TECHNICAL FIELD
The application relates to a light-emitting device, and more particularly, to a light-emitting device with temperature compensation.
DESCRIPTION OF BACKGROUND ART
The light-emitting principle of light-emitting diode (LED) is to use the energy difference of the electrons moving between n-type semiconductor and p-type semiconductor released in the form of the light. This is different from the light-emitting principle of incandescent lamp, so LED is called the cold light source.
Furthermore, LED has the advantages of high durability, long life, light weight, and low power consumption. Today, LED is highly appreciated in lighting market and is regarded as a new generation of lighting tools, and has gradually replaced traditional lightings. LED is used in various fields such as traffic signal, backlight module, street lighting, and medical equipment.
In the application of lighting field, the near sunlight (white color light) spectrum emitted from LED is required to match human's visual habits. The white color light described above can be generated by mixing the three primary colors of red, blue, and green emitted from LED in different ratios through the deployment of operating current by the circuit design. Because the cost of circuit module is high, the method is not widespread. Another method uses ultraviolet spectrum light-emitting diode (UV-LED) to excite red, blue, and green phosphors capable of absorbing a part of light emitted by UV-LED and emitting the red color light, the blue color light, and the green color light. The red color light, the blue color light, and the green color light are mixed to generate the white color light. Nevertheless, the luminous efficiency of UV-LED still needs to be improved so the application of the product is not widespread.
When the electric current drives the LED, in addition to the electric energy-photo energy conversion mechanism, part of the electric energy is transformed into the thermal energy, thus causing changes in the photoelectric characteristics. FIG. 1 illustrates the curve of the photoelectric characteristics of blue light LED and red light LED when the junction temperature (Tj) of the LED is increased from 20° C. to 80° C. As shown in FIG. 1, the vertical axis represents the relative value of the photoelectric characteristic value at different junction temperatures compared with that at 20° C. junction temperature of the light emitting device, such as light output power (P0; rhombus symbol), wavelength shift (Wd; triangle symbol), and forward voltage (Vf; square symbol). The solid line shown in FIG. 1 represents the characteristic curve of the blue light LED, and the dotted line shown in FIG. 1 represents the characteristic curve of the red light LED. When the junction temperature is increased from 20° C. to 80° C., the light output power of the blue light LED drops about 12% and the hot/cold factor is about 0.88; the light output power of the red light LED drops about 37% and the hot/cold factor is about 0.63. Furthermore, in terms of the wavelength shift, there is no big difference between the blue light LED and the red light LED but is only slightly changed with the difference of Tj. In terms of the forward voltage changes, when the junction temperature is increased from 20° C. to 80° C., the decline of the blue light LED and the red light LED is respectively about 7˜8%. Namely, the equivalent resistances of the blue light LED and the red light LED decline about 7˜8% under the operation of constant current. As mentioned above, because the temperature dependences of the blue light LED and the red light LED photoelectric characteristics are different, the undesirable phenomenon of the unstable red/blue light output power ratio happens during the period from the initial operation to the steady state. When the warm white light-emitting device comprising the red light LED and the blue light LED is used in the lighting field, the light color instability during the initial state and the steady state owing to the different hot/cold factors of the blue light LED and the red light LED causes the inconvenient when using the lighting.
SUMMARY OF THE APPLICATION
The present application provides a light-emitting device which comprises a first light-emitting diode group with a first hot/cold factor comprising a plurality of first light-emitting diode units electrically connected to one another; and a temperature compensation element electrically connected to the first light-emitting diode group, and comprising a first resistor and a second resistor; wherein the first resistor has a first temperature coefficient of resistance and the second resistor has a second temperature coefficient of resistance; and the absolute value of the first temperature coefficient of resistance is ten times greater than that of the second temperature coefficient of resistance.
In another embodiment of the present disclosure, the light-emitting device comprises a first light-emitting diode group comprising a plurality of first light-emitting diode units electrically connected to one another; and a temperature compensation element electrically connected to the first light-emitting diode group in parallel, and having a first resistance at a first temperature and a second resistance at a second temperature; wherein the first temperature is greater than the second temperature; and wherein the first resistance is at least two times greater than that of the second resistance.
In another embodiment of the present disclosure, the light-emitting device comprises a first light-emitting diode group comprising a plurality of first light-emitting diode units electrically connected to one another; and a second light-emitting diode group electrically connected with the first light-emitting diode group in series and comprising a plurality of second light-emitting diode units electrically connected to one another; wherein the light-emitting device has a first color temperature at a first temperature and a second color temperature at a second temperature less than the first temperature; and wherein a difference of the first and second color temperatures is less than 300K.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 illustrates the relationship curve between the junction temperature and the photoelectric characteristics of blue light LED and red light LED light-emitting devices;
FIG. 2A is a diagram of the light-emitting device in accordance with the first embodiment of the present application;
FIG. 2B is a diagram of the light-emitting device in accordance with the second embodiment of the present application;
FIG. 3 is a diagram of the light-emitting device in accordance with the third embodiment according of the present application;
FIG. 4 is a diagram of the light-emitting device in accordance with the fourth embodiment of the present application;
FIG. 5 is a diagram of the light-emitting device in accordance with the fifth embodiment of the present application;
FIG. 6 is a diagram of the light-emitting device in accordance with the sixth embodiment of the present application;
FIG. 7 is a structure diagram of the light-emitting device of a light-emitting diode group according to the above-described embodiments of the present application;
FIG. 8 is a structure diagram of the light-emitting device in accordance with the fifth embodiment or the sixth embodiment of the present application;
FIG. 9 is a diagram of the light-emitting device in accordance with the seventh embodiment of the present application;
FIGS. 10A-10D are diagrams showing an operation of the light-emitting device in accordance with the seventh embodiment at different temperatures;
FIGS. 11A-11D are diagrams of the light-emitting device in accordance with the eighth embodiment of the present application;
FIGS. 12A and 12B are diagrams of the light-emitting device in accordance with the ninth embodiment of the present application;
FIG. 13 is a diagram of the light-emitting device in accordance with the tenth embodiment of the present application; and
FIG. 14 is a diagram of the light-emitting device in accordance with the eleventh embodiment of the present application.
DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS
The embodiments of the present application are illustrated in detail, and are plotted in the drawings. The same or the similar part is illustrated in the drawings and the specification with the same number.
FIG. 2A illustrates an electric circuit diagram of the light-emitting device in accordance with the first embodiment of the present application. The light-emitting device 200 comprises a first light-emitting diode group 202, a second light-emitting diode group 204, and a temperature compensation element comprising a first resistor, for example a thermistor 206 with positive temperature coefficient of resistance (PTC). The first light-emitting diode group 202 comprises a first quantity of light-emitting diode units 208 connected to one another in series, the second light-emitting diode group 204 comprises a second quantity of light-emitting diode units 208 connected to one another in series, and the first light-emitting diode group 202 is electrically connected to the second light-emitting diode group 204 in series. The light-emitting diode unit 208 of the first and the second light-emitting diode groups 202, 204 comprises the hot/cold factor no more than 0.9, preferably no more than 0.85, and further preferably no more than 0.8, and comprises a light-emitting diode capable of emitting visible or invisible wavelength, such as red, blue or ultraviolet wavelength light-emitting diodes, or formed by AlGaInP-based material, or GaN-based material. The hot/cold factor means the ratio of the light output power of the light-emitting diode at a first temperature (for example, T=80° C.) to the light output power of the light-emitting diode at a second temperature less than the first temperature (for example, T=20° C.). The light output power is normalized and the light output power of the light-emitting diode at T=20° C. is defined 100 (or 1).
In the embodiment, the second light-emitting diode group 204 is electrically connected to the thermistor 206 in parallel. The first light-emitting diode group 202 has an equivalent internal resistance R1, the second light-emitting diode group 204 has an equivalent internal resistance R2, and the thermistor 206 has a resistance Rpm, wherein R1 and R2 decrease when the temperature is increased. As shown in FIG. 1, when the light-emitting diode unit 208 is the red light or the blue light light-emitting diode, and T is increased from 20° C. to 80° C., R1 and R2 respectively decreases about 7˜8%. The resistance RPTC of the thermistor 206 with positive temperature coefficient of resistance has a correlation with the temperature, that is, RPTC increases in the linear or the non-linear correlation when the temperature is increased. During the operation of the light-emitting device 200, an electric current I1 of about 20˜1000 mA flowing through the first light-emitting diode group 202 is divided into I2 flowing through the second light-emitting diode group 204 and I3 flowing through the thermistor 206, wherein I1=I2+I3. In addition, the potential difference of the two terminals of the second light-emitting diode group 204 is equal to the potential difference of the two terminals of the thermistor 206. Namely, I3*PTC=I2*R2. From the above two relationships, the electric current I2 flowing through the second light-emitting diode group 204 is positive-correlated to RPTC/(R2+RPTC). Namely, I2 is respectively positive-correlated to RPTC and negative-correlated to R2. In the embodiment, the temperature of the light-emitting device 200 is increased during operation. For example, the resistance RPTC of the thermistor 206 is increased due to the increase of the temperature, and the resistance R2 of the second light-emitting diode group 204 is decreased due to the increase of the temperature when the temperature is increased from the initial operation temperature (second temperature) of 20° C. to the steady state temperature (first temperature) of 80° C. Therefore, under the constant electric current I1, the electric current I2 flowing through the second light-emitting diode group 204 is increased, and the light output power of the second light-emitting diode group 204 is increased due to the increase of I2. In other words, the light output power of the second light-emitting diode group 204 can be controlled by RPTC to reduce the decline of the light output power of the second light-emitting diode group 204 caused by hot/cold factor when the temperature is increased, and the function of the temperature compensation is achieved. In addition, the decline of the light output power of the light-emitting device caused by hot/cold factor during the increase of the temperature can be offset or controlled by adjusting the quantity of the light-emitting diode units of the first light-emitting diode group and the second light-emitting diode group, or selecting the thermistor with suitable temperature coefficient of resistance. It is noted that the temperature can be a junction temperature or an environment temperature, and the junction temperature is equal to the environment temperature at a steady state.
In one embodiment, the first light-emitting diode group 202 is capable of emitting blue light having a wavelength of 450-490 nm and the second light-emitting diode group 204 is capable of emitting red light having a wavelength of 610-650 nm. The light-emitting diode unit 208 in the first light-emitting diode group 202 comprises the hot/cold factor greater than 0.85, and the light-emitting diode unit 208 in the second light-emitting diode group 204 comprises the hot/cold factor less than 0.85.
FIG. 2B illustrates an electric circuit diagram of the light-emitting device in accordance with the second embodiment of the present application. The first light-emitting diode group 202 is capable of emitting blue light having a wavelength of 450-490 nm and the second light-emitting diode group 204 is capable of emitting red light having a wavelength of 610-650 nm. The temperature compensation element comprises a first resistor 206 and a second resistor 207. In this embodiment, the first resistor 206 is connected with the second light-emitting diode group 204 in parallel. The second resistor 207 is electrically connected with the first resistor 206 in series and connected to the second light-emitting diode group 204 in parallel . In this embodiment, the first resistor 206 such as a thermistor has a first temperature coefficient of resistance and the resistor 207 has a second temperature coefficient of resistance, and the absolute value of the first temperature coefficient of resistance is ten times greater than that of the second temperature coefficient of resistance. In addition, the first and second temperature coefficients of resistance are positive. In one embodiment, the first resistor 206 has a first resistance and the second resistor 207 has a second resistance. The first resistance is less than the second resistance. Depending on the actual requirements, the first resistance can be greater than or equal to the second resistance.
It is noted that the light-emitting device 200 has a first color temperature at the first temperature and a second color temperature at the second temperature less than the first temperature. A difference of the first and second color temperatures is less than 300K while the light intensity of the light-emitting device 200 is larger than 800 lm. The first color temperature is greater than the second color temperature. A difference between the first temperature and the second temperature is greater than 20 degrees Celsius.
As shown in FIG. 3, the thermistor 206 with positive temperature coefficient of resistance of the third embodiment can be electrically connected to the first light-emitting diode group 202 and the second light-emitting diode group 204 in parallel at the same time. Thus, when the temperature of the light-emitting device is increased, the electric current flowing through the first light-emitting diode group 202 and the second light-emitting diode group 204 is increased compared with that at the initial temperature.
HG. 4 is an electric circuit diagram of the light-emitting device in accordance with the fourth embodiment of the present application. The light-emitting device 400 comprises a light-emitting diode group 402 and a thermistor 405 with negative temperature coefficient of resistance (NTC). The light-emitting diode group 402 comprises a plurality of light-emitting diode units 408 connected to one another in series. The light-emitting diode group 402 comprises the light-emitting diode capable of emitting visible or invisible wavelength, such as red, blue or ultraviolet wavelength light-emitting diodes, or formed by AlGaInP-based material, or GaN-based material.
In the embodiment, the light-emitting diode group 402 and the thermistor 405 are electrically connected in series. The light-emitting diode group 402 has an equivalent internal resistance R1, and the thermistor 405 has a resistance RNTC, wherein R1 decreases when the temperature is increased. As shown in FIG. 1, when the light-emitting diode unit 408 is the red light or the blue light light-emitting diode, and T is increased from 20° C. to 80° C., R1 decreases about 7˜8%. The resistance RNTC of the thermistor 405 with negative temperature coefficient of resistance has a correlation with the temperature, that is, RNTC decreases in the linear or the non-linear relationship when the temperature is increased. When the light-emitting device 400 is operated under the constant electric voltage, the electric current I1 flowing through the light-emitting diode group 402 is about 20-1000 mA under the input Vin of constant electric voltage. According to Ohm's law, the electric current I1 is inversely proportional to the total resistance of the light-emitting device 400 and the input voltage Vin, that is, I1=Vin/(R1+RNTC). In other words, the electric current I1 flowing through the light-emitting diode group 402 is negative-correlated to RNTC and R1. In the embodiment, the temperature of the light-emitting device 400 is increased during operation. For example, the resistance RNTC of the thermistor 405 and the resistance R1 of the light-emitting diode group 402 are decreased due to the increase of the temperature when the temperature is increased from the initial operation temperature (second temperature) of 20° C. to the steady state temperature (first temperature) of 80° C. Thus, I1 is increased, and the light output power of the light-emitting diode group 402 is increased due to the increase of I1. In other words, the light output power of the light-emitting diode group 402 can be controlled by the RNTC to reduce the decline of the light output power of the light-emitting diode group 402 caused by hot/cold factor when the temperature is increased, and the function of the temperature compensation is achieved. In addition, the decline of the light output power of the light-emitting device caused by hot/cold factor during the increase of the temperature can be reduced by adjusting the quantity of the light-emitting diode units of the light-emitting diode group 402, and/or selecting the thermistor with suitable temperature coefficient of resistance. It is noted that the temperature can be a junction temperature or an environment temperature, and the junction temperature is equal to the environment temperature at a steady state.
FIG. 5 is an electric circuit diagram of the light-emitting device in accordance with the fifth embodiment of the present application. The light-emitting device 500 comprises a first light-emitting module 510, a second light-emitting module 520 connected to the first light-emitting module 510 in parallel, and a thermistor 506 with positive temperature coefficient of resistance electrically connected to the second light-emitting module 520. The first light-emitting module 510 comprises a first light-emitting diode group 502, and the second light-emitting module 520 comprises a second light-emitting diode group 503 and a third light-emitting diode group 504. The first light-emitting diode group 502 comprises a first quantity of the first light-emitting diode units 507 connected to one another in series, the second light-emitting diode group 503 comprises a second quantity of the second light-emitting diode units 508 connected to one another in series, and the third light-emitting diode group 504 comprises a third quantity of the second light-emitting diode units 508 connected to one another in series. The thermistor 506 is electrically connected to the third light-emitting diode group 504 in parallel, and electrically connected to the second light-emitting diode group 503 in series. The first light-emitting module 510 or the first light-emitting diode unit 507 has the hot/cold factor more than 0.85; the second light-emitting module 520 or the second light-emitting diode unit 508 has the hot/cold factor less than that of the first light-emitting module 510 or the first light-emitting diode unit 507, for example less than 0.85, or preferably less than 0.8. In the embodiment, the first light-emitting diode unit comprises the blue light light-emitting diode emitting blue light having a wavelength of 450-490 nm with the hot/cold factor about 0.88, and the second light-emitting diode unit comprises the red light light-emitting diode emitting red light having a wavelength of 610-650 nm with the hot/cold factor about 0.63. Other visible or invisible wavelength light-emitting diode can also be included, such as green, yellow or ultraviolet wavelength light-emitting diodes, or formed by AlGaInP-based material, or GaN-based material.
In the embodiment, the third light-emitting diode group 504 is electrically connected to the thermistor 506 in parallel. The second light-emitting diode group 503 has an equivalent internal resistance R1, the third light-emitting diode group 504 has an equivalent internal resistance R2, and the thermistor 506 has a resistance RPTC, wherein R1 and R2 decrease when the temperature is increased. As shown in FIG. 1, when the second light-emitting diode unit is the red light or the blue light light-emitting diode, R1 and R2 respectively decreases about 7˜8%. The resistance Rpm of the thermistor 506 with positive temperature coefficient of resistance has a correlation with the temperature, that is, RPTC increases in the linear or the non-linear correlation when the temperature is increased. During the operation of the light-emitting device 500, an electric current I0 is divided into I1 flowing through the first light-emitting module 510 and I2 flowing through the second light-emitting module 520. The electric current I2 flowing through the third light-emitting diode group 504 and the thermistor 506 of the second light-emitting module 520 is divided into I3 flowing through the third light-emitting diode group 504 and I4 flowing through the thermistor 506, wherein I2=I3+I4. In addition, the potential difference of the two terminals of the third light-emitting diode group 504 is equal to the potential difference of the two terminals of the thermistor 506. Namely, I4*RPTC=I3*R2. From the above two relationships, the electric current I3 flowing through the third light-emitting diode group 504 is positive-correlated to RPTC/(R2+RPTC). Namely, I3 is positive-correlated to RPTC and negative-correlated to R2. In the embodiment, the temperature of the light-emitting device 500 is increased during operation. For example, the resistance Rpm of the thermistor 506 is increased due to the increase of the temperature, and the resistance R2 of the third light-emitting diode group 504 is decreased due to the increase of the temperature when the temperature is increased from the initial operation temperature (second temperature) 20° C. to the steady state temperature (first temperature) 80° C. Therefore, I3 increases due to the increase of the temperature and the light output power of the third light-emitting diode group 504 also increases due to the increase of I3. In the embodiment, the hot/cold factor of the first light-emitting module 510 is larger than that of the second light-emitting module 520, so the decline of the light output power of the second light-emitting module 520 is larger than that of the first light-emitting module 510 when the temperature is increased. Thus, the light color mixed by the light emitted from the first light-emitting module 510 and the light emitted from the second light-emitting module 520 shifts to the light color emitted from the first light-emitting module 510 when the temperature is increased. But the decline of the light output power of the second light-emitting module 520 caused by hot/cold factor can be reduced when the temperature is increased by controlling the RPTC of the thermistor 506, and the function of the temperature compensation can be achieved. In addition, the decline of the light output power of the second light-emitting module 520 caused by hot/cold factor during the increase of the temperature can be offset or controlled by adjusting the quantity of the light-emitting diode units of the second light-emitting diode group and the third light-emitting diode group, or selecting the thermistor with suitable temperature coefficient of resistance. Furthermore, the thermistor 506 of the embodiment can be electrically connected to the second light-emitting diode group 503 and the third light-emitting diode group 504 in parallel at the same time. Thus, when the temperature of the light-emitting device is increased, the electric current flowing through the second light-emitting diode group 503 and the third light-emitting diode group 504 is increased compared with that at the initial temperature
The sixth embodiment of the present application is illustrated in FIG. 6. The difference between the sixth and the fifth embodiments is that the second light-emitting module 520 is connected to the thermistor 605 with negative temperature coefficient of resistance in series. Based on the related description similar to the fourth embodiment and the fifth embodiment, the function of temperature compensation of the present application is achieved. In addition, the first light-emitting module and the second light-emitting module of the above-described fifth and sixth embodiments are not limited to be connected in parallel, and each of them also can be connected to an independent control current source or voltage source.
FIG. 7 is a structure diagram of a light-emitting diode group according to the above-described embodiments of the present application. A light-emitting diode group 700 comprises a substrate 710, and a plurality of light-emitting diode units formed or attached to the substrate 710 in an array type, and is divided by a trench 711. Each of the plurality of light-emitting diode units comprises an n-type contact layer 720 formed on the substrate 710, an n-type cladding layer 730 formed on the contact layer 720, an active layer 740 formed on the n-type cladding layer 730, a p-type cladding layer 750 formed on the active layer 740, a p-type contact layer 760 formed on the p-type cladding layer 750, a connecting wire 770 electrically connected to the n-type contact layer 720 of the light-emitting diode unit and the p-type contact layer 760 of another light-emitting diode unit in series, and an insulation layer 780 formed between the trench 711 and the connecting wire 770 to avoid the short circuit path. The n-type cladding layer 730 and p-type cladding layer 750 respectively provide electrons and holes such that electrons and holes can be combined in the active layer 740 to emit light. The contact layer provides an ohmic contact interface between an electrode and the cladding layer. In the embodiment of the present application, the light-emitting diode group 700 comprises a high voltage array-type single chip including the plurality of light-emitting diode units collectively formed on the single substrate, such as the blue light high voltage array-type single chip with the operation voltage between 60-120V or the red light high voltage array-type single chip with the operation voltage between 30-50V, and the operation voltage depends on the quantity of the light-emitting diode units connected in series. The material of the above-described n-type or p-type contact layer, the n-type or the p-type cladding layer, or the active layer comprises the III-V group compound such as AlxInyGa(1-x-y)N or AlxInyGa(1-x-y)P, wherein 0≦x, y≦1; (x+y)≦1.
FIG. 8 is a structure diagram of the light-emitting device in accordance with the fifth embodiment or the sixth embodiment of the present application. The first light-emitting module 510 of the light-emitting device 600 comprises the blue light high voltage array-type single chip illustrated in FIG. 7, and the second light-emitting module 520 comprising the red light high voltage array-type single chip illustrated in FIG. 7 is electrically connected to a thermistor 506, 605; two electrodes 509 are electrically connected to the first light-emitting module 510 and the second light-emitting module 520 to receive a power signal; the first light-emitting module 510, the second light-emitting module 520, the temperature compensation element (thermistor 506, 605) and the electrode 509 are collectively formed on a board 501.
FIG. 9 is an electric circuit diagram of the light-emitting device in accordance with the seventh embodiment of the present application. The light-emitting device 800 comprises a first light-emitting diode group 802 and a second light-emitting diode group 804. The first light-emitting diode group 802 comprises a first quantity of light-emitting diode units 808 connected to one another in series, the second light-emitting diode group 804 comprises a second quantity of light-emitting diode units 810 connected to one another in series, and the first light-emitting diode group 802 is electrically connected to the second light-emitting diode group 804 in series. The light-emitting diode units 808, 810 comprise a light-emitting diode capable of emitting visible or invisible wavelength, such as red, blue or ultraviolet wavelength light-emitting diodes, or formed by AlGaInP-based material, or GaN-based material. In this embodiment, the first light-emitting diode group 802 emits blue light having a wavelength of 450-490 nm, and the second light-emitting diode group 804 emits red light having a wavelength of 610-650 nm. The light-emitting device 800 further comprises a temperature compensation element 82 electrically connected to the second light-emitting diode group 804 in parallel. The temperature compensation element 82 can be operated in an electrical form or a mechanic form. In this embodiment, the temperature compensation element 82 is a mechanic form and comprises a plurality of resistor elements 821. Each of the resistor elements 821 comprises a resistor 8211 and a mechanic switch 8212. The switch 8212 comprises micro-actuator, one-way or two way-shaped memory alloy (SMA), bi-metallic strip, or capillary thermostat switch. The resistor 8211 in each resistor element 821 has the same resistance. In other embodiment, the resistance of the resistors 8211 in each of the resistor elements 821 can be different depending on the actual requirements. The number of the resistor elements 821 can also be varied. A number of the switch can be designed to connected or disconnected with different temperatures.
In this embodiment, the switch 8212 is two-way shaped memory alloy. The shape of the shaped memory alloy can deform with different temperature. In a first stage, as shown in FIG. 10A, during the operation of the light-emitting device 800 at temperature of 20° C., the shaped memory alloy is connected to the resistors 8211 such that the resistors 8211 (for example, three resistors are shown in this embodiment) are electrically connected with the second light-emitting diode group 804 in parallel. Therefore, an electric current I11 such as 20˜1000 mA flowing through the first light-emitting diode group 802 is divided into I21 flowing through the second light-emitting diode group 804 and I31 flowing through the temperature compensation element 82, wherein I11=I21+I31. In a second stage, as shown in FIG. 10B, at temperature of 40° C., the shape of one shaped memory alloy deforms to disconnected one resistor 8211 with the second light-emitting diode group 804 such that a total resistance of the resistor elements 821 is increased (that is, the resistance of the temperature compensation element is increased), and the electric current I32 (<I31) flowing therethrough is decreased. Since the electric current I12(=I11=I22+I32.) through the first light-emitting diode group 802 is constant, when the resistance of the temperature compensation element 82 is increased, the electric current I22(>I21) through the second light-emitting diode group 804 is increased. Likewise, in a third stage, as shown in FIG. 10C, at temperature of 60° C., the shape of another shaped memory alloy deforms further such that two resistors 8211 are disconnected with the second light-emitting diode group 804 and a total resistance of the resistor elements 821 is further increased (that is, the resistance of the temperature compensation element is further increased) compared to that in FIG. 10B, and the electric current I33 (<I32) flowing therethrough is further decreased. The electric current I23(>I22) through the second light-emitting diode group 804 is further increased. In a fourth stage, as shown in FIG. 10D, at temperature of 80° C., the shapes of three shaped memory alloy deform to disconnected all of the resistors 8211 with the second light-emitting diode group 804 such that the electric current I14(=I11=I12=I13) flowing through the first light-emitting diode group 802 is not divided and flows through the second light-emitting diode group 804 (I24>I23). By virtue of disconnecting the resistor with the second light-emitting diode group 804, a total resistance of the resistor elements 821 is increased (that is, the resistance of the temperature compensation element is increased), which results in the electric current flowing through the temperature compensation element 82 is decreased and the electric current through the second light-emitting diode group 804 is increased when the electric current through the temperature compensation element 82 and the second light-emitting diode group 804 is constant. Accordingly, the decline of the light output power of the second light-emitting group 804 caused by hot/cold factor can be reduced when the temperature is increased by controlling the total resistance of the temperature compensation element and the function of the temperature compensation can be achieved. It is noted that when the resistance of each resistor element is the same, a first difference between the resistance in the first stage and the resistance in the second stage is less than a second difference between the resistance in the second stage and the resistance in the third stage, and the second difference is less than a third difference between the resistance in the third stage and the resistance in the fourth stage. In other embodiment, the resistance of each resistor element can be different.
FIGS. 11A -11C are electric circuit diagrams of the light-emitting device in accordance with the eighth embodiment of the present application. As shown in FIG. 11A, a temperature compensation element 82′ is electrically connected to the second light-ernitting diode group 804 in parallel. The temperature compensation element 82′ comprises a first resistor 8214 having a first resistance and a second resistor 8215 having a second resistance less than the first resistance, and a switch 8212. The first resistance at a first temperature is at least two times greater than the second resistance; wherein the first temperature is greater than the second temperature. The switch 8212 is shaped memory alloy. During operation, at temperature of 20° C., as shown in FIG. 11B, the switch 8212 is connected with the second resistor 8215 and disconnected with the first resistor 8214. The electric current I15 flowing through the first light-emitting diode group 802 is divided into I25 flowing through the second light-emitting diode group 804 and I35 flowing through the second resistor 8215, wherein I15=I25+I35. At temperature of 50° C., as shown in FIG. 11C, the switch 8212 is deformed in shape to disconnected with the second resistor 8215 and to connect with the first resistor 8214 having the resistance larger than that of the second resistor 8215. Since an electric current I16(=I15=I26+I36) through the first light-emitting diode group 802 is constant, when the resistance of the temperature compensation element 82′ is increased, the electric current I36(<I35) flowing therethrough is decreased. The electric current I26(>I25) through the second light-emitting diode group 804 is increased. At temperature of 80° C., as shown in FIG. 11D, the switch 8212 is deformed in shape to disconnected with the first and second resistors 8214, 8215 such that an electric current I17 flowing through the first light-emitting diode group 802 is not divided and flows through the second light-emitting diode group 804 (I127>I26). Accordingly, the decline of the light output power of the second light-emitting group 804 caused by hot/cold factor can be reduced when the temperature is increased by controlling the resistance of the temperature compensation element 82′ and the function of the temperature compensation can be achieved.
FIGS. 12A and 12B are electric circuit diagrams of the light-emitting device in accordance with the ninth embodiment of the present application. As shown in FIG. 12A, a temperature compensation element 92 comprises a one-way shaped memory alloy 921, a conductive spring 922, and a resistor 923. At temperature of 20° C., the shaped memory alloy 921 has an end fixed with one end of the conductive spring 922 and connected with the second light-emitting diodes group 802 at a node 9211, and the other end of the conductive spring 922 is connected with the resistor 923 such that the resistor is electrically connected with the second light-emitting didoes group 802 in parallel. An electric current I18 flowing through the first light-emitting diode group 802 is divided into I28 flowing through the second light-emitting diode group 804 and I38 flowing through the second resistor 923. At temperature of 80° C. (or 40° C. or 60° C., for example), the shaped memory alloy 921 is deformed to compress the conductive spring 922 such that the conductive spring 922 is disconnected with the resistor 923 as shown in FIG. 12B. Accordingly, the electric current I19 flowing through the first light-emitting diode group 802 is not divided and flows through the second light-emitting diode group 804. Subsequently, when the temperature is reduced from 80° C. to 20° C., a restoring force of the conductive spring 922 is provided to force the shaped memory alloy 921 to connect with the second light-emitting diodes group 802, thereby again electrically connecting the resistor 823 with the second light-emitting diodes group 802 in parallel.
FIG. 13 is an electric circuit diagram of the light-emitting device in accordance with the tenth embodiment of the present application. The temperature compensation element 82″ is an electrical form and comprises a temperature sensing unit 832, a temperature detection circuit 831, a switch circuit 830 and a plurality of resistors 834. The switch circuit 830 comprises bipolar junction transistor (BJT), power bipolar junction transistor, hetero-bipolar junction transistor (BJT), metal-oxide-semiconductor field-effect transistor (MOSFET), power metal-oxide-semiconductor field-effect transistor, high electron mobility transistor (HEMT), silicon controlled rectifier (SCR), insulated gate bipolar transistor (IGBT). The temperature sensing circuit 831 and the switch circuit 830 can be integrated to form an integrated circuit. In operation, the temperature sensing unit 832 detects a temperature and transmits a signal to the temperature detection circuit 831. Thereafter, the temperature detection circuit 831 based on the received signal from the temperature sensing unit 832 controls the switch circuit 830 to connect or disconnect the resistors 834 with the second light-emitting diodes group 804. Similar to the seventh embodiment as shown in FIGS. 9-10D, at temperature of 20° C., all of the resistors 834 are electrically connected with the second light-emitting diode group 804 in parallel. At temperature of 40° C., one resistor is disconnected with the second light-emitting diode group 804. At temperature of 60° C., two resistors are disconnected with the second light-emitting diode group 804. At temperature of 80° C., all of the resistors are disconnected with the second light-emitting diode group 804.
FIG. 14 is an electric circuit diagram of the light-emitting device in accordance with the eleventh embodiment of the present application. The light-emitting device 900 comprises a first light-emitting diode group 902 and a second light-emitting diode group 904. The first light-emitting diode group 902 comprises a first quantity of light-emitting diode units 908 connected to one another in series, the second light-emitting diode group 904 comprises a second quantity of light-emitting diode units 910 connected to one another in series, and the first light-emitting diode group 902 is electrically connected to the second light-emitting diode group 904 in series. The light-emitting device 900 has the similar structure with the light-emitting device of the tenth embodiment. The light-emitting device 900 further comprises a light-emitting unit 906 connected with the second light-emitting diode group 904 in parallel. The light-emitting diode units 906, 908, 910 comprises a light-emitting diode capable of emitting visible or invisible wavelength, such as red, blue or ultraviolet wavelength light-emitting diodes, or formed by AlGaInP-based material, or GaN-based material. The light-emitting device 900 comprises the temperature compensation element 82″ and a current detection unit 841, a current detection circuit 840. The current detection unit 841 detects the current flowing through the second light-emitting diode group 904 and transmits a current signal to the current detection circuit 840. Thereafter, the current detection circuit 840 based on the received current signal from the current sensing unit 841 controls the light-emitting unit 906 to emit light. In this embodiment, the light-emitting diode units 906, 910 emit a red light, and the light-emitting diode unit 908 emits a blue light. At a current density less than 3 mA, a decay of the light output power of the red light-emitting diode unit is larger than that of the blue light-emitting diode unit. Accordingly, when the current detection unit 841 detects the current through the second light-emitting diode group 904 less than 3 mA, a signal from the current detection unit 841 is transmitted to the current detection circuit 840 to control the light-emitting unit 906 to emit red light. In this embodiment, the temperature compensation element 82″ and the current detection circuit 840 can be integrated to form an integrated circuit.
The principle and the efficiency of the present application illustrated by the embodiments above are not the limitation of the present application. Any person having ordinary skill in the art can modify or change the aforementioned embodiments. Therefore, the protection range of the rights in the present application will be listed as the following claims.
Patent Application
20130140590
