The invention generally relates to a light emitting device, a light emitting module, and an illuminating apparatus.
Light emitting diodes (LEDs) are semiconductor devices. LEDs emit light by converting electric energy into light energy. In details, LEDs apply currents to compound semiconductors so as to release excess energy in the form of light through the binding of electrons and holes. Since the light emitting phenomenon of LEDs does not occur through thermo-luminescence or discharge-luminescence, the lifespan of LEDs can be longer than one hundred thousand hours. LEDs further include advantages such as fast response speed, small volume, energy saving, low pollution, high reliability, suitable for mass production, and so on. Thus, LEDs can be widely applied in various fields, for instance, large display boards, traffic lights, cellular phones, scanner, light sources of fax machines, LED lamps, and the like.
A general lamp filament adopting LEDs has the electrodes disposed at two opposite ends of the lamp filament, wherein the electrodes are configured to be electrically connected to an external electrical power. Since the electrodes are disposed at the two opposite ends, the lamp filament is hard to be assembled. Usually, the lamp filament needs to be manually assembled. As a result, the yield of the assembled lamp filaments is low, the process time is long, and the lamp filament is unfavorable to mass production.
Accordingly, the invention is directed to a light emitting device, which is easy to be assembled.
The invention is directed to a light emitting module, which is easy to be assembled.
The invention is directed to an illuminating apparatus, which is easy to be assembled.
According to an embodiment of the invention, a light emitting device including a substrate, a first group of light emitting diode (LED) structures, a second group of LED structures, and a connection port is provided. The substrate has a first surface and a second surface opposite to the first surface. The first group of LED structures is disposed on one side of the first surface. The second group of LED structures is disposed on another side of the first surface opposite to the first group of LED structures. The connection port is adapted to be directly coupled to other device. The connection portion includes a top opening, a side opening, and a first connection pad and a second connection pad electrically coupled to at least a part of the first group and the second group of LED structures. The connection pads are disposed on the substrate and between the first group of LED structures and the second group of LED structures, and the top opening directly exposes the connection pads and communicates with the side opening located on a side of the connection port. At least a part of light emitted from the first group and the second group of LED structures passes through the substrate and emerges from the second surface, and the light emitting device emits light in omni-directions.
According to an embodiment of the invention, a light emitting module including the aforementioned light emitting device and a connection device is provided. The connection device includes a bonding surface. The light emitting device is engaged with the connection device through the top and side openings of the connection port of the light emitting device, and the connection pads of the connection port are bonded on the bonding surface of the connection device.
According to an embodiment of the invention, a light emitting module including at least two aforementioned light emitting devices and a connection device is provided. The connection device includes a bonding surface, wherein the light emitting devices are coupled to each other, and at least one of the light emitting devices is disposed on the bonding surface of the connection device.
According to an embodiment of the invention, an illuminating apparatus including a lamp holder, the aforementioned light emitting module, and a lamp cap is provided. The lamp cap is disposed on the lamp holder. The lamp cap and the lamp holder define an accommodating space, wherein the light emitting module is disposed in the accommodating space.
In the light emitting device, the light emitting module, and the illuminating apparatus according to the embodiments of the invention, the connection port is between the first group of LED structures and the second group of LED structures, so that the light emitting device is easy to be assembled through the connection port. In this way, the light emitting device may be automatically assembled by a machine, so that the mass production and high yield may be achieved.
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
Reference will now be made in detail to the present embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
In this embodiment, the LED structures may be connected in series or in parallel in the first group or the second group of LED structures 120/130, and the first connection pad 146 and the second connection pad 148 are respectively electrically connected to at least two electrodes of the first group of LED structures 120 and at least two electrodes of the second group of LED structures 130. The electrical property of the first connection pad 146 is different from the electrical property of the second connection pad 148. For example, one of the first connection pad 146 and the second connection pad 148 is a positive electrode pad, and the other of the first connection pad 146 and the second connection pad 148 is a negative electrode pad.
In this embodiment, the light emitting device 100 further includes a wavelength conversion layer 150. The wavelength conversion layer 150 is disposed on the substrate 110 for receiving at least a part of light emitted from the first and second groups of LED structures 120 and 130, and exposes the connection port 140 to form the top and side openings 142 and 144. In this embodiment, the thickness T of the wavelength conversion layer 150 is preferably greater than 30 μm. Furthermore, the wavelength conversion layer 150 is disposed on at least a part of the first surface 112 of the substrate 110 and covers the first and second groups of LED structures 120 and 130. A part of the wavelength conversion layer 150 which covers the first group of LED structures 120 and another part of the wavelength conversion layer 150 which covers the second group of LED structures 130 may respectively include the same or different phosphor compositions, which means, for example, the material, element, concentration or distribution of the phosphor in the wavelength conversion layers 150 disposed on different positions may be the same or different, so that the lighting effects, like color, brightness or intensity, induced by the first group of LED structures 120 and the second group of LED structures 130 may be the same or different. Besides, a wavelength conversion layer 150 could be disposed on the second surface 114 of the substrate 110.
In this embodiment, the shape of the first surface 112 is rectangular, and each of the first group and the second group of the LED structures 120 and 130 is arranged along a direction parallel to a side of the first surface 112. The quantity of the LED structures 122 in the first group of LED structures 120 could be the same as or different from the quantity of the LED structures 132 in the second group of LED structures 130. The color of light emitted from the first group of LED structures 120 could be the same 10 as or different from the color of light emitted from the second group of LED structures 130. The intensity of light emitted from the first group of LED structures 120 could be the same as or different from the intensity of light emitted from the second group of LED structures 130.
In this embodiment, the light emitting device 100 may serve as a lamp filament. In the light emitting device 100, the connection port 140 is between the first group of LED structures 120 and the second group of LED structures 130, so that the light emitting device 100 is easy to be assembled through the opening of the connection port 140. In this way, the light emitting device 100 may be automatically assembled by a machine, so that the mass production and high yield may be achieved. In addition, the light emitting device 100 has an upper wavelength conversion layer 150 and a lower wavelength conversion layer 150, so that the color temperature of the light emitting device 100 may be flexibly adjusted by adjusting the coefficients of the upper wavelength conversion layer 150 and the lower wavelength conversion layer 150, so as to mix the color temperature due to the upper wavelength conversion layer 150 and the color temperature due to the lower wavelength conversion layer 150 to form the color temperature of the light emitting device 100.
In this embodiment, the quantity of the light emitting device 100 is more than one, and the connection device 210 includes a plurality of segments 211 having bonding surfaces 212 to engage with the light emitting devices 100, respectively. The light emitting devices 100 are engaged with the connection device 210 as a plurality of crosses, and an angle Θ is formed between each light emitting device 100 and the connection device 210. The angles Θ between the light emitting devices 100 and the connection device 210 could be the same or different. The degree of angles Θ could be equal to or less than 90 degree. The light emitting devices 100 could be engaged with the connection device 210 and extend along the same direction or respectively extend along a plurality of different directions.
In this embodiment, the connection device 210 is formed as a ring by connecting the segments 211 end to end. The quantity of the segments 211 could be three, and the connection device 210 is formed as a polygon-ring. The connection device 210 further includes folding junctions 213 between every two adjacent segments 211, so that the connection device 210 is foldable.
In this embodiment, the connection device 210a includes another bonding surface 212, and the light emitting devices 100 are respectively disposed on the bonding surfaces 212 opposite to each other, so that the light emitting devices 100 can be coupled to each other. The light emitting devices 100 could be engaged with the connection device 210a and extend along the same direction or respectively extend along a plurality of different directions.
In conclusion, in the light emitting device, the light emitting module, and the illuminating apparatus according to the embodiments of the invention, the connection port is between the first group of LED structures and the second group of LED structures, so that the light emitting device is easy to be assembled through the connection port. In this way, the light emitting device may be automatically assembled by a machine, so that the mass production and high yield may be achieved.
It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the invention covers modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.
This application claims the priority benefit of U.S. application Ser. No. 14/731,419, filed on Jun. 5, 2015, now U.S. Pat. No. 10,854,800, which claims the priority benefit of U.S. Provisional Application No. 62/034,164, filed on Aug. 7, 2014, which are incorporated herein by reference in their entirety.
Number | Name | Date | Kind |
---|---|---|---|
9261242 | Ge et al. | Feb 2016 | B2 |
9366390 | Kuo et al. | Jun 2016 | B2 |
20040008525 | Shibata | Jan 2004 | A1 |
20070139949 | Tanda et al. | Jun 2007 | A1 |
20090108271 | Chou et al. | Apr 2009 | A1 |
20100053956 | Park et al. | Mar 2010 | A1 |
20100320928 | Kaihotsu et al. | Dec 2010 | A1 |
20110050071 | Chung et al. | Mar 2011 | A1 |
20110163683 | Steele et al. | Jul 2011 | A1 |
20110303927 | Sanpei et al. | Dec 2011 | A1 |
20120044669 | Ogata et al. | Feb 2012 | A1 |
20130044480 | Sato et al. | Feb 2013 | A1 |
20130058080 | Ge | Mar 2013 | A1 |
20130155683 | Matsuda | Jun 2013 | A1 |
20130188375 | Masuda et al. | Jul 2013 | A1 |
20130235592 | Takeuchi | Sep 2013 | A1 |
20130235593 | Takeuchi et al. | Sep 2013 | A1 |
20130249381 | Takeuchi | Sep 2013 | A1 |
20140197440 | Ye et al. | Jul 2014 | A1 |
20140240979 | Chen | Aug 2014 | A1 |
20140254181 | Chang et al. | Sep 2014 | A1 |
20140362565 | Yao et al. | Dec 2014 | A1 |
20150069432 | Chiu | Mar 2015 | A1 |
20150103526 | Johnson et al. | Apr 2015 | A1 |
20160155775 | Yano | Jun 2016 | A1 |
Number | Date | Country |
---|---|---|
101782189 | Jul 2010 | CN |
101994959 | Mar 2011 | CN |
202992879 | Jun 2013 | CN |
103456728 | Dec 2013 | CN |
203521459 | Apr 2014 | CN |
103867947 | Jun 2014 | CN |
M485346 | Sep 2014 | TW |
Number | Date | Country | |
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20210083162 A1 | Mar 2021 | US |
Number | Date | Country | |
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62034164 | Aug 2014 | US |
Number | Date | Country | |
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Parent | 14731419 | Jun 2015 | US |
Child | 17107391 | US |