from the surface of the base platform 3d on which the LED chips 3c are mounted.
Meanwhile, a wiring pattern is formed on the surface of the base platform 3d on which the LED chips 3c are mounted. The wiring pattern may be formed of, for example, a translucent conductive material such as indium tin oxide (ITO).
As illustrated in
The stem component 5a is composed of a material having a heat conductivity higher than a heat conductivity of the base platform 3d of the LED module 3. It is desirable that the stem component 5a is composed of a material having a heat conductivity higher than the heat conductivity of glass (approximately 1.0[W/m·K]). The stem component 5a can be composed of a metal or an inorganic material such as ceramics, for example. In the present embodiment, the stem component 5a is made of aluminum having the heat conductivity of 237[W/m·K].
As described above, the stem component 5a is composed of materials having the heat conductivity higher than the heat conductivity of the base platform 3d in each of the LED modules 3a and 3b, to thereby allow the heat from the LED modules 3a and 3b to be efficiently conducted to the stem component 5a through the base platform 3d. With this, the heat from the LED modules 3a and 3b is transferred toward the base 4. This suppresses the reduction in the light-emitting efficiency of the LED modules 3a and 3b and reduction in the lifetime, which are caused by increased temperature.
The supporting component 5b is a component connected to the opening of the globe 2 so as to close the opening of the globe 2 and to support the stem component 5a. In the present embodiment, the supporting component 5b is fit into the case 6 so as to be fixed thereto.
The supporting component 5b is composed of a material having a heat conductivity higher than the heat conductivity of the base platform 3d of each of the LED modules 3a and 3b. It is desirable for the supporting component 5b to be composed of a material having a heat conductivity higher than the heat conductivity of glass. For example, the supporting component 5b may be formed of metal material or an inorganic material such as ceramics. In order to efficiently conduct the heat in the stem component 5a to the supporting component 5b, it is desirable that the material for the supporting component 5b is composed of a material having a heat conductivity equal to or higher than the heat conductivity of the stem component 5a. In the present embodiment, the supporting component 5b is composed of the same material as the stem component 5a; that is, aluminum having the heat conductivity of 237[W/m·K].
As described above, the supporting component 5b is composed of a material having high heat conductivity, to thereby allow the heat which is heat-conducted to the stem component 5a from the LED modules 3a and 3b, to be efficiently conducted to the supporting component 5b. This suppresses the reduction in the light-emitting efficiency of the LED modules 3a and 3b, and reduction in the lifetime of the LED modules 3a and 3b, which are caused by increase in the temperature.
Furthermore, in the present embodiment, the supporting component 5b is composed of a disc-shaped plate material, and includes a first supporting component 5h and a second supporting component 5i having a diameter larger than that of the first supporting component 5h. At the boundary between the first supporting component 5h and the second supporting component 5i, a step component 5j is formed.
The stem component 5a is fixedly attached to the first supporting component 5h, and a side surface of the second supporting component 5i comes into contact with an inner surface of the case 6 so that the second supporting component 5i is fixed to the case 6. At the step component 5j, the opening of the globe 2 is positioned. The step component 5j is filled with an adhesive, so that the globe 2 and the case 6 are bonded.
As described above, the supporting component 5b is connected to the globe 2. Thus, the heat conducted to the supporting component 5b from the LED modules 3 is dissipated to air from outer surfaces of the base 4, case 6, and globe 2 which compose the envelope 8.
As in the present embodiment, when the globe 2 is made of glass, the heat conductivity of the globe 2 is higher than the heat conductivity of the case 6. For the occasion, the globe 2 has a large dimension that is directly exposed to outside air, thereby further promoting efficient heat radiation.
The case 6 performs insulation between the base 4 and the stem 5, and also serves as a resin case for housing therein the lighting circuit 9. In the present embodiment, the case 6 is made of polybutylene terephthalate (PBT) containing 5 to 15% of glass fiber and having a heat conductivity of 0.35[w/m·K].
The lighting circuit 9 is a circuit for lighting the LED modules 3a and 3b, and is housed in the case 6. To be specific, the lighting circuit 9 includes a plurality of circuit elements and a circuit board on which the lighting elements are mounted. In the present embodiment, the lighting circuit 9 converts the AC power received from the base 4 into DC power, and supplies the DC power to the LED modules 3a and 3b through the lead wires 7 and the lead wires 7a between the LED modules. The light bulb shaped lamp 1 does not necessarily have to incorporate therein the lighting circuit 9. For example, the light bulb shaped lamp 1 may not include the lighting circuit 9 when the DC power is directly supplied from the lighting apparatus, cells, or the like. In addition, the lighting circuit 9 is not limited to a smoothing circuit. A light-adjusting circuit, a voltage booster circuit, and others may be appropriately selected and combined.
Although the supporting component 5b is housed in the case 6 in the present embodiment, the supporting component 5b may be exposed to outside air if insulating processing is performed thereon. With this, the supporting component 5b is exposed to the outside air, to thereby enhance the heat radiation. For the occasion, alumite processing may be applied to the exposed component of the supporting component 5b made of aluminum, in order to enhance the heat radiation.
As described above, in the light bulb shaped lamp 1 according to the present embodiment, the stem component 5a penetrates the two LED modules 3a and 3b so as to support the two LED modules 3a and 3b. Accordingly, an appearance shape similar to that of a conventional incandescent light bulb can be achieved without enlarging the shape of the light bulb shaped lamp 1. In addition, the heat radiation of the two LED modules 3a and 3b can be enhanced by the stem component 5a which is thermally connected to the two LED modules 3a and 3b. As a result, the number of LED chips 3c serving as the semiconductor light-emitting devices can be increased, to thereby increase brightness of the light bulb shaped lamp 1. Furthermore, when the light bulb shaped lamp 1 is lighted with the base 4 being placed upward, the light emitted from the LED module 3b placed on the side of the base 4 passes through the LED module 3a placed on the side of the globe 2, and joins together with the light from the LED module 3a, to thereby increase the brightness in the vertical direction which is a light-emitting direction. In addition, part of the light emitted from the LED module 3b placed on the side of the base 4 is reflected on the reverse surface of the LED module 3a which faces the LED module 3b and is placed on the side close to the top of the globe 2, so that the light is reflected toward the lateral and backward (toward the base 4) of the light bulb shaped lamp 1, to thereby achieve wide light distribution. The light distribution can be easily controlled using the plate LED modules 3a and 3b. With this, a light bulb shaped lamp presenting an excellent productivity and sufficient brightness and having a long lifetime can be obtained.
The LED module 3 is placed in the air in the globe 2. Accordingly, the light from the LED module 3 is not blocked by a case, such as the case 6, or the like. This makes it possible to obtain the light distribution properties similar to those obtained by the conventional incandescent light bulb.
In the light bulb shaped lamp 1 according to the present embodiment, the LED modules 3a and 3b are fixedly attached to the stem 5. Therefore, the heat from the LED modules 3a and 3b is efficiently dissipated to the outside using the globe 2, case 6, base 4, or the like through the stem 5 and the like.
Although a light bulb shaped lamp according to one embodiment of the present invention has been described, the present invention is not limited thereto. All possible variations added to the present invention by a person skilled in the art in his/her conceivable range and all possible combinations of structural components in different embodiments may be involved in the present invention, as long as the variations and the combinations are not depart from the principles of the present invention.
For example, though the LED is exemplified as a semiconductor light-emitting device in the above embodiment, the LED may be a semiconductor laser, an organic electro luminescence (EL), or an inorganic EL.
The light bulb shaped lamp 1 according to the present invention is mounted to a device which has a socket and is provided on a ceiling in a room, so as to be used as, for example, a lighting apparatus. Hereinafter, a lighting apparatus according to one embodiment of the present invention is described with reference to
As shown in
The lighting device 220 is used for turning the light bulb shaped lamp 1 on and off, and includes a main body 221 to be mounted to the ceiling 300 and a lamp cover 222 covering the light bulb shaped lamp 1.
The main body 221 includes a socket 221a. Into the socket 221a, the base 4 of the light bulb shaped lamp is screwed. Through the socket 221a, electric power is supplied to the light bulb shaped lamp 1.
The lighting apparatus 200 described above is an example of the lighting apparatus 200 according to one embodiment of the present invention. The lighting apparatus according to the embodiment of the present invention holds the light bulb shaped lamp 1, and includes at least a socket for supplying electric power to the light bulb shaped lamp 1. Although the lighting apparatus 200 shown in
This allows the heat of the light bulb shaped lamp 1 to be conducted to the socket 221a of the main body 221 through the base 4 so as to be dissipated. In addition, reduction in the light emission properties of the LED module 3, which is associated with increasing the temperature can be prevented. Furthermore, the lighting apparatus 200 can be achieved which includes the light bulb shaped lamp 1 having an appearance similar to the conventional incandescent light bulb in which a filament coil is provided.
The present invention is useful as a light bulb shaped lamp which is used as a substitute for a conventional incandescent light bulb and the like, especially as a light bulb shaped LED light bulb, and a lighting apparatus or the like which includes the light bulb shaped LED light bulb.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2011-007445 | Jan 2011 | JP | national |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/JP2011/006001 | 10/26/2011 | WO | 00 | 7/16/2013 |
